XIAMEN G&P ELECTRONICS CO., LTD.

Transcription

1 XIAMEN G&P ELECTRONICS CO., LTD. SPECIFICATION FOR GoPro SUPER FLUX LED Part No.: REV: 1.1 RECEIVED MASS PRODUCTION PRELIMINARY CUSTOMER DESIGN DEVICE NUMBER : YG PAGE: 7 CUSTOMER S APPROVAL Tel: Fax:

2 Features: 1. Chip material: InGaN 2. Emitted color: white 3. Lens Appearance: water clear 4. Low power consumption. 5. High efficiency. 6. Versatile mounting on P.C. Board or panel. 7. Low current requirement. 8. This product don t contained restriction substance, compliance RoHS standard. Package dimensions: Applications: 1. Automotive: Dashboards, stop lamps, turn signals. 2. Status indicators: industrial electronics. 3. Lighting 4. Circuit board 1,2 3,4 Note: 1. All dimensions are in millimeters. 2. Tolerance is ±.25mm unless other noticed. Absolute maximum ratings(ta=25 ) Parameter Symbol Rating Unit Power Dissipation Pd 432 mw Forward Current IF 1 ma Peak Forward Current*1 IFP 12 ma Reverse Voltage VR 5 V Operating Temperature Topr -25 ~6 Storage Temperature Tstg -4 ~85 Soldering Temperature Tsol 26 (for 5 seconds) *1Condition for IFP is pulse of 1/1 duty and.1msec width REV: 1.1 Page 1of 7

3 Electrical and optical characteristics(ta=25 ) Parameter Symbol Condition Min. Typ. Max. Unit Forward Voltage VF IF=8mA V Luminous Flux ф IF=8mA lm Luminous Intensity IV IF=8mA mcd Reverse Current IR VR=5V μa CIE.Chromaticity Coordinates X IF=8mA Y IF=8mA CCT IF=8mA K Viewing Angle 2θ1/2 IF=8mA deg *Measurement Uncertainty of Luminous Intensity: ±1% *Measurement Uncertainty of Forward Voltage:±.1V *Measurement uncertainty of the color coordinates:±.1 Typical electro-optical characteristics curves 1. Fig.1 Relative intensity vs. Wavelength 12 Fig.2 Forward current derating curve vs. Ambient temperature Relative radiant intensity.5 Forward current (ma) Wavelength (nm) Ambient temperature Ta( C) 12 Fig.3 Forward current vs. Forward voltage 3. Fig.4 Relative luminous intensity vs. Ambient temperature Foward current (ma) Relative luminous intensity Forward voltage (V) Ambient temperature Ta( C) 2. Fig.5 Relatove luminous intensity vs. Forward current Fig.6 Radiation diagram Relative luminous intensity Forward current (ma) Relative radiant intensity REV: 1.1 Page 2of 7

4 Bin Limits 1. Intensity bin limits (At IF=8mA) Bin Code Min. (mcd) Max. (mcd) R S Forward Voltage bin limits (At IF=8mA) Bin Code Min. (V) Max. (V) G H I J Color Bin Limits (At IF=8mA): Color Ranks CIE W1 X Y W2 X Y W3 X Y W4 X Y W5 X Y W6 X Y W7 X Y W8 X Y REV: 1.1 Page 3of 7

5 W8 W7 W6 W5 W4 W3 W2 W Bin : x x - x Color bin code Voltage bin code Intensity bin code REV: 1.1 Page 4of 7

6 Package mean 1. Package Adhesive Pipe. G&P ROHS PAR NO: LOT NO: QTY: DAT: BIN CODE: Notes: Each Adhesive Pipe 6pcs. 2. Superficial Package paper boxes. Notes: Each paper boxes 238 bar. Notes: 1. All Dimensions are in mm, Tolerance is ±2.mm unless otherwise noted. 2. Specifications are subject to change without notice. REV: 1.1 Page 5of 7

7 SOLDERING: 1. Manual of Soldering The temperature of the iron tip should not be higher than 27 and Soldering within 3 seconds per solder-land is to be observed. 2. DIP soldering (Wave Soldering): Preheating:12 ~15,within 12~18 sec. Operation heating:26 ±5 within 1 sec.27 (Max) Gradual Cooling (Avoid quenching). Handling: Care must be taken not to cause to the epoxy resin portion of LED while it is exposed to high temperature. Care must be taken not rub the epoxy resin portion of LED with hard or sharp article such as the sand blast and the metal hook. Care must be taken there should be more than 3mm from jointing point to the epoxy resin. Notes for designing: Care must be taken to provide the current limiting resistor in the circuit so as to drive the LED within the rated figures.also caution should be taken not to overload LED with exorbitant voltage at the turning ON and OFF of the circuit. When using the pulse drive care must be taken to keep the average current within the rated figures.also the circuit should be designed so as be subjected to reverse voltage when turning off the LED. Storage: In order to avoid the absorption of moisture. It is recommended to solder LED as soon as possible after unpacking the sealed envelope. If the envelope is still packed to store it in the environment as following: Temperature: 5 ~3 (41 ~86 )Humidity : RH 6% Max. LED and against static: Approved by: Su Checked by: Chen Prepared by: Liu REV: 1.1 Page 6of 7

8 变更履历表 版本号变更内容页码日期变更者 CCT: 中心值 11K 改为中心值 18K Page 苏海鼎 REV: 1.1 Page 7of 7