Data Sheet. ASMT-Jx32 3W Mini Power LED Light Source. Description. Features. Applications

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1 ASMT-J32 3W Mini Power LED Light Source Data Sheet Description The 3W Mini Power LED Light Source is a high performance energ efficient device which can handle high thermal and high driving current. The metal slug is electricall isolated. The White Mini Power LED is available in the range of color temperature from 2700K to 10000K. The low profile package design and ultra small footprint is suitable for a wide variet of applications especiall where space and height is a constraint. The package is compatible with reflow soldering process. To facilitate eas pick & place assembl, the LEDs are packed in EIA-compliant tape and reel. Features Available in Cool White, Neutral White and Warm White Small footprint and low profile Smmetrical outline Energ efficient Direct heat transfer from metal slug to mother board Compatible with reflow soldering process High current operation Long operation life Wide viewing angle Silicone encapsulation Non-ESD sensitive (threshold > 16kV) MSL 1 products Applications Sign backlight Safet, eit and emergenc sign lightings Specialt lighting such as task lighting and reading lights Retail displa Commercial lighting Accent or marker lightings, strip or step lightings Portable lightings, biccle head lamp, torch lights Decorative lighting Architectural lighting Pathwa lighting Street lighting Pedestrian street lighting Tunnel lighting CAUTION: Customer is advised to keep the LEDs in the MBB when not in use as prolonged eposure to environment might cause the silver plated leads to tarnish, which might cause difficulties in soldering.

2 Package Dimensions Ø Anode Lead NC Lens Cathode Mark NC NC Bod NC Cathode Lead Metal Slug Ø 1.70 Notes: 1. All dimensions in millimeters. 2. Tolerance is ±0.1 mm unless otherwise specified. 3. Terminal finish: Ag plating. 4. Corresponding NC (No Connection) leads adjacent to anode and cathode leads can be electricall short. Figure 1. ASMT-J32 package outline drawing 2

3 Part Numbering Sstem ASMT- J Note: 1. Please refer to Page 8 for selection details. Packaging Option Color Bin Selection Maimum Flu Bin Selection Minimum Flu Bin Selection Dice Tpe N InGaN Color W Cool White N Neutral White Y Warm White Device Selection Guide (T J = 25 C) Luminous Flu (Im), Φ V [1,2] Electricall Part Number Color Min. Tp. Ma. Test Current (ma) Dice Technolog Isolated Metal Slug ASMT-JW32-NWY01 Cool White InGaN Yes ASMT-JW32-NWYJ InGaN Yes ASMT-JN32-NWY01 Neutral White InGaN Yes ASMT-JN32-NWYH InGaN Yes ASMT-JY32-NWY01 Warm White InGaN Yes ASMT-JY32-NWYK InGaN Yes Notes: 1. Φ V is the total luminous flu output as measured with an integrating sphere at 25ms mono pulse condition. 2. Flu tolerance is ±10% Absolute Maimum Ratings Parameter ASMT-J32 Units DC Forward Current [1] 700 ma Peak Pulsing Current 2400 ma Power Dissipation 2730 mw LED Junction Temperature 135 C Operating Metal Slug Temperature Range at 350 ma -40 to +120 C Operating Metal Slug Temperature Range at 700 ma -40 to +105 C Storage Temperature Range -40 to C Soldering Temperature Refer to Figure 15 Reverse Voltage [2] Notes: 1. Derate linearl based on Figure Not designed for reverse bias operation. Not recommended 3

4 Optical Characteristics at 350 ma (T J = 25 C) Part Number Color Correlated Color Temperature, CCT (Kelvin) Viewing Angle, 2θ ½ [1] ( ) Luminous Efficienc (lm/w) Min. Ma. Tp. Tp. ASMT-JW32-NWY01 Cool White ASMT-JW32-NWYJ ASMT-JN32-NWY01 Neutral White ASMT-JN32-NWYH ASMT-JY32-NWY01 Warm White ASMT-JY32-NWYK Note: 1. θ½ is the off-ais angle where the luminous intensit is ½ the peak intensit. Electrical Characteristic at 350 ma (T J = 25 C) Dice Tpe Forward Voltage, V F (Volts) Thermal Resistance, Rθ J-MS ( C/W) [1] Min. Tp Ma. Tp. InGaN Note: 1. Rθ J-MS is Thermal Resistance from LED junction to metal slug. Optical and Electrical Characteristic at 700 ma (T J = 25 C) Part Number Color Luminous Flu (lm), φ V Forward Voltage, V F (Volts) ASMT-JW32-NWY01 Cool White ASMT-JW32-NWYJ ASMT-JN32-NWY01 Neutral White ASMT-JN32-NWYH ASMT-JY32-NWY01 Warm White ASMT-JY32-NWYK Tp. Tp. 4

5 RELATIVE INTENSITY WARM WHITE COOL WHITE WAVELENGTH - nm Figure 2. Relative Intensit vs. Wavelength for Cool White and Warm White RELATIVE INTENSITY WAVELENGTH - nm Figure 3. Relative Intensit vs. Wavelength for Neutral White RELATIVE LUMINOUS FLUX (NORMALIZED AT 350 ma) MONO PULSE CURRENT - ma Figure 4. Relative Luminous Flu vs. Mono Pulse Current FORWARD CURRENT - ma FORWARD VOLTAGE - V Figure 5. Forward Current vs. Forward Voltage IP - PULSE CURRENT - A t p - PULSE DURATION - sec Figure 6. Maimum pulse current vs. pulse duration Derated based on T A = 25 C, Rθ J-A = 30 C/W. D = t p T t p D = T I F IP - PULSE CURRENT - A D = t p - PULSE DURATION - sec Figure 7. Maimum pulse current vs. pulse duration Derated based on T A = 85 C, Rθ J-A = 30 C/W. D = t p T t p T I F 5

6 NORMALIZED INTENSITY ANGULAR DISPLACEMENT - DEGREES Figure 8. Radiation Pattern for Cool White, Warm White and Neutral White RELATIVE LIGHT OUTPUT (%) JUNCTION TEMPERATURE, T J - C JUNCTION TEMPERATURE, T J - C FORWARD VOLTAGE SHIFT - V Figure 9. Relative Light Output vs. Junction Temperature Figure 10. Forward Voltage Shift vs. Junction Temperature MAX ALLOWABLE DC CURRENT - ma Rθ J-A = 20 C/W Rθ J-A = 25 C/W Rθ J-A = 30 C/W AMBIENT TEMPERATURE, T A - C Figure 11. Maimum Forward Current vs. Ambient Temperature. Derated based on T JMAX = 135 C, Rθ J-A = 20 C/W, 25 C/W and 30 C/W MAX ALLOWABLE DC CURRENT - ma Rθ J-MS = 9 C/W METAL SLUG TEMPERATURE, T MS - C Figure 12. Maimum Forward Current vs. Metal Slug Temperature. Derated based on T JMAX = 135 C, Rθ J-MS = 9 C/W 6

7 Solder Pad ø1.90 Slug Indepdent ø3.2 Solder Pad 1.30 Figure 13. Recommended soldering land pattern Figure 14. Recommended pick and place nozzle tip. Inner diameter = 3.2 mm SEC. TEMPERATURE 217 C 200 C 150 C C 3 C/SEC. MAX. 3 C/SEC. MAX. 6 C/SEC. MAX SEC. 100 SEC. MAX. TIME Figure 15. Recommended Reflow Soldering Profile (Acc. to J-STD-020C) Note: For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN1060 Surface Mounting SMT LED Indicator Components. 7

8 Option Selection Details ASMT-J Minimum Flu Bin Selection 4 Maimum Flu Bin Selection 5 Color Bin Selection 6 Packaging Option Flu Bin Limit [ 3, 4 ] Luminous Flu (lm) at 350 ma Bin ID Min. Ma. U V W X Y Color Bin Selection [ 5 ] Individual reel will contain parts from one color bin selection onl. Cool White Selection Bin ID 0 Full Distribution E VM, UM, VN and UN F WM, VM, WN and VN G XM, WM, XN and WN H UN, VN, U0 and V0 J WN, VN, W0 and V0 K XN, WN, X0 and W0 L V0, U0, VP and UP M W0, V0, WP, VP and WQ N X0, W0, XP, WP and WQ P Y0 Q YA Warm White Selection Bin ID 0 Full Distribution E NM, MM, N1 and M1 F PM, NM, P1 and N1 G QM, PM, Q1 and P1 H M1, N1, M0 and N0 J P1, N1, P0 and N0 K Q1, P1, Q0 and P0 L N0, M0, NA and MA M P0, N0, PA and NA N Q0, P0, QA and PA Neutral White Selection Bin ID 0 Full Distribution E SM, RM, S1 and R1 F TM, SM, TN and S1 G S1, R1, S0 and R0 H TN, S1, T0 and S0 J S0, R0, SA and RA K T0, S0, TP and SA 8

9 Y-COORDINATE K 4500K 5000K UM 5650K 6300K VM UN U0 WM VN 7000K XM WN V0 UP XN W0 VP X0 WP Y0 XP WQ BLACK BODY CURVE YA X-COORDINATE Figure 16. Color bin Structure for Cool White Y-COORDINATE QA 2700K 3050K 2850K MM 3500K 3250K PM NM QM N1 M1 P1 Q1 P0 M0 Q0 N0 MA NA PA BLACK BODY CURVE X-COORDINATE Figure 17. Color bin structure for Warm White Y-COORDINATE K 4500K SM TM S1 TN S0 T0 SA RA TP 3500K 3800K RM R1 R0 BLACK BODY CURVE X-COORDINATE Figure 18. Color bin structure for Neutral White 9

10 Color Bin Limits Cool White Bin UM Bin UN Bin U0 Bin UP Bin VM Bin VN Bin V0 Bin VP Bin WM Bin WN Bin W0 Bin WP Bin WQ Bin XM Bin XN Bin X0 Color Limits (Chromaticit Coordinates) Warm White Bin MM Bin M1 Bin M0 Bin MA Bin NM Bin N1 Bin N0 Bin NA Bin PM Bin P1 Bin P0 Bin PA Bin QM Bin Q1 Bin Q0 Bin QA Color Limits (Chromaticit Coordinates) Bin XP Tolerance: ±0.01 Bin YO Bin YA Tolerance: ±

11 Neutral White Bin RM Color Limits (Chromaticit Coordinates) Packaging Option [ 6 ] Selection Option 1 Tape and Reel Bin R Bin R0 Bin RA Bin SM Bin S1 Bin S Eample ASMT-JW32-NUV01 ASMT-JW32-N Cool White, InGaN, Electricall isolated Heat Sink X 3 = U Minimum Flu Bin U X 4 = V Maimum Flu Bin V X 5 = 0 Full Distribution X 6 = 1 Tape and Reel Option Bin SA Bin TM Bin TN Bin T Bin TP Tolerance: ±

12 Tape and Reel Option ± ±.05 ø1.5 ± ± ± ± ± ±.10 8 ø1.5 ± ± ± ± ±.10 Figure 19. Carrier Tape Dimensions 13.2 ± ±.5 3 ±0.5 ø21.0 ±0.5 ø10 ø13.1 ± ±1 ø60 ±0.5 4 ±0.5 5 ±0.5 Notes: 1. Empt component pockets sealed with top cover tape or 500 pieces per reel. 3. Drawing not to scale. 4. All dimensions are in millimeters. Figure 20. Reel dimensions 12

13 USER FEED DIRECTION CATHODE SIDE PRINTED LABEL Figure 21. Reeling Orientation DISCLAIMER: Avago s products and software are not specificall designed, manufactured or authorized for sale as parts, components or assemblies for the planning, construction, maintenance or direct operation of a nuclear facilit or for use in medical devices or applications. Customer is solel responsible, and waives all rights to make claims against avago or its suppliers, for all loss, damage, epense or liabilit in connection with such use. For product information and a complete list of distributors, please go to our web site: Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copright Avago Technologies. All rights reserved. AV EN - Februar 2, 2015