Cooling of a multi-chip power module
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1 Cooling of a multi-chip power module G. CAMMARAA, G. PERONE Department of Industrial Engineering University of Catania Viale A. Doria 6, 953 Catania IALY gcamma@dii.unict.it, gpetrone@dii.unict.it Abstract: - his paper is aimed at numerically investigate on thermal behavior of an electronic multi-chip power module. Because of the high level of thermal power to be dissipated during functioning, and in order to avoid dangerous overheating, the device is equipped by a cooling system. It mainly consists in pin-fins baseplate plunged in a water stream. A FE-based model is used to solve the fluid flow and the conjugate heat transfer problem. Velocity and pressure fields are computed by adopting a RANS approach coupled with a standard k- closure scheme for turbulence solution. Results are mainly presented in terms of velocity fields, temperature for outgoing fluid, die average temperature and pressure drops. A parametrical analysis is presented, in order to elucidate influence of inlet conditions of the cooling water on global thermal performance for the system. Key-Words: Heat transfer, cooling, electronic device, power module, numerical, FEM. Introduction Heat transfer for multi-chip power modules is a challenging topic of investigation. Overheating and thermo-mechanical stress are the main causes of failure for those technological systems. In order to correctly manage the high rate of heat generated by the chips during their functioning, pin-fins cooling baseplates are more and more used in forced convection conditions, both in parallel and in crossflow configuration. From literature evidences, heat transfer performance depends by geometry and use conditions, such as fins cross-section shape, relative fins/fluid-channel height, fins spacing, baseplate and fins constitutive materials, direction and intensity of the forced flow. In multi-chip modules a further constraint need to be considered with respect to a basic device, which consists in assuring almost constant thermal operative conditions to the different dies. For that reason, pin-fins cooling system optimization is a diffused topic for several researchers operating both in academic and industrial field. In the present literature, several significant contribution can be cited. Concerning material properties, a thermal design and analysis of multi-chip LED module with ceramic substrate was carried-out by Yin et al. [] by adopting a numerical FE approach. hey mainly find out that the module with AlN-based substrate exhibit better heat dissipation properties than these with Al and AlO3 based substrates. An investigation on performance of impinging-based cooling configurations for automotive power converters was recently proposed by Parida et al. []. hey experimentally and numerically studied various cooling options based on impingement for application in hybrid electric vehicle and other similar consumer products, pointing-out significant improvements in terms of thermal performance and volume reduction. Dix and Jokar [3] studied fluid and thermal behavior of a micro-channel electronics cooler using computational fluid dynamics. Several geometrical configurations were analyzed posing special interest in investigate on channel shape against pressure drops and thermal performance for the system. A comprehensive multi-objective thermal design optimization and comparative analysis of electronics cooling technologies was proposed by Ndao et al. [4]. Kurnia et al [5] numerically studied heat transfer in various cooling channel designs also, but considering laminar flow applications. In order to optimize microstructure geometry and maximize heat transfer dissipation through convection from a heated surface, ullius et al. [6] performed an optimization study of the micro pin fins in minichannels. Finally, they provided some useful correlations laws of Nusselt number and friction factor. A performance comparison of pin fin in-duct flow arrays with various pin cross-sections was developed by Sahiti et al. [7]. From their results, in chosen conditions the elliptic cross-section has been ISBN:
2 proven to show better performance, as well as the circular one appear valuable also. In the above introduced framework, we present a numerical FEbased analysis aimed at investigate on thermal behavior of an electronic multi-chip device. flows. An indication of the different layers composing the module is presented in Fig., where an enlargement is reported also. Baseplate <AlSiC-9> Fins <AlSiC-9> 3 racks <Cu> Modelling he geometry of the considered system is shown in Fig. a-c. Die <Si> Solder <6Sn36PbAg> DBC #3 <Cu> DBC # <AlN> DBC # <Cu> Solder <6Sn36PbAg> Fig. : Layers composing the electronic device. (a) (b) In order to solve the turbulent flow inside the channel, the Reynolds Averaged Navier-Stokes equations were numerically solved under the assumption of Newtonian fluid and uncompressible flow. Momentum equations are coupled with a standard k- closure scheme, applied in order to model turbulence by an eddy viscosity approach. Logarithmic wall functions were applied in the near wall flow, that has been considered parallel to the wall and being in a wall offset equal to one half of the boundary mesh element dimension. Under the assumption of fully turbulent flow, a turbulent length scale of 0.0 m and a 5% of turbulent intensity were applied at the air inlet section. Governing equations read as follows: U p t U U I U U () U 0 () k U k t k U U k (3) (c) Fig. : Upper (a) and bottom (b-c) view of the system geometry without (b) and with (c) representation of the cooling channel. he power module is mainly made of a pin fins baseplate and three islands (Fig. a). Each one is equipped by several dies. A significant number of conical pin fins (Fig b) is located in the bottom face of the baseplate, that are plunged in a squared channel (blue in Fig. c), where the cooling water U t C C k U U k hermal analysis is performed by solving the energy equation, reported below: Cp Cp Q t U (5) (4) ISBN:
3 An internal heat source (Q) was applied to every dies, simulating the worst thermal working condition for the device. Boundary conditions applied for solving equations (-5) are listed below: Chosen velocity (U=U in ) for incoming fluid; Chosen pressure (p=p out ) for outflowing fluid; Logarithmic wall function at solid walls; Chosen temperature (= in ) for incoming fluid; Convective flux for outflowing fluid; hermal insulation at any other surfaces. of equations coming from differential operator discretization were solved by a PARDISO package, a direct solver particularly efficient in order to solve unsymmetrical sparse matrixes by a LU decomposition technique. Computations were carried-out on a workstation disposing of 4 64-bit quad-core processors speeding up to 3. GHz of frequency and handling 5 GB of RAM. Physical properties adopted for materials are reported in able. Material Density hermal conductivity Specific heat Young's modulus Poisson's ratio CE [kg/m 3 ] [W/(m K)] [J/(kg K)] [Pa] [-] [/K] AlSiC E E-07 6Sn36PbAg E E-05 AlN E E-06 Cu E E-05 Si E E-06 able : Physical properties of materials. Material Density Dynamic viscosity hermal conductivity Specific heat [kg/m 3 ] [Pa s] [W/(m K)] [J/(kg K)] C E Continuous equations have been spatially discretized by a Finite Element approach based on the Galerkin method on non-uniform and nonstructured computational grids made of tetrahedral Lagrange second order elements. Influence of spatial discretization has been preliminary studied in order to assure mesh-independent results. A computational mesh used for simulations is graphically reported in Fig Results Results carried-out from simulations are now presented. Fig. 4 shows the velocity field in a horizontal slice of the channel. Velocity field is put into dimensionless form by using the nominal inlet value U in as scaling reference. Because of the small difference in height between the pin fins and the fluid channel, fluid correctly flows around the pin fins. his allows to avoid the fluid preferentially flows under the pin fins, limiting the convective heat transfer. Otherwise, a lateral preferential path of fluid flow is clearly observable. Number and pitch of pin fins is very high with respect to the pressure drop that is produced along the fluid path. his represents a crucial aspect in terms of pumping cost that should be kept into account form a management point of view in applications. Fig. 3: Computational grid. In order to prevent rising and propagation of numerical instabilities, an artificial streamline diffusion technique, based on the Galerkin Least- Squared (GLS) method, was employed in simulations. Steady solutions were carried-out by applying an iterative dumped Newton-Raphson scheme, based on the discretized PDE linearization by a first-order aylor expansion. Algebraic systems Fig. 4: Dimensionless velocity field (U/U in ) represented on a horizontal slice of the fluid channel. ISBN:
4 Fig. 5 shows the thermal distribution on the system. emperature value are also presented in dimensionless form by using the nominal fluid inlet temperature in as scaling value. As attended, thermal distribution is strongly influenced by the flow pattern: although an identical heat source is applied, dies arranged close to the fluid entrance region reach lower thermal levels than dies arranged in correspondence of the channel end. From simulation results, the maximum die temperature difference can attend value up to 4.7%. A parametric analysis has been developed in order to monitoring the outflow temperature of the cooling fluid as a function of the chosen inlet temperature. Main results are diagrammed in Fig. 6, Fig. 6: Dimensionless outflow temperature ( out / in ) as a function of the dimensionless temperature of incoming fluid (nominal conditions are indicated by the red-filled symbol). A similar analysis is developed for assessing the effect of the incoming flow rate of cooling fluid on the power module heat transfer. In Fig. 7 we report once again the dimensionless outflow temperature as a function of the dimensionless velocity of fluid incoming the channel. Results are presented for increasing values of fluid flow rate. he gathered trend is non linear: a % decreasing in outflow temperature is detected against an almost double mass flow rate incoming the system. where the dimensionless outflow temperature is reported as a function of the dimensionless temperature of incoming fluid. Results are carriedout for inlet temperature lower than the nominal one. A global linear trend can be deduced from the diagram. out / in U in /U in Fig. 5: Dimensionless (/ in ) thermal distribution on the power module...05 Fig. 7: Dimensionless outflow temperature ( out / in ) as a function of the dimensionless velocity of incoming fluid (nominal conditions are indicated by the red-filled symbol). 4 Conclusion out / in in / in Heat transfer in a power module is numerically studied. he electronic system is equipped by a cooling system made of a pin fins baseplate cooled by water flowing in an underlying channel. A FEbased approach is used to implement numerical model and solving velocity and thermal fields. Parametric analyses are developed in order to assess the influence of temperature and flow rate of incoming fluid on power module heat transfer. Results allowed to quantify the benefit on module thermal state due to much more favourable inlet conditions set for the cooling fluid. ISBN:
5 References: [] L. Yin, L. Yang, W. Yang, Y. G., K. Mac, S. Li, J. Zhang, hermal design and analysis of multi-chip LED module with ceramic substrate, Solid-State Electronics, Vol. 54, 00, pp [] P. R. Parida, S. V. Ekkad, K. Ngo, Impingement-based high performance cooling configurations for automotive power converters, International Journal of Heat and Mass ransfer, Vol. 55, 0, [3] J. Dix, A. Jokar, Fluid and thermal analysis of a microchannel electronics cooler using computational fluid dynamics, Applied hermal Engineering, Vol. 30, 00, [4] S. Ndao, Y. Peles, M. K. Jensen, Multiobjective thermal design optimization and comparative analysis of electronics cooling technologies, International Journal of Heat and Mass ransfer, Vol. 5, 009, [5] J. C. Kurnia, A. P. Sasmito, A. S. Mujumdar, Numerical investigation of laminar heat transfer performance of various cooling channel designs, Applied hermal Engineering, Vol. 3, 0, [6] J.F. ullius,.k. ullius, Y. Bayazitoglu, Optimization of short micro pin fins in minichannels, International Journal of Heat and Mass ransfer, Vol. 55, 0, [7] N. Sahiti, A. Lemouedda, D. Stojkovic, F. Durst, E. Franz, Performance comparison of pin fin in-duct flow arrays with various pin cross-sections, Applied hermal Engineering, Vol. 6, 006, ISBN:
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