TIM. Thermal Interface Material. Stock Code: Total Solution for Thermal Interface Material

Transcription

1 Stock Code: TIM Interface Material Total Solution for Interface Material

2 ly Conductive Solution Provider ISO 9001 : 2008 ISO : 2004 QC : 2012 OHSAS : 2007 ISO/TS : 2009

3 CONTENTS Company Overview 2 Therm-Gap 7000A 24 Basic Theory 3 Therm-Filler (Two-Part ly Conductive Liquid Gap Filling Material) Selection Guide 4 Therm-Filler Typical Application 5 Therm-Filler Therm-Pad (ly Conductive Insulator) 6 Therm-Gel (Single-Part ly Conductive Liquid Gap Filling Material) Therm-Pad Therm-Gel 3500S 27 Therm-Pad Therm-Gel 3500S FR60 28 Therm-Pad Therm-Gel 6000S 29 Therm-Pad Therm-Gap (ly Conductive Gap Filling Material) Therm-Bond (ly Conductive Adhesive Tape) 10 Therm-Bond Therm-Gap 1100SP05 10 Therm-Bond Therm-Gap Therm-Bond X25A 32 Therm-Gap Therm-Grease (ly Conductive Grease Compound) Therm-Gap 1300SF 13 Therm-Grease Therm-Gap 1300SP 14 Therm-Grease Therm-Gap Therm-Grease Therm-Gap 1500BS40 16 Therm-Form (ly Conductive Potting Gel) 36 Therm-Gap Therm-Form Therm-Gap Therm-Form Therm-Gap Therm-Flow (ly Conductive Phase Change Material) Therm-Gap 2400S20 20 Therm-Flow Therm-Gap 2500BUS 21 Therm-Flow Therm-Gap Therm-Flow Therm-Gap TIM Property and Summary

4 Company Overview Established in Shenzhen, China, in 1993, FRD (Stock Code: ) manufactures a wide range of products including EMI Shielding Materials, Interface Materials and other related electronic materials. FRD is a registered National Hi-Tech Enterprise and certificate of ISO9001, ISO14001, QC and OHSAS FRD Building ( Shenzhen ) FRD works to satisfy the needs of its customers and we excel in speed and flexibility. FRD has long-term business relationships with customers such as Huawei, ZTE, Cisco, Nokia, Alcatel- Lucent, Juniper, Dell, H3C, Microsoft, Lenovo, Xiaomi, Samsung, Foxconn, Flextronics, Jabil, PEGATRON, SANMINA-SCI, O-Film Emerson, GREE, BYD, FUJI XEROX, TOSHIBA, etc. New South China Base Shenzhen Guangming FRD New Materials Park As a leading manufacturer in its industry, FRD is growing tremendously. We are willing to provide quality products and services for more customers in various industries than our competition. These industries include networks & telecommunication equipment, consumer electronics, automotive, East China Base Kunshan FRD Electronic Materials Co.,Ltd. power supplies, lighting, military, aerospace, etc. In the future, FRD will continue to meet the challenge, to grow the FRD brand name, and to strive to become a world-class technology leader in new materials for all of our manufacturing processes. North China Base Tianjin FRD Science & Technology Co.,Ltd 2

5 Properties and Testing Fourier Equation: Heat conduction of uniform interface material, generally based on one dimensional approach, can be described with Fourier Equation in the process of heat transfer: (1) Q: heat flow, W K: thermal conductivity, W/m K A: contact area, m² T: temperature variation between the heat surfaces of inflows and outflows, d: thickness of wall, m conductivity: an inherent thermal property of the single material, having nothing to do with the size or shape of material. For the interface material reinforced by fiberglass or polyimide, the thermal conductivity depends on the relative thickness and thermal direction performance, and thus the relative thermal conductivity is more appropriate. resistance: the opposition to the flow of heat through a unit area of material across a unit thickness: (2) For the single material, the thermal resistance and thickness are in direct proportion; and for the non-single material, the thermal resistance increases with increasing thickness of the material totally, but not changes in linear relation. impedance: the sum of thermal resistance and thermal contact resistance is described as thermal impedance. impedance is more appropriate to represent thermal performance in some certain situation. (3) Surface perpendicularity, surface roughness, fastening force, stock thickness and modulus of compression all affect the thermal contact resistance. Because of the effect of practical application conditions, thermal impedance also depends on the actual assembly condition actual assembly condition. Influencing factor: Contact area A: the more contract area increases, the less thermal contact resistance will be. Thickness d: the more thickness of insulator increases, the more thermal contact resistance will be. Pressure of assembly: in ideal circumstances, the more pressure of assembly increases, the less thermal resistance will be, and thermal resistance will decrease little by little when pressure increases into a certain value, which is the optimal pressure. Besides, thermal contact resistance is also related to test method. Test method for thermal resistance: Test method: ASTM D5470 Test principle and methods: Cylinder area ( Top tip of tester ): 1in² Roughness: less than 1μm Material: aluminum 6160 T6 Material of heat block and balancing heater: copper Soft material: pressure can be as low as MPa ( 10psi ) Hard material: pressure can reach up to 3.4 MPa ( 500psi ) Material easy to deformation, can be controlled thickness over by the screw or liner brake. Balanced judgement: temperature variation within 10 minutes is less than 1 Test diagram is as shown in the following figure: Note: refer to ASTM D5470 test standard Calculation method: 1. Calculate the heat flow from the applied electrical power (4) Q: heat flow, W V: electrical potential applied to the heater, V Heat Sink I: electrical current flow in the heater, A 2. Derive the temperature of the hot meter bar surface in contact with the sample Cold Meter Bar (5) T H : temperature of the hot meter bar surface in Hot Meter Bar contact with the sample, K T 1 : warmer temperature of the hot meter bar, K T 2 : cooler temperature of the hot meter bar, K d A : distance between T 1 and T 2, m d B : distance from T 2 to the surface of the hot meter bar in contact with the sample, m 3. Derive the temperature of the cold meter bar surface in contact with the sample (6) T C : temperature of the cold meter bar surface in contact with the sample, K T 3 : warmer temperature of the cold meter bar, K T 4 : cooler temperature of the cold meter bar, K d C : distance between T 3 and T 4, m d D : distance from T 3 to the surface of the cold meter bar in contact with the sample, m 4. Calculate the thermal impedance from Eq 7 and express it in units of m² K/W (7) 5. conductivity is calculated by the slope of thickness and its thermal resistance tested by single layer and multilayer. The reciprocal of the straight slope with thickness of sample as X axis and thermal resistance as Y axis is thermal conductivity, and the intersection of zero thickness represents thermal resistance R i, which depends on the sample, pressures on the sample and the surface situation. 3

6 TIM Selection Guide 4 Frequently asked questions 1 Q:What is the thermal interface material? A:TIM is a material used between heat source and sink to accelerate the efficiency of heat dissipation. Generally good thermal conductivity and surface wettability are important for TIM. 2 Q:May TIM cause short circuit between electronic components? A:No. TIM of FRD are all electric-insulating. 3 Q:Is TIM offered with a customized size? A:Yes. Any size and shape in the certain range listed in the datasheet are available. 4 Q:Is TIM offered with an adhesive? A:Currently, Therm-Pad series are offered with and without an adhesive shaped into any forms according to requirements of customers. Therm-Gap series have the natural inherent tacky. 5 Q:Are there any differences between silicone-free and silicious thermally conductive pads? A:Silicone-free thermally conductive pad, pad without silicone oil when use, which ensures no pollution. Silicone thermally conductive pad remains the good properties (e.g. mechanical property, weatherability, etc.) and good adaptability in use temperature and mechanical when in use; Silicone-free thermally conductive pad has lower use temperature with the specific process. 6 Q:How to select TIM? A:Type of TIM may be determined first for your application; then select appropriate TIM according to the parameters (e.g. thermal conductivity, size, thickness, density, hardness, dielectric breakdown voltage, use temperature, etc.) The selection of thickness is related with the aim position and gap size, as well as the parameters of product (e.g. density, hardness, compression rate, etc.) Sample tests before decision are suggested. The selection of thermal conductivity is determined by the product heat power and cooling capacity of heat sink. Each application has specific characteristics that determine which TIM will optimize thermal performance. Select a match of two TIM that best fit the application, then conduct testing to determine which material performs the best. 7 Q:What do the applications of TIM include? A:Telecommunication, network equipment, data communication, LED, automotive electronic, consumer electronic, medical equipment military, aerospace, etc. TIM building a part number Therm-Pad 1000 A1 Gumming conductivity ly conductive insulator series ly conductive material Therm-Gap 2400S20 DC1 Single-Face hardening Hardness conductivity ly conductive gap filling material series ly conductive material Therm-Bond 900 conductivity ly conductive adhesive tape series ly conductive material Therm-Filler 1800 conductivity Two-Part thermally conductive liquid gap filler series ly conductive material Therm-Gel 3500S Single-Part conductivity One-Part thermally conductive liquid gap filler series ly conductive material Therm-Grease 1000 conductivity ly conductive grease compound series ly conductive material Therm-Form 320 conductivity ly conductive potting gel series ly conductive material Therm-Flow 2000 conductivity ly conductive phase change material series ly conductive material

7 TIM Application Therm-Pad ly conductive insulator series Therm-Gap ly conductive gap filling material series Therm-Bond ly conductive adhesive tape series Therm-Filler ly conductive two-part liquid gap filler material series Therm-Gel ly conductive single-part liquid gap filler material series Therm-Flow ly conductive phase change material series Therm-Grease ly conductive grease compound series Therm-Form ly conductive potting gel series 5

8 Therm-Pad 1000 High-Performance, ly Conductive Insulator Good thermal conductivity, low thermal impedance High dielectric breakdown voltage Smooth, good surface compliance Low mounting pressure UL94-V0 Flame Rating RoHS, Halogen-Free Therm-Pad 1000 is a thermally conductive insulator made from thermally conductive silicone rubber with polyimide as the reinforcement carrier, which has good thermal conductivity and high dielectric strength. Therm-Pad 1000 is mainly used between a power semiconductor component and its heat sink, where requires high thermal conductivity and insulating property. Therm-Pad 1000 is soft and smooth, also has quite good surface compliance upon kinds of metal and ceramic components. Therm-Pad 1000 is able to achieve low interfacial thermal resistance and high-efficiency heat dissipation of power components under lower pressures with its high thermal conductivity. Standard Roll Form Packaging Size: ( Width * Thickness ) * Length ( 505mm * 0.15mm ) * 60m Power Supply Automotive Electronics Device Shelf Life: 18 months Conditions: Temperature: 15 < T < 30 Therm-Pad 1000 Typical Properties Color Pink Visual Inspection Thickness ( mm ) 0.15 ASTM D374 Reinforcement Carrier Polyimide / Hardness ( Shore A ) 90 ASTM D2240 Elongation at Break ( % ) 20 ASTM D412 Tensile Strength ( MPa ) 30 ASTM D412 Continuous Use Temperature ( ) -60~180 / Dielectric Breakdown Voltage ( kv ) 7 ASTM D149 Volume Resistivity ( Ω cm ) 1.1x10 12 ASTM D257 Conductivity ( W/m K ) 1.0 ASTM D5470 Impedance VS. Pressure ( Reference Sample: 0.15mm / Thickness ) Pressure ( psi ) Impedance ( in 2 /W ) Compression Rate ( % ) 3% 7% 10% 13% 14% 6

9 Therm-Pad 1300 High-Performance, ly Conductive Insulator Good thermal conductivity, low thermal impedance High dielectric breakdown voltage Smooth, good surface compliance Low mounting pressure UL94-V0 Flame Rating RoHS, Halogen-Free Therm-Pad 1300 is a thermally conductive insulator made from thermally conductive silicone rubber with polyimide as reinforcement carrier, which has good thermal conductivity and high dielectric strength. Therm-Pad 1300 is mainly used between a power semiconductor component and its heat sink, where requires high thermal conductivity and insulating property. Therm-Pad 1300 is soft and smooth, also has quite good surface compliance upon kinds of metal and ceramic components. Therm-Pad 1300 is able to achieve low interfacial thermal resistance and high-efficiency heat dissipation of power components under lower pressures with its high thermal conductivity. Standard Roll Form Packaging Size: ( Width * Thickness ) * Length ( 250mm * 0.15mm ) * 100m Power Supply Automotive Electronics Device Shelf Life: 18 months Conditions: Temperature: 15 < T < 30 Therm-Pad 1300 Typical Properties Color Yellow Visual Inspection Thickness ( mm ) 0.15 ASTM D374 Reinforcement Carrier Polyimide / Hardness ( Shore A ) 89 ASTM D2240 Elongation at Break ( % ) 40 ASTM D412 Tensile Strength ( MPa ) 26 ASTM D412 Continuous Use Temperature ( ) -60~180 / Dielectric Breakdown Voltage ( kv ) 6 ASTM D149 Volume Resistivity ( Ω cm ) 1.1x10 12 ASTM D257 Conductivity ( W/m K ) 1.3 ASTM D5470 Impedance VS. Pressure ( Reference Sample: 0.15mm / Thickness ) Pressure ( psi ) Impedance ( in 2 /W ) Compression Rate ( % ) 3% 7% 10% 13% 14% 7

10 Therm-Pad 1500 High-Performance, ly Conductive Insulator Good thermal conductivity, low thermal impedance High dielectric breakdown voltage Smooth, good surface compliance Low mounting pressure UL94-V0 Flame Rating RoHS, Halogen-Free Therm-Pad 1500 is a thermally conductive insulator made from thermally conductive silicone rubber with fiberglass as reinforcement carrier, which has good thermal conductivity and high dielectric strength. Therm-Pad 1500 is mainly used between a power semiconductor component and heat sink, where requires high thermal conductivity and insulating property. Therm-Pad 1500 is soft and smooth, also has quite good surface compliance upon kinds of metal and ceramic components. Therm-Pad 1500 is able to achieve low interfacial thermal resistance and high-efficiency heat dissipation of power components under lower pressures with its good thermal conductivity. Standard Roll Form Packaging Size: ( Width * Thickness ) * Length ( 305mm * 0.19mm ) * 76.2m Power Supply Automotive Electronics Device Shelf Life: 18 months Conditions: Temperature: 15 < T < 30 Therm-Pad 1500 Typical Properties Color Pink Visual Inspection Thickness ( mm ) 0.19 ASTM D374 Reinforcement Carrier Fiberglass / Hardness ( Shore A ) 88 ASTM D2240 Elongation at Break ( % ) 2.5 ASTM D412 Tensile Strength ( MPa ) 30 ASTM D412 Continuous Use Temperature ( ) -60~180 / Dielectric Breakdown Voltage ( kv ) 6 ASTM D149 Volume Resistivity ( Ω cm ) 1.1x10 12 ASTM D257 Conductivity ( W/m K ) 1.5 ASTM D5470 Impedance VS. Pressure ( Reference Sample: 0.19mm / Thickness ) Pressure ( psi ) Impedance ( in 2 /W ) Compression Rate ( % ) 3% 7% 10% 13% 14% 8

11 Therm-Pad 1600 High-Performance, ly Conductive Insulator Good thermal conductivity, low thermal impedance High dielectric breakdown voltage Smooth, good surface compliance Low mounting pressure UL94-V0 Flame Rating RoHS, Halogen-Free Therm-Pad 1600 is a thermally conductive insulator made from thermally conductive silicone rubber with fiberglass as reinforcement carrier, which has good thermal conductivity and high dielectric strength. Therm-Pad 1600 is mainly used between a power semiconductor component and heat sink, where requires high thermal conductivity and insulating property. Therm-Pad 1600 is soft and smooth, also has quite good surface compliance upon kinds of metal and ceramic components. Therm-Pad 1600 is able to achieve low interfacial thermal resistance and high-efficiency heat dissipation of power components under lower pressures with its high thermal conductivity. Standard Roll Form Packaging Size: ( Width * Thickness ) * Length ( 305mm * 0.23mm ) * 76.2m Power Supply Automotive Electronics Device Shelf Life: 18 months Conditions: Temperature: 15 < T < 30 Therm-Pad 1600 Typical Properties Color Pink Visual Inspection Thickness ( mm ) 0.23 ASTM D374 Reinforcement Carrier Fiberglass / Hardness ( Shore A ) 88 ASTM D2240 Elongation at Break ( % ) 3 ASTM D412 Tensile Strength ( MPa ) 28 ASTM D412 Continuous Use Temperature ( ) -60~180 / Dielectric Breakdown Voltage ( kv ) 6 ASTM D149 Volume Resistivity ( Ω cm ) 1.1x10 12 ASTM D257 Conductivity ( W/m K ) 1.6 ASTM D5470 Impedance VS. Pressure ( Reference Sample: 0.23mm / Thickness ) Pressure ( psi ) Impedance ( in 2 /W ) Compression Rate ( % ) 2% 6% 11% 13% 14% 9

12 Therm-Gap 1100SP05 Good Performance, ly Conductive, Composite Structure, Gap Filling Material Good thermal conductivity, low thermal impedance Composite structure, high dielectric breakdown strength Highly soft, splendid surface compatibility Excellent elasticity, high reliability in long-term work Multiple choices of thickness for wide range of application Therm-Gap 1100SP05 is a composite material with good thermal conductivity. Therm-Gap 1100SP05 is able to achieve low interfacial thermal resistance under lower pressures. Therm-Gap 1100SP05 is mainly used between power components and the aluminous heat sinks or machine casings, which can eliminate air effectively and achieve excellent fill effects. Therm-Gap 1100SP05 is resistant to high voltage and has good thermostability, which allows its safety and reliability. Therm-Gap 1100SP05 possesses highly soft property and excellent elasticity to reduce the structural stress and protect microchips. Device Power Components Sheet Form Packing Size: Length * Width ( Thickness ) 400mm * 580mm ( 0.5 T < 1.0mm ) 400mm * 560mm ( 1.0 T < 2.0mm ) 400mm * 520mm ( 2.0 T 5.0mm ) 400mm * 320mm ( 5.0 < T 10.0mm ) Shelf Life: 18 months Conditions: Temperature: 15 < T < 30 Therm-Gap 1100SP05 Typical Properties Color White/Pink Visual Inspection Thickness ( mm ) 0.5~10.0 ( mil ) ( 20~400 ) ASTM D374 Single Reinforcement Carrier ly Conductive Insulator / Density ( g/cc ) 1.6 ASTM D792 Hardness ( Shore OO ) 5 ASTM D2240 Tensile Strength(MPa) 25 ASTM D412 Continuous Use Temperature ( ) -45~200 / Dielectric Breakdown Strength ( kv >10 ASTM D149 Volume Resistivity ( Ω cm ) 9.6x10 12 ASTM D257 Conductivity ( W/m K ) 1.1 ASTM D5470 Impedance VS. Pressure ( Reference Sample: 1mm / Thickness ) Pressure ( psi ) Impedance ( in 2 /W ) Compression Rate ( % ) 20% 34% 46% 56% 62% 10

13 Therm-Gap 1200 Good Performance, ly Conductive, Gap Filling Material Good thermal conductivity, low thermal impedance High dielectric breakdown strength Soft, splendid surface compatibility Excellent elasticity, high reliability in long-term work Multiple choices of thickness for wide range of application Therm-Gap 1200 has excellent thermal conductivity, and can achieve low interfacial thermal resistance under lower pressures. Therm-Gap 1200 is mainly used between power components and the aluminous heat sinks or machine casings, which can eliminate air effectively and achieve excellent fill effects. Therm-Gap 1200 is resistant to high voltage and has good thermostability, which allows its safety and reliability. Therm-Gap 1200 possesses highly soft property and excellent elasticity to reduce the structural stress and protect microchips. Device Power Components Sheet Form Packing Size: Length * Width ( Thickness ) 470mm * 470mm ( 0.25 T < 1.0mm ) 400mm * 400mm ( 1.00 T < 2.0mm ) 400mm * 200mm ( 2.00 T 5.0mm ) Shelf Life: 18 months Conditions: Temperature: 15 < T < 30 Therm-Gap 1200 Typical Properties Color Black Visual Inspection Thickness ( mm ) 0.25~ ~5.0 ( mil ) (10~30) (40~200) ASTM D374 Fiberglass Reinforcement Carrier Yes No / Density ( g/cc ) 2.40 ASTM D792 Hardness ( Shore OO ) ASTM D2240 Continuous Use Temperature ( ) -45~200 / Dielectric Breakdown Strength ( kv 6 ASTM D149 Volume Resistivity ( Ω cm ) 9.6x10 12 ASTM D257 Conductivity ( W/m K ) 1.2 ASTM D5470 Impedance VS. Pressure ( Reference Sample: 1mm / Thickness ) Pressure ( psi ) Impedance ( in 2 /W ) Compression Rate ( % ) 6% 12% 20% 26% 28% 11

14 Therm-Gap 1300 Good Performance, ly Conductive, Gap Filling Material Highly soft, splendid surface wettability Good thermal conductivity, low thermal impedance High dielectric breakdown strength Low silicone oil leakage rate Excellent elasticity, high reliability in long-term work Therm-Gap 1300 has excellent thermal conductivity, and can achieve low interfacial thermal resistance under lower pressures. Therm-Gap 1300 is mainly used between power components and the aluminous heat sinks or machine casings, which can eliminate air effectively and achieve excellent fill effects. Therm-Gap 1300 is resistant to high voltage and has good thermostability, which allows its safety and reliability. Therm-Gap 1300 possesses highly soft property and excellent elasticity to reduce the structural stress and protect microchips. Device Power Components Sheet Form Packing Size: Length * Width ( Thickness ) 470mm * 470mm ( 0.25 T < 1.0mm ) 400mm * 400mm ( 1.00 T < 2.0mm ) 400mm * 200mm ( 2.00 T 5.0mm ) Shelf Life: 18 months Conditions: Temperature: 15 < T < 30 Therm-Gap 1300 Typical Properties Color Light green Visual Inspection Thickness ( mm ) 0.25~ ~5.0 ( mil ) (10~30) (40~200) ASTM D374 Fiberglass Reinforcement Carrier Yes No / Density ( g/cc ) 2.40 ASTM D792 Hardness ( Shore OO ) ASTM D2240 Continuous Use Temperature ( ) -45~200 / Dielectric Breakdown Strength ( kv > 6 ASTM D149 Volume Resistivity ( Ω cm ) 9.6x10 12 ASTM D257 Conductivity ( W/m K ) 1.3 ASTM D5470 Impedance VS. Pressure ( Reference Sample: 1mm / Thickness ) Pressure ( psi ) Impedance ( in 2 /W ) Compression Rate ( % ) 13% 22% 31% 38% 42% 12

15 Therm-Gap 1300SF High Performance ly Conductive, Silicone-Free Gap Filling Material Good thermal conductivity, low thermal impedance No silicone outgassing, no silicone extraction Medium hardness, splendid surface compatibility Excellent elasticity, high reliability in long-term work Multiple choices of thickness for wide range of application Therm-Gap 1300SF has excellent thermal conductivity, and can achieve low interfacial thermal resistance under lower pressures. Therm-Gap 1300SF is mainly used between power components and the aluminous heat sinks or machine casings, which can eliminate air effectively and achieve excellent fill effects. Therm-Gap 1300SF is a thermal material with no silicone oil leakage, and has good thermostability, which allows its safety and reliability. Therm-Gap 1300SF possesses highly soft property and excellent elasticity to reduce the structural stress and protect microchips. Device Other Silicone-sensitive Devices Sheet Form Packing Size: Length * Width ( Thickness ) 400mm * 400mm ( 0.5 T < 2.0mm ) 400mm * 200mm ( 2.0 T 5.0mm ) Shelf Life: 12 months Conditions: Temperature: 15 < T < 30 Therm-Gap 1300SF Typical Properties Color White Visual Inspection Thickness ( mm ) 0.50~5.0 ( mil ) ( 20~200 ) ASTM D374 Fiberglass Reinforcement Carrier No / Density ( g/cc ) 2.60 ASTM D792 Hardness ( Shore OO ) 70 ASTM D2240 Continuous Use Temperature ( ) -15~85 / Dielectric Breakdown Strength ( kv 6 ASTM D149 Volume Resistivity ( Ω cm ) 9.6x10 12 ASTM D257 Flame Rating V-2 UL94 Conductivity ( W/m K ) 1.3 ASTM D5470 Impedance VS. Pressure ( Reference Sample: 1mm / Thickness ) Pressure ( psi ) Impedance ( in 2 /W ) Compression Rate ( % ) 6% 10% 14% 18% 20% 13

16 Therm-Gap 1300SP Good Performance, ly Conductive, Composite Structure, Gap Filling Material Good thermal conductivity, low thermal impedance Composite structure, high dielectric breakdown strength Highly soft, splendid surface compatibility Excellent elasticity, high reliability in long-term work Multiple choices of thickness for wide range of application Therm-Gap 1300SP is a composite material with good thermal conductivity. Therm-Gap 1300SP is able to achieve low interfacial thermal resistance under lower pressures. Therm-Gap 1300SP is mainly used between power components and the aluminous heat sinks or machine casings, which can eliminate air effectively and achieve excellent fill effects. Therm-Gap 1300SP is resistant to high voltage and has good thermostability, which allows its safety and reliability. Therm-Gap 1300SP possesses highly soft property and excellent elasticity to reduce the structural stress and protect microchips. Device Power Components Sheet Form Packing Size: Length * Width ( Thickness ) 400mm * 580mm ( 0.5 T < 1.0mm ) 400mm * 560mm ( 1.0 T < 2.0mm ) 400mm * 520mm ( 2.0 T 5.0mm ) 400mm * 320mm ( 5.0 < T 10.0mm ) Shelf Life: 18 months Conditions: Temperature: 15 < T < 30 Therm-Gap 1300SP Typical Properties Color Light green/pink Visual Inspection Thickness ( mm ) 0.50~10.0 ( mil ) ( 20~400 ) ASTM D374 Single Reinforcement Carrier ly Conductive Insulator / Density ( g/cc ) 2.30 ASTM D792 Hardness ( Shore OO ) 30 ASTM D2240 Tensile Strength ( MPa ) 25 ASTM D412 Continuous Use Temperature ( ) -45~200 / Dielectric Breakdown Strength ( kv > 10 ASTM D149 Volume Resistivity ( Ω cm ) 9.6x10 12 ASTM D257 Conductivity ( W/m K ) 1.3 ASTM D5470 Impedance VS. Pressure ( Reference Sample: 1mm / Thickness ) Pressure ( psi ) Impedance ( in 2 /W ) Compression Rate ( % ) 12% 21% 30% 36% 40% 14

17 Therm-Gap 1500 Good Performance, ly Conductive, Gap Filling Material Good thermal conductivity, low thermal impedance High dielectric breakdown strength Highly soft, splendid surface compatibility Excellent elasticity, high reliability in long-term work Multiple choices of thickness for wide range of application Therm-Gap 1500 has excellent thermal conductivity, and can achieve low interfacial thermal resistance under lower pressures. Therm-Gap 1500 is mainly used between power components and the aluminous heat sinks or machine casings, which can eliminate air effectively and achieve excellent fill effects. Therm-Gap 1500 is resistant to high voltage and has good thermostability, which allows its safety and reliability. Therm-Gap 1500 possesses highly soft property and excellent elasticity to reduce the structure stress and protect microchips. Device Power Components Sheet Form Packing Size: Length * Width ( Thickness ) 470mm * 470mm ( 0.25 T < 1.0mm ) 400mm * 400mm ( 1.00 T < 2.0mm ) 400mm * 200mm ( 2.00 T 5.0mm ) Shelf Life: 18 months Conditions: Temperature: 15 < T < 30 Therm-Gap 1500 Typical Properties Color White Visual Inspection Thickness ( mm ) 0.25~ ~5.0 ( mil ) (10~30) (40~200) ASTM D374 Fiberglass Reinforcement Carrier Yes No / Density ( g/cc ) 2.40 ASTM D792 Hardness ( Shore OO ) ASTM D2240 Continuous Use Temperature ( ) -45~200 / Dielectric Breakdown Strength ( kv 6 ASTM D149 Volume Resistivity ( Ω cm ) 9.6x10 12 ASTM D257 Conductivity ( W/m K ) 1.5 ASTM D5470 Impedance VS. Pressure ( Reference Sample: 1mm / Thickness ) Pressure ( psi ) Impedance ( in 2 /W ) Compression Rate ( % ) 6% 12% 20% 26% 28% 15

18 Therm-Gap 1500BS40 Good Performance, ly Conductive, Gap Filling Material Good thermal conductivity, low thermal impedance High dielectric breakdown strength Soft, splendid surface compatibility Excellent elasticity, high reliability in long-term work Multiple choices of thickness for wide range of application Therm-Gap 1500BS40 has excellent thermal conductivity, and can achieve low interfacial thermal resistance under lower pressures. Therm-Gap 1500BS40 is mainly used between power components and the aluminous heat sinks or machine casings, which can eliminate air effectively and achieve excellent fill effects. Therm-Gap 1500BS40 is resistant to high voltage and has good thermostability, which allows its safety and reliability. Therm-Gap 1500BS40 possesses highly soft property and excellent elasticity to reduce the structure stress and protect microchips. Device Power Components Sheet Form Packing Size: Length * Width ( Thickness ) 400mm * 400mm ( 0.5 T < 2.0mm ) 400mm * 200mm ( 2.0 T 5.0mm ) Shelf Life: 18 months Conditions: Temperature: 15 < T < 30 Therm-Gap 1500BS40 Typical Properties Color Black Visual Inspection Thickness ( mm ) 0.5~5.0 ( mil ) ( 20~200) ASTM D374 Fiberglass Reinforcement Carrier No / Density ( g/cc ) 2.40 ASTM D792 Hardness ( Shore OO ) 40 ASTM D2240 Continuous Use Temperature ( ) -45~200 / Dielectric Breakdown Strength ( kv 6 ASTM D149 Volume Resistivity ( Ω cm ) 9.6x10 12 ASTM D257 Conductivity ( W/m K ) 1.5 ASTM D5470 Impedance VS. Pressure ( Reference Sample: 1mm / Thickness ) Pressure ( psi ) Impedance ( in 2 /W ) Compression Rate ( % ) 2% 14% 22% 28% 30% 16

19 Therm-Gap 1800 Good Performance, ly Conductive, Gap Filling Material Good thermal conductivity, low thermal impedance Composite structure, high dielectric breakdown strength Highly soft, splendid surface compatibility Excellent elasticity, high reliability in long-term work Multiple choices of thickness for wide range of application Therm-Gap 1800 has good thermal conductivity and is able to achieve low interfacial thermal resistance under lower pressures. Therm-Gap 1800 is mainly used between power components and the aluminous heat sinks or machine casings, which can eliminate air effectively and achieve excellent fill effects. Therm-Gap 1800 is resistant to high voltage and has good thermostability, which allows its safety and reliability. Therm-Gap 1800 possesses highly soft property and excellent elasticity to reduce the structural stress and protect microchips. Device Power Components Sheet Form Packing Size: Length * Width ( Thickness ) 400mm * 400mm ( 1.0 T < 2.0mm ) 400mm * 200mm ( 2.0 T 5.0mm ) Shelf Life: 18 months Conditions: Temperature: 15 < T < 30 Therm-Gap 1800 Typical Properties Color Pink Visual Inspection Thickness ( mm ) 1.0~5.0 ( mil ) ( 40~200 ) ASTM D374 Fiberglass Reinforcement Carrier No / Density ( g/cc ) 2.60 ASTM D792 Hardness ( Shore OO ) 50 ASTM D2240 Continuous Use Temperature ( ) -45~200 / Dielectric Breakdown Strength ( kv > 6 ASTM D149 Volume Resistivity ( Ω cm ) 9.6x10 12 ASTM D257 Conductivity ( W/m K ) 1.8 ASTM D5470 Impedance VS. Pressure ( Reference Sample: 1mm / Thickness ) Pressure ( psi ) Impedance ( in 2 /W ) Compression Rate ( % ) 7% 14% 22% 28% 30% 17

20 Therm-Gap 2200 Good Performance, ly Conductive, Gap Filling Material Good thermal conductivity, low thermal impedance High dielectric breakdown strength Highly soft, splendid surface wettability Excellent elasticity, high reliability in long-term work Multiple choices of thickness for wide range of application Therm-Gap 2200 has good thermal conductivity and is able to achieve low interfacial thermal resistance under lower pressures. Therm-Gap 2200 is mainly used between power components and the aluminous heat sinks or machine casings, which can eliminate air effectively and achieve excellent fill effects. Therm-Gap 2200 is resistant to high voltage and has good thermostability, which allows its safety and reliability. Therm-Gap 2200 possesses highly soft property and excellent elasticity to reduce the structural stress and protect microchips. Device Power Components Sheet Form Packing Size: Length * Width ( Thickness ) 400mm * 400mm ( 1.0 T < 2.0mm ) 400mm * 200mm ( 2.0 T 5.0mm ) Shelf Life: 18 months Conditions: Temperature: 15 < T < 30 Therm-Gap 2200 Typical Properties Color Blue Visual Inspection Thickness ( mm ) 1.0~5.0 ( mil ) ( 40~200 ) ASTM D374 Fiberglass Reinforcement Carrier No / Density ( g/cc ) 2.70 ASTM D792 Hardness ( Shore OO ) 55 ASTM D2240 Continuous Use Temperature ( ) -45~200 / Dielectric Breakdown Strength ( kv > 6 ASTM D149 Volume Resistivity ( Ω cm ) 9.6x10 12 ASTM D257 Conductivity ( W/m K ) 2.2 ASTM D5470 Impedance VS. Pressure ( Reference Sample: 1mm / Thickness ) Pressure ( psi ) Impedance ( in 2 /W ) Compression Rate ( % ) 6% 12% 20% 26% 28% 18

21 Therm-Gap 2400 High Performance, ly Conductive, Gap Filling Material High thermal conductivity, low thermal impedance High dielectric breakdown strength Highly soft, splendid surface wettability Excellent elasticity, high reliability in long-term work Multiple choices of thickness for wide range of application Therm-Gap 2400 has high thermal conductivity and is able to achieve low interfacial thermal resistance under lower pressures. Therm-Gap 2400 is mainly used between power components and the aluminous heat sinks or machine casings, which can eliminate air effectively and achieve excellent fill effects. Therm-Gap 2400 is resistant to high voltage and has good thermostability, which allows its safety and reliability. Therm-Gap 2400 possesses highly soft property and excellent elasticity to reduce the structural stress and protect microchips. Device Power Components Sheet Form Packing Size: Length * Width ( Thickness ) 400mm * 400mm ( 1.0 T < 2.0mm ) 400mm * 200mm ( 2.0 T 5.0mm ) Shelf Life: 18 months Conditions: Temperature: 15 < T < 30 Therm-Gap 2400 Typical Properties Color Orange Visual Inspection Thickness ( mm ) 1.0~5.0 ( mil ) ( 40~200 ) ASTM D374 Fiberglass Reinforcement Carrier No / Density ( g/cc ) 2.60 ASTM D792 Hardness ( Shore OO ) 45 ASTM D2240 Continuous Use Temperature ( ) -45~200 / Dielectric Breakdown Strength ( kv > 6 ASTM D149 Volume Resistivity ( Ω cm ) 9.6x10 12 ASTM D257 Conductivity ( W/m K ) 2.4 ASTM D5470 Impedance VS. Pressure ( Reference Sample: 1mm / Thickness ) Pressure ( psi ) Impedance ( in 2 /W ) Compression Rate ( % ) 8% 16% 24% 30% 34% 19

22 Therm-Gap 2400S20 High Performance, ly Conductive, Gap Filling Material High thermal conductivity low thermal impedance High dielectric breakdown strength, splendid surface wettability Highly soft, fiberglass reinforced Excellent elasticity, high reliability in long-term work Multiple choices of thickness for wide range of application Therm-Gap 2400S20 has high thermal conductivity and is able to achieve low interfacial thermal resistance under lower pressures. Therm-Gap 2400S20 is mainly used between power components and the aluminous heat sinks or machine casings, which can eliminate air effectively and achieve excellent fill effects. Therm-Gap 2400S20 is resistant to high voltage and has good thermostability, which allows its safety and reliability. Therm-Gap 2400S20 possesses highly soft property and excellent elasticity to reduce the structural stress and protect microchips. Device Power Components Sheet Form Packing Size: Length * Width ( Thickness ) 400mm * 200mm ( 0.5 T 5.0mm ) Shelf Life: 18 months Conditions: Temperature: 15 < T < 30 Therm-Gap 2400S20 Typical Properties Color Blue Visual Inspection Thickness ( mm ) 0.50~5.0 ( mil ) ( 20~200 ) ASTM D374 Fiberglass Reinforcement Carrier Yes / Density ( g/cc ) 2.80 ASTM D792 Hardness ( Shore OO ) 20 ASTM D2240 Continuous Use Temperature ( ) -45~200 / Dielectric Breakdown Strength ( kv > 6 ASTM D149 Volume Resistivity ( Ω cm ) 1.5x10 13 ASTM D257 Conductivity ( W/m K ) 2.6 ASTM D5470 Impedance VS. Pressure ( Reference Sample: 1mm / Thickness ) Pressure ( psi ) Impedance ( in 2 /W ) Compression Rate ( % ) 22% 36% 48% 58% 66% 20

23 Therm-Gap 2500BUS High Performance, ly Conductive, Gap Filling Material High thermal conductivity, low thermal impedance High dielectric breakdown strength Medium hardness, splendid surface compatibility Excellent elasticity, high reliability in long-term work Multiple choices of thickness for wide range of application Therm-Gap 2500BUS has high thermal conductivity and is able to achieve low interfacial thermal resistance under lower pressures. Therm-Gap 2500BUS is mainly used between power components and the aluminous heat sinks or machine casings, which can eliminate air effectively and achieve excellent fill effects. Therm-Gap 2500BUS is resistant to high voltage and has good thermostability, which allows its safety and reliability. Therm-Gap 2500BUS possesses highly soft property and excellent elasticity to reduce the structural stress and protect microchips. Device Power Components Sheet Form Packing Size: Length * Width ( Thickness ) 400mm * 400mm ( 0.18 T < 0.25mm ) 470mm * 470mm ( 0.25 T < 1.0mm ) Shelf Life: 18 months Conditions: Temperature: 15 < T < 30 Therm-Gap 2500BUS Typical Properties Color Blue Visual Inspection Thickness ( mm ) 0.18~ ~1.0 ( 1.0 is not included ) ( mil ) (7~9.6) ( 10~40 ) ASTM D374 Fiberglass Reinforcement Carrier Yes / Density ( g/cc ) 2.50 ASTM D792 Hardness ( Shore OO ) ASTM D2240 Continuous Use Temperature ( ) -45~200 / Dielectric Breakdown Strength ( kv 3 ASTM D149 Volume Resistivity ( Ω cm ) 9.6x10 12 ASTM D257 Conductivity ( W/m K ) 2.5 ASTM D5470 Impedance VS. Pressure ( Reference Sample: 0.25mm / Thickness ) Pressure ( psi ) Impedance ( in 2 /W ) Compression Rate ( % ) 5% 8% 12% 14% 16% 21

24 Therm-Gap 2800 High Performance, ly Conductive, Gap Filling Material High thermal conductivity, low thermal impedance High dielectric breakdown strength Splendid surface wettability Excellent elasticity, high reliability in long-term work Multiple choices of thickness for wide range of application Therm-Gap 2800 has high thermal conductivity and is able to achieve low interfacial thermal resistance under lower pressures. Therm-Gap 2800 is mainly used between power components and the aluminous heat sinks or machine casings, which can eliminate air effectively and achieve excellent fill effects. Therm-Gap 2800 is resistant to high voltage and has good thermostability, which allows its safety and reliability. Therm-Gap 2800 possesses highly soft property and excellent elasticity to reduce the structural stress and protect microchips. Device Power Components Sheet Form Packing Size: Length * Width ( Thickness ) 470mm * 470mm ( 0.25 T < 0.75mm ) 400mm * 400mm ( 1.00 T < 2.0mm ) 400mm * 200mm ( 2.00 T 5.0mm ) Shelf Life: 18 months Conditions: Temperature: 15 < T < 30 Therm-Gap 2800 Typical Properties Color Light blue Visual Inspection Thickness ( mm ) 0.25~ ~5.0 ( mil ) (10~30) ( 40~200 ) ASTM D374 Fiberglass Reinforcement Carrier Yes No / Density ( g/cc ) 2.80 ASTM D792 Hardness ( Shore OO ) ASTM D2240 Continuous Use Temperature ( ) -45~200 / Dielectric Breakdown Strength ( kv > 6 ASTM D149 Volume Resistivity ( Ω cm ) 1.5x10 13 ASTM D257 Conductivity ( W/m K ) 2.8 ASTM D5470 Impedance VS. Pressure ( Reference Sample: 1mm / Thickness ) Pressure ( psi ) Impedance ( in 2 /W ) Compression Rate ( % ) 12% 20% 28% 35% 40% 22

25 Therm-Gap 5000 High Performance, ly Conductive, Gap Filling Material Excellent thermal conductivity, extremely low thermal impedance High dielectric breakdown strength Splendid surface wettability Excellent elasticity, high reliability in long-term work Multiple choices of thickness for wide range of application Therm-Gap 5000 has high thermal conductivity and is able to achieve low interfacial thermal resistance under lower pressures. Therm-Gap 5000 is mainly used between power components and the aluminous heat sinks or machine casings, which can eliminate air effectively and achieve excellent fill effects. Therm-Gap 5000 is resistant to high voltage and has good thermostability, which allows its safety and reliability. Therm-Gap 5000 possesses highly soft property and excellent elasticity to reduce the structural stress and protect microchips. Device Power Components Sheet Form Packing Size: Length * Width ( Thickness ) 400mm * 200mm ( 0.5 T 5.0mm ) Shelf Life: 18 months Conditions: Temperature: 15 < T < 30 Therm-Gap 5000 Typical Properties Color Light blue Visual Inspection Thickness ( mm ) 0.5~ ~5.0 ( mil ) ( 20~30 ) ( 40~200 ) ASTM D374 Fiberglass Reinforcement Carrier Yes No / Density ( g/cc ) 3.0 ASTM D792 Hardness ( Shore OO ) ASTM D2240 Continuous Use Temperature ( ) -45~200 / Dielectric Breakdown Strength ( kv > 6 ASTM D149 Volume Resistivity ( Ω cm ) 1.5x10 13 ASTM D257 Conductivity ( W/m K ) 5.0 ASTM D5470 Impedance VS. Pressure ( Reference Sample: 1mm / Thickness ) Pressure ( psi ) Impedance ( in 2 /W ) Compression Rate ( % ) 8% 15% 21% 25% 29% 23

26 Therm-Gap 7000A High Performance, ly Conductive, Gap Filling Material High thermal conductivity, low thermal impedance High dielectric breakdown strength Highly soft, splendid surface wettability Excellent elasticity, high reliability in long-term work Multiple choices of thickness for wide range of application Therm-Gap 7000A has high thermal conductivity and is able to achieve low interfacial thermal resistance under lower pressures. Therm-Gap 7000A is mainly used between power components and the aluminous heat sinks or machine casings, which can eliminate air effectively and achieve excellent fill effects. Therm-Gap 7000A is resistant to high voltage and has good thermostability, which allows its safety and reliability. Therm-Gap 7000A possesses highly soft property and excellent elasticity to reduce the structural stress and protect microchips. Device Power Components Sheet Form Packing Size: Length * Width ( Thickness ) 400mm * 200mm ( 1.0 T 10.0mm ) Shelf Life: 18 months Conditions: Temperature: 15 < T < 30 Therm-Gap 7000A Typical Properties Color Light blue Visual Inspection Thickness ( mm ) 1.0~10.0 ( mil ) ( 40~400 ) ASTM D374 Fiberglass Reinforcement Carrier No / Density ( g/cc ) 3.3 ASTM D792 Hardness ( Shore OO ) 55 ASTM D2240 Continuous Use Temperature ( ) -40~150 / Dielectric Breakdown Strength ( kv > 6 ASTM D149 Volume Resistivity ( Ω cm ) 9.6x10 12 ASTM D257 Conductivity ( W/m K ) 7.0 ASTM D5470 Impedance VS. Pressure ( Reference Sample: 1mm / Thickness ) Pressure ( psi ) Impedance ( in 2 /W ) Compression Rate ( % ) 2% 6% 8% 18% 28% 24

27 Therm-Filler 1800 Two-Part, ly Conductive Liquid Gap Filling Material Two-Part 1:1, 100% solids Curing at room or elevated temperatures Resistant to high voltage, working well on the irregular structure gap Excellent mechanical property and weather resistance Therm-Filler 1800 is a thermally conductive, liquid gap filling material, curing to a soft, highly thermally conductive, form-in-place elastomer at room or elevated temperatures. Therm-Filler 1800 possesses excellent structural applicability and ultra-conforming property, as well as fills the gaps fully, for components such as a heat sink, uneven ceramic or irregular cavity. Therm-Filler 1800 is resistant to high voltage and has good thermostability, which allows its safety and reliability. Therm-Filler 1800 flows under pressure like grease before cure and will not pump from the interface as a result of thermal cycling after cure. In addition, it can play the same role as the thermally conductive insulator after cure. Device Power Components Supplied in syringe or canning form Packing Manner: Two-Part 1: 1, Mixed syringe Volume: 50cc / 400cc Shelf Life: 6 months Temperature: 15 < T < 30 Therm-Filler 1800 Typical Properties Performance before Mixture A Part B Part Color White Yellow Visual Inspection Viscosity ( mpa s ) 250x x10 3 ASTM D2196 Density ( g/cc ) ASTM D792 Mix Ratio 1:1 / Shelf ( months ) 6 6 / Performance after Mixture Color Yellow Visual Inspection Hardness ( Shore OO ) 55 ( 1:1 as cured ) ASTM D2240 Conductivity ( W/m K ) 1.8 ASTM D5470 Dielectric Breakdown Strength ( kv 6 ASTM D149 Volume Resistivity ( Ω cm ) 9.6x10 12 ASTM D257 Surface Curing Time ( H ) 1.0 / Continuous Use Temperature ( ) -45~200 / Cure Schedule 25 ( H ) 5 / 100 ( min ) 15 / Impedance VS. Pressure ( Reference Sample 1mm / Thickness ) Pressure ( psi ) Impedance ( in 2 /W ) Compression Rate ( % ) 6% 12% 20% 26% 28% 25

28 Therm-Filler 3500 Two-Part, ly Conductive Liquid Gap Filling Material Two-Part 1:1, 100% solids Curing at room or elevated temperatures Resistant to high voltage, working well on the irregular structure gap Excellent mechanical property and weather resistance Therm-Filler 3500 is a thermally conductive, liquid gap filling material, curing to a soft, highly thermally conductive, form-in-place elastomer at room or elevated temperatures. Therm-Filler 3500 possesses excellent structural applicability and ultra-conforming property, as well as fills the gaps fully, for components such as a heat sink, uneven ceramic or irregular cavity. Therm-Filler 3500 is resistant to high voltage and has good thermostability, which allows its safety and reliability. Therm-Filler 3500 flows under pressure like grease before cure and will not pump from the interface as a result of thermal cycling after cure. In addition, it can play the same role as the thermally conductive insulator after cure. Device Power Components Supplied in syringe or canning form Packing Manner: Two-Part 1: 1, Mixed syringe Volume: 50cc / 400cc Shelf Life: 6 months Temperature: 15 < T < 30 Therm-Filler 3500 Typical Properties Performance before Mixture A Part B Part Color White Yellow Visual Inspection Viscosity ( mpa s ) 250x x10 3 ASTM D2196 Density ( g/cc ) ASTM D792 Mix Ratio 1:1 / Shelf ( months ) 6 6 / Performance after Mixture Color Yellow Visual Inspection Hardness ( Shore OO ) 55 ( 1:1 as cured ) ASTM D2240 Conductivity ( W/m K ) 3.5 ASTM D5470 Dielectric Breakdown Strength ( kv 6 ASTM D149 Volume Resistivity ( Ω cm ) 9.6x10 12 ASTM D257 Surface Curing Time ( H ) 1.0 / Continuous Use Temperature ( ) -45~200 / Cure Schedule 25 ( H ) 5 / 100 ( min ) 40 / Impedance VS. Pressure ( Reference Sample: 1mm / Thickness ) Pressure ( psi ) Impedance ( in 2 /W ) Compression Rate ( % ) 6% 12% 20% 26% 28% 26

29 Therm-Gel 3500S Single-Part, ly Conductive Liquid Gap Filling Material Single-Part No curing with high reliability Working well on the irregular structure gap Resistant to high strength Excellent mechanical property and weather resistance Therm-Gel 3500S is a thermally conductive, form-in-place, liquid gap filling material. Therm-Gel 3500S possesses excellent structural applicability and ultraconforming property, as well as fills the gaps fully, for components such as a heat sink, uneven ceramic or irregular cavity. Therm-Gel 3500S is resistant to high voltage and has good thermostability, which allows its safety and reliabilty. Therm-Gel 3500S flows under pressure like grease and will not cure as a result of thermal cycling. Device Power Components Supplied in syringe or canning form Packing Manner: Single-Part Volume: 30cc / 300cc Shelf Life: 12 months Temperature: 15 < T < 30 Therm-Gel 3500S Typical Properties Color Yellow Visual Inspection Density ( g/cc ) 2.90 ASTM D792 Output ( g/min ) mm Needle under 90Psi Pressure (30cc canning) Typical Minimum Thickness ( mm ) 0.1 / Continuous Use Temperature ( ) -45~200 / Volume Resistivity ( Ω cm ) 9.6x10 13 ASTM D257 Expansion ( ppm/k ) 152 ASTM E831 Conductivity ( W/m K ) 3.5 ASTM D

30 Therm-Gel 3500S FR60 Single-Part, ly Conductive Liquid Gap Filling Material Single-Part No curing with high reliability Working well on the irregular structure gap Resistant to high strength Excellent mechanical property and weather resistance Therm-Gel 3500S FR60 is a thermally conductive, form-in-place, liquid gap filling material. Therm-Gel 3500S FR60 possesses excellent structural applicability and ultra-conforming property, as well as fills the gaps fully, for components such as a heat sink, uneven ceramic or irregular cavity. Therm-Gel 3500S FR60 is resistant to high voltage and has good thermostability, which allows its safety and reliabilty. Therm-Gel 3500S FR60 flows under pressure like grease and will not cure as a result of thermal cycling. Device Power Components Supplied in syringe or canning form Packing Manner: Single-Part Volume: 30cc / 300cc Shelf Life: 12 months Temperature: 15 < T < 30 Therm-Gel 3500S FR60Typical Properties Color Yellow Visual Inspection Density ( g/cc ) 2.40 ASTM D792 Output ( g/min ) mm Needle under 90Psi Pressure (30cc canning) Typical Minimum Thickness ( mm ) 0.1 / Continuous Use Temperature ( ) -45~200 / Volume Resistivity ( Ω cm ) 9.6x10 13 ASTM D257 Expansion ( ppm/k ) 152 ASTM E831 Conductivity ( W/m K ) 3.5 ASTM D

31 Therm-Gel 6000S Single-Part, ly Conductive Liquid Gap Filling Material Single-Part No curing with high reliability Working well on the irregular structure gap Resistant to high strength Excellent mechanical property and weather resistance Therm-Gel 6000S is a thermally conductive, form-in-place, liquid gap filling material. Therm-Gel 6000S possesses excellent structural applicability and ultraconforming property, as well as fills the gaps fully, for components such as a heat sink, uneven ceramic or irregular cavity. Therm-Gel 6000S is resistant to high voltage and has good thermostability, which allows its safety and reliabilty. Therm-Gel 6000S flows under pressure like grease and will not cure as a result of thermal cycling. Device Power Components Supplied in syringe or canning form Packing Manner: Single-Part Volume: 30cc / 300cc Shelf Life: 12 months Temperature: 15 < T < 30 Therm-Gel 6000S Typical Properties Color Ash Black Visual Inspection Density ( g/cc ) 2.40 ASTM D792 Typical Minimum Thickness ( mm ) 0.15 / Continuous Use Temperature ( ) -40~200 / Dielectric Breakdown Strength ( kv 4.3 ASTM D149 Volume Resistivity ( Ω cm ) 9.6x10 9 ASTM D257 Expansion ( ppm/k ) 152 ASTM E831 Conductivity ( W/m K ) 6.0 ASTM D

32 Therm-Bond 750 ly Conductive, Double-Sided Transfer Adhesive Tape Soft, easy to paste and transfer Resistance to heat aging Good thermal conductivity High bonding strength Die-Cut into various shapes Therm-Bond 750 is a white, thermally conductive, double-sided adhesive tape, with thermally conductive pressure sensitive adhesive coated on both side, which has soft tape and certain tensile strength. Therm-Bond 750 is covered by release film on two sides for die-cutting easily, and has high bonding strength for a variety of surfaces including many materials, which is intended for thermally conductive adhesive solutions of microwave components. Therm-Bond 750 maintains high cohesive strength in its bond layer, and will resist slipping or dripping while bearing the continuous shearing force at elevated temperature, in applications to paste on heat generating components. Communication Devices Computer Automatic Control Equipment Mobile Telephone Whole Roll: Width * Length 500mm * 50m Shelf Life: 24 months Temperature: 25±10 Therm-Bond 750 Typical Properties Color White Visual Inspection Thickness ( mm ) 0.05 ASTM D374 Adhesive Type Ceramic powder filling pressure sensitive adhesive / Release Liner Type Release film / Release Liner Thickness(mm) / / Property 180 Peel Strength ( N/100mm ) 32 ASTM D1000 Holding Power ( H ) ( 1kg/in² & 70 ) > 72 ASTM D3654 Continuous Use Temperature ( ) -45~125 / Conductivity ( W/m K ) 0.75 ASTM D5470 Impedance VS. Pressure ( Reference Sample: 0.05mm / Thickness ) Impedance ( in 2 /W ) 20psi psi 0.16 ASTM D psi

33 Therm-Bond 900 ly Conductive Double-Sided Adhesive Tape Soft, easy to paste and move Resistance to heat aging Good thermal conductivity High bonding strength Die-Cut into various shapes Therm-Bond 900 is a white, thermally conductive, double-sided adhesive tape, with fiber glass as baseband and thermally conductive pressure sensitive adhesive coated on both side, which has good double-sided thermally conductive performance and low thermal impedance. Therm-bond 900 is covered by release film on one side for die-cutting easily, and has high bonding strength for a variety of surfaces including many materials, which is intended for thermally conductive adhesive solutions of microwave components. Therm-Bond 900 maintains high cohesive strength in its bond layer, and will resist slipping or dripping while bearing the continuous shearing force at elevated temperature, in applications to paste on heat generating components. Communication Devices Computer Automatic Control Equipment Mobile Telephone Whole Roll: Length * Width 1030mm * 25m or 50m Shelf Life: 24 months Temperature: 15 < T < 35 Therm-Bond 900 Typical Properties Color White / Total Thickness ( mm ) 0.10 ASTM D374 Baseband Type Glass Fabric / 180 Peel Strength ( N/100mm ) 90 ASTM D1000 Holding Power( H ) ( 1kg/25mm & 70 ) > 72 ASTM D3654 Continuous Use Temperature ( ) -45~125 / Dielectric Breakdown Strength ( kv > 20 ASTM D149 Dielectric Breakdown Voltage ( kv ) > 3 ASTM D149 Conductivity ( W/m K ) 0.82 ASTM D5470 Impedance VS. Pressure Impedance ( in 2 /W ) 20psi psi 1.05 ASTM D psi

34 Therm-Bond X25A ly Conductive, Double-Sided Transfer Adhesive Tape Soft, easy to paste and transfer Resistance to heat aging Good thermal conductivity High bonding strength Die-Cut into various shapes Therm-Bond X25A is a white, thermally conductive, double-sided adhesive tape, with thermally conductive pressure sensitive adhesive coated on both side, which has soft tape and certain tensile strength. Therm-Bond X25A is covered by release film on two sides for die-cutting easily, and has high bonding strength for a variety of surfaces including many materials, which is intended for thermally conductive adhesive solutions of microwave components. Therm-Bond X25A maintains high cohesive strength in its bond layer, and will resist slipping or dripping while bearing the continuous shearing force at elevated temperature, in applications to paste on heat generating components. Communication Devices Computer Automatic Control Equipment Mobile Telephone Whole Roll: Width * Length 520mm * 100m Shelf Life: 24 months Temperature: 15 < T < 35 Therm-Bond X25A Typical Properties Color White Visual Inspection Thickness ( mm ) ASTM D374 Adhesive Type Ceramic powder filling pressure sensitive adhesive / Release Liner Type PET / Release Liner Thickness(mm) / / Property 180 Peel Strength ( N/100mm ) > 60 ASTM D Holding Power ( 1kg/25mm ) H > 24 ASTM D3654 Continuous Use Temperature ( ) -45~125 / Impedance VS. Pressure Impedance ( in 2 /W ) 20psi psi 0.20 ASTM D psi

35 Therm-Grease 1000 High Performance, ly Conductive Grease Compound Good thermal conductivity, low thermal impedance Good thixotropy, operating easily Low sedimentation, good chemical and mechanical stability Good crumpling resistance, high reliability in long-term work Suitable for silk-screen printing process Therm-Grease 1000 is a thermally conductive grease compound designed for use as a thermal interface material between a high-power electronic component and a heat sink. Therm-Grease 1000 compound wets-out the thermal interfaces and flows to produce very low thermal impedance. The compound is able to cool the electronic components quickly and efficiently, in order to extend their shelf life and improve reliability. Therm-Grease 1000 is highly stabile from -45 to 150, and has good weatherability as well as dielectric properties, in addition to the good thermal conductivity, which will not produce the pressure when use. The compound meets the requirements of electronics industries as a thermally conductive interface material. Device Power Components Canning Form Packing Weight: 1kg/can Shelf Life: 12 months Conditions: Temperature: 15 < T < 30 Note: Stirring uniformly before use when finding any sedimentation Therm-Grease 1000 Typical Properties Color White Visual Inspection Volatilization Rate ( 24H@200 ) % < 1.0 / Penetration Rate ( 24H@150 ) % < 0.05 / Density ( g/cc ) 2.20 ASTM D792 Viscosity ( mpa s ) 100~300 ( * 10 3 ) ASTM D2196 Continuous Use Temperature ( ) -45~150 / Conductivity ( W/m K ) 1.0 ASTM D5470 Impedance VS. Pressure ( Reference Sample: 0.1mm / Thickness ) Pressure ( psi ) Impedance ( in 2 /W )

36 Therm-Grease 2000 High Performance, ly Conductive Grease Compound Good thermal conductivity, low thermal impedance Good thixotropy, operating easily Low sedimentation, good chemical and mechanical stability Good crumpling resistance, high reliability in long-term work Suitable for silk-screen printing process Therm-Grease 2000 is a thermally conductive grease compound designed for use as a thermal interface material between a high-power electronic component and a heat sink. Therm-Grease 2000 compound wets-out the thermal interfaces and flows to produce very low thermal impedance. The compound is able to cool the electronic components quickly and efficiently, in order to extend their shelf life and improve reliability. Therm-Grease 2000 is highly stabile from -45 to 150, and has good weatherability as well as dielectric properties, in addition to the good thermal conductivity, which will not produce the pressure when use. The compound meets the requirements of electronics industries as a thermally conductive interface material. Device Power Components Canning Form Packing Weight: 1kg/can Shelf Life: 12 months Conditions: Temperature: 15 < T < 30 Note: Stirring uniformly before use when finding any sedimentation Therm-Grease 2000 Typical Properties Color Gray Visual Inspection Volatilization Rate ( 24H@200 ) % < 0.7 / Penetration Rate ( 24H@150 ) % < 0.05 / Density ( g/cc ) 2.80 ASTM D792 Viscosity ( mpa s ) 40~250 ( * 10 3 ) ASTM D2196 Continuous Use Temperature ( ) -45~150 / Conductivity ( W/m K ) 2.0 ASTM D5470 Impedance VS. Pressure ( Reference Sample: 0.1mm / Thickness ) Pressure ( psi ) Impedance ( in 2 /W )

37 Therm-Grease 3800 High Performance, ly Conductive Grease Compound Excellent thermal conductivity, low thermal impedance Good thixotropy, operating easily Low sedimentation, good chemical and mechanical stability Good crumpling resistance, high reliability in long-term work Suitable for silk-screen printing process Therm-Grease 3800 is a thermally conductive grease compound designed for use as a thermal interface material between a high-power electronic component and a heat sink. Therm-Grease 3800 compound wets-out the thermal interfaces and flows to produce very low thermal impedance. The compound is able to cool the electronic components quickly and efficiently, in order to extend their shelf life and improve reliability. Therm-Grease 3800 is highly stabile from -45 to 150, and has good weatherability as well as dielectric properties, in addition to the good thermal conductivity, which will not produce the pressure when use. The compound meets the requirements of electronics industries as a thermally conductive interface material. Device Power Components Canning Form Packing Weight: 1kg/can Shelf Life: 12 months Conditions: Temperature: 15 < T < 30 Note: Stirring uniformly before use when finding any sedimentation Therm-Grease 3800 Typical Properties Color Gray Visual Inspection Volatilization Rate ( 24H@200 ) % < 0.5 / Penetration Rate ( 24H@150 ) % < 0.05 / Density ( g/cc ) 3.2 ASTM D792 Viscosity ( mpa s ) 35~220 ( * 10 3 ) ASTM D2196 Continuous Use Temperature ( ) -45~150 / Conductivity ( W/m K ) 3.8 ASTM D5470 Impedance VS. Pressure ( Reference Sample: 0.1mm / Thickness ) Pressure ( psi ) Impedance ( in 2 /W )

38 Therm-Form 320 High Performance, ly Conductive Potting Gel Good thermal and insolating performance Good aging resistance Good flowability Good mechanical property and weather resistance Good ductility Therm-Form 320, thermal potting gel, is a two-part silicone rubber, which is designed to be used in electronic modules. Therm-Form 320 cures to a thermally conductive, elastic, and flameretardant rubber at room or elevated temperature. Therm-Form 320 is usually used by manual or automatic dispensing way. Connection between automotive electronic components and PCB Potting protection for car power supply module communication Equipment Frequency Converter, Sensor Structure Two-Part 1:1; 100% solids Silicone Elastomer Shelf Life: 12 months Conditions: Temperature: 15 < T < 30 Therm-Form 320 Typical Properties Performance before Mixture A Part B Part / Color Black White Visual Inspection Viscosity ( cps ASTM D2196 Mix Ratio 1:1 / Shelf Life@25 ( months ) 12 / Performance after Mixture Viscosity ( cps ) 1520 ASTM D2196 Hardness ( Shore A ) 55 ASTM D2240 Tensile Strength ( psi ) 178 ASTM D412 Elongation at Break ( % ) 40 ASTM D412 Density ( g/cm³ ) 1.26 ASTM D792 Surface Curing ( min ) 50~60 / Dielectric Breakdown Strength ( kv 10 ASTM D149 Volume Resistivity ( Ω cm ) 4.02x10 14 ASTM D257 Flame Rating ( 2.0mm ) V-0 UL94 Continuous Use Temperature ( ) -55~240 / Cure Schedule 25 ( H ) 16 / 100 ( min ) 30 / Conductivity ( W/m K ) 0.32 ASTM D5470 Impedance VS. Pressure ( Reference Sample: 1mm / Thickness ) Pressure ( psi ) Impedance ( in 2 /W )

39 Therm-Form 1600 High Performance, ly Conductive Potting Gel Good thermal and insolating performance Good aging resistance Good flowability Good mechanical property and weather resistance Good ductility Therm-Form 1600, thermal potting gel, is a two-part silicone rubber, which is designed to be used in electronic modules. Therm-Form 1600 cures to a thermally conductive, elastic, and flameretardant rubber at room or elevated temperature. Therm-Form 1600 is usually used by manual or automatic dispensing way. Connection between automotive electronic components and PCB Potting protection for car power supply module communication Equipment Frequency Converter, Sensor Structure Two-Part 1:1; 100% solids Silicone Elastomer Shelf Life: 12 months Conditions: Temperature: 15 < T < 30 Therm-Form 1600 Typical Properties Performance before Mixture A Part B Part / Color White Gray Visual Inspection Viscosity ( cps ASTM D2196 Mix Ratio 1:1 / Shelf Life@25 ( months ) 12 / Performance after Mixture Viscosity ( cps ) ASTM D2196 Hardness ( Shore A ) 60 ASTM D2240 Tensile Strength ( psi ) 115 ASTM D412 Elongation at Break ( % ) 10 ASTM D412 Density ( g/cm³ ) 2.5 ASTM D792 Surface Curing ( min ) 100 / Dielectric Breakdown Strength ( kv 10 ASTM D149 Volume Resistivity ( Ω cm ) 1.0x10 13 ASTM D257 Flame Rating ( 2.0mm ) V-0 UL94 Continuous Use Temperature ( ) -45~180 / Cure Schedule 25 ( H ) 15 / 100 ( min ) 15 / Conductivity ( W/m K ) 1.6 ASTM D5470 Impedance VS. Pressure ( Reference Sample: 1mm / Thickness ) Pressure ( psi ) Impedance ( in 2 /W )

40 Therm-Flow 1400 Phase Change Material High thermal conductivity, low thermal impedance phase change material Good compressibility Good wettability Good reliability Therm-Flow 1400 is a high-performance thermal phase change material with 58 of phase changing temperature. Therm-Flow 1400 is solid under room temperature, and fluid over phase changing temperature, having good wettability and compressibility. Therm-Flow 1400 is used to be attached between a heat sink and a power component to reduce thermal resistance with any sizes according to customer requirement. Computer Power Converter Device Shelf Life: 12 months Conditions: Temperature: 8 < T < 28 Therm-Flow 1400 Typical Properties Structure Ceramic particles filling non-silicon resin / Color Pink Visual Inspection Thickness ( mm ) / 0.2 ( mil ) (5 / 8) ASTM D374 Density ( g/cc ) 2.9 ASTM D792 Continuous Use Temperature ( ) -25~125 / Phase Changing Temperature ( ) 58 DSC Electric Volume Resistance ( Ω cm ) 1.0x10 14 ASTM D257 & 50psi ) Conductivity ( W/m K ) 1.4 ASTM D5470 Impedance ( in²/w ) 0.13 ASTM D

41 Therm-Flow 2000 Phase Change Material High thermal conductivity, low thermal impedance phase change material Good compressibility Good wettability Good reliability Therm-Flow 2000 is a high-performance thermal phase change material with 50 of phase changing temperature. Therm-Flow 2000 is solid under room temperature, and fluid over phase changing temperature, having good wettability and compressibility. Therm-Flow 2000 is used to be attached between a heat sink and a power component to reduce thermal resistance with any sizes according to customer requirement. Computer Power Converter Device Shelf Life: 12 months Conditions: Temperature: 8 < T < 28 Therm-Flow 2000 Typical Properties Structure phase change material / Color Gray Visual Inspection Thickness ( mm ) / 0.2 / 0.25 ( mil ) (5 / 8 / 10) ASTM D374 Density ( g/cc ) 2.5 ASTM D792 Continuous Use Temperature ( ) -40~130 / Phase Changing Temperature ( ) 50 DSC Electric Volume Resistance ( Ω cm ) 3.0x10 12 ASTM D257 & 50psi ) Conductivity ( W/m K ) 2.0 ASTM D5470 Impedance ( in²/w ) 0.04 ASTM D

42 Therm-Flow 3700 Phase Change Material High thermal conductivity, low thermal impedance phase change material Good compressibility Good wettability Good reliability Therm-Flow 3700 is a high-performance thermal phase change material with 50 of phase changing temperature. Therm-Flow 3700 is solid under room temperature, and fluid over phase changing temperature, having good wettability and compressibility. Therm-Flow 3700 is used to be attached between a heat sink and a power component to reduce thermal resistance with any sizes according to customer requirement. Computer Power Converter Device Shelf Life: 12 months Conditions: Temperature: 8 < T < 28 Therm-Flow 3700 Typical Properties Structure Ceramic particles filling non-silicon resin / Color Gray Visual Inspection Thickness ( mm ) / 0.2 / 0.25 ( mil ) (5 / 8 / 10) ASTM D374 Density ( g/cc ) 2.85 ASTM D792 Continuous Use Temperature ( ) -40~130 / Phase Changing Temperature ( ) 50 DSC Electric Volume Resistance ( Ω cm ) 1.0x10 12 ASTM D257 & 50psi ) Conductivity ( W/m K ) 3.7 ASTM D5470 Impedance ( in²/w ) 0.02 ASTM D