MECH 466. Micro Electromechanical Systems. Laboratory Manual Laboratory #3: Stiction of MEMS and Strength of MEMS Materials
|
|
- Samson Barker
- 5 years ago
- Views:
Transcription
1 MECH 466 Micro Electromechanical Systems Laboratory Manual Laboratory #: Stiction of MEMS and Strength of MEMS Materials Department of Mechanical Engineering, University of Victoria N. Dechev, 2011, University of Victoria Page 1 of 7
2 Report: The laboratory report must be in the following format: (i) (ii) (iii) (iv) (v) Title Page i. Include your name, student number, date of lab, etc Objective Data i. Include data and images you collected. ii. Comment on any Sources of Error that may have influenced the data, or the collection of the data. Discussion i. Compare and contrast the experimental results in comparison to the theoretical/analytical results. ii. Include answers to the questions that pertain to the experiments, as listed in the Lab Write-up section. Conclusion Please organize the laboratory report into the five divisions indicated above (Title Page, Objective, Data/Images, Discussion (with questions answered), and Conclusion). The report should be a maximum of 5 pages (double spaced text), including figures, and data. Appendices may be added as extra pages. N. Dechev, 2011, University of Victoria Page 2 of 7
3 Laboratory #: Stiction of MEMS and Strength of MEMS Materials Purpose: The purpose of this laboratory is to investigate the microscale phenomenon of stiction. The second purpose of this laboratory is to investigate the strength of polysilicon, which is typically used as a structural material in MEMS devices. Introduction: Part (I): Stiction is an effect observed when micro-scaled objects come into direct contact with each other. To a casual observer, it appears that when the micro-objects are brought into contact, they stick together with relatively high adhesion. The stiction effect is actually a combination of a number of different micro-phenomena [1,2,], including: (a) electrostatic attraction (transient), (b) fluid surface tension due to a nano-scale water layer on objects, and (c) Van der Vaals force. Research into the stiction phenomena is on going and there are a number of other possible causes under investigation [4]. This laboratory will attempt to experimentally quantify the stiction that exists between a polysilicon microtool tip shown in Fig. A-1, and the substrate of a MUMPs chip. Part (II): The knowledge of the strength of MEMS materials is an important aspect to their design. This laboratory will destructively test the beams of a microtool by using the robotic micromanipulator. The purpose is to determine the ultimate strength of polysilicon beams fabricated by the MUMPs process, and compare these results with the results reported by others [5,6]. Laboratory Preparation: Review this document and the procedures prior to performing the laboratory. Note: Appendix A provides an illustration and the geometry of the microtool that will be used in these experiments. Procedure: Setup: (1) The lab technician/ta will mount a glass slide containing MEMS chips onto the worktable of the micromanipulator. (2) The lab technician/ta will bond a microtool to the pin-probe of the micromanipulator. (Observation #1): Bonding of a MEMS microtool: (1) Mount the probe pin holder (with a tungsten probe installed) on the Beta Axis of the micromanipulator (2) Locate the tip of the probe pin using the Manual XYZ Stage, i.e. bring it into the field of view of the camera. () Locate the desired microtool for a given task on the MEMS chip. (4) Localize the probe pin tip with respect to the microtool bond-pad (Fig. A-1), by touching down on the bond-pad with the probe pin. Be careful not to crush the bond-pad with too much pressure. (5) Zero the coordinate system in software. (6) Raise the probe pin by 10 mm (10,000 microns) and apply UV adhesive to the tip. (7) Return the probe pin to 100 microns above the bond-pad, and slowly lower the pint until the encoder displays the zero position N. Dechev, 2011, University of Victoria Page of 7
4 (8) Watch/Verify that the adhesive flows from the probe pin onto the bond-pad. (9) Put on your UV-Glasses. If you are unable to use UV-Glasses, you will be required to exit the laboratory until the UV-bonding step is completed. (10) The lab technician/ta will expose the adhesive with the UV spot light system. (11) After UV adhesive has cured, slowly command the probe pin upwards along the z-axis. This will raise the microtool away from the substrate, thereby breaking off the tethers that hold it down. (12) The microtool is now bonded to the probe pin, and is ready to be used for the experiments. (1) Since the microtool is parallel to the substrate, it is necessary to tilt it by degrees, to ensure that the square-tip is the lowest point. Do this by commanding the beta-axis to tilt 0.9 (x ) in the appropriate direction. Experiment #1: Static Test of Stiction (1) Locate the long polysilicon tracks along the edge of the chip. The tracks are approximately 50 microns wide and 2000 microns long. (2) Line up the microtool square-tip such that it is perpendicular to the poly-track. () Gently place the microtool square-tip onto the poly-track. Since the microtool is tilted at, you may need to move down (z-direction) an extra micron, to ensure the square-tip is flat onto the poly-track. NOTE: It may be difficult to determine when contact occurs, so ask your TA or the instructor for help. (4) Record an image (Starting position). (5) Using the micromanipulator controller, move the microtool laterally (i.e. sideways in comparison to it s longitudinal axis) in 1 um increments. (6) Record the # of microns you can move, before the microtool square-tip slips relative to the poly-track. (7) Try to record an image showing the deflected microtool (Final Position). (8) Lift the microtool off the substrate. (9) Repeat steps # ( to 8) at two other locations along poly-track. (10) Repeat steps # ( to 8) with the square-tip touching the silicon nitride substrate. Experiment #2: Dynamic Test of Stiction (1) Line up the microtool square-tip such that it is perpendicular to the poly-track. (2) Gently place the microtool square-tip onto the poly-track. Since the microtool is tilted at, you may need to move down (z-direction) an extra micron, to ensure the square-tip is flat onto the poly-track. NOTE: It may be difficult to determine when contact occurs, so ask your TA or the instructor for help. () Record an image (Starting position). (4) Using the micromanipulator controller, move the microtool laterally (i.e. sideways in comparison to it s longitudinal axis) at a constant velocity. Specify a speed of 10 microns/second for the velocity, and a move distance of 50 microns. This should provide 5 seconds of motion. (5) As the microtool is in motion, Record an image. (6) Lift the microtool off the substrate. (7) Repeat steps # (1 to 6) at one other location along the poly-track. (8) Repeat steps # (1 to 6) with the square-tip touching the silicon nitride substrate. N. Dechev, 2011, University of Victoria Page 4 of 7
5 Experiment #: Ultimate Strength of Polysilicon Beams (1) Locate a corner of the chip, (or a poly-1 feature on the substrate). (2) Gently place one microtool square-tip against the corner of the chip (or against the selected poly-1 feature). Ensure that the square-tip is just touching the edge/poly-1-feature, without any noticeable deflection. () Record an image (Starting position). (4) Using the micromanipulator controller, move the microtool laterally in 1 um increments. (5) Record an image of the microtool tips as they bend, for each increment. (6) Record the # of microns you can move, before the microtool tip breaks off. (7) Record an image (Final position). (8) Move the microtool back to the starting position and this time gently place the remaining microtool square-tip against the corner of the chip (as instructed by the TA). Ensure that the square-tip is just touching the edge/poly-1-feature, without any noticeable deflection. (9) Repeat steps # ( to 7). Laboratory Write-up: In relation to Experiment #1, answer the following questions in the Discussion Section of your laboratory report. You may use the supplementary information in the next section, to help you answer these questions. (Q1) What is the static stiction force holding the microtool to the substrate? In relation to Experiment #2, answer the following questions in your laboratory report: (Q2) What is the dynamic stiction force between the micrgripper and the substrate? (Q) Comment on any unexpected results you may have observed for both experiment #1 and #2. What may have caused these? In relation to Experiment #, answer the following questions in your laboratory report: (Q4) Calculate the ultimate strength (stress) of the polysilicon due to bending, using the flexture formula. (Q5) What is the ultimate strength (stress) of polysilicon, as reported in the literature? Comment on the difference/agreement with your result, as compared to the literature. Provide possible explanation for differences. (Q6) Comment on any sources of error for Experiment #1, #2 or #. Supplementary Information for the Microtool: The geometry of the microtool is given in Appendix A. The polysilicon material properties can be assumed as: E (Young s Modulus) = 160 GPa, and other values as listed in references [5,6]. To analytically determine the forces applied to the square-tip, for a given tip deflection from its rest position, we can use the following: For the lateral forces, the beams can be modeled as follows: Referring to the microtool illustration of Fig. A-1(a), and assuming loading force F 2 as shown in Fig. A-1(c), we can model the microtool as three parallel fixed-guided beams. N. Dechev, 2011, University of Victoria Page 5 of 7
6 For each beam, the distance from the bond-pad to the end of the square-tip is 120 um. Also, the width of the beams is w = 2 um and the thickness is t = 2 um. Using the flexture formula: σ = My I We can substitute values to re-write this as (where we approximate moment M = FL, which is valid for cantilever beams, where M is maximum at the root of the beam): ( σ = FL) w 2 = 6FL tw tw 2 12 For a single fixed-guided beam, the deflection is: δ = FL b 12EI Where E is assumed to be 160 GPa. Re-arranging the above equation in terms of F, we have: 12δE tw F = 12 = δetw L b L b For the case of three parallel beams the lateral force developed for a given deflection is: F = δetw L b Note: for two parallel beams, the constant in the numerator is 2. Therefore, the maximum lateral stress in any one of the beams (for three-beam configuration) can be approximated as: 6 F L b σ = tw 2 References: [1] N. Tas, T. Sonnenberg, H. Jansen, R. Legtenberg, and M. Elwenspoek, Stiction in Surface Micromachining, Journal of Micromechanics and Microengineering, vol. 6, 1996, pp [2] C. H. Mastrangelo, and C. H. Hsu, Mechanical stability and adhesion of microstructures under capillary forces part I: basic theory, Journal of Microelectromechanical Systems, vol. 2, 199, pp. -4 [] W. Merlijn van Spengen, R. Puers, and I. De Wolf, A Physical Model to Predict Stiction in MEMS, Journal of Micromechanics and Microengineering, vol. 12, 2002, pp N. Dechev, 2011, University of Victoria Page 6 of 7
7 [4] Philip Ball, Fundamental physics: Feel the force, Nature, [Online, last cited July 2, 2008] [5] W. N. Sharpe and K. Jackson, Tensile testing of MEMS materials, in Proc SEM IX International Congress, Orlando, FL, June 5 8, 2000 [6] W. N. Sharpe, B. Yuan, R. Vaidyanathan, and R. L. Edwards, Measurements of Young s modulus, Poisson s ratio, and tensile strength of polysilicon, in Proc. Tenth IEEE International Workshop on Microelectromechanical Systems, Nagoya, Japan, 1997, pp Appendix A: Figure A-1: Microtool Geometry N. Dechev, 2011, University of Victoria Page 7 of 7
MECH 466. Micro Electromechanical Systems. Laboratory #1: Testing of Electrostatic Microactuators
MECH 466 Micro Electromechanical Systems Laboratory #1: Testing of Electrostatic Microactuators Department of Mechanical Engineering, University of Victoria N. Dechev, 2016, University of Victoria Page
More informationDecember 1999 FINAL TECHNICAL REPORT 1 Mar Mar 98
REPORT DOCUMENTATION PAGE AFRL-SR- BL_TR " Public reporting burden for this collection of information is estimated to average 1 hour per response, including the time for reviewing instruct the collection
More informationY. C. Lee. Micro-Scale Engineering I Microelectromechanical Systems (MEMS)
Micro-Scale Engineering I Microelectromechanical Systems (MEMS) Y. C. Lee Department of Mechanical Engineering University of Colorado Boulder, CO 80309-0427 leeyc@colorado.edu January 15, 2014 1 Contents
More informationEE C247B / ME C218 INTRODUCTION TO MEMS DESIGN SPRING 2016 C. NGUYEN PROBLEM SET #4
Issued: Wednesday, March 4, 2016 PROBLEM SET #4 Due: Monday, March 14, 2016, 8:00 a.m. in the EE C247B homework box near 125 Cory. 1. This problem considers bending of a simple cantilever and several methods
More informationA Vertical Electrostatic Actuator with Extended Digital Range via Tailored Topology
A Vertical Electrostatic Actuator with Extended Digital Range via Tailored Topology Yanhang Zhang and Martin L. Dunn Department of Mechanical Engineering University of Colorado at Boulder Boulder, CO 80309
More informationSINGLE-STEP ASSEMBLY OF COMPLEX 3-D MICROSTRUCTURES
SINGLE-STEP ASSEMBLY OF COMPLEX 3-D MICROSTRUCTURES Elliot E. Hui, Roger T. Howe, and M. Steven Rodgers* Berkeley Sensor & Actuator Center, University of California, Berkeley, CA 94720-1774, USA *Intelligent
More information1. Narrative Overview Questions
Homework 4 Due Nov. 16, 010 Required Reading: Text and Lecture Slides on Downloadable from Course WEB site: http://courses.washington.edu/overney/nme498.html 1. Narrative Overview Questions Question 1
More informationENSC387: Introduction to Electromechanical Sensors and Actuators LAB 3: USING STRAIN GAUGES TO FIND POISSON S RATIO AND YOUNG S MODULUS
ENSC387: Introduction to Electromechanical Sensors and Actuators LAB 3: USING STRAIN GAUGES TO FIND POISSON S RATIO AND YOUNG S MODULUS 1 Introduction... 3 2 Objective... 3 3 Supplies... 3 4 Theory...
More informationPlatform Isolation Using Out-of-plane Compliant Mechanism
Platform Isolation Using Out-of-plane Compliant Mechanism by Arpys Arevalo PhD Candidate in Electrical Engineering Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) King Abdullah University
More informationPHY 221 Lab 5 Diverse Forces, Springs and Friction
Name: Partner: Partner: PHY 221 Lab 5 Diverse Forces, Springs and Friction Goals: To explore the nature of forces and the variety of ways in which they can be produced. Characterize the nature of springs
More information1 Force Sensing. Lecture Notes. 1.1 Load Cell. 1.2 Stress and Strain
Lecture Notes 1 Force Sensing 1.1 Load Cell A Load Cell is a structure which supports the load and deflects a known amount in response to applied forces and torques. The deflections are measured to characterize
More informationAERO 214. Lab II. Measurement of elastic moduli using bending of beams and torsion of bars
AERO 214 Lab II. Measurement of elastic moduli using bending of beams and torsion of bars BENDING EXPERIMENT Introduction Flexural properties of materials are of interest to engineers in many different
More informationExperimental Lab. Principles of Superposition
Experimental Lab Principles of Superposition Objective: The objective of this lab is to demonstrate and validate the principle of superposition using both an experimental lab and theory. For this lab you
More informationMEMS Report for Lab #3. Use of Strain Gages to Determine the Strain in Cantilever Beams
MEMS 1041 Report for Lab #3 Use of Strain Gages to Determine the Strain in Cantilever Beams Date: February 9, 2016 Lab Instructor: Robert Carey Submitted by: Derek Nichols Objective: The objective of this
More informationSolder Self-assembly for MEMS
Solder Self-assembly for MEMS Kevin F. Harsh, Ronda S. Irwin and Y. C. Lee NSF Center for Advanced Manufacturing and Packaging of Microwave, Optical and Digital Electronics, Department of Mechanical Engineering
More information1 332 Laboratories 1. 2 Computational Exercises 1 FEA of a Cantilever Beam... 1 Experimental Laboratory: Tensile Testing of Materials...
1 332 Laboratories Contents 1 332 Laboratories 1 2 Computational Exercises 1 FEA of a Cantilever Beam.......................................... 1 Experimental Laboratory: Tensile Testing of Materials..........................
More informationWorkshop 8. Lateral Buckling
Workshop 8 Lateral Buckling cross section A transversely loaded member that is bent about its major axis may buckle sideways if its compression flange is not laterally supported. The reason buckling occurs
More information9-11 April 2008 Measurement of Large Forces and Deflections in Microstructures
9-11 April 28 Measurement of Large Forces and Deflections in Microstructures Kai Axel Hals 1, Einar Halvorsen, and Xuyuan Chen Institute for Microsystem Technology, Vestfold University College, P.O. Box
More informationM-3: Statics & M-10 Elasticity
Group member names This sheet is the lab document your TA will use to score your lab. It is to be turned in at the end of lab. To receive full credit you must use complete sentences and explain your reasoning
More informationBending Load & Calibration Module
Bending Load & Calibration Module Objectives After completing this module, students shall be able to: 1) Conduct laboratory work to validate beam bending stress equations. 2) Develop an understanding of
More informationBasic Laboratory. Materials Science and Engineering. Atomic Force Microscopy (AFM)
Basic Laboratory Materials Science and Engineering Atomic Force Microscopy (AFM) M108 Stand: 20.10.2015 Aim: Presentation of an application of the AFM for studying surface morphology. Inhalt 1.Introduction...
More informationDesign And Analysis of Microcantilevers With Various Shapes Using COMSOL Multiphysics Software
Design And Analysis of Microcantilevers With Various Shapes Using COMSOL Multiphysics Software V. Mounika Reddy 1, G.V.Sunil Kumar 2 1,2 Department of Electronics and Instrumentation Engineering, Sree
More informationNONLINEARITY is easily encountered in the resonant
122 JOURNAL OF MICROELECTROMECHANICAL SYSTEMS, VOL. 7, NO. 1, MARCH 1998 Nonlinearity and Hysteresis of Resonant Strain Gauges Chengqun Gui, Rob Legtenberg, Harrie A. C. Tilmans, Jan H. J. Fluitman, and
More informationDetermination of maximum allowable strain for polysilicon micro!devices
PERGAMON Engineering Failure Analysis 5 "0888# 16Ð30 Determination of maximum allowable strain for polysilicon micro!devices S[C[ Bromley\ L[L[ Howell\ B[D[ Jensen Mechanical Engineering Department\ Brigham
More informationMeasurement of Bone Strength and Stiffness using 3-Point Bending
BME 315 Biomechanics, U. Wisconsin Adapted by R. Lakes from D. Thelen and C. Decker, 09, adapted from Lakes 06 Experimental Details I. Laboratory equipment The load frame that we will use to perform our
More informationHow Does a Microcantilever Work?
How Does a Cantilever Work? Participant Guide Description and Estimated Time to Complete The microcantilever is a widely used component in microsystems devices or microelectromechanical systems (MEMS).
More informationFeatures of static and dynamic friction profiles in one and two dimensions on polymer and atomically flat surfaces using atomic force microscopy
Features of static and dynamic friction profiles in one and two dimensions on polymer and atomically flat surfaces using atomic force microscopy Author Watson, Gregory, Watson, Jolanta Published 008 Journal
More informationCHAPTER 4 DESIGN AND ANALYSIS OF CANTILEVER BEAM ELECTROSTATIC ACTUATORS
61 CHAPTER 4 DESIGN AND ANALYSIS OF CANTILEVER BEAM ELECTROSTATIC ACTUATORS 4.1 INTRODUCTION The analysis of cantilever beams of small dimensions taking into the effect of fringing fields is studied and
More informationMAAE 2202 A. Come to the PASS workshop with your mock exam complete. During the workshop you can work with other students to review your work.
It is most beneficial to you to write this mock final exam UNDER EXAM CONDITIONS. This means: Complete the exam in 3 hours. Work on your own. Keep your textbook closed. Attempt every question. After the
More informationEE C247B / ME C218 INTRODUCTION TO MEMS DESIGN SPRING 2014 C. Nguyen PROBLEM SET #4
Issued: Wednesday, Mar. 5, 2014 PROBLEM SET #4 Due (at 9 a.m.): Tuesday Mar. 18, 2014, in the EE C247B HW box near 125 Cory. 1. Suppose you would like to fabricate the suspended cross beam structure below
More informationMODELING OF T-SHAPED MICROCANTILEVER RESONATORS. Margarita Narducci, Eduard Figueras, Isabel Gràcia, Luis Fonseca, Joaquin Santander, Carles Cané
Stresa, Italy, 5-7 April 007 MODELING OF T-SHAPED MICROCANTILEVER RESONATORS Margarita Narducci, Eduard Figueras, Isabel Gràcia, Luis Fonseca, Joaquin Santander, Carles Centro Nacional de Microelectrónica
More informationIntroduction to Actuators PK
Introduction to Actuators Primary Knowledge Participant Guide Description and Estimated Time to Complete This learning module is one of three SCME modules that discuss the types of components found in
More informationImaging Methods: Scanning Force Microscopy (SFM / AFM)
Imaging Methods: Scanning Force Microscopy (SFM / AFM) The atomic force microscope (AFM) probes the surface of a sample with a sharp tip, a couple of microns long and often less than 100 Å in diameter.
More informationCHAPTER 5 FIXED GUIDED BEAM ANALYSIS
77 CHAPTER 5 FIXED GUIDED BEAM ANALYSIS 5.1 INTRODUCTION Fixed guided clamped and cantilever beams have been designed and analyzed using ANSYS and their performance were calculated. Maximum deflection
More informationDevelopment and Characterization of High Frequency Bulk Mode Resonators
Excerpt from the Proceedings of the COMSOL Conference 008 Hannover Development and Characterization of High Frequency Bulk Mode Resonators Hossein Pakdast 1*, Zachary James Davis 1 1 DTU Nanotech, Technical
More informationPublished by: PIONEER RESEARCH & DEVELOPMENT GROUP(
MEMS based Piezo resistive Pressure Sensor Swathi Krishnamurthy 1, K.V Meena 2, E & C Engg. Dept., The Oxford College of Engineering, Karnataka. Bangalore 560009 Abstract The paper describes the performance
More informationMEMS Mechanical Fundamentals
ROCHESTER INSTITUTE OF TECHNOLOGY MICROELECTRONIC ENGINEERING MEMS Mechanical Fundamentals Dr. Lynn Fuller webpage: http://people.rit.edu/lffeee Electrical and Microelectronic Engineering Rochester Institute
More informationSimulation of a Micro-Scale Out-of-plane Compliant Mechanism
Simulation of a Micro-Scale Out-of-plane Compliant Mechanism by Arpys Arevalo PhD Candidate in Electrical Engineering Computer, Electrical and Mathematical Sciences and Engineering (CEMSE) King Abdullah
More informationDesign and Simulation of Micro-cantilever
Design and Simulation of Micro-cantilever Suresh Rijal 1, C.K.Thadani 2, C.K.Kurve 3,Shrikant Chamlate 4 1 Electronics Engg.Dept.,KITS,Ramtek, 2 Electronics and Comn.Engg.Dept.,KITS,Ramtek, 3 Electronics
More informationDurability of Silicon Pin-Joints for Microrobotics
Durability of Silicon Pin-Joints for Microrobotics Daniel S. Contreras, Kristofer S. J. Pister Electrical Engineering and Computer Sciences University of California, Berkeley Berkeley, California 9477-1774
More informationTwo Tier projects for students in ME 160 class
ME 160 Introduction to Finite Element Method Spring 2016 Topics for Term Projects by Teams of 2 Students Instructor: Tai Ran Hsu, Professor, Dept. of Mechanical engineering, San Jose State University,
More informationDESIGN AND EXPERIMENTAL EVALUATION OF AN ELECTROSTATIC MICRO-GRIPPING SYSTEM
DESIGN AND EXPERIMENTAL EVALUATION OF AN ELECTROSTATIC MICRO-GRIPPING SYSTEM Defeng Lang, Marcel Tichem 3mE, dep. PME, section PMA, Delfi Universiv of Technology Abstract: Key words: The paper describes
More informationA Technique for Force Calibration MEMS Traceable to NIST Standards
A Technique for Force Calibration MEMS Traceable to NIST Standards K. Abbas and Z. C. Leseman * University of New Mexico, Albuquerque, NM * Corresponding Author: MSC01-1150 Albuquerque, NM 87131: zleseman@unm.edu
More informationLab Exercise #5: Tension and Bending with Strain Gages
Lab Exercise #5: Tension and Bending with Strain Gages Pre-lab assignment: Yes No Goals: 1. To evaluate tension and bending stress models and Hooke s Law. a. σ = Mc/I and σ = P/A 2. To determine material
More informationSupplement: Statically Indeterminate Frames
: Statically Indeterminate Frames Approximate Analysis - In this supplement, we consider another approximate method of solving statically indeterminate frames subjected to lateral loads known as the. Like
More informationFinite Element Analysis of Piezoelectric Cantilever
Finite Element Analysis of Piezoelectric Cantilever Nitin N More Department of Mechanical Engineering K.L.E S College of Engineering and Technology, Belgaum, Karnataka, India. Abstract- Energy (or power)
More informationMechanics of wafer bonding: Effect of clamping
JOURNAL OF APPLIED PHYSICS VOLUME 95, NUMBER 1 1 JANUARY 2004 Mechanics of wafer bonding: Effect of clamping K. T. Turner a) Massachusetts Institute of Technology, Cambridge, Massachusetts 0219 M. D. Thouless
More informationPARTICLE ADHESION AND REMOVAL IN POST-CMP APPLICATIONS
PARTICLE ADHESION AND REMOVAL IN POST-CMP APPLICATIONS George Adams, Ahmed A. Busnaina and Sinan Muftu the oratory Mechanical, Industrial, and Manufacturing Eng. Department Northeastern University, Boston,
More informationDesign and Analysis of Various Microcantilever Shapes for MEMS Based Sensing
ScieTech 014 Journal of Physics: Conference Series 495 (014) 01045 doi:10.1088/174-6596/495/1/01045 Design and Analysis of Various Microcantilever Shapes for MEMS Based Sensing H. F. Hawari, Y. Wahab,
More informationComputers and Mathematics with Applications
Computers and Mathematics with Applications 5 2) 272 27 Contents lists available at ScienceDirect Computers and Mathematics with Applications journal homepage: wwwelseviercom/locate/camwa Solution of nonlinear
More informationCompliant MEMS Motion Characterization by Nanoindentation
Mater. Res. Soc. Symp. Proc. Vol. 152 28 Materials Research Society 152-DD6-24 Compliant MEMS Motion Characterization by Nanoindentation Joseph Goerges Choueifati 1, Craig Lusk 1, Xialou Pang 1,2, and
More informationUna Metodología Para Resolver Problemas Inversos en Mecánica Experimental de Sólidos
Una Metodología Para Resolver Problemas Inversos en Mecánica Experimental de Sólidos J. F. Cárdenas-García, PhD, PE Becario Prometeo Escuela Politécnica Nacional Quito, ECUADOR 1 of 69 Outline Motivation
More informationMLCC APPLICATION GUIDE
MLCC APPLICATION GUIDE 1/10 No. Process Condition 1 Operating Condition (Storage) 1) The capacitor must be stored in an ambient temperature between 5 ~ 40 with a relative humidity of 20 ~ 70%. The products
More informationThe Pull-In of Symmetrically and Asymmetrically Driven Microstructures and the Use in DC Voltage References
IEEE Instrumentation and Measurement Technology Conference Anchorage, AK, USA, 1-3 May 00 The Pull-In of Symmetrically and Asymmetrically Driven Microstructures and the Use in DC Voltage References L.A.
More informationCAPACITIVE MICRO PRESSURE SENSORS WITH UNDERNEATH READOUT CIRCUIT USING A STANDARD CMOS PROCESS
Journal of the Chinese Institute of Engineers, Vol. 26, No. 2, pp. 237-241 (2003) 237 Short Paper CAPACITIVE MICRO PRESSURE SENSORS WITH UNDERNEATH READOUT CIRCUIT USING A STANDARD CMOS PROCESS Ching-Liang
More informationIntensity (a.u.) Intensity (a.u.) Raman Shift (cm -1 ) Oxygen plasma. 6 cm. 9 cm. 1mm. Single-layer graphene sheet. 10mm. 14 cm
Intensity (a.u.) Intensity (a.u.) a Oxygen plasma b 6 cm 1mm 10mm Single-layer graphene sheet 14 cm 9 cm Flipped Si/SiO 2 Patterned chip Plasma-cleaned glass slides c d After 1 sec normal Oxygen plasma
More informationSTRUCTURAL SURFACES & FLOOR GRILLAGES
STRUCTURAL SURFACES & FLOOR GRILLAGES INTRODUCTION Integral car bodies are 3D structures largely composed of approximately subassemblies- SSS Planar structural subassemblies can be grouped into two categories
More information1220. Design considerations of a MEMS cantilever beam switch for pull-in under electrostatic force generated by means of vibrations
1220. Design considerations of a MEMS cantilever beam switch for pull-in under electrostatic force generated by means of vibrations Serhat İkizoğlu 1, Ayşe Özgül Ertanır 2 1 Istanbul Technical University,
More informationEECS C245 ME C218 Midterm Exam
University of California at Berkeley College of Engineering EECS C245 ME C218 Midterm Eam Fall 2003 Prof. Roger T. Howe October 15, 2003 Dr. Thara Srinivasan Guidelines Your name: SOLUTIONS Circle your
More informationTunable MEMS Capacitor for RF Applications
Tunable MEMS Capacitor for RF Applications Shriram H S *1, Tushar Nimje 1, Dhruv Vakharia 1 1 BITS Pilani, Rajasthan, India *1167, 1 st Main, 2 nd Block, BEL Layout, Vidyaranyapura, Bangalore 560097; email:
More informationUNIVERSITY OF BOLTON SCHOOL OF ENGINEERING. BEng (HONS) CIVIL ENGINEERING SEMESTER 1 EXAMINATION 2016/2017 MATHEMATICS & STRUCTURAL ANALYSIS
TW21 UNIVERSITY OF BOLTON SCHOOL OF ENGINEERING BEng (HONS) CIVIL ENGINEERING SEMESTER 1 EXAMINATION 2016/2017 MATHEMATICS & STRUCTURAL ANALYSIS MODULE NO: CIE4011 Date: Wednesday 11 th January 2017 Time:
More informationImproving Yield for High Pin Count Wafer Probing Applications
John R. Goulding Martin Elzingre Larry Hendler Technical Marketing Manager 200mm Product Manager Consultant Electroglas, Inc. Electroglas, Inc. Electroglas, Inc. South West Test Workshop June 11-14 th
More informationPhysics 476LW Advanced Physics Laboratory Michelson Interferometer
Physics 476LW Advanced Physics Laboratory Michelson Interferometer Introduction An optical interferometer is an instrument which splits a beam of light into two beams, each beam follows a different path
More informationANALYSIS AND NUMERICAL MODELLING OF CERAMIC PIEZOELECTRIC BEAM BEHAVIOR UNDER THE EFFECT OF EXTERNAL SOLICITATIONS
Third International Conference on Energy, Materials, Applied Energetics and Pollution. ICEMAEP016, October 30-31, 016, Constantine,Algeria. ANALYSIS AND NUMERICAL MODELLING OF CERAMIC PIEZOELECTRIC BEAM
More information10 - Celestron Telescope II: Operation
10 - Celestron Telescope II: Operation Purpose: Gain more experience setting up a 6 Celestron telescope, familiarize yourself with the software interface, and acquire an image with the CCD camera. Due:
More informationAmerican Society for Testing and Materials (ASTM) Standards. Mechanical Testing of Composites and their Constituents
Mechanical Testing of Composites and their Constituents American Society for Testing and Materials (ASTM) Standards Tests done to determine intrinsic material properties such as modulus and strength for
More informationNSC E
NSC 892218E006071 1 Preparation of NSC Project Reports microfluidic channels are fabricated on quartz substrates and then used to imprint microstructures into Polymethylmethacrylate (PMMA) substrates using
More informationGENERAL CONTACT AND HYSTERESIS ANALYSIS OF MULTI-DIELECTRIC MEMS DEVICES UNDER THERMAL AND ELECTROSTATIC ACTUATION
GENERAL CONTACT AND HYSTERESIS ANALYSIS OF MULTI-DIELECTRIC MEMS DEVICES UNDER THERMAL AND ELECTROSTATIC ACTUATION Yie He, James Marchetti, Carlos Gallegos IntelliSense Corporation 36 Jonspin Road Wilmington,
More informationDesign and Simulation of A MEMS Based Horseshoe Shaped Low Current Lorentz Deformable Mirror (LCL-DM).
Design and Simulation of A MEMS Based Horseshoe Shaped Low Current Lorentz Deformable Mirror (LCL-DM). Byoungyoul Park 1, Tao Chen 1, Cyrus Shafai 1 1 Electrical and Computer Engineering, University of
More informationQuestion Sheet for Laboratory 3: E-1: Electrostatics
Name Section Question Sheet for Laboratory 3: E-1: Electrostatics PART I. CHARGE OBJECTIVE: To build a qualitative model for charge by observing forces between charged objects. APPARATUS: 1. Tape, hard
More informationb. The displacement of the mass due to a constant acceleration a is x=
EE147/247A Final, Fall 2013 Page 1 /35 2 /55 NO CALCULATORS, CELL PHONES, or other electronics allowed. Show your work, and put final answers in the boxes provided. Use proper units in all answers. 1.
More informationMicroelectromechanical systems (MEMS) have become an increasingly important area of
1 Chapter 1 Introduction 1.1 Background Microelectromechanical systems (MEMS) have become an increasingly important area of technology. This is due to the premise that the efficiencies of high volume production
More informationEE C245 ME C218 Introduction to MEMS Design
EE C245 ME C218 Introduction to MEMS Design Fall 2007 Prof. Clark T.-C. Nguyen Dept. of Electrical Engineering & Computer Sciences University of California at Berkeley Berkeley, CA 94720 Lecture 16: Energy
More informationCharge to Mass Ratio of The Electron
Introduction Charge to Mass Ratio of The Electron The electron was first discovered by Sir J.J. Thomson in 1897 at the Cavendish Laboratory in Cambridge, England. His experimental apparatus is not very
More informationAbstract. 1 Introduction
In R. A. Adey et al., eds., Simulation and Design of Microsystems and Microstructures (Proceedings of the 1st International Conference on Simulation and Design of Microsystems and Microstructures), Computational
More informationExperiment Five (5) Principal of Stress and Strain
Experiment Five (5) Principal of Stress and Strain Introduction Objective: To determine principal stresses and strains in a beam made of aluminum and loaded as a cantilever, and compare them with theoretical
More informationIntroduction to Structural Member Properties
Introduction to Structural Member Properties Structural Member Properties Moment of Inertia (I): a mathematical property of a cross-section (measured in inches 4 or in 4 ) that gives important information
More informationAtomic Force Microscopy
Journal of the Advanced Undergraduate Physics Laboratory Investigation Volume 0 Issue 0 Premiere Issue Article 2 6-6-2012 Atomic Force Microscopy Tyler Lane Minnesota State University - Moorhead, lanety@mnstate.edu
More informationName :. Roll No. :... Invigilator s Signature :.. CS/B.TECH (CE-NEW)/SEM-3/CE-301/ SOLID MECHANICS
Name :. Roll No. :..... Invigilator s Signature :.. 2011 SOLID MECHANICS Time Allotted : 3 Hours Full Marks : 70 The figures in the margin indicate full marks. Candidates are required to give their answers
More informationABSTRACT. Keywords: MEMS, Electrostatic, Repulsive force, Cantilever, IR Sensor, Casimir Force, Finite element analysis 1.
Vertical electrostatic force in MEMS cantilever IR sensor Imen Rezadad, Javaneh Boroumand, Evan M. Smith, Ammar Alhasan, Robert E. Peale University of Central Florida, Physics Department, Orlando, FL,
More informationMLCC APPLICATION GUIDE
MLCC APPLICATION GUIDE 1/11 No. Process Condition 1 Operating Condition (Storage) 1) The capacitor must be stored in an ambient temperature between 5 ~ 40 with a relative humidity of 20 ~ 70%. The products
More informationSurface Engineering for MEMS Reliability
Surface Engineering for MEMS Reliability ESS5855 Lecture Fall 2010 Surface Engineering and Microtribology for MEMS 01 K. Komvopoulos, U.C. Berkeley Wear, 1996 Adhesion and Friction Forces in MEMS: Mechanisms,
More informationLaith Batarseh. internal forces
Next Previous 1/8/2016 Chapter seven Laith Batarseh Home End Definitions When a member is subjected to external load, an and/or moment are generated inside this member. The value of the generated internal
More informationStress Engineering Interview Questions Part 1
Stress Engineering Interview Questions Part 1 Author: Surya Batchu Senior Stress Engineer Founder, STRESS EBOOK LLC. http://www.stressebook.com 1 P a g e Stress Engineering Interview Questions Part 1:
More informationCE 320 Structures Laboratory 1 Flexure Fall 2006
CE 320 Structures Laboratory 1 Flexure Fall 2006 General Note: All structures labs are to be conducted by teams of no more than four students. Teams are expected to meet to decide on an experimental design
More informationIntroduction to Microeletromechanical Systems (MEMS) Lecture 9 Topics. MEMS Overview
Introduction to Microeletromechanical Systems (MEMS) Lecture 9 Topics MicroOptoElectroMechanical Systems (MOEMS) Grating Light Valves Corner Cube Reflector (CCR) MEMS Light Modulator Optical Switch Micromirrors
More informationA SCIENTIFIC APPROACH TO A STICKY PROBLEM
A SCIENTIFIC APPROACH TO A STICKY PROBLEM Sticking, the adherence of granule to punch face or die bore, is one of the major issues affecting the manufacture of solid dose pharmaceuticals. As part of I
More informationMechanical characterization of single crystal BaTiO 3 film and insitu. XRD observation of microstructure change due to
76 Chapter 4 Mechanical characterization of single crystal BaTiO 3 film and insitu XRD observation of microstructure change due to mechanical loading 4.1 Introduction Ferroelectric materials have many
More informationImproving nano-scale imaging of of intergrated micro-raman/afm systems using negativestiffness
See vibration isolation technology @ www.minusk.com?pdf) Electronic Products and Technology - May 2014 Improving nano-scale imaging of of intergrated micro-raman/afm systems using negativestiffness vibration
More informationSTRENGTH OF MATERIALS-I. Unit-1. Simple stresses and strains
STRENGTH OF MATERIALS-I Unit-1 Simple stresses and strains 1. What is the Principle of surveying 2. Define Magnetic, True & Arbitrary Meridians. 3. Mention different types of chains 4. Differentiate between
More informationheight trace of a 2L BN mechanically exfoliated on SiO 2 /Si with pre-fabricated micro-wells. Scale bar 2 µm.
Supplementary Figure 1. Few-layer BN nanosheets. AFM image and the corresponding height trace of a 2L BN mechanically exfoliated on SiO 2 /Si with pre-fabricated micro-wells. Scale bar 2 µm. Supplementary
More informationSTRUCTURAL ANALYSIS OF THE LIFTING DEVICE DETECTOR SUPPORTS FOR THE LHCb VERTEX LOCATOR (VELO)
National Institute for Nuclear Physics and High Energy Physics Kruislaan 409 1098 SJ Amsterdam The Netherlands NIKHEF Reference no.: MT-VELO 04-2 EDMS no: 466608 OF THE LIFTING DEVICE DETECTOR SUPPORTS
More informationCharacterization of MEMS Devices
MEMS: Characterization Characterization of MEMS Devices Prasanna S. Gandhi Assistant Professor, Department of Mechanical Engineering, Indian Institute of Technology, Bombay, Recap Characterization of MEMS
More informationA simple method to characterize the electrical and mechanical properties of micro-fibers
A simple method to characterize the electrical and mechanical properties of micro-fibers A Castellanos-Gomez * Kavli Institute of Nanoscience, Delft University of Technology, Lorentzweg 1, 2628 CJ Delft,
More informationPHY222 Lab 2 - Electric Fields Mapping the Potential Curves and Field Lines of an Electric Dipole
Print Your Name PHY222 Lab 2 - Electric Fields Mapping the Potential Curves and Field Lines of an Electric Dipole Print Your Partners' Names Instructions January 23, 2015 Before lab, read the Introduction,
More informationKurukshetra University INDIA
American International Journal of Research in Science, Technology, Engineering & Mathematics Available online at http://www.iasir.net ISSN (Print): 2328-3491, ISSN (Online): 2328-3580, ISSN (CD-ROM): 2328-3629
More informationmy!wind Ltd 5 kw wind turbine Static Stability Specification
my!wind Ltd 5 kw wind turbine Static Stability Specification 1 P a g e 0 3 / 0 4 / 2 0 1 4 Contents Contents... 2 List of Changes... 2 Appendixes... 2 General remarks... 3 1. Introduction... 4 2. Geometry...
More informationMET 487 Instrumentation and Automatic Controls. Lecture 13 Sensors
MET 87 nstrumentation and utomatic Controls Lecture Sensors July 6-9, 00 Stress and Strain Measurement Safe Load Level monitoring Force (indirect measurement by measuring strain of a flexural element Pressure
More informationMechatronics II Laboratory EXPERIMENT #1 MOTOR CHARACTERISTICS FORCE/TORQUE SENSORS AND DYNAMOMETER PART 1
Mechatronics II Laboratory EXPEIMENT #1 MOTO CHAACTEISTICS FOCE/TOQUE SENSOS AND DYNAMOMETE PAT 1 Force Sensors Force and torque are not measured directly. Typically, the deformation or strain of some
More informationOutline. 4 Mechanical Sensors Introduction General Mechanical properties Piezoresistivity Piezoresistive Sensors Capacitive sensors Applications
Sensor devices Outline 4 Mechanical Sensors Introduction General Mechanical properties Piezoresistivity Piezoresistive Sensors Capacitive sensors Applications Introduction Two Major classes of mechanical
More information