Conjugate heat transfer from an electronic module package cooled by air in a rectangular duct
|
|
- Isaac Barnett
- 5 years ago
- Views:
Transcription
1 Conjugate heat transfer from an electronic module package cooled by air in a rectangular duct Hideo Yoshino a, Motoo Fujii b, Xing Zhang b, Takuji Takeuchi a, and Souichi Toyomasu a a) Fujitsu Kyushu System Engineering Limited, Fukuoka , Japan b) Institute of Advanced Material Study, Kyushu University, Kasuga , Japan Experimental and numerical studies are carried out for the conjugate heat transfer of an electronic module package cooled by air. Firstly, the heat conduction experiment was conducted to obtain the surface temperature profiles and to estimate the total conductive resistance and natural convection heat transfer rate to air from the outer wall of duct, where the same type two module packages were fixed opposite at the bottom and top inner walls of duct and glass wool was filled inside the gap. The measured temperature profiles were compared with those obtained by the corresponding numerical simulations and the heat transfer coefficient at the outer wall of duct was estimated. Secondly, the convective heat transfer experiment was done for a single module package attached on the bottom wall of the duct by switching three fans on and off in various combinations. As for the surface temperature profiles, the numerical results agree well with the experimental ones. When the thermal conductivity of printed circuit board is varied, however, the heat transfer coefficients based on the conventional definition could not be summarized with a unique correlation due to the effects of conjugate heat transfer. Introducing an effective heat transfer area has solved the problems and a unique correlation is proposed. Numerical simulations also clarified the effect of thermal conductivity ratio on the non-dimensional effective heat transfer area, and further the heat transfer characteristics when two or more module packages are set in the same duct. 1. Introduction Recently, conjugate heat transfer in microelectronic equipment has received considerable attention from heat transfer researchers, because of rapid increase in power dissipation of LSI chips and downsizing of electronic devices. Ramadhyani et al. (1985) and Sugavanam et al. (1994) reported the results of numerical analysis on the conjugate heat transfer from two-dimensional flush-mounted heat sources to laminar flow in the channel. Incropera et al. (1986) and Ortega et al. (1994) did experiments for two-dimensional flush-mounted heat sources. Nakayama and Park (1996) did both the numerical simulations and experiments. They concentrated their attention on the heat transfer from the floor area near the surface-mounted block and discussed how to develop a specific prediction method of the conjugate heat transfer. Zhang et al. (1999) discussed how to define an effective heat transfer area to solve the problems of the conjugate heat transfer from small heat sources mounted on a conductive wall. Fujii et al. (2001) further summarized their experimental results of the conjugate heat transfer behavior of an electronic chip module cooled by air, based on the effective heat transfer area. The present paper describes the experimental and numerical studies on the conjugate heat transfer of a printed circuit board (PCB) with an electronic module packages cooled by air in a rectangular duct. Two experiments, heat conduction and heat convection, and corresponding numerical simulations with a commercial CFD code CFdesign have been performed. For the heat conduction, the surface temperatures of the module package and heat losses to air from the outer walls of duct were measured. From the corresponding numerical simulations, was estimated the value of heat transfer coefficient for the outer walls of duct, which could be used as the boundary conditions for the successive calculations. For the heat convection, the surface temperature profiles were measured at various heat rates and air velocities. The numerical simulations under the corresponding conditions agree well with the experiments as for the temperature profiles. The computational code used was confirmed to be valid, and then several calculations have done with various combinations of thermal conductivities of PCB and fluid. When the conventional definition of heat transfer coefficient was used, however, the heat transfer characteristic could not be summarized with a unique correlation. Then, the effective heat transfer area proposed by Zhang et al. was examined to rearrange the convection heat transfer. After taking into account the effect of thermal conductivity ratio between PCB and fluid, the heat transfer characteristics can be summarized with a unique non-dimensional correlation available not only for a single module package but also
2 for two or more ones. The experimental results can also be summarized with the same correlation as obtained by numerical simulations. 2. Heat conduction experiments and simulations 2.1 Experimental setup Figure 1 shows the geometry of the experimental setup. The same type two PCBs with electronic module packages are fixed opposite at the bottom and top inner walls of duct with mm in length, 200 mm in width, and mm in height shown in the figure. Each PCB (its thermal conductivity λ p =0.3 W/m/K) having 1 mm square and 1.2mm thick is set at the center about 0 mm away from inlet of the duct. The module package consists of a heat spreader (λ hs =398 W/m/K), a heater (λ h =45 W/m/K) and a package substrate (λ ps =16 W/m/K). The heat spreader is 28 mm square, and 0.5 mm thick, and is attached to the heater with 13.4 mm square and 0.4 mm thick. The heat spreader and the heater are tightly adhered to the package substrate with 45 mm square and 2.4 mm thick. The package substrate is connected with ball grid array to the center of the PCB. Glass wool (λ gw =0.05 W/m/K) was filled inside the gap to prevent natural convection. Figure 2 shows the location of the thermocouples. Six T-type thermocouples with 50 m diameter are installed on the module package to measure the surface temperature, T s. The thermocouples numbered from 1 to 4 are located on the heat spreader surface, and the other two, No.5 and No.6, are located on the package substrate surface. A built-in diode is installed in the center of the heater, and enable to measure junction temperature, T d. The heater is energized with a DC power supply in a variable voltage range and the maximum power dissipation of the heater is about 5 watts Package substrate Heater 45 x 45 x x 13.4 x :Thermocouple No B Heat spreader 28 x 28 x 0.5 B Package substrate Heat spreader PCB 3.0 PCB 1 x 1 x 1.2 Fan 35 x 35 x 5.0 Heat spreader Package substrate PCB.0 B-B Package substrate (Symmetrical arrangement) Fan Heater Fig. 2 Location of six thermocouples Table Package substrate Fig. 1 Schematic of module package 2.2 Simulation model The simulation model has been developed based on the corresponding experimental setup described above. The dimensions and thermophysical properties of the duct and module package for the present simulations are the same as the experimental ones. On the other hand, the complicated internal structures of the package substrate
3 and PCB were simplified and they were replaced with two blocks with uniform but different thermal conductivities to save computational time. A volumetrically uniform heat generation was assumed in the heater. Natural convection boundary conditions are employed at the outer surfaces of the duct. The heat transfer coefficient was estimated to be 7.46 W/m 2 /K by fitting the surface temperatures obtained numerically with those measured for various heating rates. 2.3 Heat conduction results Figure 3 compares the measured temperature profiles with numerical ones. The temperature profiles for typical heating rates are plotted. The solid and broken lines represent the results of the experiments and the simulations, respectively. The ordinate is the temperature difference between T s and the room temperature, T o. The abscissa indicates the thermocouple number corresponding to the locations shown in Fig. 2. As the results of setting the heat transfer coefficient 7.46 W/m 2 /K, the temperature profiles of the simulation are in good agreement with the experimental results except for the position of package substrate edge (No.6), where the numerical values show higher than those measured. The temperatures on the package substrate of the experiments are lower than those at the heat spreader surface. On the T s -T o [K] 0.0 other hand, the temperatures on the package substrate of the simulations are relatively flat compared with the experimental results. These slight differences can be attributed to the simplification of the simulation model. From the results of heat conduction experiments, the heat conducted through the package substrate and PCB, and convected away from the outer walls of the duct was estimated. The heat conduction rate, Q loss, is proportional to the temperature difference (T d - T o ), and can be expressed by Q loss = 2.79 x -2 (T d - T o ) x -2 (1) Equation (1) can be used to estimate the natural convection heat losses at the same temperature difference, (T d - T o ), for forced convection experiments. 3. Forced convection experiments and simulations 3.1 Experimental setup The geometry and dimensions of the experimental setup are those used in the same as the heat conduction experiment except that there are no more the PCB at the top inner wall of duct and glass wool filled inside. The three fans with 35 mm square and 5.0 mm high are attached on the downstream most of the duct. Switching three fans on and off in various combinations can change the flow rate. The average velocity at the inlet was measured with an accurate hot-wire anemometer. 3.2 Simulation model The simulation model is also almost the same as the heat conduction case except that the convection boundary conditions inside the duct must be considered. The uniform pressure and the uniform velocity are assumed at the inlet and the outlet of the duct, respectively. 3.3 Convection heat transfer results The average velocities at the duct inlet were measured for the three operation modes. The average values were 0.33, 0.66, and 1.0 m/s for one, two, and three fans, respectively. The temperature profiles at the module package surface were measured at three heat dissipation rates, 1.00, 2.19 and 3.71 W, while the three fans ran together. Figure 4 shows a comparison of temperature profiles between experiments and simulations at U=1.00 m/s, and Experiments Q t =2.09 W Q t =1.50 W Q t =0.989 W Q t =0.506 W Simulations Location of thermocouples Fig. 3 Temperature profiles
4 three heat dissipation rates. The temperature profiles obtained from simulations agree well with those measured. The numerical results for the other two operation modes are also in good agreement with the experimental data as shown in Fig. 5, where the heat dissipation rate is kept at 1.00 W. These results confirm that the present CFD code is valid and can be used for the calculations of the conjugate heat transfer with high accuracy. T S -T o [K] Experiments Q t = 3.71 W Q t = 2.19 W Q t = 1.00 W Simulations U=1.00 m/s Location of thermocouples Fig. 4 Temperature profiles for three fans in operation 4. Parametric study on single module package 4.1 Non-dimensional correlation with conventional method Based on the validity of the present simulations, some parametric calculations were carried out with various inlet air velocities and thermal conductivities of PCB. Figure 6 shows the non-dimensional relationship between the heat transfer coefficient and air velocity. The ordinate and abscissa are the Nusselt and Reynolds numbers, respectively, which are defined as: Nu = h t L hs /λ a (2) Re = U D H /ν a (3) Here, U is the average velocity of the duct inlet, and D H is the hydraulic diameter of the duct, and L hs is the length of the heat spreader, and ν a and λ a represent the kinematic viscosity and thermal conductivity of air, respectively. The heat transfer coefficient, h t, in Eq. (2) is defined by following conventional method as: h t = Q net /A ref /(T max -T o ) (4) T s -T o [K] Experiment U=0.33 m/s, Q t = 1.00 W U=0.66 m/s, Q t = 1.00 W Simulations Location of thermocouples Fig. 5 Temperature profiles for single and two fans in operation λ p /λ a : Re ( = U D H /ν) Where, Q net is the net heat transfer rate, Q t -Q loss. Q t is the total heat dissipated, Q loss is the heat loss convected away from the outer walls of the duct, A ref is the surface area of the heat spreader, and T max represents the maximum temperature at the heat spreader surface. As shown in Fig. 6, the Nusselt number in conjugate heat transfer depends not only on the Reynolds number but also on the thermal conductivity ratio of PCB and air. The numerical results, therefore, could not be summarized with a unique non-dimensional correlation when the conventional definition of heat transfer coefficient is used. In the following discussion, the concept of effective heat transfer area is introduced to deal with such a complicated conjugate heat transfer phenomenon and to derive a unique correlation. Nu ( = h L hs / λ a ) 3 Fig. 6 Nu number versus Re number (Based on the conventional heat transfer coefficient)
5 4.2 Non-dimensional correlation with effective heat transfer area To introduce the effective heat transfer area, a uniform heat flux is assumed as an average even for the non-uniform heat flux over a heat transfer surface. At first, the convective heat flux at the heat spreader surface must be defined as q = Q conv /A ref (5) Here, Q conv is the convective heat actually transferred to air from the heat spreader surface, which can only be obtained from the simulation. The effective heat transfer area is, then, defined as A eff = Q net /q = (Q net / Q conv )A ref (6) Using effective surface area, the heat transfer coefficient is newly defined as h = Q net /A eff /(T max -T o ) (7) Therefore, the average Nusselt number can be defined with A eff 0.5 as the reference length by Nu = h A eff 0.5 /λ a (8) Figure 7 shows the relationship between the effective heat transfer area and the thermal conductivity ratio, λ p /λ a. For the region of relatively lower thermal conductivity ratio, the non-dimensional heat transfer area increases with an increase in Reynolds number. This tendency disappears in the region of higher thermal conductivity ratio. At λ p /λ a =780, the effective heat transfer area is almost independent of the Reynolds number. Figure 8 shows the relationship between Nusselt and Reynolds numbers. The numerical results can be expressed by a unique non-dimensional correlation by introducing another parameter, the thermal conductivity ratio. Nu/(λ P /λ a ) = 1.6 Re 0.4 (9).0 A eff /A ref Re number : λ P /λ a Fig. 7 Relationship between A eff /A ref and λ P /λ a Nu/(λ P /λ a ) Nu/(λ P /λ a ) = 1.6 Re 0.4 λp/λa : Experiments Re (=U D H /ν a ) Fig. 8 Nu number versus Re number based on effective heat transfer area According to the above definitions, the present experimental results are rearranged. The results agree well with Eq. (9) as shown with the symbol in Fig. 8. Practically, the effective heat transfer area for a board with known thermal conductivity can be determined from such numerical results as shown in Fig. 7. Then the Nu can be calculated by using Eq. (9) for a given inlet velocity and the duct geometry. Further, the heat transfer coefficient can be obtained from Eq. (8). Finally, the maximum temperature, that is, the most important parameter for thermal design can be predicted by the definition of heat transfer coefficient Eq. (7). Conclusively, the present method can provide two important parameters for thermal design, one is the maximum temperature, T max, and the other is the effective surface area. The latter is particularly important for the case of arrangement with multiple heat sources. 5. Multiple module packages Further calculations are carried out for the two cases of multiple arrangements of module packages, that is, the series and parallel arrangements. The concept of the effective heat transfer area can also be applied to these systems. Figure 9 shows the relationship between Nu and Re for the series arrangement. The heat transfer characteristic of the upstream package shown by the solid line is almost the same as that for a single module
6 package, while that of the second package shown by the dashed line is about 20 % lower, due to the thermal wake effect. Figure is the case of the parallel arrangement where four module packages are considered. When the thermal conductivity of PCB is high, the heat transfer characteristics of both upstream and downstream arrays of packages are almost the same as those for the series arrangement as shown by the solid and dashed lines. The Nusselt numbers become around % higher than those when the thermal conductivity is low. Νu/(λ P /λ a ) Air L hs 2L hs Nu/(λ P /λ a ) = 1.6 Re 0.4 λp/λa & position 11.7, Upstream 11.7, Downstream 780.3, Upstream 780.3, Downstream Νu/(λ P /λ a ) Air L hs 2L hs Nu/(λ P /λ a ) = 1.6 Re 0.4 λ p /λ a & position 11.7, Upstream 11.7, Downstream 780.3, Upstream 780.3, Downstream Nu/(λ P /λ a ) = 1.3 Re 0.4 Nu/(λ P /λ a ) = 1.3 Re 0.4 Re ( = U D H /ν a ) Re ( = U D H /ν a ) Fig. 9 Nu number versus Re number Fig. Nu number versus Re number (Series arrangement) (Parallel arrangement) 6. Conclusions Both the experiments and simulations for the conjugate heat transfer of an electronic module package cooled by air have been carried out. The main conclusions are as follows. 1. Experimental results have shown that the present code CFdesign can accurately predict the heat transfer characteristics of the conjugate heat transfer problems. 2. Based on the concept of effective heat transfer area, a unique non-dimensional correlation is proposed, which can predict the maximum temperature at the module package surface and can estimate the spreading of surface area. The present method is confirmed to be available for the series and parallel arrangements of multiple module packages. References journal article M. Fujii, M. Behnia, X. Zhang, S. Gima and K. Hamano, Conjugate heat transfer behavior of an electronic chip module cooled by air, Proc. of IPACK 01, IPACK (CD-ROM), F.P Incropera, J.S. Kerby, D.F. Moffatt, and S. Ramadhyani, Convection heat transfer from discrete heat sources in a rectangular channel, Int. J. Heat Mass Transfer, vol. 29, pp , W. Nakayama and S. -H. Park, Conjugate heat transfer from a single surface-mounted block to forced convective air flow in a channel, J. Heat Transfer, vol. 118, pp , A. Ortega, U.S. Wirth, and S.J Kim, Conjugate forced convection from a discrete heat source on a plane conducting surface, Heat Transfer in Electronic Systems, ASME HTD, vol. 292, pp , S. Ramadhyani, D.F. Moffatt, and F. P. Incropera, Conjugate heat transfer from small isothermal heat souces embedded in a large substrate, Int. J. Heat Mass Transfer, vol. 28, pp , R. Sugavanam, A. Ortega, and C.Y. Choi, A numerical investigation of conjugate heat transfer from a flush heat source on a conductive board in lamina channel flow, Proc. of Intersociety Conference on Thermal Phenomena in Electronic Systems (I-THERM IV), pp , X. Zhang, T. Imamura, and M. Fujii, Conjugate heat transfer from small heat sources mounted on a conductive wall, Proc. of Int. Intersociety Electronic Packaging Conf. - INTERpack '99, vol.1, pp , 1999.
NUMERICAL SIMULATION OF CONJUGATE HEAT TRANSFER FROM MULTIPLE ELECTRONIC MODULE PACKAGES COOLED BY AIR
Proceedings of IPACK03 International Electronic Packaging Technical Conference and Exhibition July 6 11 2003 Maui Hawaii USA InterPack2003-35144 NUMERICAL SIMULATION OF CONJUGATE HEAT TRANSFER FROM MULTIPLE
More informationEnhancement of Natural Convection Heat Transfer within Closed Enclosure Using Parallel Fins F. A. Gdhaidh, K. Hussain, H. S. Qi
Enhancement of Natural Convection Heat Transfer within Closed Enclosure Using Parallel Fins F. A. Gdhaidh, K. Hussain, H. S. Qi Abstract A numerical study of natural convection heat transfer in water filled
More informationNatural and Mixed Convection Heat Transfer Cooling of Discrete Heat Sources Placed Near the Bottom on a PCB
Natural and Mixed Convection Heat Transfer Cooling of Discrete Heat Sources Placed Near the Bottom on a PCB Tapano Kumar Hotta, S P Venkateshan Abstract Steady state experiments have been conducted for
More informationStudy on the natural air cooling design of electronic equipment casings: Effects of the height and size of outlet vent on the flow resistances
Journal of Physics: Conference Series Study on the natural air cooling design of electronic equipment casings: Effects of the height and size of outlet vent on the flow resistances To cite this article:
More informationExergy Analysis of Solar Air Collector Having W Shaped Artificial Roughness
Advances in Materials Science and Mechanical Engineering Research Volume 1, Number 1 (2015), pp. 25-32 International Research Publication House http://www.irphouse.com Exergy Analysis of Solar Air Collector
More informationNATURAL CONVECTIVE HEAT TRANSFER FROM A RECESSED NARROW VERTICAL FLAT PLATE WITH A UNIFORM HEAT FLUX AT THE SURFACE
HEFAT2007 5 th International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics Sun City, South Africa Paper number: OP2 NATURAL CONVECTIVE HEAT TRANSFER FROM A RECESSED NARROW VERTICAL FLAT
More informationSemiconductor Thermal Resistance Standards versus Real Life. Bernie Siegal Thermal Engineering Associates, Inc.
Semiconductor Thermal Resistance Standards versus Real Life Bernie Siegal Thermal Engineering Associates, Inc. bsiegal@thermengr.com Overview Introduction Objective Temperature vs. Thermal Current Standard
More informationNATURAL CONVECTION HEAT TRANSFER CHARACTERISTICS OF KUR FUEL ASSEMBLY DURING LOSS OF COOLANT ACCIDENT
NATURAL CONVECTION HEAT TRANSFER CHARACTERISTICS OF KUR FUEL ASSEMBLY DURING LOSS OF COOLANT ACCIDENT Ito D*, and Saito Y Research Reactor Institute Kyoto University 2-1010 Asashiro-nishi, Kumatori, Sennan,
More informationThermo-Fluid Performance of a Vapor- Chamber Finned Heat Sink
The Egyptian International Journal of Engineering Sciences and Technology Vol. 20 (July 2016) 10 24 http://www.eijest.zu.edu.eg Thermo-Fluid Performance of a Vapor- Chamber Finned Heat Sink Saeed A.A.
More informationIEEE TRANSACTIONS ON COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY PART A, VOL. 20, NO. 4, DECEMBER
IEEE TRANSACTIONS ON COMPONENTS, PACKAGING, AND MANUFACTURING TECHNOLOGY PART A, VOL. 20, NO. 4, DECEMBER 1997 463 Pressure Loss Modeling for Surface Mounted Cuboid-Shaped Packages in Channel Flow Pete
More informationExperimental Study of Convective Heat Transfer and Thermal Performance in the Heat-Sink Channel with Various Geometrical Configurations Fins
Experimental Study of Convective Heat Transfer and Thermal Performance in the Heat-Sink Channel with Various Geometrical Configurations Fins 1 Mohit Taneja, 2 Sandeep Nandal, 3 Arpan Manchanda, 4 Ajay
More informationAnalysis of the Cooling Design in Electrical Transformer
Analysis of the Cooling Design in Electrical Transformer Joel de Almeida Mendes E-mail: joeldealmeidamendes@hotmail.com Abstract This work presents the application of a CFD code Fluent to simulate the
More informationPHYSICAL MECHANISM OF NATURAL CONVECTION
1 NATURAL CONVECTION In this chapter, we consider natural convection, where any fluid motion occurs by natural means such as buoyancy. The fluid motion in forced convection is quite noticeable, since a
More informationEFFECT OF BAFFLES GEOMETRY ON HEAT TRANSFER ENHANCEMENT INSIDE CORRUGATED DUCT
International Journal of Mechanical Engineering and Technology (IJMET) Volume 10, Issue 03, March 2019, pp. 555-566. Article ID: IJMET_10_03_057 Available online at http://www.iaeme.com/ijmet/issues.asp?jtype=ijmet&vtype=10&itype=3
More informationTheoretical and Experimental Studies on Transient Heat Transfer for Forced Convection Flow of Helium Gas over a Horizontal Cylinder
326 Theoretical and Experimental Studies on Transient Heat Transfer for Forced Convection Flow of Helium Gas over a Horizontal Cylinder Qiusheng LIU, Katsuya FUKUDA and Zheng ZHANG Forced convection transient
More informationFree and Forced Convection Heat Transfer Characteristics in an Opened Box with Parallel Heated Plates
American Journal of Energy and Power Engineering 2015; 2(1): 1-11 Published online February 20, 2015 (http://www.aascit.org/journal/ajepe) ISSN: 2375-3897 Free and Forced Convection Heat Transfer Characteristics
More informationCOMPUTATIONAL ANALYSIS OF LAMINAR FORCED CONVECTION IN RECTANGULAR ENCLOSURES OF DIFFERENT ASPECT RATIOS
HEFAT214 1 th International Conference on Heat Transfer, Fluid Mechanics and Thermodynamics 14 16 July 214 Orlando, Florida COMPUTATIONAL ANALYSIS OF LAMINAR FORCED CONVECTION IN RECTANGULAR ENCLOSURES
More informationHeat Transfer Characteristics of Square Micro Pin Fins under Natural Convection
Journal of Electronics Cooling and Thermal Control, 2014, 4, 59-69 Published Online September 2014 in SciRes. http://www.scirp.org/journal/jectc http://dx.doi.org/10.4236/jectc.2014.43007 Heat Transfer
More informationExperimental Analysis of Rectangular Fin Arrays with Continuous Fin and Interrupted Fins Using Natural and Forced Convection
Experimental Analysis of Rectangular Fin Arrays with Continuous Fin and Interrupted Fins Using Natural and Forced Convection Vinaya Kumara U M 1, Mr. Krishnamurthy K.N 2, Akash Deep B N 3 P.G. Student,
More informationInternational Journal of Scientific & Engineering Research, Volume 6, Issue 5, May ISSN
International Journal of Scientific & Engineering Research, Volume 6, Issue 5, May-2015 28 CFD BASED HEAT TRANSFER ANALYSIS OF SOLAR AIR HEATER DUCT PROVIDED WITH ARTIFICIAL ROUGHNESS Vivek Rao, Dr. Ajay
More informationModeling of Natural Convection in Electronic Enclosures
Peter M. Teertstra e-mail: pmt@mhtlab.uwaterloo.ca M. Michael Yovanovich J. Richard Culham Microelectronics Heat Transfer Laboratory, Department of Mechanical Engineering, University of Waterloo, Waterloo,
More informationComputational Fluid Dynamics Based Analysis of Angled Rib Roughened Solar Air Heater Duct
Research Article International Journal of Thermal Technologies ISSN 2277-4114 2013 INPRESSCO. All Rights Reserved. Available at http://inpressco.com/category/ijtt Computational Fluid Dynamics Based Analysis
More informationThe Increasing Importance of the Thermal Management for Modern Electronic Packages B. Psota 1, I. Szendiuch 1
Ročník 2012 Číslo VI The Increasing Importance of the Thermal Management for Modern Electronic Packages B. Psota 1, I. Szendiuch 1 1 Department of Microelectronics, Faculty of Electrical Engineering and
More informationNumerical Investigation of Conjugate Natural Convection Heat Transfer from Discrete Heat Sources in Rectangular Enclosure
Proceedings of the World Congress on Engineering 4 Vol II, WCE 4, July - 4, 4, London, U.K. Numerical Investigation of Conjugate Natural Convection Heat Transfer from Discrete Heat Sources in Rectangular
More informationAN EXPERIMENTAL STUDY OF MIXED CONVECTION HEAT TRANSFER IN AN INCLINED RECTANGULAR DUCT EXPOSED TO UNIFORM HEAT FLUX FROM UPPER SURFACE
AN EXPERIMENTAL STUDY OF MIXED CONVECTION HEAT TRANSFER IN AN INCLINED RECTANGULAR DUCT EXPOSED TO UNIFORM HEAT FLUX FROM UPPER SURFACE Dr. Ahmed F. Khudheyer Ali Jawad Obaid Mazin Y. Abdul-Kareem ahyaja@yahoo.com
More informationby M. Felczak, T.Wajman and B. Więcek Technical University of Łódź, Wólczańska 211/215, Łódź, Poland
Optimization of electronic devices placement on printed circuit board Abstract by M. Felczak, T.Wajman and B. Więcek Technical University of Łódź, Wólczańska 211/215, 90-924 Łódź, Poland Power densities
More informationNatural convection heat transfer around a horizontal circular cylinder near an isothermal vertical wall
Natural convection heat transfer around a horizontal circular cylinder near an isothermal vertical wall Marcel Novomestský 1, Richard Lenhard 1, and Ján Siažik 1 1 University of Žilina, Faculty of Mechanical
More informationCFD AND CONJUGATE HEAT TRANSFER ANALYSIS OF HEAT SINKS WITH DIFFERENT FIN GEOMETRIES SUBJECTED TO FORCED CONVECTION USED IN ELECTRONICS COOLING
CFD AND CONJUGATE HEAT TRANSFER ANALYSIS OF HEAT SINKS WITH DIFFERENT FIN GEOMETRIES SUBJECTED TO FORCED CONVECTION USED IN ELECTRONICS COOLING V. M Kulkarni 1, Basavaraj Dotihal 2 1 Professor, Thermal
More informationDepartment of Mechanical Engineering ME 96. Free and Forced Convection Experiment. Revised: 25 April Introduction
CALIFORNIA INSTITUTE OF TECHNOLOGY Department of Mechanical Engineering ME 96 Free and Forced Convection Experiment Revised: 25 April 1994 1. Introduction The term forced convection refers to heat transport
More informationFluid Flow and Heat Transfer of Combined Forced-Natural Convection around Vertical Plate Placed in Vertical Downward Flow of Water
Advanced Experimental Mechanics, Vol.2 (2017), 41-46 Copyright C 2017 JSEM Fluid Flow and Heat Transfer of Combined Forced-Natural Convection around Vertical Plate Placed in Vertical Downward Flow of Water
More informationCFD ANALYSIS OF TURBULENT THERMAL MIXING OF HOT AND COLD AIR IN AUTOMOBILE HVAC UNIT
ISTP-6, 005, PRAGUE 6 TH INTERNATIONAL SYMPOSIUM ON TRANSPORT PHENOMENA CFD ANALYSIS OF TURBULENT THERMAL MIING OF HOT AND COLD AIR IN AUTOMOBILE HVAC UNIT Hideo Asano ((, Kazuhiko Suga (3, Masafumi Hirota
More informationThe Effect of Solid and Perforated Pin Fin on the Heat Transfer Performance of Finned Tube Heat Exchanger
International Journal of Energy Engineering 2018, 8(1): 1-11 DOI: 10.5923/j.ijee.20180801.01 The Effect of Solid and Perforated Pin Fin on the Heat Transfer Performance of Finned Tube Heat Exchanger Nabil
More informationNumerical Investigation of Convective Heat Transfer in Pin Fin Type Heat Sink used for Led Application by using CFD
GRD Journals- Global Research and Development Journal for Engineering Volume 1 Issue 8 July 2016 ISSN: 2455-5703 Numerical Investigation of Convective Heat Transfer in Pin Fin Type Heat Sink used for Led
More informationUNIT II CONVECTION HEAT TRANSFER
UNIT II CONVECTION HEAT TRANSFER Convection is the mode of heat transfer between a surface and a fluid moving over it. The energy transfer in convection is predominately due to the bulk motion of the fluid
More informationANALYSIS OF NANOFLUIDS IN LIQUID ELECTRONIC COOLING SYSTEMS
Proceedings of the ASME 2009 InterPACK Conference IPACK2009 July 19-23, 2009, San Francisco, California, USA Proceedings of InterPACK09 ASME/Pacific Rim Technical Conference and Exhibition on Packaging
More informationME 105 Mechanical Engineering Laboratory Spring Quarter Experiment #2: Temperature Measurements and Transient Conduction and Convection
ME 105 Mechanical Engineering Lab Page 1 ME 105 Mechanical Engineering Laboratory Spring Quarter 2010 Experiment #2: Temperature Measurements and Transient Conduction and Convection Objectives a) To calibrate
More informationExperimental Study of Heat Transfer Enhancement in a Tilted Semi-Cylindrical Cavity with Triangular Type of Vortex Generator in Various Arrangements.
Experimental Study of Heat Transfer Enhancement in a Tilted Semi-Cylindrical Cavity with Triangular Type of Vortex Generator in Various Arrangements. #1 Korake Supriya S, #2 Dr Borse Sachin L #1 P.G. Student,
More informationComparison of heat transfer characteristics of liquid coolants in forced convection cooling in a micro heat sink
Nivesh Agrawal et al. / IJAIR ISSN: 78-7844 Comparison of heat transfer characteristics of liquid coolants in forced convection cooling in a micro heat sink Mr.Nivesh Agrawal #1 Mr.Mahesh Dewangan * #1
More informationNumerical Study of Conjugate Natural Convection Heat Transfer Using One Phase Liquid Cooling
IOP Conference Series: Materials Science and Engineering OPEN ACCESS Numerical Study of Conjugate Natural Convection Heat Transfer Using One Phase Liquid Cooling To cite this article: F A Gdhaidh et al
More informationME 4/549 Lab Assignment 5: Single Block Experiment Spring 2006 due 1 June 2006
ME 4/549 Lab Assignment 5: Single Block Experiment Spring 2006 due 1 June 2006 version May 23, 2006 1 Objective The objective of the laboratory exercise is to measure the convective heat transfer coefficient
More informationCFD Simulation and Experimental Study on Airside Performance for MCHX
Purdue University Purdue e-pubs International Refrigeration and Air Conditioning Conference School of Mechanical Engineering 21 CFD Simulation and Experimental Study on Airside Performance for MCHX Tu
More informationGÖRTLER VORTICES AND THEIR EFFECT ON HEAT TRANSFER
ISTP-6, 2005, PRAGUE 6 TH INTERNATIONAL SYMPOSIUM ON TRANSPORT PHENOMENA GÖRTLER VORTICES AND THEIR EFFECT ON HEAT TRANSFER Petr Sobolík*, Jaroslav Hemrle*, Sadanari Mochizuki*, Akira Murata*, Jiří Nožička**
More informationLaminar flow heat transfer studies in a twisted square duct for constant wall heat flux boundary condition
Sādhanā Vol. 40, Part 2, April 2015, pp. 467 485. c Indian Academy of Sciences Laminar flow heat transfer studies in a twisted square duct for constant wall heat flux boundary condition RAMBIR BHADOURIYA,
More informationW-Discrete Rib for Enhancing the Thermal Performance of Solar Air Heater
W-Discrete Rib for Enhancing the Thermal Performance of Solar Air Heater Alok Kumar Rohit 1, A.M. Lanjewar 2 1PhD Scholar, Mechanical Engineering Department, AISECT University Bhopal, M.P. - 462024 India
More informationHEAT TRANSFER AND FLOW CHARACTERISTICS OF A BACKWARD-FACING STEP FLOW WITH MIST
Paper No. IMPRES13-119 HEAT TRANSFER AND FLOW CHARACTERISTICS OF A BACKWARD-FACING STEP FLOW WITH MIST Masaki HIGA 1,*, Izuru SENAHA, Yoshitaka MIYAFUJI 3, Sumio KATO and Shoichi MATSUDA 1 Graduate School
More informationCOMPUTATIONAL FLUID DYNAMICS ANALYSIS OF A V-RIB WITH GAP ROUGHENED SOLAR AIR HEATER
THERMAL SCIENCE: Year 2018, Vol. 22, No. 2, pp. 963-972 963 COMPUTATIONAL FLUID DYNAMICS ANALYSIS OF A V-RIB WITH GAP ROUGHENED SOLAR AIR HEATER by Jitesh RANA, Anshuman SILORI, Rajesh MAITHANI *, and
More informationUsing Computational Fluid Dynamics And Analysis Of Microchannel Heat Sink
International Journal of Engineering Inventions e-issn: 2278-7461, p-issn: 2319-6491 Volume 4, Issue 12 [Aug. 2015] PP: 67-74 Using Computational Fluid Dynamics And Analysis Of Microchannel Heat Sink M.
More informationVertical Mantle Heat Exchangers for Solar Water Heaters
for Solar Water Heaters Y.C., G.L. Morrison and M. Behnia School of Mechanical and Manufacturing Engineering The University of New South Wales Sydney 2052 AUSTRALIA E-mail: yens@student.unsw.edu.au Abstract
More informationSMA Technical Memorandum # 118
SMA Technical Memorandum # 118 Bob Wilson J. Moran, G. Nystrom, E. Silverberg Ken McCracken January 26, 1998 Clarification on Reynolds Number and the Correlator Thermal Design Fluid Mechanics, F.M. White,
More informationFlow and heat transfer characteristics of tornado-like vortex flow
Advances in Fluid Mechanics VI 277 Flow and heat transfer characteristics of tornado-like vortex flow Y. Suzuki & T. Inoue Department of Mechanical Sciences and Engineering, Tokyo Institute of Technology
More informationCFD Analysis on Flow Through Plate Fin Heat Exchangers with Perforations
CFD Analysis on Flow Through Plate Fin Heat Exchangers with Perforations 1 Ganapathi Harish, 2 C.Mahesh, 3 K.Siva Krishna 1 M.Tech in Thermal Engineering, Mechanical Department, V.R Siddhartha Engineering
More informationCFD Analysis & Experimental Investigation to improve Heat Transfer Enhancement in flat plate with W Ribs
Analysis & erimental Investigation to improve Heat Transfer Enhancement in flat with W Ribs Jayshri S Gulave 1, Kulkarni V.S. 2 Parag S. Desale 3 1 M.E Student Matoshri college of Engineering, Nashik,
More informationPrinciples of Convection
Principles of Convection Point Conduction & convection are similar both require the presence of a material medium. But convection requires the presence of fluid motion. Heat transfer through the: Solid
More informationExperiment 1. Measurement of Thermal Conductivity of a Metal (Brass) Bar
Experiment 1 Measurement of Thermal Conductivity of a Metal (Brass) Bar Introduction: Thermal conductivity is a measure of the ability of a substance to conduct heat, determined by the rate of heat flow
More informationTHE INFLUENCE OF INCLINATION ANGLE ON NATURAL CONVECTION IN A RECTANGULAR ENCLOSURE
THE INFLUENCE OF INCLINATION ANGLE ON NATURAL CONVECTION IN A RECTANGULAR ENCLOSURE Thamer Khalif Salem Mechanical Engineering, College of Engineering, Tikrit University, IRAQ. thamer_khalif@yahoo.com
More informationHeat Transfer F12-ENG Lab #4 Forced convection School of Engineering, UC Merced.
1 Heat Transfer F12-ENG-135 - Lab #4 Forced convection School of Engineering, UC Merced. October 23, 2012 1 General purpose of the Laboratory To gain a physical understanding of the behavior of the average
More informationHeat Transfer Performance in Double-Pass Flat-Plate Heat Exchangers with External Recycle
Journal of Applied Science and Engineering, Vol. 17, No. 3, pp. 293 304 (2014) DOI: 10.6180/jase.2014.17.3.10 Heat Transfer Performance in Double-Pass Flat-Plate Heat Exchangers with External Recycle Ho-Ming
More informationExperimental Analysis of Wire Sandwiched Micro Heat Pipes
Experimental Analysis of Wire Sandwiched Micro Heat Pipes Rag, R. L. Department of Mechanical Engineering, John Cox Memorial CSI Institute of Technology, Thiruvananthapuram 695 011, India Abstract Micro
More informationConvection Heat Transfer. Introduction
Convection Heat Transfer Reading Problems 12-1 12-8 12-40, 12-49, 12-68, 12-70, 12-87, 12-98 13-1 13-6 13-39, 13-47, 13-59 14-1 14-4 14-18, 14-24, 14-45, 14-82 Introduction Newton s Law of Cooling Controlling
More informationCHME 302 CHEMICAL ENGINEERING LABOATORY-I EXPERIMENT 302-V FREE AND FORCED CONVECTION
CHME 302 CHEMICAL ENGINEERING LABOATORY-I EXPERIMENT 302-V FREE AND FORCED CONVECTION OBJECTIVE The objective of the experiment is to compare the heat transfer characteristics of free and forced convection.
More informationINTERNATIONAL JOURNAL OF SCIENTIFIC & TECHNOLOGY RESEARCH VOLUME 5, ISSUE 09, SEPTEMBER 2016 ISSN
Numerical Analysis Of Heat Transfer And Fluid Flow Characteristics In Different V-Shaped Roughness Elements On The Absorber Plate Of Solar Air Heater Duct Jitesh Rana, Anshuman Silori, Rohan Ramola Abstract:
More informationTHERMAL PERFORMANCE EVALUATION AND METHODOLOGY FOR PYRAMID STACK DIE PACKAGES
THERMAL PERFORMANCE EVALUATION AND METHODOLOGY FOR PYRAMID STACK DIE PACKAGES Krishnamoorthi.S, *W.H. Zhu, C.K.Wang, Siew Hoon Ore, H.B. Tan and Anthony Y.S. Sun. Package Analysis and Design Center United
More informationThe Electrodynamics of a Pair of PV Modules with Connected Building Resistance
Proc. of the 3rd IASME/WSEAS Int. Conf. on Energy, Environment, Ecosystems and Sustainable Development, Agios Nikolaos, Greece, July 24-26, 2007 563 he Electrodynamics of a Pair of s with Connected Building
More informationPerformance of Elliptical Pin Fin Heat Exchanger with Three Elliptical Perforations
www.cfdl.issres.net Vol. 3 (2) June 2011 Performance of Elliptical Pin Fin Heat Exchanger with Three Elliptical Perforations Monoj Baruah 1, Anupam Dewan 2c and P. Mahanta 1 1 Department of Mechanical
More informationELEC9712 High Voltage Systems. 1.2 Heat transfer from electrical equipment
ELEC9712 High Voltage Systems 1.2 Heat transfer from electrical equipment The basic equation governing heat transfer in an item of electrical equipment is the following incremental balance equation, with
More informationEXPERIMENTAL STUDY OF HEAT TRANSFER AND PRESSURE LOSS IN CHANNELS WITH MINIATURE V RIB-DIMPLE HYBRID STRUCTURE
EXPERIMENTAL STUDY OF HEAT TRANSFER AND PRESSURE LOSS IN CHANNELS WITH MINIATURE V RIB-DIMPLE HYBRID STRUCTURE Yu Rao and Peng Zhang. Institute of Turbomachinery, School of Mechanical Engineering, Shanghai
More informationHEAT TRANSFER THERMAL MANAGEMENT OF ELECTRONICS YOUNES SHABANY. C\ CRC Press W / Taylor Si Francis Group Boca Raton London New York
HEAT TRANSFER THERMAL MANAGEMENT OF ELECTRONICS YOUNES SHABANY C\ CRC Press W / Taylor Si Francis Group Boca Raton London New York CRC Press is an imprint of the Taylor & Francis Group, an informa business
More informationExperimental Investigation of Heat Transfer in Impingement Air Cooled Plate Fin Heat Sinks
Zhipeng Duan Graduate Research Assistant e-mail: zpduan@engr.mun.ca Y. S. Muzychka Associate Professor Member ASME e-mail: yuri@engr.mun.ca Faculty of Engineering and Applied Science, Memorial University
More informationTable of Contents. Foreword... xiii. Preface... xv
Table of Contents Foreword.... xiii Preface... xv Chapter 1. Fundamental Equations, Dimensionless Numbers... 1 1.1. Fundamental equations... 1 1.1.1. Local equations... 1 1.1.2. Integral conservation equations...
More informationExperimental Validation of Heat Transfer Enhancement in plate Heat Exchanger with Non Conventional Shapes of Rib
Experimental Validation of Heat Transfer Enhancement in plate Heat Exchanger with Non Conventional Shapes of Rib 1 Miss. Ashwini Vasant Thakare, 2 Dr. J. A. Hole 1 M.Tech Student of JSPM Narhe Technical
More informationStudies on flow through and around a porous permeable sphere: II. Heat Transfer
Studies on flow through and around a porous permeable sphere: II. Heat Transfer A. K. Jain and S. Basu 1 Department of Chemical Engineering Indian Institute of Technology Delhi New Delhi 110016, India
More informationEffect of roughness shape on heat transfer and flow friction characteristics of solar air heater with roughened absorber plate
Advanced Computational Methods in Heat Transfer IX 43 Effect of roughness shape on heat transfer and flow friction characteristics of solar air heater with roughened absorber plate A. Chaube 1, P. K. Sahoo
More informationThermo Hydraulic Performance of Solar Air Heater by Using Double Inclined Discrete Rib Roughened Absorber Plate
Thermo Hydraulic Performance of Solar Air Heater by Using Double Inclined Discrete Rib Roughened Absorber Plate Rahul kumar¹, Ravindra mohan² ¹Research Scholar, ²Assistant Professor, Mechanical Engineering
More informationFLOW AND HEAT TRANSFER AROUND THE FLAT PLATE INSTALLED IN A RECTANGULAR DUCT WITH FLOW PULSATION
ISTP-16, 2005, PRAGUE 16 TH INTERNATIONAL SYMPOSIUM ON TRANSPORT PHENOMENA FLOW AND HEAT TRANSFER AROUND THE FLAT PLATE INSTALLED IN A RECTANGULAR DUCT WITH FLOW PULSATION Hironori SAITOH* *Dept. of Mechanical
More informationAN ANALYTICAL THERMAL MODEL FOR THREE-DIMENSIONAL INTEGRATED CIRCUITS WITH INTEGRATED MICRO-CHANNEL COOLING
THERMAL SCIENCE, Year 2017, Vol. 21, No. 4, pp. 1601-1606 1601 AN ANALYTICAL THERMAL MODEL FOR THREE-DIMENSIONAL INTEGRATED CIRCUITS WITH INTEGRATED MICRO-CHANNEL COOLING by Kang-Jia WANG a,b, Hong-Chang
More informationAn experimental investigation of the thermal performance of an asymmetrical at plate heat pipe
International Journal of Heat and Mass Transfer 43 (2000) 2657±2668 www.elsevier.com/locate/ijhmt An experimental investigation of the thermal performance of an asymmetrical at plate heat pipe Y. Wang,
More informationMinhhung Doan, Thanhtrung Dang
An Experimental Investigation on Condensation in Horizontal Microchannels Minhhung Doan, Thanhtrung Dang Department of Thermal Engineering, Hochiminh City University of Technology and Education, Vietnam
More informationExperimental Heat transfer study of Turbulent Square duct flow through V type turbulators
IOSR Journal of Mechanical and Civil Engineering (IOSR-JMCE) e-issn: 2278-1684,p-ISSN: 2320-334X, Volume 13, Issue 6 Ver. II (Nov. - Dec. 2016), PP 26-31 www.iosrjournals.org Experimental Heat transfer
More informationThe Effect of Nozzle Height on Cooling Heat Transfer from a Hot Steel Plate by an Impinging Liquid Jet
, pp. 704 709 The Effect of Nozzle Height on Cooling Heat Transfer from a Hot Steel Plate by an Impinging Liquid Jet Piljong LEE, Haewon CHOI 1) and Sunghong LEE 2) Technical Research Center, POSCO, Pohang
More informationMaximum Heat Transfer Density From Finned Tubes Cooled By Natural Convection
Maximum Heat Transfer Density From Finned Tubes Cooled By Natural Convection Ahmed Waheed Mustafa 1 Mays Munir Ismael 2 AL-Nahrain University College of Engineering Mechanical Engineering Department ahmedwah@eng.nahrainuniv.edu.iq
More informationThe influence of a magnetic field on turbulent heat transfer of a high Prandtl number fluid
Experimental Thermal and Fluid Science 32 (27) 23 28 www.elsevier.com/locate/etfs The influence of a magnetic field on turbulent heat transfer of a high Prandtl number fluid H. Nakaharai a, *, J. Takeuchi
More informationCHAPTER 7 NUMERICAL MODELLING OF A SPIRAL HEAT EXCHANGER USING CFD TECHNIQUE
CHAPTER 7 NUMERICAL MODELLING OF A SPIRAL HEAT EXCHANGER USING CFD TECHNIQUE In this chapter, the governing equations for the proposed numerical model with discretisation methods are presented. Spiral
More informationExternal Forced Convection :
External Forced Convection : Flow over Bluff Objects (Cylinders, Spheres, Packed Beds) and Impinging Jets Chapter 7 Sections 7.4 through 7.8 7.4 The Cylinder in Cross Flow Conditions depend on special
More informationMicroelectronics Heat Transfer Laboratory
Microelectronics Heat Transfer Laboratory Department of Mechanical Engineering University of Waterloo Waterloo, Ontario, Canada http://www.mhtl.uwaterloo.ca Outline Personnel Capabilities Facilities Research
More informationNatural Convection from Horizontal Rectangular Fin Arrays within Perforated Chassis
Proceedings of the 2 nd International Conference on Fluid Flow, Heat and Mass Transfer Ottawa, Ontario, Canada, April 30 May 1, 2015 Paper No. 146 Natural Convection from Horizontal Rectangular Fin Arrays
More informationHeat Transfer Enhancement Through Perforated Fin
IOSR Journal of Mechanical and Civil Engineering (IOSR-JMCE) e-issn: 2278-1684,p-ISSN: 2320-334X PP. 72-78 www.iosrjournals.org Heat Transfer Enhancement Through Perforated Fin Noaman Salam, Khan Rahmatullah,
More informationForced Convection Heat Transfer Enhancement by Porous Pin Fins in Rectangular Channels
Jian Yang Min Zeng Qiuwang Wang 1 e-mail: wangqw@mail.xjtu.edu.cn State Key Laboratory of Multiphase Flow in Power Engineering, School of Energy and Power Engineering, Xi an Jiaotong University, Xi an,
More informationCHAPTER 5 CONVECTIVE HEAT TRANSFER COEFFICIENT
62 CHAPTER 5 CONVECTIVE HEAT TRANSFER COEFFICIENT 5.1 INTRODUCTION The primary objective of this work is to investigate the convective heat transfer characteristics of silver/water nanofluid. In order
More informationFinite Element Evaluation Of Thermal Stresses in a Composite Circuit Board Cooled by Mixed Convection
Finite Element Evaluation Of Thermal Stresses in a Composite Circuit Board Cooled by Mixed Convection Amir Khalilollahi Pennsylvania State University, The Behrend College Abstract Present-day interest
More informationModeling and Metrology for Expedient Analysis and Design of Computer Systems
Modeling and Metrology for Expedient Analysis and Design of Computer Systems Cullen Bash Chandrakant Patel Hewlett-Packard Laboratories Hewlett-Packard Laboratories 1501 Page Mill Road, M/S 3U-7 1501 Page
More informationLaminar Forced Convection and Heat Transfer Characteristics in a Square Channel Equipped with V-Wavy Surface
Journal of Mathematics and Statistics Original Research Paper Laminar Forced Convection and Heat Transfer Characteristics in a Square Channel Equipped with V-Wavy Surface 1 Amnart Boonloi and 2 Withada
More informationIJSRD - International Journal for Scientific Research & Development Vol. 3, Issue 06, 2015 ISSN (online):
IJSRD - International Journal for Scientific Research & Development Vol. 3, Issue 06, 2015 ISSN (online): 2321-0613 Experimental Investigation for Enhancement of Heat Transfer in Two Pass Solar Air Heater
More informationChapter 9 NATURAL CONVECTION
Heat and Mass Transfer: Fundamentals & Applications Fourth Edition in SI Units Yunus A. Cengel, Afshin J. Ghajar McGraw-Hill, 2011 Chapter 9 NATURAL CONVECTION PM Dr Mazlan Abdul Wahid Universiti Teknologi
More informationThe experimental determination of the thermal conductivity of melting chocolate: thermal resistance analogies and free convection boundary conditions
Advanced Computational Methods and Experiments in Heat Transfer XIII 505 The experimental determination of the thermal conductivity of melting chocolate: thermal resistance analogies and free convection
More informationTransitional Flow and Heat Transfer Characteristics in a Rectangular Duct with Stagger-arrayed Short Pin Fins
Chinese Journal of Aeronautics 22(2009) 237-242 Chinese Journal of Aeronautics www.elsevier.com/locate/cja Transitional Flow and Heat Transfer Characteristics in a Rectangular Duct with Stagger-arrayed
More informationNUMERICAL HEAT TRANSFER ENHANCEMENT IN SQUARE DUCT WITH INTERNAL RIB
NUMERICAL HEAT TRANSFER ENHANCEMENT IN SQUARE DUCT WITH INTERNAL RIB University of Technology Department Mechanical engineering Baghdad, Iraq ABSTRACT - This paper presents numerical investigation of heat
More informationA Computational Study of a PLCC Package In Mixed Convection
Intl. Journal of Microcircuits and Electronic Packaging A Computational Study of a PLCC Package In Mixed Convection G. A. Quadir, Ko Yun Hung, and K. N. Seetharamu School of Mechanical Engineering, USM(KCP),
More informationA Computational Fluid Dynamics Investigation of Solar Air Heater Duct Provided with Inclined Circular Ribs as Artificial Roughness
Bonfring International Journal of Industrial Engineering and Management Science, Vol. 4, No. 3, August 2014 115 A Computational Fluid Dynamics Investigation of Solar Air Heater Duct Provided with Inclined
More informationThermo-Hydraulic performance of Internal finned tube Automobile Radiator
Thermo-Hydraulic performance of Internal finned tube Automobile Radiator Dr.Kailash Mohapatra 1, Deepiarani Swain 2 1 Department of Mechanical Engineering, Raajdhani Engineering College, Bhubaneswar, 751017,
More informationThermal Management of SMT LED Application Note
hermal Management of SM LED Application Note Introduction o achieve reliability and optimal performance of LED Light sources a proper thermal management design is necessary. Like all electronic components,
More information