The K-Input Floating-Gate MOS (FGMOS) Transistor

Size: px
Start display at page:

Download "The K-Input Floating-Gate MOS (FGMOS) Transistor"

Transcription

1 The K-Input Floating-Gate MOS (FGMOS) Transistor C 1 V D C 2 V D I V D I V S Q C 1 C 2 V S V K Q V K C K Layout V B V K C K Circuit Symbols V S Control Gate Floating Gate Interpoly Oxide Field Oxide Gate Oxide Bulk Cross-section p

2 Capacitive Voltage Dividers When trying to solve capacitor networks, it pays to think Q = CV rather than I= C dv dt C Q V Assume no net charge on the middle node. By conservation of charge, -Q 1 - Q 2 = 0 fi -C 1 ( -V )-C 2 ( -V)= 0 fi V = C 1 C 1 + C 2 + C 2 C 1 + C 2 Q 1 C 1 C 2 Q 2 V

3 Capacitive Voltage Dividers For all k, Q k = C k (V k - V ) Net charge Q on the common node. By conservation of charge, K -Â Q k =Q k=1 K ( ) fi -Â C k V k -V =Q k=1 K fivâ C k =Q + C k V k k=1 K Â k=1 C 1 Q 1 C 2 Q 2 V Q C K Q K V K fi V = Q C T + where C T K Â k =1 C k K Â k =1 C k C T V k

4 Capacitive-Divider Model of the Subthreshold FGMOS Transistor C gd C 1 C V FG 2 V D I C 1 C 2 C gd V D C C V ox dep FG ys V K C K Q C gs V S V K C K Q C gs V S C b C b V FG = Q C T + C gs C T V S + C gd C T V D + K Â C k C T V k I = I 0 e k QC T U T e k ( C 1 +L+C K V K ) C T U T e k C gd V D C T U T e k C gs V S C T U T ( e - V S U T - e - V D U T ) k=1 C T = ( C ox C dep )+C b +C gs +C gd + C k I = I 0 e k V FG U T ( e - V S U T - e - V D U T ) K Â k=1

5 Subthreshold FGMOS Transistor Id (A) n=4 n=3 n=2 n= (V) (4 n)c nc I d = I 0 exp n V C V C = 173 mv I 0 = 171 fa I d 5 V

6 10-6 Subthreshold FGMOS Transistor Id (A) V 0.5 V 0.4 V 0.3 V 0.2 V 0.1 V =0 V 5 V I d (V) I d = I 0 exp + 3 V C V C = 173 mv I 0 = 171 fa

7 10-6 Subthreshold FGMOS Transistor: Drain Characteristics 0.7 V V V Id (A) V V g =0.3 V I d = I 0 exp 4 V g V C I 0 = 171 fa exp V d 5 V V A V C = 173 mv V d (V) V g V A = 2.88 V I d V d

8 Subthreshold FGMOS Transistor: Drain Characteristics I d (na) V cas V g Cascoded FGMOS I d V d V g MOS V d I d FGMOS 2.93 V/e-fold V g 0.5 I d V d V d (V)

9 Capacitive-Divider Model of the Above-Threshold FGMOS Transistor C gd C 1 C V FG 2 V D I C 1 C 2 C gd V D C C V ox dep FG ys V K C K Q C gs V S V K C K Q C gs V S C b C b I = W L I = W L mc ox 2k mc ox 2k (( k( V FG - V T0 )-V S ) 2 -kv ( ( FG -V T0 )-V D ) 2 ) Ê Ê K Ê C k  k * Á Á Á V k -V T0 Ë Ë Ë k=1 C T ˆ ˆ -V S 2 Ê K Ê C - kâ k * Á Á V k -V T0 Ë Ë k=1c T ˆ -V D ˆ 2 ˆ V T0 * = V T0 - Q C T - C gs C T V S - C gd C T V D

10 Above-Threshold FGMOS Transistor (4 n)c nc I 5 V I ( A) I = na B A = A/V B = A n=4 n= n= (V) n=1

11 Above-Threshold FGMOS Transistor I ( A) I = A + 3A B A = A/V B = A I 5 V (V) = 0.7 V 0.6 V 0.5 V 0.4 V 0.3 V 0.2 V 0.1 V

12 How to Make Leaky Floating Gates... Keep your floating gates on poly1. If you make a contact to metal, your gate will probably leak, because the oxide surrounding the metal layers are typically deposited rather than thermally grown.

13 Beware of Capacitive Coupling from Below... If possible, don't allow a floating gate to cross a well boundary. For a pfgmos, keep it entirely over the well. For an nfgmos, keep it entirely over the substrate. If you split the area evenly between the substrate and the well, your floating-gate voltage will have a dependence on V DD that you didn't expect...

14 Beware of Capacitive Coupling from Above... Be careful about routing metal lines over top of your floating gates. The voltages on such lines couple into the floating gate just like the control-gate voltages. Moreover, if you are trying to carefuly match C T for two FGMOS transistors, then you have to count the stray capacitance between these lines and the floating-gate too...

15 Which FGMOS Transistor Has a Higher Output Resistance?

16 Which FGMOS Transistor Has a Higher Output Resistance? The transistor on the left... For a FGMOS transistor, the Early effect (i.e., channel-length modulation) is always negligible compared to the effect of V D coupling through C gd to the floating gate. Increasing L does not increase r o. C gd µ W, so making the transistor wider decreases r o.

17 Matching: Same Size & Shape Reference Good Bad To obtain matched capacitive-divider ratios in different FGMOS transistors, use floating gates with identical geometries. Don't forget that C T includes parasitics that you won't be able to predict properly at design time.

18 Matching: Parallel Unit-Sized Control Gates Refernce Good Bad To obtain accurate control-gate capacitor ratios (e.g., 2:1), connect unit-sized control gates in parallel rather than making composite control gates with the correct area ratios. If you are trying to carefuly match C T, don t connect the unit-sized control gates on top of the floating gate.

19 dummy Matching: Same Surround dummy To improve control-gate matching, use dummy control gates at each end to make each real control gate have an identical surround. Systematic edge effects are ubiquitous, but the underlying mechanisms are not always clear (e.g., fringing fields, nonuniform etching rates).

20 Relative Capacitance vs Position (1.2 mm Process) 1 Relative Capacitance λ 20 λ 8 λ 8 λ Position 32

21 Relative Capacitance vs Position 1.05 (.35 mm Process) 1.04 Relative Capacitance λ 20 λ 8 λ 8 λ Position

22 Experimental Method for Measuring Capacitor Matching b N 1 b 1 b 0 N-to-K decoder V g V c V k V K C 1 C 2 C k C K I fi In subthreshold, I µe k C i V i C T U T fi log I = kc i µ C i V i C T U T Mismatch in the slope of log I vs V i directly reflects mismatch in C i.

MOS Transistor I-V Characteristics and Parasitics

MOS Transistor I-V Characteristics and Parasitics ECEN454 Digital Integrated Circuit Design MOS Transistor I-V Characteristics and Parasitics ECEN 454 Facts about Transistors So far, we have treated transistors as ideal switches An ON transistor passes

More information

EE 435. Lecture 37. Parasitic Capacitances in MOS Devices. String DAC Parasitic Capacitances

EE 435. Lecture 37. Parasitic Capacitances in MOS Devices. String DAC Parasitic Capacitances EE 435 Lecture 37 Parasitic Capacitances in MOS Devices String DAC Parasitic Capacitances Parasitic Capacitors in MOSFET (will initially consider two) Parasitic Capacitors in MOSFET C GCH Parasitic Capacitors

More information

Chapter 2 CMOS Transistor Theory. Jin-Fu Li Department of Electrical Engineering National Central University Jungli, Taiwan

Chapter 2 CMOS Transistor Theory. Jin-Fu Li Department of Electrical Engineering National Central University Jungli, Taiwan Chapter 2 CMOS Transistor Theory Jin-Fu Li Department of Electrical Engineering National Central University Jungli, Taiwan Outline Introduction MOS Device Design Equation Pass Transistor Jin-Fu Li, EE,

More information

MOS Transistor Theory

MOS Transistor Theory MOS Transistor Theory So far, we have viewed a MOS transistor as an ideal switch (digital operation) Reality: less than ideal EE 261 Krish Chakrabarty 1 Introduction So far, we have treated transistors

More information

EE382M-14 CMOS Analog Integrated Circuit Design

EE382M-14 CMOS Analog Integrated Circuit Design EE382M-14 CMOS Analog Integrated Circuit Design Lecture 3, MOS Capacitances, Passive Components, and Layout of Analog Integrated Circuits MOS Capacitances Type of MOS transistor capacitors Depletion capacitance

More information

The Devices. Digital Integrated Circuits A Design Perspective. Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic. July 30, 2002

The Devices. Digital Integrated Circuits A Design Perspective. Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic. July 30, 2002 Digital Integrated Circuits A Design Perspective Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic The Devices July 30, 2002 Goal of this chapter Present intuitive understanding of device operation Introduction

More information

ECE 342 Electronic Circuits. 3. MOS Transistors

ECE 342 Electronic Circuits. 3. MOS Transistors ECE 342 Electronic Circuits 3. MOS Transistors Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jschutt@emlab.uiuc.edu 1 NMOS Transistor Typically L = 0.1 to 3 m, W = 0.2 to

More information

ECE 342 Electronic Circuits. Lecture 6 MOS Transistors

ECE 342 Electronic Circuits. Lecture 6 MOS Transistors ECE 342 Electronic Circuits Lecture 6 MOS Transistors Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jesa@illinois.edu 1 NMOS Transistor Typically L = 0.1 to 3 m, W = 0.2

More information

EE105 - Fall 2005 Microelectronic Devices and Circuits

EE105 - Fall 2005 Microelectronic Devices and Circuits EE105 - Fall 005 Microelectronic Devices and Circuits ecture 7 MOS Transistor Announcements Homework 3, due today Homework 4 due next week ab this week Reading: Chapter 4 1 ecture Material ast lecture

More information

MOS Transistors. Prof. Krishna Saraswat. Department of Electrical Engineering Stanford University Stanford, CA

MOS Transistors. Prof. Krishna Saraswat. Department of Electrical Engineering Stanford University Stanford, CA MOS Transistors Prof. Krishna Saraswat Department of Electrical Engineering S Stanford, CA 94305 saraswat@stanford.edu 1 1930: Patent on the Field-Effect Transistor! Julius Lilienfeld filed a patent describing

More information

MOS Transistor Theory

MOS Transistor Theory CHAPTER 3 MOS Transistor Theory Outline 2 1. Introduction 2. Ideal I-V Characteristics 3. Nonideal I-V Effects 4. C-V Characteristics 5. DC Transfer Characteristics 6. Switch-level RC Delay Models MOS

More information

CMOS Inverter (static view)

CMOS Inverter (static view) Review: Design Abstraction Levels SYSTEM CMOS Inverter (static view) + MODULE GATE [Adapted from Chapter 5. 5.3 CIRCUIT of G DEVICE Rabaey s Digital Integrated Circuits,, J. Rabaey et al.] S D Review:

More information

Digital Integrated Circuits A Design Perspective

Digital Integrated Circuits A Design Perspective Semiconductor Memories Adapted from Chapter 12 of Digital Integrated Circuits A Design Perspective Jan M. Rabaey et al. Copyright 2003 Prentice Hall/Pearson Outline Memory Classification Memory Architectures

More information

MOSFET: Introduction

MOSFET: Introduction E&CE 437 Integrated VLSI Systems MOS Transistor 1 of 30 MOSFET: Introduction Metal oxide semiconductor field effect transistor (MOSFET) or MOS is widely used for implementing digital designs Its major

More information

EE105 Fall 2014 Microelectronic Devices and Circuits. NMOS Transistor Capacitances: Saturation Region

EE105 Fall 2014 Microelectronic Devices and Circuits. NMOS Transistor Capacitances: Saturation Region EE105 Fall 014 Microelectronic Devices and Circuits Prof. Ming C. Wu wu@eecs.berkeley.edu 511 Sutardja Dai Hall (SDH) 1 NMOS Transistor Capacitances: Saturation Region Drain no longer connected to channel

More information

MOS Transistor Properties Review

MOS Transistor Properties Review MOS Transistor Properties Review 1 VLSI Chip Manufacturing Process Photolithography: transfer of mask patterns to the chip Diffusion or ion implantation: selective doping of Si substrate Oxidation: SiO

More information

ECE-305: Fall 2017 MOS Capacitors and Transistors

ECE-305: Fall 2017 MOS Capacitors and Transistors ECE-305: Fall 2017 MOS Capacitors and Transistors Pierret, Semiconductor Device Fundamentals (SDF) Chapters 15+16 (pp. 525-530, 563-599) Professor Peter Bermel Electrical and Computer Engineering Purdue

More information

P. R. Nelson 1 ECE418 - VLSI. Midterm Exam. Solutions

P. R. Nelson 1 ECE418 - VLSI. Midterm Exam. Solutions P. R. Nelson 1 ECE418 - VLSI Midterm Exam Solutions 1. (8 points) Draw the cross-section view for A-A. The cross-section view is as shown below.. ( points) Can you tell which of the metal1 regions is the

More information

Design of Analog Integrated Circuits

Design of Analog Integrated Circuits Design of Analog Integrated Circuits Chapter 11: Introduction to Switched- Capacitor Circuits Textbook Chapter 13 13.1 General Considerations 13.2 Sampling Switches 13.3 Switched-Capacitor Amplifiers 13.4

More information

The Devices. Jan M. Rabaey

The Devices. Jan M. Rabaey The Devices Jan M. Rabaey Goal of this chapter Present intuitive understanding of device operation Introduction of basic device equations Introduction of models for manual analysis Introduction of models

More information

EECS130 Integrated Circuit Devices

EECS130 Integrated Circuit Devices EECS130 Integrated Circuit Devices Professor Ali Javey 10/30/2007 MOSFETs Lecture 4 Reading: Chapter 17, 19 Announcements The next HW set is due on Thursday. Midterm 2 is next week!!!! Threshold and Subthreshold

More information

MOSFET Model with Simple Extraction Procedures, Suitable for Sensitive Analog Simulations

MOSFET Model with Simple Extraction Procedures, Suitable for Sensitive Analog Simulations ROMANIAN JOURNAL OF INFORMATION SCIENCE AND TECHNOLOGY Volume 10, Number 2, 2007, 189 197 MOSFET Model with Simple Extraction Procedures, Suitable for Sensitive Analog Simulations S. EFTIMIE 1, ALEX. RUSU

More information

Today s lecture. EE141- Spring 2003 Lecture 4. Design Rules CMOS Inverter MOS Transistor Model

Today s lecture. EE141- Spring 2003 Lecture 4. Design Rules CMOS Inverter MOS Transistor Model - Spring 003 Lecture 4 Design Rules CMOS Inverter MOS Transistor Model Today s lecture Design Rules The CMOS inverter at a glance An MOS transistor model for manual analysis Important! Labs start next

More information

Digital Integrated Circuits A Design Perspective. Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic. The Devices. July 30, Devices.

Digital Integrated Circuits A Design Perspective. Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic. The Devices. July 30, Devices. Digital Integrated Circuits A Design Perspective Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic The July 30, 2002 1 Goal of this chapter Present intuitive understanding of device operation Introduction

More information

Chapter 20. Current Mirrors. Basics. Cascoding. Biasing Circuits. Baker Ch. 20 Current Mirrors. Introduction to VLSI

Chapter 20. Current Mirrors. Basics. Cascoding. Biasing Circuits. Baker Ch. 20 Current Mirrors. Introduction to VLSI Chapter 20 Current Mirrors Basics Long Channel Matching Biasing Short Channel Temperature Subthreshold Cascoding Simple Low Voltage, Wide Swing Wide Swing, Short Channel Regulated Drain Biasing Circuits

More information

ECE 305 Exam 5 SOLUTIONS: Spring 2015 April 17, 2015 Mark Lundstrom Purdue University

ECE 305 Exam 5 SOLUTIONS: Spring 2015 April 17, 2015 Mark Lundstrom Purdue University NAME: PUID: : ECE 305 Exam 5 SOLUTIONS: April 17, 2015 Mark Lundstrom Purdue University This is a closed book exam. You may use a calculator and the formula sheet at the end of this exam. Following the

More information

Digital Integrated Circuits A Design Perspective. Semiconductor. Memories. Memories

Digital Integrated Circuits A Design Perspective. Semiconductor. Memories. Memories Digital Integrated Circuits A Design Perspective Semiconductor Chapter Overview Memory Classification Memory Architectures The Memory Core Periphery Reliability Case Studies Semiconductor Memory Classification

More information

Lecture 5: CMOS Transistor Theory

Lecture 5: CMOS Transistor Theory Lecture 5: CMOS Transistor Theory Slides courtesy of Deming Chen Slides based on the initial set from David Harris CMOS VLSI Design Outline q q q q q q q Introduction MOS Capacitor nmos I-V Characteristics

More information

Circuits. L5: Fabrication and Layout -2 ( ) B. Mazhari Dept. of EE, IIT Kanpur. B. Mazhari, IITK. G-Number

Circuits. L5: Fabrication and Layout -2 ( ) B. Mazhari Dept. of EE, IIT Kanpur. B. Mazhari, IITK. G-Number EE610: CMOS Analog Circuits L5: Fabrication and Layout -2 (12.8.2013) B. Mazhari Dept. of EE, IIT Kanpur 44 Passive Components: Resistor Besides MOS transistors, sometimes one requires to implement passive

More information

Lecture 210 Physical Aspects of ICs (12/15/01) Page 210-1

Lecture 210 Physical Aspects of ICs (12/15/01) Page 210-1 Lecture 210 Physical Aspects of ICs (12/15/01) Page 210-1 LECTURE 210 PHYSICAL ASPECTS OF ICs (READING: Text-Sec. 2.5, 2.6, 2.8) INTRODUCTION Objective Illustrate the physical aspects of integrated circuits

More information

CMPEN 411 VLSI Digital Circuits. Lecture 03: MOS Transistor

CMPEN 411 VLSI Digital Circuits. Lecture 03: MOS Transistor CMPEN 411 VLSI Digital Circuits Lecture 03: MOS Transistor Kyusun Choi [Adapted from Rabaey s Digital Integrated Circuits, Second Edition, 2003 J. Rabaey, A. Chandrakasan, B. Nikolic] CMPEN 411 L03 S.1

More information

SEMICONDUCTOR MEMORIES

SEMICONDUCTOR MEMORIES SEMICONDUCTOR MEMORIES Semiconductor Memory Classification RWM NVRWM ROM Random Access Non-Random Access EPROM E 2 PROM Mask-Programmed Programmable (PROM) SRAM FIFO FLASH DRAM LIFO Shift Register CAM

More information

EE105 - Fall 2006 Microelectronic Devices and Circuits

EE105 - Fall 2006 Microelectronic Devices and Circuits EE105 - Fall 2006 Microelectronic Devices and Circuits Prof. Jan M. Rabaey (jan@eecs) Lecture 7: MOS Transistor Some Administrative Issues Lab 2 this week Hw 2 due on We Hw 3 will be posted same day MIDTERM

More information

ENGR890 Digital VLSI Design Fall Lecture 4: CMOS Inverter (static view)

ENGR890 Digital VLSI Design Fall Lecture 4: CMOS Inverter (static view) ENGR89 Digital VLSI Design Fall 5 Lecture 4: CMOS Inverter (static view) [Adapted from Chapter 5 of Digital Integrated Circuits, 3, J. Rabaey et al.] [Also borrowed from Vijay Narayanan and Mary Jane Irwin]

More information

Lecture 4: CMOS Transistor Theory

Lecture 4: CMOS Transistor Theory Introduction to CMOS VLSI Design Lecture 4: CMOS Transistor Theory David Harris, Harvey Mudd College Kartik Mohanram and Steven Levitan University of Pittsburgh Outline q Introduction q MOS Capacitor q

More information

Lecture 11: MOS Transistor

Lecture 11: MOS Transistor Lecture 11: MOS Transistor Prof. Niknejad Lecture Outline Review: MOS Capacitors Regions MOS Capacitors (3.8 3.9) CV Curve Threshold Voltage MOS Transistors (4.1 4.3): Overview Cross-section and layout

More information

Scaling Issues in Planar FET: Dual Gate FET and FinFETs

Scaling Issues in Planar FET: Dual Gate FET and FinFETs Scaling Issues in Planar FET: Dual Gate FET and FinFETs Lecture 12 Dr. Amr Bayoumi Fall 2014 Advanced Devices (EC760) Arab Academy for Science and Technology - Cairo 1 Outline Scaling Issues for Planar

More information

Introduction and Background

Introduction and Background Analog CMOS Integrated Circuit Design Introduction and Background Dr. Jawdat Abu-Taha Department of Electrical and Computer Engineering Islamic University of Gaza jtaha@iugaza.edu.ps 1 Marking Assignments

More information

Lecture 15: MOS Transistor models: Body effects, SPICE models. Context. In the last lecture, we discussed the modes of operation of a MOS FET:

Lecture 15: MOS Transistor models: Body effects, SPICE models. Context. In the last lecture, we discussed the modes of operation of a MOS FET: Lecture 15: MOS Transistor models: Body effects, SPICE models Context In the last lecture, we discussed the modes of operation of a MOS FET: oltage controlled resistor model I- curve (Square-Law Model)

More information

EE 330. Lecture 35. Parasitic Capacitances in MOS Devices

EE 330. Lecture 35. Parasitic Capacitances in MOS Devices EE 330 Lecture 35 Parasitic Capacitances in MOS Devices Exam 2 Wed Oct 24 Exam 3 Friday Nov 16 Review from Last Lecture Cascode Configuration Discuss V CC gm1 gm1 I B VCC V OUT g02 g01 A - β β VXX Q 2

More information

Charge Storage in the MOS Structure. The Inverted MOS Capacitor (V GB > V Tn )

Charge Storage in the MOS Structure. The Inverted MOS Capacitor (V GB > V Tn ) The Inverted MO Capacitor (V > V Tn ) We consider the surface potential as Þxed (ÒpinnedÓ) at φ s,max = - φ p φ(x).5 V. V V ox Charge torage in the MO tructure Three regions of operation: Accumulation:

More information

ESE370: Circuit-Level Modeling, Design, and Optimization for Digital Systems. Today. Refinement. Last Time. No Field. Body Contact

ESE370: Circuit-Level Modeling, Design, and Optimization for Digital Systems. Today. Refinement. Last Time. No Field. Body Contact ESE370: Circuit-Level Modeling, Design, and Optimization for Digital Systems Day 10: September 6, 01 MOS Transistor Basics Today MOS Transistor Topology Threshold Operating Regions Resistive Saturation

More information

1. The MOS Transistor. Electrical Conduction in Solids

1. The MOS Transistor. Electrical Conduction in Solids Electrical Conduction in Solids!The band diagram describes the energy levels for electron in solids.!the lower filled band is named Valence Band.!The upper vacant band is named conduction band.!the distance

More information

and V DS V GS V T (the saturation region) I DS = k 2 (V GS V T )2 (1+ V DS )

and V DS V GS V T (the saturation region) I DS = k 2 (V GS V T )2 (1+ V DS ) ECE 4420 Spring 2005 Page 1 FINAL EXAMINATION NAME SCORE /100 Problem 1O 2 3 4 5 6 7 Sum Points INSTRUCTIONS: This exam is closed book. You are permitted four sheets of notes (three of which are your sheets

More information

VLSI Design The MOS Transistor

VLSI Design The MOS Transistor VLSI Design The MOS Transistor Frank Sill Torres Universidade Federal de Minas Gerais (UFMG), Brazil VLSI Design: CMOS Technology 1 Outline Introduction MOS Capacitor nmos I-V Characteristics pmos I-V

More information

LAYOUT TECHNIQUES. Dr. Ivan Grech

LAYOUT TECHNIQUES. Dr. Ivan Grech LAYOUT TECHNIQUES OUTLINE Transistor Layout Resistor Layout Capacitor Layout Floor planning Mixed A/D Layout Automatic Analog Layout Layout Techniques Main Layers in a typical Double-Poly, Double-Metal

More information

ECE 546 Lecture 10 MOS Transistors

ECE 546 Lecture 10 MOS Transistors ECE 546 Lecture 10 MOS Transistors Spring 2018 Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jesa@illinois.edu NMOS Transistor NMOS Transistor N-Channel MOSFET Built on p-type

More information

Fundamentals of the Metal Oxide Semiconductor Field-Effect Transistor

Fundamentals of the Metal Oxide Semiconductor Field-Effect Transistor Triode Working FET Fundamentals of the Metal Oxide Semiconductor Field-Effect Transistor The characteristics of energy bands as a function of applied voltage. Surface inversion. The expression for the

More information

The Gradual Channel Approximation for the MOSFET:

The Gradual Channel Approximation for the MOSFET: 6.01 - Electronic Devices and Circuits Fall 003 The Gradual Channel Approximation for the MOSFET: We are modeling the terminal characteristics of a MOSFET and thus want i D (v DS, v GS, v BS ), i B (v

More information

Lecture 5 Review Current Source Active Load Modified Large / Small Signal Models Channel Length Modulation

Lecture 5 Review Current Source Active Load Modified Large / Small Signal Models Channel Length Modulation Lecture 5 Review Current Source Active Load Modified Large / Small Signal Models Channel Length Modulation Text sec 1.2 pp. 28-32; sec 3.2 pp. 128-129 Current source Ideal goal Small signal model: Open

More information

Integrated Circuits & Systems

Integrated Circuits & Systems Federal University of Santa Catarina Center for Technology Computer Science & Electronics Engineering Integrated Circuits & Systems INE 5442 Lecture 10 MOSFET part 1 guntzel@inf.ufsc.br ual-well Trench-Isolated

More information

Semiconductor Memory Classification

Semiconductor Memory Classification Semiconductor Memory Classification Read-Write Memory Non-Volatile Read-Write Memory Read-Only Memory Random Access Non-Random Access EPROM E 2 PROM Mask-Programmed Programmable (PROM) SRAM FIFO FLASH

More information

Chapter 4 Field-Effect Transistors

Chapter 4 Field-Effect Transistors Chapter 4 Field-Effect Transistors Microelectronic Circuit Design Richard C. Jaeger Travis N. Blalock 5/5/11 Chap 4-1 Chapter Goals Describe operation of MOSFETs. Define FET characteristics in operation

More information

3. Basic building blocks. Analog Design for CMOS VLSI Systems Franco Maloberti

3. Basic building blocks. Analog Design for CMOS VLSI Systems Franco Maloberti Inverter with active load It is the simplest gain stage. The dc gain is given by the slope of the transfer characteristics. Small signal analysis C = C gs + C gs,ov C 2 = C gd + C gd,ov + C 3 = C db +

More information

CMOS INVERTER. Last Lecture. Metrics for qualifying digital circuits. »Cost» Reliability» Speed (delay)»performance

CMOS INVERTER. Last Lecture. Metrics for qualifying digital circuits. »Cost» Reliability» Speed (delay)»performance CMOS INVERTER Last Lecture Metrics for qualifying digital circuits»cost» Reliability» Speed (delay)»performance 1 Today s lecture The CMOS inverter at a glance An MOS transistor model for manual analysis

More information

Lecture 12: MOSFET Devices

Lecture 12: MOSFET Devices Lecture 12: MOSFET Devices Gu-Yeon Wei Division of Engineering and Applied Sciences Harvard University guyeon@eecs.harvard.edu Wei 1 Overview Reading S&S: Chapter 5.1~5.4 Supplemental Reading Background

More information

ECE-343 Test 1: Feb 10, :00-8:00pm, Closed Book. Name : SOLUTION

ECE-343 Test 1: Feb 10, :00-8:00pm, Closed Book. Name : SOLUTION ECE-343 Test : Feb 0, 00 6:00-8:00pm, Closed Book Name : SOLUTION C Depl = C J0 + V R /V o ) m C Diff = τ F g m ω T = g m C µ + C π ω T = g m I / D C GD + C or V OV GS b = τ i τ i = R i C i ω H b Z = Z

More information

ECEN 474/704 Lab 2: Layout Design

ECEN 474/704 Lab 2: Layout Design ECEN 474/704 Lab 2: Layout esign Objectives Learn Techniques for successful integrated circuit layout design. Introduction In this lab you will learn in detail how to generate a simple transistor layout.

More information

Scaling of MOS Circuits. 4. International Technology Roadmap for Semiconductors (ITRS) 6. Scaling factors for device parameters

Scaling of MOS Circuits. 4. International Technology Roadmap for Semiconductors (ITRS) 6. Scaling factors for device parameters 1 Scaling of MOS Circuits CONTENTS 1. What is scaling?. Why scaling? 3. Figure(s) of Merit (FoM) for scaling 4. International Technology Roadmap for Semiconductors (ITRS) 5. Scaling models 6. Scaling factors

More information

Semiconductor Devices. C. Hu: Modern Semiconductor Devices for Integrated Circuits Chapter 5

Semiconductor Devices. C. Hu: Modern Semiconductor Devices for Integrated Circuits Chapter 5 Semiconductor Devices C. Hu: Modern Semiconductor Devices for Integrated Circuits Chapter 5 Global leader in environmental and industrial measurement Wednesday 3.2. afternoon Tour around facilities & lecture

More information

Impact of parametric mismatch and fluctuations on performance and yield of deep-submicron CMOS technologies. Philips Research, The Netherlands

Impact of parametric mismatch and fluctuations on performance and yield of deep-submicron CMOS technologies. Philips Research, The Netherlands Impact of parametric mismatch and fluctuations on performance and yield of deep-submicron CMOS technologies Hans Tuinhout, The Netherlands motivation: from deep submicron digital ULSI parametric spread

More information

Topics to be Covered. capacitance inductance transmission lines

Topics to be Covered. capacitance inductance transmission lines Topics to be Covered Circuit Elements Switching Characteristics Power Dissipation Conductor Sizes Charge Sharing Design Margins Yield resistance capacitance inductance transmission lines Resistance of

More information

Lecture 12: MOS Capacitors, transistors. Context

Lecture 12: MOS Capacitors, transistors. Context Lecture 12: MOS Capacitors, transistors Context In the last lecture, we discussed PN diodes, and the depletion layer into semiconductor surfaces. Small signal models In this lecture, we will apply those

More information

Microelectronics Part 1: Main CMOS circuits design rules

Microelectronics Part 1: Main CMOS circuits design rules GBM8320 Dispositifs Médicaux telligents Microelectronics Part 1: Main CMOS circuits design rules Mohamad Sawan et al. Laboratoire de neurotechnologies Polystim! http://www.cours.polymtl.ca/gbm8320/! med-amine.miled@polymtl.ca!

More information

Semiconductor Memories

Semiconductor Memories !"#"$%&'()$*#+%$*,' -"+./"$0 1'!*0"#)'2*+03*.$"4* Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic Semiconductor Memories December 20, 2002 !"#$%&'()*&'*+&, Memory Classification Memory Architectures

More information

FIELD-EFFECT TRANSISTORS

FIELD-EFFECT TRANSISTORS FIEL-EFFECT TRANSISTORS 1 Semiconductor review 2 The MOS capacitor 2 The enhancement-type N-MOS transistor 3 I-V characteristics of enhancement MOSFETS 4 The output characteristic of the MOSFET in saturation

More information

CMPEN 411 VLSI Digital Circuits. Lecture 04: CMOS Inverter (static view)

CMPEN 411 VLSI Digital Circuits. Lecture 04: CMOS Inverter (static view) CMPEN 411 VLSI Digital Circuits Lecture 04: CMOS Inverter (static view) Kyusun Choi [Adapted from Rabaey s Digital Integrated Circuits, Second Edition, 2003 J. Rabaey, A. Chandrakasan, B. Nikolic] CMPEN

More information

The Devices: MOS Transistors

The Devices: MOS Transistors The Devices: MOS Transistors References: Semiconductor Device Fundamentals, R. F. Pierret, Addison-Wesley Digital Integrated Circuits: A Design Perspective, J. Rabaey et.al. Prentice Hall NMOS Transistor

More information

Lecture 06: Current Mirrors

Lecture 06: Current Mirrors Lecture 06: Current Mirrors Analog IC Design Dr. Ryan Robucci Department of Computer Science and Electrical Engineering, UMBC Spring 2015 Dr. Ryan Robucci Lecture VI 1 / 26 Lowered Resistance Looking into

More information

Supporting information

Supporting information Supporting information Design, Modeling and Fabrication of CVD Grown MoS 2 Circuits with E-Mode FETs for Large-Area Electronics Lili Yu 1*, Dina El-Damak 1*, Ujwal Radhakrishna 1, Xi Ling 1, Ahmad Zubair

More information

University of Pennsylvania Department of Electrical Engineering. ESE 570 Midterm Exam March 14, 2013 FORMULAS AND DATA

University of Pennsylvania Department of Electrical Engineering. ESE 570 Midterm Exam March 14, 2013 FORMULAS AND DATA University of Pennsylvania Department of Electrical Engineering ESE 570 Midterm Exam March 4, 03 FORMULAS AND DATA. PHYSICAL CONSTANTS: n i = intrinsic concentration undoped) silicon =.45 x 0 0 cm -3 @

More information

ESE 570: Digital Integrated Circuits and VLSI Fundamentals

ESE 570: Digital Integrated Circuits and VLSI Fundamentals ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 5: January 25, 2018 MOS Operating Regions, pt. 1 Lecture Outline! 3 Regions of operation for MOSFET " Subthreshold " Linear " Saturation!

More information

ECEN474/704: (Analog) VLSI Circuit Design Spring 2018

ECEN474/704: (Analog) VLSI Circuit Design Spring 2018 ECEN474/704: (Analog) SI Circuit Design Spring 2018 ecture 2: MOS ransistor Modeling Sam Palermo Analog & Mixed-Signal Center exas A&M University Announcements If you haven t already, turn in your 0.18um

More information

EE141. EE141-Spring 2006 Digital Integrated Circuits. Administrative Stuff. Class Material. Flash Memory. Read-Only Memory Cells MOS OR ROM

EE141. EE141-Spring 2006 Digital Integrated Circuits. Administrative Stuff. Class Material. Flash Memory. Read-Only Memory Cells MOS OR ROM EE141-pring 2006 igital Integrated Circuits Lecture 29 Flash memory Administrative tuff reat job on projects and posters! Homework #10 due today Lab reports due this week Friday lab in 353 Final exam May

More information

Electronic Devices and Circuits Lecture 18 - Single Transistor Amplifier Stages - Outline Announcements. Notes on Single Transistor Amplifiers

Electronic Devices and Circuits Lecture 18 - Single Transistor Amplifier Stages - Outline Announcements. Notes on Single Transistor Amplifiers 6.012 Electronic Devices and Circuits Lecture 18 Single Transistor Amplifier Stages Outline Announcements Handouts Lecture Outline and Summary Notes on Single Transistor Amplifiers Exam 2 Wednesday night,

More information

ECE 415/515 ANALOG INTEGRATED CIRCUIT DESIGN

ECE 415/515 ANALOG INTEGRATED CIRCUIT DESIGN ECE 415/515 ANALOG INTEGRATED CIRCUIT DESIGN CMOS PROCESS CHARACTERIZATION VISHAL SAXENA VSAXENA@UIDAHO.EDU Vishal Saxena DESIGN PARAMETERS Analog circuit designers care about: Open-loop Gain: g m r o

More information

Announcements. EE141- Fall 2002 Lecture 7. MOS Capacitances Inverter Delay Power

Announcements. EE141- Fall 2002 Lecture 7. MOS Capacitances Inverter Delay Power - Fall 2002 Lecture 7 MOS Capacitances Inverter Delay Power Announcements Wednesday 12-3pm lab cancelled Lab 4 this week Homework 2 due today at 5pm Homework 3 posted tonight Today s lecture MOS capacitances

More information

B.Supmonchai June 26, q Introduction of device basic equations. q Introduction of models for manual analysis.

B.Supmonchai June 26, q Introduction of device basic equations. q Introduction of models for manual analysis. June 26, 2004 oal of this chapter Chapter 2 MO Transistor Theory oonchuay upmonchai Integrated esign Application Research (IAR) Laboratory June 16th, 2004; Revised June 16th, 2005 q Present intuitive understanding

More information

GMU, ECE 680 Physical VLSI Design 1

GMU, ECE 680 Physical VLSI Design 1 ECE680: Physical VLSI Design Chapter VIII Semiconductor Memory (chapter 12 in textbook) 1 Chapter Overview Memory Classification Memory Architectures The Memory Core Periphery Reliability Case Studies

More information

Semiconductor Memories

Semiconductor Memories Semiconductor References: Adapted from: Digital Integrated Circuits: A Design Perspective, J. Rabaey UCB Principles of CMOS VLSI Design: A Systems Perspective, 2nd Ed., N. H. E. Weste and K. Eshraghian

More information

HW 5 posted due in two weeks Lab this week Midterm graded Project to be launched in week 7

HW 5 posted due in two weeks Lab this week Midterm graded Project to be launched in week 7 HW 5 posted due in two weeks Lab this week Midterm graded Project to be launched in week 7 2 What do digital IC designers need to know? 5 EE4 EECS4 6 3 0< V GS - V T < V DS Pinch-off 7 For (V GS V T )

More information

Section 12: Intro to Devices

Section 12: Intro to Devices Section 12: Intro to Devices Extensive reading materials on reserve, including Robert F. Pierret, Semiconductor Device Fundamentals Bond Model of Electrons and Holes Si Si Si Si Si Si Si Si Si Silicon

More information

Lecture 3: CMOS Transistor Theory

Lecture 3: CMOS Transistor Theory Lecture 3: CMOS Transistor Theory Outline Introduction MOS Capacitor nmos I-V Characteristics pmos I-V Characteristics Gate and Diffusion Capacitance 2 Introduction So far, we have treated transistors

More information

Microelectronics Main CMOS design rules & basic circuits

Microelectronics Main CMOS design rules & basic circuits GBM8320 Dispositifs médicaux intelligents Microelectronics Main CMOS design rules & basic circuits Mohamad Sawan et al. Laboratoire de neurotechnologies Polystim mohamad.sawan@polymtl.ca M5418 6 & 7 September

More information

6.012 Electronic Devices and Circuits

6.012 Electronic Devices and Circuits Page 1 of 10 YOUR NAME Department of Electrical Engineering and Computer Science Massachusetts Institute of Technology 6.012 Electronic Devices and Circuits Exam No. 2 Thursday, November 5, 2009 7:30 to

More information

! MOS Capacitances. " Extrinsic. " Intrinsic. ! Lumped Capacitance Model. ! First Order Capacitor Summary. ! Capacitance Implications

! MOS Capacitances.  Extrinsic.  Intrinsic. ! Lumped Capacitance Model. ! First Order Capacitor Summary. ! Capacitance Implications ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 7: February, 07 MOS SPICE Models, MOS Parasitic Details Lecture Outline! MOS Capacitances " Extrinsic " Intrinsic! Lumped Capacitance Model!

More information

ESE 570: Digital Integrated Circuits and VLSI Fundamentals

ESE 570: Digital Integrated Circuits and VLSI Fundamentals ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 15: March 15, 2018 Euler Paths, Energy Basics and Optimization Midterm! Midterm " Mean: 89.7 " Standard Dev: 8.12 2 Lecture Outline! Euler

More information

CMOS Cross Section. EECS240 Spring Dimensions. Today s Lecture. Why Talk About Passives? EE240 Process

CMOS Cross Section. EECS240 Spring Dimensions. Today s Lecture. Why Talk About Passives? EE240 Process EECS240 Spring 202 CMOS Cross Section Metal p - substrate p + diffusion Lecture 2: CMOS Technology and Passive Devices Poly n - well n + diffusion Elad Alon Dept. of EECS EECS240 Lecture 2 4 Today s Lecture

More information

Lecture 6 Power Zhuo Feng. Z. Feng MTU EE4800 CMOS Digital IC Design & Analysis 2010

Lecture 6 Power Zhuo Feng. Z. Feng MTU EE4800 CMOS Digital IC Design & Analysis 2010 EE4800 CMOS Digital IC Design & Analysis Lecture 6 Power Zhuo Feng 6.1 Outline Power and Energy Dynamic Power Static Power 6.2 Power and Energy Power is drawn from a voltage source attached to the V DD

More information

Magnetic core memory (1951) cm 2 ( bit)

Magnetic core memory (1951) cm 2 ( bit) Magnetic core memory (1951) 16 16 cm 2 (128 128 bit) Semiconductor Memory Classification Read-Write Memory Non-Volatile Read-Write Memory Read-Only Memory Random Access Non-Random Access EPROM E 2 PROM

More information

Thin Film Transistors (TFT)

Thin Film Transistors (TFT) Thin Film Transistors (TFT) a-si TFT - α-si:h (Hydrogenated amorphous Si) deposited with a PECVD system (low temp. process) replaces the single crystal Si substrate. - Inverted staggered structure with

More information

Introduction to CMOS VLSI. Chapter 2: CMOS Transistor Theory. Harris, 2004 Updated by Li Chen, Outline

Introduction to CMOS VLSI. Chapter 2: CMOS Transistor Theory. Harris, 2004 Updated by Li Chen, Outline Introduction to MOS VLSI Design hapter : MOS Transistor Theory copyright@david Harris, 004 Updated by Li hen, 010 Outline Introduction MOS apacitor nmos IV haracteristics pmos IV haracteristics Gate and

More information

Lecture 15 OUTLINE. MOSFET structure & operation (qualitative) Review of electrostatics The (N)MOS capacitor

Lecture 15 OUTLINE. MOSFET structure & operation (qualitative) Review of electrostatics The (N)MOS capacitor Lecture 15 OUTLINE MOSFET structure & operation (qualitative) Review of electrostatics The (N)MOS capacitor Electrostatics t ti Charge vs. voltage characteristic Reading: Chapter 6.1 6.2.1 EE105 Fall 2007

More information

NE 204 mini-syllabus (weeks 4 8)

NE 204 mini-syllabus (weeks 4 8) NE 24 mini-syllabus (weeks 4 8) Instructor: John Burke O ce: MCS 238 e-mail: jb@math.bu.edu o ce hours: by appointment Overview: For the next few weeks, we will focus on mathematical models of single neurons.

More information

EECS240 Spring Today s Lecture. Lecture 2: CMOS Technology and Passive Devices. Lingkai Kong EECS. EE240 CMOS Technology

EECS240 Spring Today s Lecture. Lecture 2: CMOS Technology and Passive Devices. Lingkai Kong EECS. EE240 CMOS Technology EECS240 Spring 2013 Lecture 2: CMOS Technology and Passive Devices Lingkai Kong EECS Today s Lecture EE240 CMOS Technology Passive devices Motivation Resistors Capacitors (Inductors) Next time: MOS transistor

More information

CS 152 Computer Architecture and Engineering

CS 152 Computer Architecture and Engineering CS 152 Computer Architecture and Engineering Lecture 12 VLSI II 2005-2-24 John Lazzaro (www.cs.berkeley.edu/~lazzaro) TAs: Ted Hong and David Marquardt www-inst.eecs.berkeley.edu/~cs152/ Last Time: Device

More information

Class 05: Device Physics II

Class 05: Device Physics II Topics: 1. Introduction 2. NFET Model and Cross Section with Parasitics 3. NFET as a Capacitor 4. Capacitance vs. Voltage Curves 5. NFET as a Capacitor - Band Diagrams at V=0 6. NFET as a Capacitor - Accumulation

More information

CMOS Devices. PN junctions and diodes NMOS and PMOS transistors Resistors Capacitors Inductors Bipolar transistors

CMOS Devices. PN junctions and diodes NMOS and PMOS transistors Resistors Capacitors Inductors Bipolar transistors CMOS Devices PN junctions and diodes NMOS and PMOS transistors Resistors Capacitors Inductors Bipolar transistors PN Junctions Diffusion causes depletion region D.R. is insulator and establishes barrier

More information

ECE315 / ECE515 Lecture-2 Date:

ECE315 / ECE515 Lecture-2 Date: Lecture-2 Date: 04.08.2016 NMOS I/V Characteristics Discussion on I/V Characteristics MOSFET Second Order Effect NMOS I-V Characteristics ECE315 / ECE515 Gradual Channel Approximation: Cut-off Linear/Triode

More information

Lecture 7 Circuit Delay, Area and Power

Lecture 7 Circuit Delay, Area and Power Lecture 7 Circuit Delay, Area and Power lecture notes from S. Mitra Intro VLSI System course (EE271) Introduction to VLSI Systems 1 Circuits and Delay Introduction to VLSI Systems 2 Power, Delay and Area:

More information