Data Sheet. ASMT-Mx00. Moonstone TM 1 W Power LED Light Source. Features. Description. Specifications. Applications

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1 ASMT-M Moonstone TM 1 W Power LED Light Source Data Sheet Description The Moonstone TM 1W Power LED Light Source is a high performance energ efficient device which can handle high thermal and high driving current. The eposed pad design has ecellent heat transfer from the package to the motherboard. The Cool White Power LED is available in various color temperature ranging from 4K to 1K and Warm White Power LED ranging from 26K to 4K. The low profile package design is suitable for a wide variet of applications especiall where height is a constraint. The package is compatible with reflow soldering process. This will give more freedom and fleibilit to the light source designer. Applications Portable (flash light, biccle head light) Reading light Architectural lighting Garden lighting Decorative lighting Features Available in Red, Amber, Green, Blue, Cool White and Warm White color Energ efficient Eposed pad for ecellent heat transfer Suitable for reflow soldering process High current operation Long operation life Wide viewing angle Silicone encapsulation ESD Class HBM Class 3B (threshold > 8 kv) MSL 2A for InGaN products MSL 4 for AlInGaP products Specifications AllnGaP technolog for Red and Amber 2.1V (tp) at 35mA for AllnGaP InGaN technolog for Green, Blue, Cool White and Warm White 3.2V (tp) at 35mA for InGaN

2 Package Dimensions Anode Cathode Heat Sink 8.5 Metal Slug Ø 5.26 Ø LED + ZENER Notes: 1. All dimensions are in millimeters. 2. Tolerance is ±.1 mm unless otherwise specified. 3. Metal slug is connected to anode for electricall non-isolated option. Device Selection Guide ( T j = 25 C) Part Number Color Luminous Flu, V [1,2] (lm) Min. Tp. Ma. Test Current (ma) Dice Technolog ASMT-MR-AGH Red AlInGaP ASMT-MR-AHJ AlInGaP ASMT-MA-AGH Amber AlInGaP ASMT-MG Green InGaN ASMT-MB Blue InGaN ASMT-MW Cool White InGaN ASMT-M Warm White InGaN ASMT-MWB1 Cool White Diffused InGaN ASMT-MB1 Warm White Diffused InGaN Notes 1. V is the total luminous flu output as measured with an integrating sphere at 25 ms mono pulse condition. 2. Flu tolerance is ± 1%. 2

3 Part Numbering Sstem ASMT-M Note: 1. Please refer to Page 8 for selection details. Packaging Option Color Bin Selection Maimum Flu Bin Selection Minimum Flu Bin Selection Dice Tpe N InGaN A AllnGaP Silicone Tpe Non-diffused B1 Diffused Color R Red A Amber G - Green B - Blue W - Cool White - Warm White Absolute Maimum Ratings (T A = 25 C) Parameter ASMT-M/ ASMT-MB1 Units DC Forward Current [1] 35 ma Peak Pulsing Current [2] 1 ma Power Dissipation for AllnGaP 85 mw Power Dissipation for InGaN 1225 mw LED Junction Temperature for AllnGaP 125 C LED Junction Temperature for InGaN 11 C Operating Ambient Temperature Range -4 to +1 C Storage Temperature Range -4 to +12 C Reverse Volttage [3] Not recommended Notes: 1. DC forward current derate linearl based on Figure 5 for AlInGaP & Figure 11 for InGaN. 2. Pulse condition dut factor = 1%, Frequenc = 1kHz. 3. Not recommended for reverse bias operation. 3

4 Optical Characteristics at 35 ma (TJ = 25 C) Peak Wavelength, λ PEAK (nm) Dominant Wavelength, λ D [1] (nm) Viewing Angle, 2θ½ [2] ( ) Part Number Color Tp Tp Tp Tp ASMT-MR-AGH Red ASMT-MR-AHJ Red ASMT-MA-AGH Amber ASMT-MG Green ASMT-MB Blue Luminous Efficienc (lm/w) Correlated Color Temperature, CCT (Kelvin) Viewing Angle, 2θ½ [2] ( ) Part Number Color Min. Ma. Tp Tp ASMT-MW Cool White ASMT-M Warm White ASMT-MWB1 Cool White Diffused ASMT-MB1 Warm White Diffused Luminous Efficienc (lm/w) Electrical Characteristic at 35 ma (T J = 25 C) Thermal Resistance Forward Voltage V F (Volts) at I F = 35mA Rθ j-ms ( C/W) [1] Dice tpe Min. Tp. Ma. Tp. AllnGaP InGaN Notes: 1. Rθ j-ms is Thermal Resistance from LED junction to metal slug. 4

5 RELATIVE INTENSIT Figure 1. Relative Intensit vs. Wavelength for AlInGaP RED AMBER WAVELENGTH - nm FORWARD CURRENT - ma FORWARD VOLTAGE - V Figure 2. Forward Current vs Forward Voltage for AlInGaP RELATIVE LUMINOUS FLU (-v) - lm MONO PULSE CURRENT - ma Figure 3. Relative Luminous Flu vs. Mono Pulse Current for AlInGaP RELATIVE INTENSIT OFF-AIS ANGLE( ) Figure 4. Radiation Pattern for AlInGaP I F - MA FORWARD CURRENT - ma R JA = 6 C/W R JA = 5 C/W R JA = 4 C/W T A - AMBIENT TEMPERATURE - C Figure 5. Maimum forward current vs. ambient temperature for AlInGaP Derated based on T J MA = 125 C, Rθ JA = 4 C/W / 5 C/W and 6 C/W RELATIVE LOP (Normalized at 25 C) RED AMBER JUNCTION TEMPERATURE - C Figure 6. Relative LOP (Normalized at 25 C) vs. junction temperature for AlInGaP 5

6 RELATIVE INTENSIT Figure 7. Relative Intensit vs. Wavelength for InGaN GREEN BLUE COOL WHITE WARM WHITE WAVELENGTH - nm FORWARD CURRENT - ma FORWARD VOLTAGE - V Figure 8. Forward Current vs. Forward Voltage for InGaN RELATIVE LUMINOUS FLU (φv) - lm MONO PULSE CURRENT - ma Figure 9. Relative Luminous Flu vs Mono Pulse Current for InGaN RELATIVE INTENSIT GREEN.3 BLUE.2 COOL WHITE.1 WARM WHITE OFF-AIS ANGLE ( ) Figure 1. Radiation Pattern for InGaN I F MAIMUM FORWARD CURRENT ma Rθ JA = 5 C/W Rθ JA = 4 C/W Rθ JA = 3 C/W TA AMBIENT TEMPERATURE C 9 DOMINANT WAVELENGTH nm GREEN BLUE FORWARD CURRENT ma 35 4 Figure 11. Maimum Forward Current vs. Ambient Temperature for InGaN Derated based on T J MA = 11 C, R JA = 3 C/W, 4 C/W and 5 C/W Figure 12. Dominant wavelength vs. forward current InGaN devices 6

7 ma 15 ma -COORDINATES ma 35 ma ma COORDINATES.7.8 Figure 13. Chromaticit shift vs. current *Note: (,) 35 ma reference to (.) 1.7 ± SEC. TEMPERATURE 217 C 2 C 15 C C 3 C/SEC. MA. 3 C/SEC. MA. -6 C/SEC. MA. 17. ±.2 1. ± ± SEC. 1 SEC. MA. 3.1 ±.1 (Acc. to J-STD-2C) TIME Figure 14. Recommended reflow soldering profile 5.8 ±.1 Figure 15. Recommended soldering land pattern RELATIVE FORWARD VOLTAGE SHIFT (mv) TEMPERATURE - C Figure 16. Temperature vs. relative forward voltage shift RELATIVE LOP (%) Figure 17. Relative LOP vs Junction Temperature for InGaN Devices GREEN BLUE COOL WHITE WARM WHITE JUNCTION TEMPERATURE ( C) Note: For detail information on reflow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN16 Surface Mounting SMT LED Indicator Components. 7

8 Option Selection Details ASMT-M Minimum Flu Bin Selection 2 Maimum Flu Bin Selection 3 Color Bin Selection 4 Packaging Option Flu Bin Limit [ 1 2 ] Luminous Flu (lm) at I F = 35mA Bin Min. Ma. D E F G H J K Tolerance for each bin limits is ±1% Color Bin Selection [ 3 ] Individual reel will contain parts from one full bin onl. Warm White Full Distribution A A onl B B onl C C onl D D onl E E onl F F onl N A and C onl P B and D onl Q E and C onl R F and D onl U E and F onl W C and D onl Z A and B onl 1 A, B, C and D onl 4 C, D, E and F onl Other Colors Full Distribution Z A and B B and C W C and D V D and E Q A, B and C P B, C and D N C, D and E Cool White Full Distribution A A onl B B onl C C onl D D onl E E onl F F onl G G onl H H onl L A and G onl M B and H onl N A and C onl P B and D onl Q E and C onl R F and D onl S G and H onl U E and F onl W C and D onl Z A and B onl 1 A, B, C and D onl 2 G, H, A and B onl 4 C, D, E and F onl 8

9 - COORDINATE E 1k F Figure 18. Color bins (Cool White). C 7k D COORDINATE A B 5.6k G 4.5k H 4.k Black Bod Curve - COORDINATE k F Figure 19. Color bins (Warm White). E 3.5k D C 3.k B COORDINATE A 2.6k Black Bod Curve Color Bin Limits Warm White Bin A Color Limits (Chromaticit Coordinates) Cool White Bin A Color Limits (Chromaticit Coordinates) Bin B Bin B Bin C Bin C Bin D Bin D Bin E Bin E Bin F Bin F Tolerance: ±.1 Bin G Color Bin Min. Ma. Red Full Distribution Amber A Bin H Tolerance: ± B C D E Blue A B C D Green A B C D Tolerance: ± 1 nm 9

10 Sub-Color Binning (Onl Applicable for Color Bin A to Bin D and Bin G to Bin H) Color Limits Cool White Bin A1 Bin A2 Bin A3 Bin A4 Bin B1 Bin B2 Bin B3 Bin B4 Bin B5 Bin B6 Bin C1 Bin C2 Bin C3 Bin C4 (Chromaticit Coordinates) Cool White Bin D1 Bin D2 Bin D3 Bin D4 Bin D5 Bin D6 Bin G1 Bin G2 Bin H1 Bin H2 Bin H3 Tolerances ±.1 (Chromaticit Coordinates) G1 - COORDINATE C1 C3 C2 C4 D1 D4 D2 7k D5 D3 D6 A3 A4 B4 5.6k B5 B6 A1 A2 B1 B2 B3 G2 H1 H2 4.5k H3 4.k Black Bod Curve.28 1k COORDINATE Figure 2. Sub-color bins (Cool White) 1

11 Packaging option [ 4 ] Selection Option Tube 1 Tape & Reel Eample ASMT-MR-AHJ ASMT-MR-A AllnGaP Red, Non-diffused 1 = H Minimum Flu Bin H 2 = J Maimum Flu Bin J 3 = Full Distribution 4 = Tube Option Packing Tube - Option SIDE VIEW 535. TOP VIEW Figure 21. Tube dimensions Tape & Reel - Option 1 Tape Dimension A E Dim Value F A 8.8±.1 W Bo B 16.45±.1 K 3.6±.1 B P A B 2.5 Ko SECTION A W 24.±.1 P 16.±.1 Qt/Reel 25EA Unit: mm Ao SECTION B Figure 22. Carrier tape dimensions

12 Tape & Reel - Option 1 (Cont.) Tape Dimension END START THERE SHALL BE A MINIMUM OF 16 mm OF EMPT COMPONENT POCKETS SEALED WITH COVER TAPE. MOUNTED WITH COMPONENTS THERE SHALL BE A MINIMUM OF 39 mm OF EMPT COMPONENT POCKETS SEALED WITH COVER TAPE. Figure 23. Carrier tape leader and trailer dimensions Reel Dimensions R1. 6.º ± ± ±.5 R1.5 ± ±.5 Figure 24. Reel dimensions 12.º

13 Handling Precaution The encapsulation material of the product is made of silicone for better reliabilit of the product. As silicone is a soft material, please do not press on the silicone or poke a sharp object onto the silicone. These might damage the product and cause premature failure. During assembl or handling, the unit should be held on the bod onl. Please refer to Avago Application Note AN5288 for detail information. Moisture Sensitivit This product is qualified as Moisture Sensitive Level 2a for InGaN devices and MSL 4 for AlInGaP devices per Jedec J-STD-2. Precautions when handling this moisture sensitive product is important to ensure the reliabilit of the product. Do refer to Avago Application Note AN535 Handling of Moisture Sensitive Surface Mount Devices for details. A. Storage before use Unopen moisture barrier bag (MBB) can be stored at <4 C/9%RH for 12 months. If the actual shelf life has eceeded 12 months and the humidit indicator card (HIC) indicates that baking is not required, then it is safe to reflow the LEDs per the original MSL rating. It is not recommended to open the MBB prior to assembl (e.g. for IQC). B. Control after opening the MBB The humidit indicator card (HIC) shall be read immediatel upon opening of MBB. The LEDs must be kept at <3 C/6%RH at all time and all high temperature related process including soldering, curing or rework need to be completed within 672 hours for MSL 2a and 72 hours for MSL 4. C. Control for unfinished reel For an unused LEDs, the need to be stored in sealed MBB with desiccant or desiccator at <5%RH. D. Control of assembl boards If the PCB soldered with the LEDs is to be subjected to other high temperature processes, the PCB need to be stored in sealed MBB with desiccant or desiccator at <5%RH to ensure no LEDs have eceeded their floor life of 672 hours for MSL 2a and 72 hours for MSL 4. E. Baking is required if HIC 1% indicator is not blue and 5% indicator is pink. - The LEDs are eposed to condition of >3 C/6% RH at an time. The LEDs floor life eceeded 672 hours for MSL 2a and 72 hours for MSL 4. Recommended baking condition: 6±5ºC for 2hrs. DISCLAIMER AVAGO S PRODUCTS AND SOFTWARE ARE NOT SPECIFICALL DESIGNED, MANUFACTURED OR AUTHORIZED FOR SALE AS PARTS, COMPONENTS OR ASSEMBLIES FOR THE PLANNING, CONSTRUCTION, MAINTENANCE OR DIRECT OP- ERATION OF A NUCLEAR FACILIT OR FOR USE IN MEDICAL DEVICES OR APPLICATIONS. CUSTOMER IS SOLEL RE- SPONSIBLE, AND WAIVES ALL RIGHTS TO MAKE CLAIMS AGAINST AVAGO OR ITS SUPPLIERS, FOR ALL LOSS, DAMAGE, EPENSE OR LIABILIT IN CONNECTION WITH SUCH USE. For product information and a complete list of distributors, please go to our web site: Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copright Avago Technologies. All rights reserved. Obsoletes AV1-668EN AV2-129EN - October 5, 21