PHOTOVOLTAIC SOLID-STATE RELAY OPTOCOUPLERS
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1 PACKAGE SCHEMATIC ANODE 6 DRAIN 6 CATHODE N/C 3 4 DRAIN DESCRIPTION The HSR32 and HSR42 devices consist of a AlGaAs infrared emitting diode optically coupled to a power MOSFET detector which is driven by a photovoltaic generator. The devices are housed in a 6-pin dual-in-line package. The HSR32L and HSR42L employ an active current limit circuitry enabling the device to withstand current surge transients. FEATURES 4,000 VRMS Isolation Wide operating voltage range 250 V (HSR32, HSR32L) 400 V (HSR42, HSR42L) Solid-State Reliability Bounce-Free Operation 4000 V ESD Rating (HBM) UL, CSA and BABT approval pending APPLICATIONS On/Off Hook Switch Replacement for Mechanical Relays Dial Out Relay Ring Injection Relay General Switching Ground Start ABSOLUTE MAXIMUM RATINGS (T A = 25 C unless otherwise noted) Parameters Symbol Device Value Units TOTAL DEVICE Storage Temperature T STG All -40 to +00 C Operating Temperature T OPR All -40 to +85 C Lead Solder Temperature T SOL All 260 for 0 sec C Isolation Surge Voltage V ISO All 4000 Vac(RMS) Maximum Input/Output Capacitance C IO All.0 pf Maximum Input/Output Resistance R IO All 0 2 Ω Page of 8 5/3/02
2 ELECTRICAL CHARACTERISTICS (T A = -40 C to +85 C Unless otherwise specified) INPUT CHARACTERISTICS Parameters/Test Conditions Connection Symbol Limit Units Control Current Series or Parallel I F(ON) Max ma Control Current for Off-State Resistance Series or Parallel I F(OFF) Min ma Min Control Current Range Series or Parallel I F Max ma Reverse Voltage Series or Parallel V R Min V Forward Voltage (I F =0 ma) Series or Parallel V F Max V OUTPUT CHARACTERISTICS Parameters / Test Conditions Connection Symbol Limit Units Operating Voltage Range Series or Parallel V OPR Max Load Current T A = +40 C, 5mA control (see fig. & 2) On-State Resistance T A = 25 C, 50mA pulsed load, 5mA control Off-State Leakage Current T A = 25 C, ±250V for HSR32/L, ±400V for HSR42/L Current Limit T A = +25 C, 5mA control Series Max Parallel I L Max Series Max Parallel R ON Max V DC or V AC(PEAK) Series or Parallel fl Max µa Series Parallel I LMT Min N/A 90 N/A 30 Max N/A 300 N/A 220 Min N/A 330 N/A 260 Max N/A 560 N/A 440 Turn-On Time T A = +25 C for 50mA, Series or Parallel T ON Max ms 00VDC load, 5mA control Turn-Off Time T A = +25 C for 50mA, Series or Parallel T OFF Max ms 00VDC load, 5mA control Thermal Offset Voltage 5mA control Series or Parallel fl Max N/A N/A mv Output Capacitance 5V DC Series or Parallel C O Max pf ma Ω ma ISOLATION CHARACTERISTICS Characteristics Test Conditions Symbol Limit Units Input-Output Isolation Voltage V ISO Max V Page 2 of 8 5/3/02
3 LOAD CURRENT, IDD (ma) LOAD CURRENT, IDD (ma) FORWARD CURRENT, IF (ma) Figure. Forward Current vs. Forward Voltage 85 C 25 C 40 C NORMALIZED ON RESISTANCE, R ON (Ω) Figure 2. Normalized on Resistance vs. Ambient Temperature 2 5mA Control I D = 0mA Normalized at 25 C HSR32L HSR FORWARD VOLTAGE, V F (V) Figure 3. Normalized on Resistance vs. Ambient Temperature Figure 4. Load Current vs. Voltage Drop NORMALIZED ON RESISTANCE, R ON (Ω) 2 5mA Control I D = 0mA Normalized at 25 C HSR42L HSR mA C, pulsed HSR32 HSR32L VOLTAGE DROP, V DD (V) Figure 5. Load Current vs. Voltage Drop Figure 6. Maximum Load Current Vs Ambient Temperature mA C, pulsed HSR42L HSR42 Maximum Load Current, I dd (ma) V dd = 4V HSR32 I F = 2mA I F = 5mA VOLTAGE DROP, V DD (V) Ambient Temperature, T A ( C) Page 3 of 8 5/3/02
4 OFF STATE CURRENT, I OFF (na) I D-OFF /I C OFF STATE CURRENT, IOFF (na) Figure 7. Maximum Load Current Vs Ambient Temperature Figure 8. Maximum Load Current Vs Ambient Temperature dd (ma) Maximum Load Current, I V dd = 4V I F = 2mA HSR32L I F = 5mA Maximum Load Current, I dd (ma) V dd = 4V HSR42 I F = 5mA I F = 3mA Ambient Temperature, T A ( C) Ambient Temperature, T A ( C) 25 Figure 9. Maximum Load Current Vs Ambient Temperature V dd = 4V HSR42L 000 Figure 0. Off State Current vs. Ambient Temperature Maximum Load Current, I dd (ma) I F = 3mA I F = 5mA 00 0 HSR32/L Ambient Temperature, T A ( C) Figure. Off State Current vs. Ambient Temperature Figure 2. Normalized Off State Leakage vs. Ambient Temperature HSR32/L 0 HSR42/L Page 4 of 8 5/3/02
5 I D-OFF /I C Figure 3. Normalized Off State Leakage vs. Ambient Temperature 00 0 HSR42/L AC or DC LOAD 3 4 Parallel Connection LOAD 3 4 Page 5 of 8 5/3/02
6 Package Dimensions (Through Hole) Package Dimensions (Surface Mount) (8.89) (8.3) (8.89) (8.3) (6.60) (6.0) (6.60) (6.0) (9.90) (8.43) (.77) (.02) 0.04 (0.36) 0.00 (0.25) (8.3) (.77) (.02) 0.04 (0.36) 0.00 (0.25) (8.3) (5.08) 0.5 (2.93) (5.08) 0.5 (2.93) 0.02 (0.30) (0.20) 0.00 (2.54) 0.05 (0.38) (0.50) 0.06 (0.4) 0.00 (2.54) (0.30) (0.63) (0.5) (0.50) 0.06 (0.4) 0.00 [2.54] (0.88) (0.6) Recommended Pad Layout for Surface Mount Leadform (.78) (.52) (0.79) 0.00 (2.54) (7.75) (0.76) NOTE All dimensions are in inches (millimeters) Page 6 of 8 5/3/02
7 ORDERING INFORMATION Option Order Entry Identifier Description S S Surface Mount Lead Bend SR2 SR2 Surface Mount; Tape and reel Carrier Tape Specifications ( D Tapin Orientation) 4.5 ± MAX 2.0 ± ± ± 0. Ø.5 MIN.75 ± ± 0..5 ± ± ± MAX 0. ± 0.20 Ø.5 ± 0./-0 User Direction of Feed NOTE All dimensions are in inches (millimeters) Page 7 of 8 5/3/02
8 DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Page 8 of 8 5/3/02
9 This datasheet has been download from: Datasheets for electronics components.
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