HI-POWER / LED MICRO-08
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1 HI-POWER / LED MICRO-08 FEATURES + Smallest form factor with up to 1.5W (500mA) output power + Ultra wide illumination field angle (FWHM 155 degree) + Low thermal resistance: <4 C/W + Lead Free and RoHS 2 compliant + Moisture Sensitivity Level: 1 + ESD protection up to 8KV + SMT soldering solution - Reflow solderable - JEDEC J-STD-020C compatible ABSOLUTE MAXIMUM RATINGS PARAMETERS SYMBOL VALUE UNIT Typ. Forward Current IF 350 ma Max. Forward Current IF 500 ma Max. Peak Pulse Current Ipulse 700 ma Reverse Voltage V 5 V Power Dissipation Pd 1.15 (typ) W Junction Temperature Tj 125 C Operating Temperature Topr -40 ~ +85 C Storage Temperature Tstg -40 ~ +100 C Max. Soldering Temperature Tsol 240 C Max. Thermal resistance Rth 4 C/W Allowable Reflow Cycles - 3 Cycles Max. ESD Sensitivity - ±8,000V HBM - JEDEC MOISTURE SENSITIVITY LEVEL FLOOR LIFE SOAK REQUIREMENT STANDARD TIME (HOURS CONDITIONS TIME (HOURS) CONDITIONS 1 Unlimited 30 C/ 85% C/ 85% PAGE 1 OF 14 I SPEC 01 I REV.00 I JUNE 2015
2 GENERAL CHARACTERISTICS 350MA SYMBOL UNIT COOL WHITE 5700 K 5000 K Luminous Flux (Typ.) Φv Lm 120 / / 110 Correlated Color Temperature (Typ.) CCT K Forward Voltage (Typ.) Vf V Wide viewing angle 2θ1/2 deg. 155 ± ± 10 CRI ±3 Ra 70 / / 80 Thermal resistance Rθj-c C/W <4 C/W <4 /W 350MA SYMBOL UNIT NEUTRAL WHITE 4000 K Luminous Flux (Typ.) Φv Lm 110 / 100 Correlated Color Temperature (Typ.) CCT K 4000 Forward Voltage (Typ.) Vf V 3.3 Wide viewing angle 2θ1/2 deg. 155 ± 10 CRI ±3 Ra 75 / 80 Thermal resistance Rθj-c C/W <4 C/W 350MA SYMBOL UNIT WARM WHITE 2700 K 3000 K Luminous Flux (Typ.) Φv Lm 90 / / 90 Correlated Color Temperature (Typ.) CCT K Forward Voltage (Typ.) Vf V Wide viewing angle 2θ1/2 deg. 155 ± ± 10 CRI ±3 Ra Thermal resistance Rθj-c C/W <4 C/W <4 /W Note: Contoc maintains a tolerance of ±7% on flux and power measurements and ±3 on CRI measurements Contoc maintains a ±0.003 in the measurement of CIE x and y coordinates. For other special requirements, please contact Contoc directly PAGE 2 OF 14 I SPEC 01 I REV.00 I JUNE 2015
3 CHROMATICITY DIAGRAMS CHROMATICITY COORDINATES 5700K Cool White Cx Cy Cx Cy Cx Neutral white 4000K 5000K K Warm White Cx Cy Cx Cy Cy 2700K Note: Contoc maintains a measurement tolerance of ±0.003 for CIE-x, y coordinates if not mentioned PAGE 3 OF 14 I SPEC 01 I REV.00 I JUNE 2015
4 MECHANICAL DIMENSIONS (TA = 25 C) Notes: 1. The drawings above are not to scale and all dimensions are in millimeters. 2. Tolerances unless mentioned are ± 0.1mm PAGE 4 OF 14 I SPEC 01 I REV.00 I JUNE 2015
5 PAD CONFIGURATIONS RECOMMENDED TRACE LAYOUT ON MCPCB SOLDER PAD REFERENCE Notes: 1. Please contact Contoc about trace dimension if the FR4 or CEM materials were applied for Light boards. 2. The drawings above are not to scale and all dimensions are in millimeters. 3. Tolerances unless mentioned are ± 0.1mm PAGE 5 OF 14 I SPEC 01 I REV.00 I JUNE 2015
6 OPTICAL AND ELECTRICAL CHARACTERISTICS RELATIVE SPECTRAL DISTRIBUTION VS. WAVELENGTH CHARACTERISTICS SPECTRUMS OF NOMINAL 5700K 4000K AND 3000K - BOARD TEMPERATURE=25 C PAGE 6 OF 14 I SPEC 01 I REV.00 I JUNE 2015
7 SXYEM HI-POWER / LED MICRO-25 HV FORWARD VOLTAGE VS. BOARD 350MA RELATIVE LUMINOUS FLUX VS. BOARD 350MA Note: 5. All plots are measured with 15 pf load at room temperature, unless otherwise stated. PAGE 7 OF 14 I SPEC 01 I REV.00 I JUNE 2015
8 TYPICAL FORWARD CURRENT CHARACTERISTICS BOARD TEMPERATURE = 25 C TYPICAL RELATIVE LUMINOUS FLUX VS. FORWARD CURRENT BOARD TEMPERATURE = 25 C PAGE 8 OF 14 I SPEC 01 I REV.00 I JUNE 2015
9 TYPICAL RADIATION PATTERN PAGE 9 OF 14 I SPEC 01 I REV.00 I JUNE 2015
10 REFLOW SOLDERING CHARACTERISTICS The series are compatible with JEDEC J-STD-020C, using the parameters listed below. As a general guideline, Contoc recommends that users follow the recommended soldering profile provided by the manufacturer of solder paste used. Profile Feature Pb-Free Assembly Average ramp-up rate (TL to TP) Preheat: Temperature Min (Tsmin) Temperature Max (Tsmax) Time (min to max) (ts) Time maintained above: Temperature (TL) Time (tl) 3 C/second max. 150 C 200 C seconds 217 C seconds Peak/Classification Temperature (Tp) 240 C Time within 5 C of actual Peak Temperature (tp) Ramp-down Rate Time 25 C to Peak Temperature seconds 6 C/second max. 8 minutes max. PAGE 10 OF 14 I SPEC 01 I REV.00 I JUNE 2015
11 TAPE AND REEL PACKAGE Symbol Dimension W 8.00 ±020 P 4.00±0.1 E 1.75 ±0.1 F 3.5 ±0.05 P ±0.05 D /-0.0 D1 0.4 ± 0.1 P ±0.1 10P ±0.2 Ao 1.00 ±0.05 Bo 1.23 ±0.05 Ko 0.90 ±0.05 t 0.20 ±0.05 PAGE 11 OF 14 I SPEC 01 I REV.00 I JUNE 2015
12 ORDERING INFORMATION LED FAMILY MICRO-08 NOMINAL CCT W2 = 3000K C2 = 5700K CRI A = CRI-70 (±3) B = CRI-75 (±3) C = CRI-80 (±3) D = CRI-85 (±3) E = CRI-90 (±3) M08 W2-LF1 C K CHIP TYPE NONE LUMINOUS FLUX LF1 = LM LF2 = LM LF3 = LM LF4 = LM LF5 = LM LF6 = LM LF7 = LM LF8 = LM LF9 = LM FORWARD VOLTAGE H = 2.8V~3.0V I = 3.0V~3.2V J = 3.2V~3.4V K = 3.4V~3.6V L = 3.0V~3.5V EXAMPLE: M08W2-LF1CK PLEASE INDICATE YOUR REQUIRED PARAMETERS Notes: 1. Please contact Contoc if your requirements are not listed above. PAGE 12 OF 14 I SPEC 01 I REV.00 I JUNE 2015
13 Precaution for Use 1. The LED output light is very intense and may injure human eyes if viewing the module directly. Please do NOT view it by naked eyes to avoid injury of eyes. 2. The products should be stored away from direct light in dry location 3. The packaged LED units should not be used in any type of fluid such as water, oil, organic, solvent, etc. When cleaning is required, IPA is recommended as cleaning agent. 4. Non-compliance measurement under ESD protection may damage devices on the product 5. Handling of silicone lens on LEDs: 5.1 Please do not use over 3 kg forced impact or pressure on the silicone lens, otherwise it will cause a Catastrophic failure. 5.2 Avoid touching the silicone lens especially by sharp tools such as tweezers. 5.3 Avoid leaving fingerprints on the silicone lens. 5.4 Please store the LEDs away from dusty areas or seal the product against dust. 5.5 Please do not mold over the silicone lens with another resin. (epoxy, urethane, etc) 6. LEDs should be packed by a sealed container with nitrogen gas injected; these should be stored in the environment with temp. 5~30 C, RH<50% condition. Recommend to use the series products within 1 year. 7. The device should not be used in any type of fluid such as water, oil, organic, solvent, etc. When cleaning is required, IPA is recommended as cleaning agent. 8. After storage bag is opened, Contoc suggest to apply soldering process within 1 day. If not, please follow the below instructions. a. Contoc suggest to re-pack the unused products with nitrogen gas injected and be stored in the environment with temp. 5~30 C, RH<50% condition. b. Contoc suggest to place the unused products in the dry box with temp. 5~30 C, RH<50% condition Contoc strongly recommend to finish the process of unused products within three months both stored in above (a) and (b) conditions. PAGE 13 OF 14 I SPEC 01 I REV.00 I JUNE 2015
14 OUR COMPANY IS CERTIFIED ACCORDING TO ISO 9001:2008 IN OCTOBER 2013 BY THE DMSZ CERTIFIKATION GMBH. THIS IS FOR YOU TO ENSURE THAT THE PRINCIPLES OF QUALITY MANAGEMENT ARE FULLY IMPLEMENTED IN OUR QUALITY MANAGEMENT SYSTEM AND QUALITY CONTROL METHODS ALSO DOMINATE OUR QUALITY STANDARDS. Contoc Components GmbH & Co. KG The information contained herein is subject to change at any time without notice. Contoc owns all rights, title and interest to the intellectual property related to Contoc's products, including any software, firmware, copyright, patent, or trademark. The sale of Contoc products does not convey or imply any license under patent or other rights. Contoc retains the copyright and trademark rights in all documents, catalogs and plans supplied pursuant to or ancillary to the sale of products or services by Contoc. Unless otherwise agreed to in writing by Contoc, any reproduction, modification, translation, compilation, or representation of this material shall be strictly prohibited. PAGE 14 OF 14 I SPEC 01 I REV.00 I JUNE 2015
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