PART NO.: L-C19F1RGBCT-CA

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1 PARA LIGHT ELECTRONICS CO., LTD. 4F, No.1, Lane 93, Chien Yi Road, Chung Ho City, Taipei, Taiwan. Tel: Fax: DATA SHEET PART NO.: L-C19F1RGBCT-CA REV: A / 3 CUSTOMER S APPROVAL: DCC: DRAWING NO.: DS DATE: PAGE 1 of 15 PARA-FOR-65

2 PACKAGE OUTLINE DIMENSIONS POLARITY Notes: 1. a chip: Red; b chip: Green; c chip: Blue 2. All dimensions are in millimeters. 3. Tolerance is ±.1mm (.4 ) unless otherwise noted. Features Three color, top view, wide view angle Chip LED. Package in 8mm tape on 7 diameter reels. Compatible with automatic Pick & Place equipment. Compatible with Reflow soldering and Wave soldering processes. EIA STD package. I.C. compatible. Pb free product. DRAWING NO.: DS DATE: PAGE 2 of 15

3 Chip Materials Chip Light Color Dice Material Lens Color a R:Red AlInGap b G:Green InGaN C B:Blue InGaN Absolute Maximum Ratings (Ta=25 ) Note A: SYMBOL PARAMETER Water Clear Rating R G B UNIT PD Power Dissipation mw VR Reverse Voltage 5 V IF Continuous Forward Current ma IPF Peak Forward Current ma ESD Electrostatic Discharge Threshold (HBM) Note A V Topr Operating Temperature Range -4 ~ +85 Tstg Storage Temperature Range -4 ~ +85 HBM: Human Body Model. Seller gives no other assurances regarding the ability of to withstand ESD DRAWING NO.: DS DATE: PAGE 3 of 15

4 Electro-Optical Characteristics (Ta=25 ) SURFACE MOUNT DEVICE LED SYMBOL PARAMETER TEST MIN. TYP. MAX. UNIT R VF G Forward Voltage IF = 2mA V B R IV G Luminous Intensity IF = 2mA mcd B R 623 λd G Dominant Wavelength IF = 2mA 525 nm B 47 R 17 λ G Spectral Line Half-Width IF = 2mA 15 nm B 25 R 63 λp G Peak Emission Wavelength IF = 2mA 52 nm B 468 2θ1/2 Half Intensity Angle IF = 2mA 13 deg R 1 IR G Reverse Current VR = 5V 5 µa B 5 Notes: 1. Luminous intensity is measured with a light sensor and filter combination that proximities the CIE eye-response curve. 2. θ1/2 is the off-axis angle at which the luminous intensity is half the axial luminous intensity. 3. The dominant wavelength λd is derived from the CIE chromaticity diagram and represents the single wavelength which defines the color of the device. 4. Caution in ESD : Static Electricity and surge damages the LED. It is recommended use a wrist band or anti-electrostatic glove when handling the LED. All devices, equipment and machinery must be properly grounded. 5. Major standard testing equipment by Instrument System Model : CAS14B Compact Array Spectrometer and KEITHLEY Source Meter Model : 24. DRAWING NO.: DS DATE: PAGE 4 of 15

5 Red Typical Electro-Optical Characteristics Curves (25 Ambient Temperature Unless Otherwise Noted) 5 5 Forward Current(mA) Luminous lntensity(mcd) Forward Voltage(V) Forward Current(mA) Fig.2 Forward Current vs.forward Voltage Fig.3 Luminous Intensity vs.forward Current Relative Luminous lntensity Normalized of 2mA Forward Current(mA) Fig.4 Relative Luminous Intensity vs.forward Current Relative luminous intensity(%) Ambient Temperature Ta( ) Fig.5 Luminous Intensity vs.ambient Temperature Forward Current IF(mA) Ambient Temperature Ta( ) Fig.6 Forward Current Derating Curve Fig.7 Relative Intensity vs.angle DRAWING NO.: DS DATE: PAGE 5 of 15

6 Green Typical Electro-Optical Characteristics Curves (25 Ambient Temperature Unless Otherwise Noted) Luminous lntensity(mcd) Fig.2 Forward Current vs.forward Voltage Fig.3 Luminous Intensity vs.forward Current 1 Relative Luminous lntensity Normalized of 2mA Relative luminous intensity(%) Ambient Temperature Ta( ) Fig.4 Relative Luminous Intensity vs.forward Current Fig.5 Luminous Intensity vs.ambient Temperature Forward Current IF(mA) Ambient Temperature Ta( ) Fig.6 Forward Current Derating Curve Fig.7 Relative Intensity vs.angle DRAWING NO.: DS DATE: PAGE 6 of 15

7 Blue Typical Electro-Optical Characteristics Curves (25 Ambient Temperature Unless Otherwise Noted) Luminous lntensity(mcd) Fig.2 Forward Current vs.forward Voltage Fig.3 Luminous Intensity vs.forward Current 1 Relative Luminous lntensity Normalized of 2mA Relative luminous intensity(%) Ambient Temperature Ta( ) Fig.4 Relative Luminous Intensity vs.forward Current Fig.5 Luminous Intensity vs.ambient Temperature Forward Current IF(mA) Ambient Temperature Ta( ) Fig.6 Forward Current Derating Curve Fig.7 Relative Intensity vs.angle DRAWING NO.: DS DATE: PAGE 7 of 15

8 Label Explanation ITEM CODE:PARA LIGHT PART NO: L-C19F1RGBCT-CA IV --- Luminous Intensity Code LOT NO: EM S L A B C D E F A---EM: Emos Code B---S:SMD C---Local D---Year E---Month F---SPEC. PACKING QUANTITY OF BAG : 3pcs for series 4pcs for 191 series 5pcs for 192 series DATE CODE: G H I G--- Year H--- Month I --- Day DRAWING NO.: DS DATE: PAGE 8 of 15

9 Typical Electro-Optical Characteristics Curves Fig.1 Red Relative Intensity vs. Wavelength Fig.1 Green Relative Intensity vs. Wavelength Fig.1 Blue Relative Intensity vs. Wavelength Reel Dimensions Notes: 1. Taping Quantity: 3pcs 2. The tolerances unless mentioned is±.1mm, Angle±.5, Unit: mm. DRAWING NO.: DS DATE: PAGE 9 of 15

10 H:\SMD\SMD\SMD ü \±ê??.jpg H:\SMD\SMD\SMD ü \±ê??.jpg Package Dimensions Of Tape And Reel SURFACE MOUNT DEVICE LED Progressive direction Polarity ANODE Notes: All dimensions are in millimeters. Moisture Resistant Packaging H:\SMD\SMD\SMD ü \±ê??.jpg H:\SMD\SMD\SMD ü \±ê??.jpg Label Reel Label Aluminum moistue-proof bag Desiccant Label Box Carton Notes : One reel in a bag, six bag in a inner box, six inner boxes in a carton. Unit : mm DRAWING NO.: DS DATE: PAGE 1 of 15

11 Cleaning If cleaning is required, use the following solutions for less than 1 minute and less than 4. Appropriate chemicals: Ethyl alcohol and isopropyl alcohol. Effect of ultrasonic cleaning on the LED resin body differs depending on such factors as the oscillator output, size of PCB and LED mounting method. The use of ultrasonic cleaning should be enforced at proper output after confirming there is no problem. Suggest Soldering Pad Dimensions Direction of PWB camber and go to reflow furnace DRAWING NO.: DS DATE: PAGE 11 of 15

12 Suggest Sn/Pb IR Reflow Soldering Profile Condition: Suggest Pb-Free IR Reflow Soldering Profile Condition: DRAWING NO.: DS DATE: PAGE 12 of 15

13 Bin Code List Luminous Intensity (IV), Unit: Red (a chip) Green (b chip) Blue (c chip) Bin Code Min Max Bin Code Min Max Bin Code Min Max Q T Q R U R Tolerance of each bin are±15% CAUTIONS Green (b chip) Dominant Wavelength (Hue), Unit: Blue (c chip) Bin Code Min Max Bin Code Min Max AP AC AQ AD Application Limitation: Tolerance of each bin are±1nm The LED s described here are intended to be used for ordinary electronic equipment (such as office equipment, communication equipment and household application). Consult PARA s sales in advance for information on application in which exceptional quality and reliability are required, particularly when the failure or malfunction of the LED s may directly jeopardize life or health (such as airplanes, automobiles, traffic control equipment, life support system and safety devices). 2.Storage: Do not open moisture proof bag before the products are ready to use. Before opening the package: The LEDs should be kept at 3 or less and 9%RH or less. After opening the package: The LED's floor life is 1 year under 3 or less and 6% RH or less. If unused LEDs remain, it should be stored in moisture proof packages. If the moisture absorbent material (silica gel) has faded away or the LEDs have exceeded the storage time, baking treatment should be performed using the following conditions. Baking treatment: 6±5 for 24 hours DRAWING NO.: DS DATE: PAGE 13 of 15

14 3.Soldering SURFACE MOUNT DEVICE LED Do not apply any stress to the lead frame during soldering while the LED is at high temperature. Recommended soldering condition. Reflow Soldering: Pre-heat 12~15 C, 12sec. MAX., Peak temperature : 24 C Max. Soldering time: 1 sec Max. Soldering Iron: (Not recommended) Temperature 3 C Max., Soldering time : 3 sec. Max.(one time only), power dissipation of iron : 2W Max. use SN6 solder of solder with silver content and don t to touch LED lens when soldering. Wave soldering: Pre-heat 1 C Max, Pre-heat time 6 sec. Max, Solder wave 26 C Max, Soldering time 5 sec. Max. preformed consecutively cooling process is required between 1 st and 2 nd soldering processes. 4. Lead-Free Soldering For Reflow Soldering: 1 Pre-Heat Temp:15-18,12sec.Max. 2 Soldering Temp: Temperature Of Soldering Pot Over 23,4sec.Max. 3 Peak Temperature:26,5sec. 4 Reflow Repetition:2 Times Max. 5 Suggest Solder Paste Formula 93.3 Sn/3.1 Ag/3.1 Bi /.5 Cu For Soldering Iron (Not Recommended): 1 Iron Tip Temp:35 Max. 2 Soldering Iron:3w Max. 3 Soldering Time:3 Sec. Max. One Time. For Dip Soldering: 1 Pre-Heat Temp:15 Max. 12 Sec. Max. 2 Bath Temp:265 Max. 3 Dip Time:5 Sec. Max. 5. Drive Method Circuit model A Circuit model B (A)Recommended circuit. (B)The difference of brightness between LED`s could be found due to the Vf-If characteristics of LED. DRAWING NO.: DS DATE: PAGE 14 of 15

15 6.Reliability Test Classification Test Item Test Condition Reference Standard Endurance Test Environmental Test 7.Others: Operation Life High Temperature High Humidity Storage High Temperature Storage Low Temperature Storage Temperature Cycling Thermal Shock Solder Resistance Solder ability Ta= Under Room Temperature As Per Data Sheet Maximum Rating *Test Time= 1HRS IR-Reflow In-Board, 2 Times Ta= 65±5,RH= 9~95% *Test Time= 1HRS±2HRS Ta= 15±5 Test Time= 1HRS (-24HRS, 72HRS) Ta= -55±5 *Test Time=1HRS (-24HRS, 72H RS) 15±5-55±5 1mins 1mins 1 Cycles IR-Reflow In-Board, 2 Times 15±5-55 ±5 1mins 1mins 1 Cycles Tsol= 26 ± 5 Dwell Time= 1 ± 1sec Tsol= 235 ± 5 Immersion time 2±.5 sec Immersion rate 25±2.5 mm/sec Coverage 95% of the dipped surface MIL-STD-75D: 126 (1995) MIL-STD-883D: 15 (1991) JIS C 721:B-1 (1982) MIL-STD-22F: 13B(198) JIS C 721: B-11 (1982) MIL-STD-883D: 18 (1991) JIS C 721:B-1 (1982) JIS C 721:B-12 (1982) MIL-STD-22F: 17D (198) MIL-STD-75D: 151(1995) MIL-STD-883D: 11 (1991) JIS C 721: A-4 (1982) MIL-STD-22F: 17D(198) MIL-STD-75D: 151(1995) MIL-STD-883D: 111(1991) MIL-STD-22F: 21A(198) MIL-STD-75D: 231(1995) JIS C 721: A-1 (1982) MIL-STD-22F: 28D(198) MIL-STD-75D: 226(1995) MIL-STD-883D: 23(1991) IEC 68 Part 2-2 JIS C 721: A-2 (1982) The appearance and specifications of the product may be modified for improvement without notice. DRAWING NO.: DS DATE: PAGE 15 of 15

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