MECH 466. Micro Electromechanical Systems. Laboratory Manual Laboratory #3: Stiction of MEMS and Strength of MEMS Materials

Size: px
Start display at page:

Download "MECH 466. Micro Electromechanical Systems. Laboratory Manual Laboratory #3: Stiction of MEMS and Strength of MEMS Materials"

Transcription

1 MECH 466 Micro Electromechanical Systems Laboratory Manual Laboratory #: Stiction of MEMS and Strength of MEMS Materials Department of Mechanical Engineering, University of Victoria N. Dechev, 2011, University of Victoria Page 1 of 7

2 Report: The laboratory report must be in the following format: (i) (ii) (iii) (iv) (v) Title Page i. Include your name, student number, date of lab, etc Objective Data i. Include data and images you collected. ii. Comment on any Sources of Error that may have influenced the data, or the collection of the data. Discussion i. Compare and contrast the experimental results in comparison to the theoretical/analytical results. ii. Include answers to the questions that pertain to the experiments, as listed in the Lab Write-up section. Conclusion Please organize the laboratory report into the five divisions indicated above (Title Page, Objective, Data/Images, Discussion (with questions answered), and Conclusion). The report should be a maximum of 5 pages (double spaced text), including figures, and data. Appendices may be added as extra pages. N. Dechev, 2011, University of Victoria Page 2 of 7

3 Laboratory #: Stiction of MEMS and Strength of MEMS Materials Purpose: The purpose of this laboratory is to investigate the microscale phenomenon of stiction. The second purpose of this laboratory is to investigate the strength of polysilicon, which is typically used as a structural material in MEMS devices. Introduction: Part (I): Stiction is an effect observed when micro-scaled objects come into direct contact with each other. To a casual observer, it appears that when the micro-objects are brought into contact, they stick together with relatively high adhesion. The stiction effect is actually a combination of a number of different micro-phenomena [1,2,], including: (a) electrostatic attraction (transient), (b) fluid surface tension due to a nano-scale water layer on objects, and (c) Van der Vaals force. Research into the stiction phenomena is on going and there are a number of other possible causes under investigation [4]. This laboratory will attempt to experimentally quantify the stiction that exists between a polysilicon microtool tip shown in Fig. A-1, and the substrate of a MUMPs chip. Part (II): The knowledge of the strength of MEMS materials is an important aspect to their design. This laboratory will destructively test the beams of a microtool by using the robotic micromanipulator. The purpose is to determine the ultimate strength of polysilicon beams fabricated by the MUMPs process, and compare these results with the results reported by others [5,6]. Laboratory Preparation: Review this document and the procedures prior to performing the laboratory. Note: Appendix A provides an illustration and the geometry of the microtool that will be used in these experiments. Procedure: Setup: (1) The lab technician/ta will mount a glass slide containing MEMS chips onto the worktable of the micromanipulator. (2) The lab technician/ta will bond a microtool to the pin-probe of the micromanipulator. (Observation #1): Bonding of a MEMS microtool: (1) Mount the probe pin holder (with a tungsten probe installed) on the Beta Axis of the micromanipulator (2) Locate the tip of the probe pin using the Manual XYZ Stage, i.e. bring it into the field of view of the camera. () Locate the desired microtool for a given task on the MEMS chip. (4) Localize the probe pin tip with respect to the microtool bond-pad (Fig. A-1), by touching down on the bond-pad with the probe pin. Be careful not to crush the bond-pad with too much pressure. (5) Zero the coordinate system in software. (6) Raise the probe pin by 10 mm (10,000 microns) and apply UV adhesive to the tip. (7) Return the probe pin to 100 microns above the bond-pad, and slowly lower the pint until the encoder displays the zero position N. Dechev, 2011, University of Victoria Page of 7

4 (8) Watch/Verify that the adhesive flows from the probe pin onto the bond-pad. (9) Put on your UV-Glasses. If you are unable to use UV-Glasses, you will be required to exit the laboratory until the UV-bonding step is completed. (10) The lab technician/ta will expose the adhesive with the UV spot light system. (11) After UV adhesive has cured, slowly command the probe pin upwards along the z-axis. This will raise the microtool away from the substrate, thereby breaking off the tethers that hold it down. (12) The microtool is now bonded to the probe pin, and is ready to be used for the experiments. (1) Since the microtool is parallel to the substrate, it is necessary to tilt it by degrees, to ensure that the square-tip is the lowest point. Do this by commanding the beta-axis to tilt 0.9 (x ) in the appropriate direction. Experiment #1: Static Test of Stiction (1) Locate the long polysilicon tracks along the edge of the chip. The tracks are approximately 50 microns wide and 2000 microns long. (2) Line up the microtool square-tip such that it is perpendicular to the poly-track. () Gently place the microtool square-tip onto the poly-track. Since the microtool is tilted at, you may need to move down (z-direction) an extra micron, to ensure the square-tip is flat onto the poly-track. NOTE: It may be difficult to determine when contact occurs, so ask your TA or the instructor for help. (4) Record an image (Starting position). (5) Using the micromanipulator controller, move the microtool laterally (i.e. sideways in comparison to it s longitudinal axis) in 1 um increments. (6) Record the # of microns you can move, before the microtool square-tip slips relative to the poly-track. (7) Try to record an image showing the deflected microtool (Final Position). (8) Lift the microtool off the substrate. (9) Repeat steps # ( to 8) at two other locations along poly-track. (10) Repeat steps # ( to 8) with the square-tip touching the silicon nitride substrate. Experiment #2: Dynamic Test of Stiction (1) Line up the microtool square-tip such that it is perpendicular to the poly-track. (2) Gently place the microtool square-tip onto the poly-track. Since the microtool is tilted at, you may need to move down (z-direction) an extra micron, to ensure the square-tip is flat onto the poly-track. NOTE: It may be difficult to determine when contact occurs, so ask your TA or the instructor for help. () Record an image (Starting position). (4) Using the micromanipulator controller, move the microtool laterally (i.e. sideways in comparison to it s longitudinal axis) at a constant velocity. Specify a speed of 10 microns/second for the velocity, and a move distance of 50 microns. This should provide 5 seconds of motion. (5) As the microtool is in motion, Record an image. (6) Lift the microtool off the substrate. (7) Repeat steps # (1 to 6) at one other location along the poly-track. (8) Repeat steps # (1 to 6) with the square-tip touching the silicon nitride substrate. N. Dechev, 2011, University of Victoria Page 4 of 7

5 Experiment #: Ultimate Strength of Polysilicon Beams (1) Locate a corner of the chip, (or a poly-1 feature on the substrate). (2) Gently place one microtool square-tip against the corner of the chip (or against the selected poly-1 feature). Ensure that the square-tip is just touching the edge/poly-1-feature, without any noticeable deflection. () Record an image (Starting position). (4) Using the micromanipulator controller, move the microtool laterally in 1 um increments. (5) Record an image of the microtool tips as they bend, for each increment. (6) Record the # of microns you can move, before the microtool tip breaks off. (7) Record an image (Final position). (8) Move the microtool back to the starting position and this time gently place the remaining microtool square-tip against the corner of the chip (as instructed by the TA). Ensure that the square-tip is just touching the edge/poly-1-feature, without any noticeable deflection. (9) Repeat steps # ( to 7). Laboratory Write-up: In relation to Experiment #1, answer the following questions in the Discussion Section of your laboratory report. You may use the supplementary information in the next section, to help you answer these questions. (Q1) What is the static stiction force holding the microtool to the substrate? In relation to Experiment #2, answer the following questions in your laboratory report: (Q2) What is the dynamic stiction force between the micrgripper and the substrate? (Q) Comment on any unexpected results you may have observed for both experiment #1 and #2. What may have caused these? In relation to Experiment #, answer the following questions in your laboratory report: (Q4) Calculate the ultimate strength (stress) of the polysilicon due to bending, using the flexture formula. (Q5) What is the ultimate strength (stress) of polysilicon, as reported in the literature? Comment on the difference/agreement with your result, as compared to the literature. Provide possible explanation for differences. (Q6) Comment on any sources of error for Experiment #1, #2 or #. Supplementary Information for the Microtool: The geometry of the microtool is given in Appendix A. The polysilicon material properties can be assumed as: E (Young s Modulus) = 160 GPa, and other values as listed in references [5,6]. To analytically determine the forces applied to the square-tip, for a given tip deflection from its rest position, we can use the following: For the lateral forces, the beams can be modeled as follows: Referring to the microtool illustration of Fig. A-1(a), and assuming loading force F 2 as shown in Fig. A-1(c), we can model the microtool as three parallel fixed-guided beams. N. Dechev, 2011, University of Victoria Page 5 of 7

6 For each beam, the distance from the bond-pad to the end of the square-tip is 120 um. Also, the width of the beams is w = 2 um and the thickness is t = 2 um. Using the flexture formula: σ = My I We can substitute values to re-write this as (where we approximate moment M = FL, which is valid for cantilever beams, where M is maximum at the root of the beam): ( σ = FL) w 2 = 6FL tw tw 2 12 For a single fixed-guided beam, the deflection is: δ = FL b 12EI Where E is assumed to be 160 GPa. Re-arranging the above equation in terms of F, we have: 12δE tw F = 12 = δetw L b L b For the case of three parallel beams the lateral force developed for a given deflection is: F = δetw L b Note: for two parallel beams, the constant in the numerator is 2. Therefore, the maximum lateral stress in any one of the beams (for three-beam configuration) can be approximated as: 6 F L b σ = tw 2 References: [1] N. Tas, T. Sonnenberg, H. Jansen, R. Legtenberg, and M. Elwenspoek, Stiction in Surface Micromachining, Journal of Micromechanics and Microengineering, vol. 6, 1996, pp [2] C. H. Mastrangelo, and C. H. Hsu, Mechanical stability and adhesion of microstructures under capillary forces part I: basic theory, Journal of Microelectromechanical Systems, vol. 2, 199, pp. -4 [] W. Merlijn van Spengen, R. Puers, and I. De Wolf, A Physical Model to Predict Stiction in MEMS, Journal of Micromechanics and Microengineering, vol. 12, 2002, pp N. Dechev, 2011, University of Victoria Page 6 of 7

7 [4] Philip Ball, Fundamental physics: Feel the force, Nature, [Online, last cited July 2, 2008] [5] W. N. Sharpe and K. Jackson, Tensile testing of MEMS materials, in Proc SEM IX International Congress, Orlando, FL, June 5 8, 2000 [6] W. N. Sharpe, B. Yuan, R. Vaidyanathan, and R. L. Edwards, Measurements of Young s modulus, Poisson s ratio, and tensile strength of polysilicon, in Proc. Tenth IEEE International Workshop on Microelectromechanical Systems, Nagoya, Japan, 1997, pp Appendix A: Figure A-1: Microtool Geometry N. Dechev, 2011, University of Victoria Page 7 of 7

MECH 466. Micro Electromechanical Systems. Laboratory #1: Testing of Electrostatic Microactuators

MECH 466. Micro Electromechanical Systems. Laboratory #1: Testing of Electrostatic Microactuators MECH 466 Micro Electromechanical Systems Laboratory #1: Testing of Electrostatic Microactuators Department of Mechanical Engineering, University of Victoria N. Dechev, 2016, University of Victoria Page

More information

December 1999 FINAL TECHNICAL REPORT 1 Mar Mar 98

December 1999 FINAL TECHNICAL REPORT 1 Mar Mar 98 REPORT DOCUMENTATION PAGE AFRL-SR- BL_TR " Public reporting burden for this collection of information is estimated to average 1 hour per response, including the time for reviewing instruct the collection

More information

Y. C. Lee. Micro-Scale Engineering I Microelectromechanical Systems (MEMS)

Y. C. Lee. Micro-Scale Engineering I Microelectromechanical Systems (MEMS) Micro-Scale Engineering I Microelectromechanical Systems (MEMS) Y. C. Lee Department of Mechanical Engineering University of Colorado Boulder, CO 80309-0427 leeyc@colorado.edu January 15, 2014 1 Contents

More information

EE C247B / ME C218 INTRODUCTION TO MEMS DESIGN SPRING 2016 C. NGUYEN PROBLEM SET #4

EE C247B / ME C218 INTRODUCTION TO MEMS DESIGN SPRING 2016 C. NGUYEN PROBLEM SET #4 Issued: Wednesday, March 4, 2016 PROBLEM SET #4 Due: Monday, March 14, 2016, 8:00 a.m. in the EE C247B homework box near 125 Cory. 1. This problem considers bending of a simple cantilever and several methods

More information

A Vertical Electrostatic Actuator with Extended Digital Range via Tailored Topology

A Vertical Electrostatic Actuator with Extended Digital Range via Tailored Topology A Vertical Electrostatic Actuator with Extended Digital Range via Tailored Topology Yanhang Zhang and Martin L. Dunn Department of Mechanical Engineering University of Colorado at Boulder Boulder, CO 80309

More information

SINGLE-STEP ASSEMBLY OF COMPLEX 3-D MICROSTRUCTURES

SINGLE-STEP ASSEMBLY OF COMPLEX 3-D MICROSTRUCTURES SINGLE-STEP ASSEMBLY OF COMPLEX 3-D MICROSTRUCTURES Elliot E. Hui, Roger T. Howe, and M. Steven Rodgers* Berkeley Sensor & Actuator Center, University of California, Berkeley, CA 94720-1774, USA *Intelligent

More information

1. Narrative Overview Questions

1. Narrative Overview Questions Homework 4 Due Nov. 16, 010 Required Reading: Text and Lecture Slides on Downloadable from Course WEB site: http://courses.washington.edu/overney/nme498.html 1. Narrative Overview Questions Question 1

More information

ENSC387: Introduction to Electromechanical Sensors and Actuators LAB 3: USING STRAIN GAUGES TO FIND POISSON S RATIO AND YOUNG S MODULUS

ENSC387: Introduction to Electromechanical Sensors and Actuators LAB 3: USING STRAIN GAUGES TO FIND POISSON S RATIO AND YOUNG S MODULUS ENSC387: Introduction to Electromechanical Sensors and Actuators LAB 3: USING STRAIN GAUGES TO FIND POISSON S RATIO AND YOUNG S MODULUS 1 Introduction... 3 2 Objective... 3 3 Supplies... 3 4 Theory...

More information

Platform Isolation Using Out-of-plane Compliant Mechanism

Platform Isolation Using Out-of-plane Compliant Mechanism Platform Isolation Using Out-of-plane Compliant Mechanism by Arpys Arevalo PhD Candidate in Electrical Engineering Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) King Abdullah University

More information

PHY 221 Lab 5 Diverse Forces, Springs and Friction

PHY 221 Lab 5 Diverse Forces, Springs and Friction Name: Partner: Partner: PHY 221 Lab 5 Diverse Forces, Springs and Friction Goals: To explore the nature of forces and the variety of ways in which they can be produced. Characterize the nature of springs

More information

1 Force Sensing. Lecture Notes. 1.1 Load Cell. 1.2 Stress and Strain

1 Force Sensing. Lecture Notes. 1.1 Load Cell. 1.2 Stress and Strain Lecture Notes 1 Force Sensing 1.1 Load Cell A Load Cell is a structure which supports the load and deflects a known amount in response to applied forces and torques. The deflections are measured to characterize

More information

AERO 214. Lab II. Measurement of elastic moduli using bending of beams and torsion of bars

AERO 214. Lab II. Measurement of elastic moduli using bending of beams and torsion of bars AERO 214 Lab II. Measurement of elastic moduli using bending of beams and torsion of bars BENDING EXPERIMENT Introduction Flexural properties of materials are of interest to engineers in many different

More information

Experimental Lab. Principles of Superposition

Experimental Lab. Principles of Superposition Experimental Lab Principles of Superposition Objective: The objective of this lab is to demonstrate and validate the principle of superposition using both an experimental lab and theory. For this lab you

More information

MEMS Report for Lab #3. Use of Strain Gages to Determine the Strain in Cantilever Beams

MEMS Report for Lab #3. Use of Strain Gages to Determine the Strain in Cantilever Beams MEMS 1041 Report for Lab #3 Use of Strain Gages to Determine the Strain in Cantilever Beams Date: February 9, 2016 Lab Instructor: Robert Carey Submitted by: Derek Nichols Objective: The objective of this

More information

Solder Self-assembly for MEMS

Solder Self-assembly for MEMS Solder Self-assembly for MEMS Kevin F. Harsh, Ronda S. Irwin and Y. C. Lee NSF Center for Advanced Manufacturing and Packaging of Microwave, Optical and Digital Electronics, Department of Mechanical Engineering

More information

1 332 Laboratories 1. 2 Computational Exercises 1 FEA of a Cantilever Beam... 1 Experimental Laboratory: Tensile Testing of Materials...

1 332 Laboratories 1. 2 Computational Exercises 1 FEA of a Cantilever Beam... 1 Experimental Laboratory: Tensile Testing of Materials... 1 332 Laboratories Contents 1 332 Laboratories 1 2 Computational Exercises 1 FEA of a Cantilever Beam.......................................... 1 Experimental Laboratory: Tensile Testing of Materials..........................

More information

Workshop 8. Lateral Buckling

Workshop 8. Lateral Buckling Workshop 8 Lateral Buckling cross section A transversely loaded member that is bent about its major axis may buckle sideways if its compression flange is not laterally supported. The reason buckling occurs

More information

9-11 April 2008 Measurement of Large Forces and Deflections in Microstructures

9-11 April 2008 Measurement of Large Forces and Deflections in Microstructures 9-11 April 28 Measurement of Large Forces and Deflections in Microstructures Kai Axel Hals 1, Einar Halvorsen, and Xuyuan Chen Institute for Microsystem Technology, Vestfold University College, P.O. Box

More information

M-3: Statics & M-10 Elasticity

M-3: Statics & M-10 Elasticity Group member names This sheet is the lab document your TA will use to score your lab. It is to be turned in at the end of lab. To receive full credit you must use complete sentences and explain your reasoning

More information

Bending Load & Calibration Module

Bending Load & Calibration Module Bending Load & Calibration Module Objectives After completing this module, students shall be able to: 1) Conduct laboratory work to validate beam bending stress equations. 2) Develop an understanding of

More information

Basic Laboratory. Materials Science and Engineering. Atomic Force Microscopy (AFM)

Basic Laboratory. Materials Science and Engineering. Atomic Force Microscopy (AFM) Basic Laboratory Materials Science and Engineering Atomic Force Microscopy (AFM) M108 Stand: 20.10.2015 Aim: Presentation of an application of the AFM for studying surface morphology. Inhalt 1.Introduction...

More information

Design And Analysis of Microcantilevers With Various Shapes Using COMSOL Multiphysics Software

Design And Analysis of Microcantilevers With Various Shapes Using COMSOL Multiphysics Software Design And Analysis of Microcantilevers With Various Shapes Using COMSOL Multiphysics Software V. Mounika Reddy 1, G.V.Sunil Kumar 2 1,2 Department of Electronics and Instrumentation Engineering, Sree

More information

NONLINEARITY is easily encountered in the resonant

NONLINEARITY is easily encountered in the resonant 122 JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, VOL. 7, NO. 1, MARCH 1998 Nonlinearity and Hysteresis of Resonant Strain Gauges Chengqun Gui, Rob Legtenberg, Harrie A. C. Tilmans, Jan H. J. Fluitman, and

More information

Determination of maximum allowable strain for polysilicon micro!devices

Determination of maximum allowable strain for polysilicon micro!devices PERGAMON Engineering Failure Analysis 5 "0888# 16Ð30 Determination of maximum allowable strain for polysilicon micro!devices S[C[ Bromley\ L[L[ Howell\ B[D[ Jensen Mechanical Engineering Department\ Brigham

More information

Measurement of Bone Strength and Stiffness using 3-Point Bending

Measurement of Bone Strength and Stiffness using 3-Point Bending BME 315 Biomechanics, U. Wisconsin Adapted by R. Lakes from D. Thelen and C. Decker, 09, adapted from Lakes 06 Experimental Details I. Laboratory equipment The load frame that we will use to perform our

More information

How Does a Microcantilever Work?

How Does a Microcantilever Work? How Does a Cantilever Work? Participant Guide Description and Estimated Time to Complete The microcantilever is a widely used component in microsystems devices or microelectromechanical systems (MEMS).

More information

Features of static and dynamic friction profiles in one and two dimensions on polymer and atomically flat surfaces using atomic force microscopy

Features of static and dynamic friction profiles in one and two dimensions on polymer and atomically flat surfaces using atomic force microscopy Features of static and dynamic friction profiles in one and two dimensions on polymer and atomically flat surfaces using atomic force microscopy Author Watson, Gregory, Watson, Jolanta Published 008 Journal

More information

CHAPTER 4 DESIGN AND ANALYSIS OF CANTILEVER BEAM ELECTROSTATIC ACTUATORS

CHAPTER 4 DESIGN AND ANALYSIS OF CANTILEVER BEAM ELECTROSTATIC ACTUATORS 61 CHAPTER 4 DESIGN AND ANALYSIS OF CANTILEVER BEAM ELECTROSTATIC ACTUATORS 4.1 INTRODUCTION The analysis of cantilever beams of small dimensions taking into the effect of fringing fields is studied and

More information

MAAE 2202 A. Come to the PASS workshop with your mock exam complete. During the workshop you can work with other students to review your work.

MAAE 2202 A. Come to the PASS workshop with your mock exam complete. During the workshop you can work with other students to review your work. It is most beneficial to you to write this mock final exam UNDER EXAM CONDITIONS. This means: Complete the exam in 3 hours. Work on your own. Keep your textbook closed. Attempt every question. After the

More information

EE C247B / ME C218 INTRODUCTION TO MEMS DESIGN SPRING 2014 C. Nguyen PROBLEM SET #4

EE C247B / ME C218 INTRODUCTION TO MEMS DESIGN SPRING 2014 C. Nguyen PROBLEM SET #4 Issued: Wednesday, Mar. 5, 2014 PROBLEM SET #4 Due (at 9 a.m.): Tuesday Mar. 18, 2014, in the EE C247B HW box near 125 Cory. 1. Suppose you would like to fabricate the suspended cross beam structure below

More information

MODELING OF T-SHAPED MICROCANTILEVER RESONATORS. Margarita Narducci, Eduard Figueras, Isabel Gràcia, Luis Fonseca, Joaquin Santander, Carles Cané

MODELING OF T-SHAPED MICROCANTILEVER RESONATORS. Margarita Narducci, Eduard Figueras, Isabel Gràcia, Luis Fonseca, Joaquin Santander, Carles Cané Stresa, Italy, 5-7 April 007 MODELING OF T-SHAPED MICROCANTILEVER RESONATORS Margarita Narducci, Eduard Figueras, Isabel Gràcia, Luis Fonseca, Joaquin Santander, Carles Centro Nacional de Microelectrónica

More information

Introduction to Actuators PK

Introduction to Actuators PK Introduction to Actuators Primary Knowledge Participant Guide Description and Estimated Time to Complete This learning module is one of three SCME modules that discuss the types of components found in

More information

Imaging Methods: Scanning Force Microscopy (SFM / AFM)

Imaging Methods: Scanning Force Microscopy (SFM / AFM) Imaging Methods: Scanning Force Microscopy (SFM / AFM) The atomic force microscope (AFM) probes the surface of a sample with a sharp tip, a couple of microns long and often less than 100 Å in diameter.

More information

CHAPTER 5 FIXED GUIDED BEAM ANALYSIS

CHAPTER 5 FIXED GUIDED BEAM ANALYSIS 77 CHAPTER 5 FIXED GUIDED BEAM ANALYSIS 5.1 INTRODUCTION Fixed guided clamped and cantilever beams have been designed and analyzed using ANSYS and their performance were calculated. Maximum deflection

More information

Development and Characterization of High Frequency Bulk Mode Resonators

Development and Characterization of High Frequency Bulk Mode Resonators Excerpt from the Proceedings of the COMSOL Conference 008 Hannover Development and Characterization of High Frequency Bulk Mode Resonators Hossein Pakdast 1*, Zachary James Davis 1 1 DTU Nanotech, Technical

More information

Published by: PIONEER RESEARCH & DEVELOPMENT GROUP(

Published by: PIONEER RESEARCH & DEVELOPMENT GROUP( MEMS based Piezo resistive Pressure Sensor Swathi Krishnamurthy 1, K.V Meena 2, E & C Engg. Dept., The Oxford College of Engineering, Karnataka. Bangalore 560009 Abstract The paper describes the performance

More information

MEMS Mechanical Fundamentals

MEMS Mechanical Fundamentals ROCHESTER INSTITUTE OF TECHNOLOGY MICROELECTRONIC ENGINEERING MEMS Mechanical Fundamentals Dr. Lynn Fuller webpage: http://people.rit.edu/lffeee Electrical and Microelectronic Engineering Rochester Institute

More information

Simulation of a Micro-Scale Out-of-plane Compliant Mechanism

Simulation of a Micro-Scale Out-of-plane Compliant Mechanism Simulation of a Micro-Scale Out-of-plane Compliant Mechanism by Arpys Arevalo PhD Candidate in Electrical Engineering Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) King Abdullah

More information

Design and Simulation of Micro-cantilever

Design and Simulation of Micro-cantilever Design and Simulation of Micro-cantilever Suresh Rijal 1, C.K.Thadani 2, C.K.Kurve 3,Shrikant Chamlate 4 1 Electronics Engg.Dept.,KITS,Ramtek, 2 Electronics and Comn.Engg.Dept.,KITS,Ramtek, 3 Electronics

More information

Durability of Silicon Pin-Joints for Microrobotics

Durability of Silicon Pin-Joints for Microrobotics Durability of Silicon Pin-Joints for Microrobotics Daniel S. Contreras, Kristofer S. J. Pister Electrical Engineering and Computer Sciences University of California, Berkeley Berkeley, California 9477-1774

More information

Two Tier projects for students in ME 160 class

Two Tier projects for students in ME 160 class ME 160 Introduction to Finite Element Method Spring 2016 Topics for Term Projects by Teams of 2 Students Instructor: Tai Ran Hsu, Professor, Dept. of Mechanical engineering, San Jose State University,

More information

DESIGN AND EXPERIMENTAL EVALUATION OF AN ELECTROSTATIC MICRO-GRIPPING SYSTEM

DESIGN AND EXPERIMENTAL EVALUATION OF AN ELECTROSTATIC MICRO-GRIPPING SYSTEM DESIGN AND EXPERIMENTAL EVALUATION OF AN ELECTROSTATIC MICRO-GRIPPING SYSTEM Defeng Lang, Marcel Tichem 3mE, dep. PME, section PMA, Delfi Universiv of Technology Abstract: Key words: The paper describes

More information

A Technique for Force Calibration MEMS Traceable to NIST Standards

A Technique for Force Calibration MEMS Traceable to NIST Standards A Technique for Force Calibration MEMS Traceable to NIST Standards K. Abbas and Z. C. Leseman * University of New Mexico, Albuquerque, NM * Corresponding Author: MSC01-1150 Albuquerque, NM 87131: zleseman@unm.edu

More information

Lab Exercise #5: Tension and Bending with Strain Gages

Lab Exercise #5: Tension and Bending with Strain Gages Lab Exercise #5: Tension and Bending with Strain Gages Pre-lab assignment: Yes No Goals: 1. To evaluate tension and bending stress models and Hooke s Law. a. σ = Mc/I and σ = P/A 2. To determine material

More information

Supplement: Statically Indeterminate Frames

Supplement: Statically Indeterminate Frames : Statically Indeterminate Frames Approximate Analysis - In this supplement, we consider another approximate method of solving statically indeterminate frames subjected to lateral loads known as the. Like

More information

Finite Element Analysis of Piezoelectric Cantilever

Finite Element Analysis of Piezoelectric Cantilever Finite Element Analysis of Piezoelectric Cantilever Nitin N More Department of Mechanical Engineering K.L.E S College of Engineering and Technology, Belgaum, Karnataka, India. Abstract- Energy (or power)

More information

Mechanics of wafer bonding: Effect of clamping

Mechanics of wafer bonding: Effect of clamping JOURNAL OF APPLIED PHYSICS VOLUME 95, NUMBER 1 1 JANUARY 2004 Mechanics of wafer bonding: Effect of clamping K. T. Turner a) Massachusetts Institute of Technology, Cambridge, Massachusetts 0219 M. D. Thouless

More information

PARTICLE ADHESION AND REMOVAL IN POST-CMP APPLICATIONS

PARTICLE ADHESION AND REMOVAL IN POST-CMP APPLICATIONS PARTICLE ADHESION AND REMOVAL IN POST-CMP APPLICATIONS George Adams, Ahmed A. Busnaina and Sinan Muftu the oratory Mechanical, Industrial, and Manufacturing Eng. Department Northeastern University, Boston,

More information

Design and Analysis of Various Microcantilever Shapes for MEMS Based Sensing

Design and Analysis of Various Microcantilever Shapes for MEMS Based Sensing ScieTech 014 Journal of Physics: Conference Series 495 (014) 01045 doi:10.1088/174-6596/495/1/01045 Design and Analysis of Various Microcantilever Shapes for MEMS Based Sensing H. F. Hawari, Y. Wahab,

More information

Computers and Mathematics with Applications

Computers and Mathematics with Applications Computers and Mathematics with Applications 5 2) 272 27 Contents lists available at ScienceDirect Computers and Mathematics with Applications journal homepage: wwwelseviercom/locate/camwa Solution of nonlinear

More information

Compliant MEMS Motion Characterization by Nanoindentation

Compliant MEMS Motion Characterization by Nanoindentation Mater. Res. Soc. Symp. Proc. Vol. 152 28 Materials Research Society 152-DD6-24 Compliant MEMS Motion Characterization by Nanoindentation Joseph Goerges Choueifati 1, Craig Lusk 1, Xialou Pang 1,2, and

More information

Una Metodología Para Resolver Problemas Inversos en Mecánica Experimental de Sólidos

Una Metodología Para Resolver Problemas Inversos en Mecánica Experimental de Sólidos Una Metodología Para Resolver Problemas Inversos en Mecánica Experimental de Sólidos J. F. Cárdenas-García, PhD, PE Becario Prometeo Escuela Politécnica Nacional Quito, ECUADOR 1 of 69 Outline Motivation

More information

MLCC APPLICATION GUIDE

MLCC APPLICATION GUIDE MLCC APPLICATION GUIDE 1/10 No. Process Condition 1 Operating Condition (Storage) 1) The capacitor must be stored in an ambient temperature between 5 ~ 40 with a relative humidity of 20 ~ 70%. The products

More information

The Pull-In of Symmetrically and Asymmetrically Driven Microstructures and the Use in DC Voltage References

The Pull-In of Symmetrically and Asymmetrically Driven Microstructures and the Use in DC Voltage References IEEE Instrumentation and Measurement Technology Conference Anchorage, AK, USA, 1-3 May 00 The Pull-In of Symmetrically and Asymmetrically Driven Microstructures and the Use in DC Voltage References L.A.

More information

CAPACITIVE MICRO PRESSURE SENSORS WITH UNDERNEATH READOUT CIRCUIT USING A STANDARD CMOS PROCESS

CAPACITIVE MICRO PRESSURE SENSORS WITH UNDERNEATH READOUT CIRCUIT USING A STANDARD CMOS PROCESS Journal of the Chinese Institute of Engineers, Vol. 26, No. 2, pp. 237-241 (2003) 237 Short Paper CAPACITIVE MICRO PRESSURE SENSORS WITH UNDERNEATH READOUT CIRCUIT USING A STANDARD CMOS PROCESS Ching-Liang

More information

Intensity (a.u.) Intensity (a.u.) Raman Shift (cm -1 ) Oxygen plasma. 6 cm. 9 cm. 1mm. Single-layer graphene sheet. 10mm. 14 cm

Intensity (a.u.) Intensity (a.u.) Raman Shift (cm -1 ) Oxygen plasma. 6 cm. 9 cm. 1mm. Single-layer graphene sheet. 10mm. 14 cm Intensity (a.u.) Intensity (a.u.) a Oxygen plasma b 6 cm 1mm 10mm Single-layer graphene sheet 14 cm 9 cm Flipped Si/SiO 2 Patterned chip Plasma-cleaned glass slides c d After 1 sec normal Oxygen plasma

More information

STRUCTURAL SURFACES & FLOOR GRILLAGES

STRUCTURAL SURFACES & FLOOR GRILLAGES STRUCTURAL SURFACES & FLOOR GRILLAGES INTRODUCTION Integral car bodies are 3D structures largely composed of approximately subassemblies- SSS Planar structural subassemblies can be grouped into two categories

More information

1220. Design considerations of a MEMS cantilever beam switch for pull-in under electrostatic force generated by means of vibrations

1220. Design considerations of a MEMS cantilever beam switch for pull-in under electrostatic force generated by means of vibrations 1220. Design considerations of a MEMS cantilever beam switch for pull-in under electrostatic force generated by means of vibrations Serhat İkizoğlu 1, Ayşe Özgül Ertanır 2 1 Istanbul Technical University,

More information

EECS C245 ME C218 Midterm Exam

EECS C245 ME C218 Midterm Exam University of California at Berkeley College of Engineering EECS C245 ME C218 Midterm Eam Fall 2003 Prof. Roger T. Howe October 15, 2003 Dr. Thara Srinivasan Guidelines Your name: SOLUTIONS Circle your

More information

Tunable MEMS Capacitor for RF Applications

Tunable MEMS Capacitor for RF Applications Tunable MEMS Capacitor for RF Applications Shriram H S *1, Tushar Nimje 1, Dhruv Vakharia 1 1 BITS Pilani, Rajasthan, India *1167, 1 st Main, 2 nd Block, BEL Layout, Vidyaranyapura, Bangalore 560097; email:

More information

UNIVERSITY OF BOLTON SCHOOL OF ENGINEERING. BEng (HONS) CIVIL ENGINEERING SEMESTER 1 EXAMINATION 2016/2017 MATHEMATICS & STRUCTURAL ANALYSIS

UNIVERSITY OF BOLTON SCHOOL OF ENGINEERING. BEng (HONS) CIVIL ENGINEERING SEMESTER 1 EXAMINATION 2016/2017 MATHEMATICS & STRUCTURAL ANALYSIS TW21 UNIVERSITY OF BOLTON SCHOOL OF ENGINEERING BEng (HONS) CIVIL ENGINEERING SEMESTER 1 EXAMINATION 2016/2017 MATHEMATICS & STRUCTURAL ANALYSIS MODULE NO: CIE4011 Date: Wednesday 11 th January 2017 Time:

More information

Improving Yield for High Pin Count Wafer Probing Applications

Improving Yield for High Pin Count Wafer Probing Applications John R. Goulding Martin Elzingre Larry Hendler Technical Marketing Manager 200mm Product Manager Consultant Electroglas, Inc. Electroglas, Inc. Electroglas, Inc. South West Test Workshop June 11-14 th

More information

Physics 476LW Advanced Physics Laboratory Michelson Interferometer

Physics 476LW Advanced Physics Laboratory Michelson Interferometer Physics 476LW Advanced Physics Laboratory Michelson Interferometer Introduction An optical interferometer is an instrument which splits a beam of light into two beams, each beam follows a different path

More information

ANALYSIS AND NUMERICAL MODELLING OF CERAMIC PIEZOELECTRIC BEAM BEHAVIOR UNDER THE EFFECT OF EXTERNAL SOLICITATIONS

ANALYSIS AND NUMERICAL MODELLING OF CERAMIC PIEZOELECTRIC BEAM BEHAVIOR UNDER THE EFFECT OF EXTERNAL SOLICITATIONS Third International Conference on Energy, Materials, Applied Energetics and Pollution. ICEMAEP016, October 30-31, 016, Constantine,Algeria. ANALYSIS AND NUMERICAL MODELLING OF CERAMIC PIEZOELECTRIC BEAM

More information

10 - Celestron Telescope II: Operation

10 - Celestron Telescope II: Operation 10 - Celestron Telescope II: Operation Purpose: Gain more experience setting up a 6 Celestron telescope, familiarize yourself with the software interface, and acquire an image with the CCD camera. Due:

More information

American Society for Testing and Materials (ASTM) Standards. Mechanical Testing of Composites and their Constituents

American Society for Testing and Materials (ASTM) Standards. Mechanical Testing of Composites and their Constituents Mechanical Testing of Composites and their Constituents American Society for Testing and Materials (ASTM) Standards Tests done to determine intrinsic material properties such as modulus and strength for

More information

NSC E

NSC E NSC 892218E006071 1 Preparation of NSC Project Reports microfluidic channels are fabricated on quartz substrates and then used to imprint microstructures into Polymethylmethacrylate (PMMA) substrates using

More information

GENERAL CONTACT AND HYSTERESIS ANALYSIS OF MULTI-DIELECTRIC MEMS DEVICES UNDER THERMAL AND ELECTROSTATIC ACTUATION

GENERAL CONTACT AND HYSTERESIS ANALYSIS OF MULTI-DIELECTRIC MEMS DEVICES UNDER THERMAL AND ELECTROSTATIC ACTUATION GENERAL CONTACT AND HYSTERESIS ANALYSIS OF MULTI-DIELECTRIC MEMS DEVICES UNDER THERMAL AND ELECTROSTATIC ACTUATION Yie He, James Marchetti, Carlos Gallegos IntelliSense Corporation 36 Jonspin Road Wilmington,

More information

Design and Simulation of A MEMS Based Horseshoe Shaped Low Current Lorentz Deformable Mirror (LCL-DM).

Design and Simulation of A MEMS Based Horseshoe Shaped Low Current Lorentz Deformable Mirror (LCL-DM). Design and Simulation of A MEMS Based Horseshoe Shaped Low Current Lorentz Deformable Mirror (LCL-DM). Byoungyoul Park 1, Tao Chen 1, Cyrus Shafai 1 1 Electrical and Computer Engineering, University of

More information

Question Sheet for Laboratory 3: E-1: Electrostatics

Question Sheet for Laboratory 3: E-1: Electrostatics Name Section Question Sheet for Laboratory 3: E-1: Electrostatics PART I. CHARGE OBJECTIVE: To build a qualitative model for charge by observing forces between charged objects. APPARATUS: 1. Tape, hard

More information

b. The displacement of the mass due to a constant acceleration a is x=

b. The displacement of the mass due to a constant acceleration a is x= EE147/247A Final, Fall 2013 Page 1 /35 2 /55 NO CALCULATORS, CELL PHONES, or other electronics allowed. Show your work, and put final answers in the boxes provided. Use proper units in all answers. 1.

More information

Microelectromechanical systems (MEMS) have become an increasingly important area of

Microelectromechanical systems (MEMS) have become an increasingly important area of 1 Chapter 1 Introduction 1.1 Background Microelectromechanical systems (MEMS) have become an increasingly important area of technology. This is due to the premise that the efficiencies of high volume production

More information

EE C245 ME C218 Introduction to MEMS Design

EE C245 ME C218 Introduction to MEMS Design EE C245 ME C218 Introduction to MEMS Design Fall 2007 Prof. Clark T.-C. Nguyen Dept. of Electrical Engineering & Computer Sciences University of California at Berkeley Berkeley, CA 94720 Lecture 16: Energy

More information

Charge to Mass Ratio of The Electron

Charge to Mass Ratio of The Electron Introduction Charge to Mass Ratio of The Electron The electron was first discovered by Sir J.J. Thomson in 1897 at the Cavendish Laboratory in Cambridge, England. His experimental apparatus is not very

More information

Abstract. 1 Introduction

Abstract. 1 Introduction In R. A. Adey et al., eds., Simulation and Design of Microsystems and Microstructures (Proceedings of the 1st International Conference on Simulation and Design of Microsystems and Microstructures), Computational

More information

Experiment Five (5) Principal of Stress and Strain

Experiment Five (5) Principal of Stress and Strain Experiment Five (5) Principal of Stress and Strain Introduction Objective: To determine principal stresses and strains in a beam made of aluminum and loaded as a cantilever, and compare them with theoretical

More information

Introduction to Structural Member Properties

Introduction to Structural Member Properties Introduction to Structural Member Properties Structural Member Properties Moment of Inertia (I): a mathematical property of a cross-section (measured in inches 4 or in 4 ) that gives important information

More information

Atomic Force Microscopy

Atomic Force Microscopy Journal of the Advanced Undergraduate Physics Laboratory Investigation Volume 0 Issue 0 Premiere Issue Article 2 6-6-2012 Atomic Force Microscopy Tyler Lane Minnesota State University - Moorhead, lanety@mnstate.edu

More information

Name :. Roll No. :... Invigilator s Signature :.. CS/B.TECH (CE-NEW)/SEM-3/CE-301/ SOLID MECHANICS

Name :. Roll No. :... Invigilator s Signature :.. CS/B.TECH (CE-NEW)/SEM-3/CE-301/ SOLID MECHANICS Name :. Roll No. :..... Invigilator s Signature :.. 2011 SOLID MECHANICS Time Allotted : 3 Hours Full Marks : 70 The figures in the margin indicate full marks. Candidates are required to give their answers

More information

ABSTRACT. Keywords: MEMS, Electrostatic, Repulsive force, Cantilever, IR Sensor, Casimir Force, Finite element analysis 1.

ABSTRACT. Keywords: MEMS, Electrostatic, Repulsive force, Cantilever, IR Sensor, Casimir Force, Finite element analysis 1. Vertical electrostatic force in MEMS cantilever IR sensor Imen Rezadad, Javaneh Boroumand, Evan M. Smith, Ammar Alhasan, Robert E. Peale University of Central Florida, Physics Department, Orlando, FL,

More information

MLCC APPLICATION GUIDE

MLCC APPLICATION GUIDE MLCC APPLICATION GUIDE 1/11 No. Process Condition 1 Operating Condition (Storage) 1) The capacitor must be stored in an ambient temperature between 5 ~ 40 with a relative humidity of 20 ~ 70%. The products

More information

Surface Engineering for MEMS Reliability

Surface Engineering for MEMS Reliability Surface Engineering for MEMS Reliability ESS5855 Lecture Fall 2010 Surface Engineering and Microtribology for MEMS 01 K. Komvopoulos, U.C. Berkeley Wear, 1996 Adhesion and Friction Forces in MEMS: Mechanisms,

More information

Laith Batarseh. internal forces

Laith Batarseh. internal forces Next Previous 1/8/2016 Chapter seven Laith Batarseh Home End Definitions When a member is subjected to external load, an and/or moment are generated inside this member. The value of the generated internal

More information

Stress Engineering Interview Questions Part 1

Stress Engineering Interview Questions Part 1 Stress Engineering Interview Questions Part 1 Author: Surya Batchu Senior Stress Engineer Founder, STRESS EBOOK LLC. http://www.stressebook.com 1 P a g e Stress Engineering Interview Questions Part 1:

More information

CE 320 Structures Laboratory 1 Flexure Fall 2006

CE 320 Structures Laboratory 1 Flexure Fall 2006 CE 320 Structures Laboratory 1 Flexure Fall 2006 General Note: All structures labs are to be conducted by teams of no more than four students. Teams are expected to meet to decide on an experimental design

More information

Introduction to Microeletromechanical Systems (MEMS) Lecture 9 Topics. MEMS Overview

Introduction to Microeletromechanical Systems (MEMS) Lecture 9 Topics. MEMS Overview Introduction to Microeletromechanical Systems (MEMS) Lecture 9 Topics MicroOptoElectroMechanical Systems (MOEMS) Grating Light Valves Corner Cube Reflector (CCR) MEMS Light Modulator Optical Switch Micromirrors

More information

A SCIENTIFIC APPROACH TO A STICKY PROBLEM

A SCIENTIFIC APPROACH TO A STICKY PROBLEM A SCIENTIFIC APPROACH TO A STICKY PROBLEM Sticking, the adherence of granule to punch face or die bore, is one of the major issues affecting the manufacture of solid dose pharmaceuticals. As part of I

More information

Mechanical characterization of single crystal BaTiO 3 film and insitu. XRD observation of microstructure change due to

Mechanical characterization of single crystal BaTiO 3 film and insitu. XRD observation of microstructure change due to 76 Chapter 4 Mechanical characterization of single crystal BaTiO 3 film and insitu XRD observation of microstructure change due to mechanical loading 4.1 Introduction Ferroelectric materials have many

More information

Improving nano-scale imaging of of intergrated micro-raman/afm systems using negativestiffness

Improving nano-scale imaging of of intergrated micro-raman/afm systems using negativestiffness See vibration isolation technology @ www.minusk.com?pdf) Electronic Products and Technology - May 2014 Improving nano-scale imaging of of intergrated micro-raman/afm systems using negativestiffness vibration

More information

STRENGTH OF MATERIALS-I. Unit-1. Simple stresses and strains

STRENGTH OF MATERIALS-I. Unit-1. Simple stresses and strains STRENGTH OF MATERIALS-I Unit-1 Simple stresses and strains 1. What is the Principle of surveying 2. Define Magnetic, True & Arbitrary Meridians. 3. Mention different types of chains 4. Differentiate between

More information

height trace of a 2L BN mechanically exfoliated on SiO 2 /Si with pre-fabricated micro-wells. Scale bar 2 µm.

height trace of a 2L BN mechanically exfoliated on SiO 2 /Si with pre-fabricated micro-wells. Scale bar 2 µm. Supplementary Figure 1. Few-layer BN nanosheets. AFM image and the corresponding height trace of a 2L BN mechanically exfoliated on SiO 2 /Si with pre-fabricated micro-wells. Scale bar 2 µm. Supplementary

More information

STRUCTURAL ANALYSIS OF THE LIFTING DEVICE DETECTOR SUPPORTS FOR THE LHCb VERTEX LOCATOR (VELO)

STRUCTURAL ANALYSIS OF THE LIFTING DEVICE DETECTOR SUPPORTS FOR THE LHCb VERTEX LOCATOR (VELO) National Institute for Nuclear Physics and High Energy Physics Kruislaan 409 1098 SJ Amsterdam The Netherlands NIKHEF Reference no.: MT-VELO 04-2 EDMS no: 466608 OF THE LIFTING DEVICE DETECTOR SUPPORTS

More information

Characterization of MEMS Devices

Characterization of MEMS Devices MEMS: Characterization Characterization of MEMS Devices Prasanna S. Gandhi Assistant Professor, Department of Mechanical Engineering, Indian Institute of Technology, Bombay, Recap Characterization of MEMS

More information

A simple method to characterize the electrical and mechanical properties of micro-fibers

A simple method to characterize the electrical and mechanical properties of micro-fibers A simple method to characterize the electrical and mechanical properties of micro-fibers A Castellanos-Gomez * Kavli Institute of Nanoscience, Delft University of Technology, Lorentzweg 1, 2628 CJ Delft,

More information

PHY222 Lab 2 - Electric Fields Mapping the Potential Curves and Field Lines of an Electric Dipole

PHY222 Lab 2 - Electric Fields Mapping the Potential Curves and Field Lines of an Electric Dipole Print Your Name PHY222 Lab 2 - Electric Fields Mapping the Potential Curves and Field Lines of an Electric Dipole Print Your Partners' Names Instructions January 23, 2015 Before lab, read the Introduction,

More information

Kurukshetra University INDIA

Kurukshetra University INDIA American International Journal of Research in Science, Technology, Engineering & Mathematics Available online at http://www.iasir.net ISSN (Print): 2328-3491, ISSN (Online): 2328-3580, ISSN (CD-ROM): 2328-3629

More information

my!wind Ltd 5 kw wind turbine Static Stability Specification

my!wind Ltd 5 kw wind turbine Static Stability Specification my!wind Ltd 5 kw wind turbine Static Stability Specification 1 P a g e 0 3 / 0 4 / 2 0 1 4 Contents Contents... 2 List of Changes... 2 Appendixes... 2 General remarks... 3 1. Introduction... 4 2. Geometry...

More information

MET 487 Instrumentation and Automatic Controls. Lecture 13 Sensors

MET 487 Instrumentation and Automatic Controls. Lecture 13 Sensors MET 87 nstrumentation and utomatic Controls Lecture Sensors July 6-9, 00 Stress and Strain Measurement Safe Load Level monitoring Force (indirect measurement by measuring strain of a flexural element Pressure

More information

Mechatronics II Laboratory EXPERIMENT #1 MOTOR CHARACTERISTICS FORCE/TORQUE SENSORS AND DYNAMOMETER PART 1

Mechatronics II Laboratory EXPERIMENT #1 MOTOR CHARACTERISTICS FORCE/TORQUE SENSORS AND DYNAMOMETER PART 1 Mechatronics II Laboratory EXPEIMENT #1 MOTO CHAACTEISTICS FOCE/TOQUE SENSOS AND DYNAMOMETE PAT 1 Force Sensors Force and torque are not measured directly. Typically, the deformation or strain of some

More information

Outline. 4 Mechanical Sensors Introduction General Mechanical properties Piezoresistivity Piezoresistive Sensors Capacitive sensors Applications

Outline. 4 Mechanical Sensors Introduction General Mechanical properties Piezoresistivity Piezoresistive Sensors Capacitive sensors Applications Sensor devices Outline 4 Mechanical Sensors Introduction General Mechanical properties Piezoresistivity Piezoresistive Sensors Capacitive sensors Applications Introduction Two Major classes of mechanical

More information