MEEN Nanoscale Issues in Manufacturing. Lithography Lecture 1: The Lithographic Process
|
|
- Maximilian Melton
- 5 years ago
- Views:
Transcription
1 MEEN Nanoscale Issues in Manufacturing Lithography Lecture 1: The Lithographic Process 1
2 Discuss Reading Assignment 1 1 Introducing Nano 2 2 Size Matters 3 3 Interlude One-The Fundamental Science Behind Nanotechnology Electrons, Atoms, Ions, Molecules Metals, Ceramics, Polymers Biosystems Electrical Conduction and Ohm s Law Quantum Effects Optics 2
3 Nanofabrication - 2 principal approaches Top-Down Miniaturizing existing processes at the Macro/Microscale Traditional approach in industrial applications E.g. Lithography, backbone of computing systems Bottom-Up Assembling structures from the atomic/molecular level Novel approach, conceptually imitating nature E.g. chemical self-assembly 3
4 Lithography Lithography in Art How lithography works Materials used for lithography drawing Photolithography Photolithographic process 4
5 Lithography in Art Invented by Alois Senefelder in 1798 Used for book illustrations, artist's prints, packaging, posters etc. In 1825, Goya produced a series of lithographs. In the 20 th and 21 st century, become an important technique with unique expressive capabilities in the Art field 5
6 How Lithography started Lithography (Greek for "stone drawing") relies on the fact that water and grease repel Draw a pattern onto a flat stone surface with a greasy substance Paint the printing ink onto the stone While the stone background absorbs water, the greasy substance retains wet ink on top Press paper against the stone to transfer the pattern Positive! Repeatable! 6
7 Materials used for lithography drawing Litho crayons and pencils (containing wax, pigment, soap and shellac), conte crayons, pens and graphite pencils, etc. Bulls of Bordeaux by Goya 7
8 Lithography, to date Miniaturized computing circuits require mass manufacturing of small features push lithographic approach to new limits Some lithography approaches for manufacturing Optical lithography (including ultraviolet) X-Ray lithography Electron Beam lithography Ion Beam lithography Dip-Pen lithography 8
9 Optical/UV Lithography Workhorse of current chip manufacturing processes Limited by wave length of light employed Smaller features reduce wave length UV light Here is how it works 9
10 Photolithographic process Wafer cleaning Barrier layer formation Photoresist application Soft baking Mask alignment Exposure and development Hard-baking 10
11 Wafer cleaning Cleans wafer chemically to remove particulate matter on the surface (traces of organic, ionic, and metallic impurities) 11
12 Barrier layer formation After cleaning, silicon dioxide (a barrier layer) is deposited on the surface of the wafer 12
13 Photoresist application After the formation of the SiO 2 layer, photoresist is applied to the surface of the wafer Spin coating produces a uniform thin film There are two types of photoresist: positive and negative 13
14 (Photolitho_main_process.jpg) 14
15 Soft baking During this stage, most of the solvents are removed from the photoresist coating The photoresist coatings become photosensitive (imageable) after softbaking 15
16 Mask alignment Use a photomask - square glass plate with a patterned emulsion of metal film on one side The mask is aligned with the wafer to transfer the pattern onto the wafer surface. 16
17 Exposure Photoresist - exposed through pattern on the mask with a high intensity ultraviolet light. Three primary exposure methods: - contact - proximity - projection 17
18 (plithp2.gif) 18
19 Development At low-exposure energies, the negative resist remains completely soluble in the developer solution a a solvent mixture delivered the resist to the surface and the masked area did not chemically change. For positive resists, the resist solubility in its developer is finite even at zero-exposure exposure energy the masked area did not chemically change, the exposed area must become MORE soluble. 19
20 (plithp3.gif) 20
21 Hard-baking The final step in photolithographic process Harden the photoresist and improve adhesion of the photoresist to the wafer surface 21
22 References: tolith.html tolith.html phy.htm 22
23 Assignment Review this PowerPoint set. 23
Nanoscale Issues in Materials & Manufacturing
Nanoscale Issues in Materials & Manufacturing ENGR 213 Principles of Materials Engineering Module 2: Introduction to Nanoscale Issues Top-down and Bottom-up Approaches for Fabrication Winfried Teizer,
More informationTechniken der Oberflächenphysik (Techniques of Surface Physics)
Techniken der Oberflächenphysik (Techniques of Surface Physics) Prof. Yong Lei & Dr. Yang Xu (& Liying Liang) Fachgebiet 3D-Nanostrukturierung, Institut für Physik Contact: yong.lei@tu-ilmenau.de; yang.xu@tu-ilmenau.de;
More informationTop down and bottom up fabrication
Lecture 24 Top down and bottom up fabrication Lithography ( lithos stone / graphein to write) City of words lithograph h (Vito Acconci, 1999) 1930 s lithography press Photolithography d 2( NA) NA=numerical
More informationIntroduction to Photolithography
http://www.ichaus.de/news/72 Introduction to Photolithography Photolithography The following slides present an outline of the process by which integrated circuits are made, of which photolithography is
More informationIntroduction. Photoresist : Type: Structure:
Photoresist SEM images of the morphologies of meso structures and nanopatterns on (a) a positively nanopatterned silicon mold, and (b) a negatively nanopatterned silicon mold. Introduction Photoresist
More informationNanotechnology Fabrication Methods.
Nanotechnology Fabrication Methods. 10 / 05 / 2016 1 Summary: 1.Introduction to Nanotechnology:...3 2.Nanotechnology Fabrication Methods:...5 2.1.Top-down Methods:...7 2.2.Bottom-up Methods:...16 3.Conclusions:...19
More informationNANOTECHNOLOGY. Students will gain an understanding of nanoscale dimensions and nanotechnology.
NANOTECHNOLOGY By Anna M. Waldron and Carl A. Batt, Nanobiotechnology Center, Cornell University Subjects: Nanotechnology, Chemistry, Physics Time: Two class periods (approximately 90 minutes) Objective:
More informationLecture 150 Basic IC Processes (10/10/01) Page ECE Analog Integrated Circuits and Systems P.E. Allen
Lecture 150 Basic IC Processes (10/10/01) Page 1501 LECTURE 150 BASIC IC PROCESSES (READING: TextSec. 2.2) INTRODUCTION Objective The objective of this presentation is: 1.) Introduce the fabrication of
More informationPhotolithography Overview 9/29/03 Brainerd/photoclass/ECE580/Overvie w/overview
http://www.intel.com/research/silicon/mooreslaw.htm 1 Moore s law only holds due to photolithography advancements in reducing linewidths 2 All processing to create electric components and circuits rely
More informationUNIT 3. By: Ajay Kumar Gautam Asst. Prof. Dev Bhoomi Institute of Technology & Engineering, Dehradun
UNIT 3 By: Ajay Kumar Gautam Asst. Prof. Dev Bhoomi Institute of Technology & Engineering, Dehradun 1 Syllabus Lithography: photolithography and pattern transfer, Optical and non optical lithography, electron,
More informationIC Fabrication Technology
IC Fabrication Technology * History: 1958-59: J. Kilby, Texas Instruments and R. Noyce, Fairchild * Key Idea: batch fabrication of electronic circuits n entire circuit, say 10 7 transistors and 5 levels
More informationFigure 1: Some examples of objects at different size scales ( 2001, CMP Científica, [2])
Top-Down vs. Bottom-Up Nanomanufacturing Prof. Derek J. Hansford, Biomedical Engineering Program and Department of Materials Science & Engineering Learning Objectives: This module should expose the student
More informationChapter 3 : ULSI Manufacturing Technology - (c) Photolithography
Chapter 3 : ULSI Manufacturing Technology - (c) Photolithography 1 Reference 1. Semiconductor Manufacturing Technology : Michael Quirk and Julian Serda (2001) 2. - (2004) 3. Semiconductor Physics and Devices-
More informationOptical Proximity Correction
Optical Proximity Correction Mask Wafer *Auxiliary features added on mask 1 Overlay Errors + + alignment mask wafer + + photomask plate Alignment marks from previous masking level 2 (1) Thermal run-in/run-out
More informationLecture 8. Photoresists and Non-optical Lithography
Lecture 8 Photoresists and Non-optical Lithography Reading: Chapters 8 and 9 and notes derived from a HIGHLY recommended book by Chris Mack, Fundamental Principles of Optical Lithography. Any serious student
More informationMSN551 LITHOGRAPHY II
MSN551 Introduction to Micro and Nano Fabrication LITHOGRAPHY II E-Beam, Focused Ion Beam and Soft Lithography Why need electron beam lithography? Smaller features are required By electronics industry:
More information5. Photochemistry of polymers
5. Photochemistry of polymers 5.1 Photopolymerization and cross-linking Photopolymerization The fundamental principle of photopolymerization is based on the photoinduced production of a reactive species,
More informationNanostructures Fabrication Methods
Nanostructures Fabrication Methods bottom-up methods ( atom by atom ) In the bottom-up approach, atoms, molecules and even nanoparticles themselves can be used as the building blocks for the creation of
More informationPhotolithography 光刻 Part II: Photoresists
微纳光电子材料与器件工艺原理 Photolithography 光刻 Part II: Photoresists Xing Sheng 盛兴 Department of Electronic Engineering Tsinghua University xingsheng@tsinghua.edu.cn 1 Photolithography 光刻胶 负胶 正胶 4 Photolithography
More informationPattern Transfer- photolithography
Pattern Transfer- photolithography DUV : EUV : 13 nm 248 (KrF), 193 (ArF), 157 (F 2 )nm H line: 400 nm I line: 365 nm G line: 436 nm Wavelength (nm) High pressure Hg arc lamp emission Ref: Campbell: 7
More informationUNIVERSITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences. Professor Ali Javey. Fall 2009.
UNIVERSITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences EE143 Professor Ali Javey Fall 2009 Exam 1 Name: SID: Closed book. One sheet of notes is allowed.
More informationStructuring and bonding of glass-wafers. Dr. Anke Sanz-Velasco
Structuring and bonding of glass-wafers Dr. Anke Sanz-Velasco Outline IMT Why glass? Components for life science Good bond requirements and evaluation Wafer bonding 1. Fusion bonding 2. UV-adhesive bonding
More informationPhotolithography II ( Part 1 )
1 Photolithography II ( Part 1 ) Chapter 14 : Semiconductor Manufacturing Technology by M. Quirk & J. Serda Bjørn-Ove Fimland, Department of Electronics and Telecommunication, Norwegian University of Science
More informationLithography and Etching
Lithography and Etching Victor Ovchinnikov Chapters 8.1, 8.4, 9, 11 Previous lecture Microdevices Main processes: Thin film deposition Patterning (lithography) Doping Materials: Single crystal (monocrystal)
More informationCarrier Transport by Diffusion
Carrier Transport by Diffusion Holes diffuse ÒdownÓ the concentration gradient and carry a positive charge --> hole diffusion current has the opposite sign to the gradient in hole concentration dp/dx p(x)
More informationUNIVERSITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences. Professor Ali Javey. Spring 2009.
UNIVERSITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences EE143 Professor Ali Javey Spring 2009 Exam 1 Name: SID: Closed book. One sheet of notes is allowed.
More informationEE115C Winter 2017 Digital Electronic Circuits. Lecture 3: MOS RC Model, CMOS Manufacturing
EE115C Winter 2017 Digital Electronic Circuits Lecture 3: MOS RC Model, CMOS Manufacturing Agenda MOS Transistor: RC Model (pp. 104-113) S R on D CMOS Manufacturing Process (pp. 36-46) S S C GS G G C GD
More informationMICRO AND NANOPROCESSING TECHNOLOGIES
LECTURE 5 MICRO AND NANOPROCESSING TECHNOLOGIES Introduction Ion lithography X-ray lithography Soft lithography E-beam lithography Concepts and processes Lithography systems Masks and resists Chapt.9.
More informationPhysics and Material Science of Semiconductor Nanostructures
Physics and Material Science of Semiconductor Nanostructures PHYS 570P Prof. Oana Malis Email: omalis@purdue.edu Course website: http://www.physics.purdue.edu/academic_programs/courses/phys570p/ Today
More informationJ. Photopolym. Sci. Technol., Vol. 22, No. 5, Fig. 1. Orthogonal solvents to conventional process media.
originates from the limited number of options regarding orthogonal solvents, i.e. solvents that do not dissolve or adversely damage a pre-deposited organic materials layer. The simplest strategy to achieve
More informationLesson 4: Tools of the Nanosciences. Student Materials
Lesson 4: Tools of the Nanosciences Student Materials Contents Black Box Lab Activity: Student Instructions and Worksheet Seeing and Building Small Things: Student Reading Seeing and Building Small Things:
More informationnmos IC Design Report Module: EEE 112
nmos IC Design Report Author: 1302509 Zhao Ruimin Module: EEE 112 Lecturer: Date: Dr.Zhao Ce Zhou June/5/2015 Abstract This lab intended to train the experimental skills of the layout designing of the
More informationNanomaterials and their Optical Applications
Nanomaterials and their Optical Applications Winter Semester 2013 Lecture 02 rachel.grange@uni-jena.de http://www.iap.uni-jena.de/multiphoton Lecture 2: outline 2 Introduction to Nanophotonics Theoretical
More informationInorganic compounds that semiconduct tend to have an average of 4 valence electrons, and their conductivity may be increased by doping.
Chapter 12 Modern Materials 12.1 Semiconductors Inorganic compounds that semiconduct tend to have an average of 4 valence electrons, and their conductivity may be increased by doping. Doping yields different
More informationFabrication at the nanoscale for nanophotonics
Fabrication at the nanoscale for nanophotonics Ilya Sychugov, KTH Materials Physics, Kista silicon nanocrystal by electron beam induced deposition lithography Outline of basic nanofabrication methods Devices
More informationLecture 0: Introduction
Lecture 0: Introduction Introduction q Integrated circuits: many transistors on one chip q Very Large Scale Integration (VLSI): bucketloads! q Complementary Metal Oxide Semiconductor Fast, cheap, low power
More informationSelf-study problems and questions Processing and Device Technology, FFF110/FYSD13
Self-study problems and questions Processing and Device Technology, FFF110/FYSD13 Version 2016_01 In addition to the problems discussed at the seminars and at the lectures, you can use this set of problems
More informationSwing Curves. T h e L i t h o g r a p h y T u t o r (Summer 1994) Chris A. Mack, FINLE Technologies, Austin, Texas
T h e L i t h o g r a p h y T u t o r (Summer 1994) Swing Curves Chris A. Mack, FINLE Technologies, Austin, Texas In the last edition of this column, we saw that exposing a photoresist involves the propagation
More informationOverview of the main nano-lithography techniques
Overview of the main nano-lithography techniques Soraya Sangiao sangiao@unizar.es Outline Introduction: Nanotechnology. Nano-lithography techniques: Masked lithography techniques: Photolithography. X-ray
More informationNPTEL. Instability and Patterning of Thin Polymer Films - Video course. Chemical Engineering.
NPTEL Syllabus Instability and Patterning of Thin Polymer Films - Video course COURSE OUTLINE T h i s course will expose students to the science of sub-micron, meso and nanoscale patterning of surfaces
More informationNano fabrication by e-beam lithographie
Introduction to nanooptics, Summer Term 2012, Abbe School of Photonics, FSU Jena, Prof. Thomas Pertsch Nano fabrication by e-beam lithographie Lecture 14 1 Electron Beam Lithography - EBL Introduction
More informationIn this place, the following terms or expressions are used with the meaning indicated:
B05D PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL (apparatus for applying liquids or other fluent materials to surfaces B05B, B05C; {coating of foodstuffs A23P 20/17,
More informationNanotechnology Nanofabrication of Functional Materials. Marin Alexe Max Planck Institute of Microstructure Physics, Halle - Germany
Nanotechnology Nanofabrication of Functional Materials Marin Alexe Max Planck Institute of Microstructure Physics, Halle - Germany Contents Part I History and background to nanotechnology Nanoworld Nanoelectronics
More informationcustom reticle solutions
custom reticle solutions 01 special micro structures Pyser Optics has over 60 years experience in producing high quality micro structure products. These products are supplied worldwide to industries including
More informationEE 434 Lecture 7. Process Technology
EE 434 Lecture 7 Process Technology Quiz 4 How many wafers can be obtained from a 2m pull? Neglect the material wasted in the kerf used to separate the wafers. 2m And the number is. 1 8 3 5 6 4 9 7 2 1
More informationA Novel Approach to the Layer Number-Controlled and Grain Size- Controlled Growth of High Quality Graphene for Nanoelectronics
Supporting Information A Novel Approach to the Layer Number-Controlled and Grain Size- Controlled Growth of High Quality Graphene for Nanoelectronics Tej B. Limbu 1,2, Jean C. Hernández 3, Frank Mendoza
More informationFabrication Technology for Miniaturization
Appendix A Fabrication Technology for Miniaturization INTRODUCTION Many of the technologies that have enabled advances in miniaturization were first developed for microelectronics and allow both lateral
More informationFabrication of ordered array at a nanoscopic level: context
Fabrication of ordered array at a nanoscopic level: context Top-down method Bottom-up method Classical lithography techniques Fast processes Size limitations it ti E-beam techniques Small sizes Slow processes
More informationSCME KIT OVERVIEW. Rainbow Wafer Kit
SCME KIT OVERVIEW Rainbow Wafer Kit Micro Nano Conference I - 2011 Objectives of Each Kit The SCME kits are designed to work both as a stand-alone activity as well as to support the materials introduced
More informationSection 3: Etching. Jaeger Chapter 2 Reader
Section 3: Etching Jaeger Chapter 2 Reader Etch rate Etch Process - Figures of Merit Etch rate uniformity Selectivity Anisotropy d m Bias and anisotropy etching mask h f substrate d f d m substrate d f
More informationKavli Workshop for Journalists. June 13th, CNF Cleanroom Activities
Kavli Workshop for Journalists June 13th, 2007 CNF Cleanroom Activities Seeing nm-sized Objects with an SEM Lab experience: Scanning Electron Microscopy Equipment: Zeiss Supra 55VP Scanning electron microscopes
More informationNanolithography Techniques
Nanolithography Techniques MSE 505 / MSNT 505 P. Coane Outline What Is Nanotechnology? The Motivation For Going Small Nanofabrication Technologies Basic Techniques Nano Lithography NANOTECHNOLOGY Nanotechnology
More informationFar IR Gas Lasers microns wavelengths, THz frequency Called Terahertz lasers or FIR lasers At this wavelength behaves more like
Far IR Gas Lasers 10-1500 microns wavelengths, 300 10 THz frequency Called Terahertz lasers or FIR lasers At this wavelength behaves more like microwave signal than light Created by Molecular vibronic
More informationDiscussions start next week Labs start in week 3 Homework #1 is due next Friday
EECS141 1 Discussions start next week Labs start in week 3 Homework #1 is due next Friday Everyone should have an EECS instructional account Use cory, quasar, pulsar EECS141 2 1 CMOS LEAKAGE CHARACTERIZATION
More informationEE C245 ME C218 Introduction to MEMS Design Fall 2007
EE C245 ME C218 Introduction to MEMS Design Fall 2007 Prof. Clark T.-C. Nguyen Dept. of Electrical Engineering & Computer Sciences University of California at Berkeley Berkeley, CA 94720 Lecture 5: ALD,
More informationCURRENT STATUS OF NANOIMPRINT LITHOGRAPHY DEVELOPMENT IN CNMM
U.S. -KOREA Forums on Nanotechnology 1 CURRENT STATUS OF NANOIMPRINT LITHOGRAPHY DEVELOPMENT IN CNMM February 17 th 2005 Eung-Sug Lee,Jun-Ho Jeong Korea Institute of Machinery & Materials U.S. -KOREA Forums
More informationOrthogonal Processing: A New Strategy for Patterning Organic Electronics
1 rthogonal Processing: A New Strategy for Patterning rganic Electronics ERC Teleconference 3/September/2009 Jin-Kyun Lee and Christopher K. ber* Materials Science & Engineering Cornell University 2 rganic
More informationWet Chemical Processing with Megasonics Assist for the Removal of Bumping Process Photomasks
Wet Chemical Processing with Megasonics Assist for the Removal of Bumping Process Photomasks Hongseong Sohn and John Tracy Akrion Systems 6330 Hedgewood Drive, Suite 150 Allentown, PA 18106, USA Abstract
More informationUnconventional Nano-patterning. Peilin Chen
Unconventional Nano-patterning Peilin Chen Reference Outlines History of patterning Traditional Nano-patterning Unconventional Nano-patterning Ancient Patterning "This is the Elks' land". A greeting at
More informationLecture 14 Advanced Photolithography
Lecture 14 Advanced Photolithography Chapter 14 Wolf and Tauber 1/74 Announcements Term Paper: You are expected to produce a 4-5 page term paper on a selected topic (from a list). Term paper contributes
More informationTechnologies VII. Alternative Lithographic PROCEEDINGS OF SPIE. Douglas J. Resnick Christopher Bencher. Sponsored by. Cosponsored by.
PROCEEDINGS OF SPIE Alternative Lithographic Technologies VII Douglas J. Resnick Christopher Bencher Editors 23-26 February 2015 San Jose, California, United States Sponsored by SPIE Cosponsored by DNS
More informationIntroduction to Electron Beam Lithography
Introduction to Electron Beam Lithography Boštjan Berčič (bostjan.bercic@ijs.si), Jožef Štefan Institute, Jamova 39, 1000 Ljubljana, Slovenia 1. Introduction Electron Beam Lithography is a specialized
More informationChapter 2. Design and Fabrication of VLSI Devices
Chapter 2 Design and Fabrication of VLSI Devices Jason Cong 1 Design and Fabrication of VLSI Devices Objectives: To study the materials used in fabrication of VLSI devices. To study the structure of devices
More informationCUSTOM RETICLE SOLUTIONS
CUSTOM RETICLE SOLUTIONS Special Micro Structures Pyser-SGI has over 60 years experience in producing high quality micro structure products. These products are supplied worldwide to industries including
More informationAdditive technologies for the patterning of fine metal tracks onto flexible substrates
Additive technologies for the patterning of fine metal tracks onto flexible substrates Marc P.Y. Desmulliez m.desmulliez@hw.ac.uk MIcroSystems Engineering Centre (MISEC) Institute of Integrated Systems
More informationModern Additive Technology - a view into the future
Introduction Modern Additive Technology - a view into the future Dr. Jürgen Omeis, Dr. Guillaume Jaunky BYK-Chemie GmbH, Wesel, Germany Reviewing the current literature of colloids and interfacial materials,
More informationEspecial Bump Bonding Technique for Silicon Pixel Detectors
Especial Bump Bonding Technique for Silicon Pixel Detectors E. Cabruja, M. Bigas, M. Ullán, G. Pellegrini, M. Lozano Centre Nacional de Microelectrònica Spain Outline Motivation Summary of bump bonding
More informationDiffusion and Ion implantation Reference: Chapter 4 Jaeger or Chapter 3 Ruska N & P Dopants determine the resistivity of material Note N lower
Diffusion and Ion implantation Reference: Chapter 4 Jaeger or Chapter 3 Ruska N & P Dopants determine the resistivity of material Note N lower resistavity than p: due to higher carrier mobility Near linear
More informationUNIVERSITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences. Fall Exam 1
UNIVERSITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences EECS 143 Fall 2008 Exam 1 Professor Ali Javey Answer Key Name: SID: 1337 Closed book. One sheet
More informationFar IR (FIR) Gas Lasers microns wavelengths, THz frequency Called Terahertz lasers or FIR lasers At this wavelength behaves more like
Far IR (FIR) Gas Lasers 10-1500 microns wavelengths, 300 10 THz frequency Called Terahertz lasers or FIR lasers At this wavelength behaves more like microwave signal than light Created by Molecular vibronic
More informationChromatography Lab # 4
Chromatography Lab # 4 Chromatography is a method for separating mixtures based on differences in the speed at which they migrate over or through a stationary phase which means that a complex mixture will
More informationExperiment Nine Thin Layer Chromatography
Name: Lab Section: 09 Thin Layer Chromatography Experiment Nine Thin Layer Chromatography Introduction Objective Separation of compounds from a mixture is an incredibly important aspect of experimental
More informationSupplementary Figure 1 Detailed illustration on the fabrication process of templatestripped
Supplementary Figure 1 Detailed illustration on the fabrication process of templatestripped gold substrate. (a) Spin coating of hydrogen silsesquioxane (HSQ) resist onto the silicon substrate with a thickness
More informationChapter 12 - Modern Materials
Chapter 12 - Modern Materials 12.1 Semiconductors Inorganic compounds that semiconduct tend to have chemical formulas related to Si and Ge valence electron count of four. Semiconductor conductivity can
More informationA Novel Self-aligned and Maskless Process for Formation of Highly Uniform Arrays of Nanoholes and Nanopillars
Nanoscale Res Lett (2008) 3: 127 DOI 10.1007/s11671-008-9124-6 NANO EXPRESS A Novel Self-aligned and Maskless Process for Formation of Highly Uniform Arrays of Nanoholes and Nanopillars Wei Wu Æ Dibyendu
More informationFast Bonding of Substrates for the Formation of Microfluidic Channels at Room Temperature
Supplementary Material (ESI) for Lab on a Chip This journal is The Royal Society of Chemistry 2005 Supporting Information Fast Bonding of Substrates for the Formation of Microfluidic Channels at Room Temperature
More information3.30 TITANIUM DIOXIDE
181 3.30 TITANIUM DIOXIDE Technology Prospects Addressable market size 5 Competitive landscape 3 IP landscape 4 Commercial prospects 4 Technology drawbacks 3 Total score (out of max. 25): 19 3.30.1 Properties
More informationNano Materials. Nanomaterials
Nano Materials 1 Contents Introduction Basics Synthesis of Nano Materials Fabrication of Nano Structure Nano Characterization Properties and Applications 2 Fabrication of Nano Structure Lithographic techniques
More informationSupplementary Information Our InGaN/GaN multiple quantum wells (MQWs) based one-dimensional (1D) grating structures
Polarized white light from hybrid organic/iii-nitrides grating structures M. Athanasiou, R. M. Smith, S. Ghataora and T. Wang* Department of Electronic and Electrical Engineering, University of Sheffield,
More information.Fritjaf Capra, The Tao of Physics
Probing inside the atom and investigating its structure, science transcended the limits of our sensory imagination. From this point on, it could no longer rely with absolute certainty on logic and common
More informationThin Wafer Handling Challenges and Emerging Solutions
1 Thin Wafer Handling Challenges and Emerging Solutions Dr. Shari Farrens, Mr. Pete Bisson, Mr. Sumant Sood and Mr. James Hermanowski SUSS MicroTec, 228 Suss Drive, Waterbury Center, VT 05655, USA 2 Thin
More informationAdvanced Texturing of Si Nanostructures on Low Lifetime Si Wafer
Advanced Texturing of Si Nanostructures on Low Lifetime Si Wafer SUHAILA SEPEAI, A.W.AZHARI, SALEEM H.ZAIDI, K.SOPIAN Solar Energy Research Institute (SERI), Universiti Kebangsaan Malaysia (UKM), 43600
More information520/ Photolithography (II) Andreas G. Andreou
520/580.495 Photolithography (II) Andreas G. Andreou Lecture notes from Positive Photoresists and Photolithography by R. Darling http://www.engr.washington.edu/~cam/processes A.G. Andreou 2000 1 Lecture
More informationLECTURE 5 SUMMARY OF KEY IDEAS
LECTURE 5 SUMMARY OF KEY IDEAS Etching is a processing step following lithography: it transfers a circuit image from the photoresist to materials form which devices are made or to hard masking or sacrificial
More informationFar IR (FIR) Gas Lasers microns wavelengths, THz frequency Called Terahertz lasers or FIR lasers At this wavelength behaves more like
Far IR (FIR) Gas Lasers 10-1500 microns wavelengths, 300 10 THz frequency Called Terahertz lasers or FIR lasers At this wavelength behaves more like microwave signal than light Created by Molecular vibronic
More informationNano-mechatronics. Presented by: György BudaváriSzabó (X0LY4M)
Nano-mechatronics Presented by: György BudaváriSzabó (X0LY4M) Nano-mechatronics Nano-mechatronics is currently used in broader spectra, ranging from basic applications in robotics, actuators, sensors,
More informationORION NanoFab: An Overview of Applications. White Paper
ORION NanoFab: An Overview of Applications White Paper ORION NanoFab: An Overview of Applications Author: Dr. Bipin Singh Carl Zeiss NTS, LLC, USA Date: September 2012 Introduction With the advancement
More informationThree Approaches for Nanopatterning
Three Approaches for Nanopatterning Lithography allows the design of arbitrary pattern geometry but maybe high cost and low throughput Self-Assembly offers high throughput and low cost but limited selections
More informationApplications in Forensic Science. T. Trimpe
Applications in Forensic Science T. Trimpe 2006 http://sciencespot.net/ What is chromatography? From Wikipedia... Chromatography (from Greek word for chromos for colour) is the collective term for a family
More informationNANONICS IMAGING FOUNTAIN PEN
NANONICS IMAGING FOUNTAIN PEN NanoLithography Systems Methods of Nanochemical Lithography Fountain Pen NanoLithography A. Lewis et al. Appl. Phys. Lett. 75, 2689 (1999) FPN controlled etching of chrome.
More informationEtching: Basic Terminology
Lecture 7 Etching Etching: Basic Terminology Introduction : Etching of thin films and sometimes the silicon substrate are very common process steps. Usually selectivity, and directionality are the first
More informationDry Etching Zheng Yang ERF 3017, MW 5:15-6:00 pm
Dry Etching Zheng Yang ERF 3017, email: yangzhen@uic.edu, MW 5:15-6:00 pm Page 1 Page 2 Dry Etching Why dry etching? - WE is limited to pattern sizes above 3mm - WE is isotropic causing underetching -
More informationSupporting Information. Metallic Adhesion Layer Induced Plasmon Damping and Molecular Linker as a Non-Damping Alternative
Supporting Information Metallic Adhesion Layer Induced Plasmon Damping and Molecular Linker as a Non-Damping Alternative Terefe G. Habteyes, Scott Dhuey, Erin Wood, Daniel Gargas, Stefano Cabrini, P. James
More informationEE141- Spring 2003 Lecture 3. Last Lecture
- Spring 003 Lecture 3 IC Manufacturing 1 Last Lecture Design Metrics (part 1) Today Design metrics (wrap-up) IC manufacturing 1 Administrivia Discussion sessions start this week. Only one this week (Dejan
More informationNanoimprint Lithography
Nanoimprint Lithography Wei Wu Quantum Science Research Advanced Studies HP Labs, Hewlett-Packard Email: wei.wu@hp.com Outline Background Nanoimprint lithography Thermal based UV-based Applications based
More informationPhotonics applications 5: photoresists
IMI-NFG s Mini Course on Chalcogenide Glasses Lecture 11 Photonics applications 5: photoresists Himanshu Jain Department of Materials Science & Engineering Lehigh University, Bethlehem, PA 18015 H.Jain@Lehigh.edu
More informationRobust shadow-mask evaporation via lithographically controlled undercut
Robust shadow-mask evaporation via lithographically controlled undercut B. Cord, a C. Dames, and K. K. Berggren Massachusetts Institute of Technology, Cambridge, Massachusetts 02139-4309 J. Aumentado National
More informationnot to be confused with using the materials to template nanostructures
Zeolites as Templates: continued Synthesis: Most zeolite syntheses are performed by using template-synthesis not to be confused with using the materials to template nanostructures templates are often surfactants
More informationFabrication Engineering at the Micro- and Nanoscale, by Stephen Campbell, 4 th Edition, Oxford University Press
Fabrication Engineering at the Micro- and Nanoscale, by Stephen Campbell, 4 th Edition, Oxford University Press Errata, by Chris Mack, chris@lithoguru.com While teaching out of this book at the University
More information4FNJDPOEVDUPS 'BCSJDBUJPO &UDI
2010.5.4 1 Major Fabrication Steps in CMOS Process Flow UV light oxygen Silicon dioxide Silicon substrate Oxidation (Field oxide) photoresist Photoresist Coating Mask exposed photoresist Mask-Wafer Exposed
More information