percolating nanotube networks

Size: px
Start display at page:

Download "percolating nanotube networks"

Transcription

1 Supporting Information for: A highly elastic, capacitive strain gauge based on percolating nanotube networks Force (kgf) Raw Data Mooney-Rivlin (R 2 =0.996) Linear Elasticity (R 2 =0.997) Stretch (1 + ε) Figure S1. Characterization of silicone mechanical properties. The same test structures used to make the sensors were tested using an Instron and 2mm/sec strain up to 100% strain. The data is characterized with respect to the Stretch parameter (Stretch = 1 + strain), as this is standard for Mooney-Rivlin non-linear elasticity. Curve fitting was performed using an optimization routine within Matlab (fmincon) and manually calculated the residuals and the goodness-of-fit. From the data, it appears that the linear elasticity model seems better suited to the data than the Mooney- Rivlin fit. Mooney-Rivlin underestimates strains below about 30%, while the linear model overestimates strains below 15%. On the higher end, Mooney-Rivlin underestimates the strains once more while the linear model is much more accurate. For these reasons, we opted to use the linear model for all of our subsequent analyses.

2 Fabrication Methods Nanotube stock solution All experiments were performed using single-walled carbon nanotubes (Cheaptubes, 99 wt%, 2 nm OD, 3-30 microns in length) prepared as follows. We first prepared a stock solution in deionized water with 5 mg/ml of nanotubes and 1 g/ml of surfactant (SDS, Sigma). This solution was bath-sonicated for 180 minutes and then allowed to settle for 12 hours. Vacuum filtration To produce two electrodes for a single capacitive sensor, 30 ml of nanotube stock solution were vacuum filtered through a 220 nm pore-size cellulose filtration membrane (MF class, Millipore). Care was taken to flush residual surfactant out of the network. Once complete the filter was removed and readied for transfer. For consistency, all filters were used for a transfer within 5 minutes of having been removed from the filtration apparatus. Substrate Preparation All devices were produced using silicone elastomer film (Bisco HT-6240 liquid silicone, 275 micron ply). The silicone was laser-cut (VLS2.3, Versa) into the dog-bone test patterns. Once cut, the substrate was masked in preparation for plasma treatment. While we successfully tested the use of traditional positive photoresists (S1818, see SI), we were able to obtain the desired electrode resolution using laser-cut sticker paper. To mask a sample, the laser-cut sticker masks were carefully placed on either side of the sample, with care taken to align them to have the proper overlap. The sample was then mounted in a custom-built 2-point clamp that held the device in a position that allowed plasma full access to all unmasked regions. Once mounted, the sample was placed in an atmospheric plasma chamber (Harrick Plasma) and exposed at 10W for a period of 30s. For higher resolution features (sub-millimeter), a combination of photoresist and oxygen plasma treatment in a reaction ion etcher can provide higher resolution boundaries to features. Plasma patterning characterization While the resolution called for in the Poisson capacitor is fairly coarse (the electrodes are many millimeters in scale), we characterized the performance of the plasma patterning method down to features of 100 microns, as shown in Figure S2. To obtain these features, we used S1818 positive photoresist and traditional photolithography. Briefly, pre-cured silicone sheets (275 microns thick) were reversibly adhered to glass slides and spin-coated with S1818 at 500 rpm (100rps) for 5 seconds followed by 4000 rpm (800rps) for 30 seconds. Following coating, the samples were soft-baked at 115 C for 2.5 min immediately prior to exposure at 65 mj/cm^2 with I-line UV. Post exposure, the samples were developed in CD-30 for 45 sec prior to plasma treatment. While atmospheric plasma is more than sufficient for coarse features (millimeter scale), we found that directional oxygen plasma in a parallel plate reactive ion etcher (RIE) provided much higher resolution, especially in conjunction with photoresist. This is likely because the anisotropic plasma treatment was less likely to infiltrate the resist:silicone interface. The features in Figure 1f were produced using a 10 sec exposure to oxygen plasma at 25 W in a Plasma-Therm PK12. Post-exposure, the resist was stripped in acetone and the substrates were immediately used for transfer experiments with freshly made nanotube percolation network filters.

3 Transfer and Encapsulation Immediately after exposure, the masks were stripped and the device was reversibly adhered to a cleaned glass slide. This was then placed on top of the nanotube membrane and the two were pressed together. This can be done manually, but we used a hydraulic press set at 0.25 MPa for consistency. Once one side was stamped, the device was carefully removed from the glass, flipped over and the process was repeated for the other side, using the same filtration substrate. For encapsulation, the device was mounted on a new glass slide and carefully taped down to mask the contact pads. Only one side can be done at a time, so the process will be repeated on the other side. Once secured, the sample is transferred to a hotplate with a surface temperature of 110 C. While this is heating, a mixture was made of hexane, PDMS (Sylgard 184, Dow) and PDMS curing agent in a 10:10:1 ratio. The mixture was loaded into in an airbrush and sprayed onto the heated sample. The volatility of hexane means that it was driven off quickly and the remaining PDMS cured within minutes on the heated sample. Thickness of the coating layer varied due to variability in the airbrush process, but no layer exceeded 100 microns as measured by micrometer. Testing Once encapsulated, the device was mounted as shown in Figure 1d. Copper foil was clamped against the exposed contact pads for each electrode using custom clamps. The clamps were then mounted into a modified syringe pump (Cole-Parmer) that allowed cyclic stretching at a rate of 2 mm/s. Alligator leads were used to couple the copper foil electrodes into an electrical impedance spectroscopy system (EIS, Novocontrol). All AC excitation was performed at 10 khz, while all sampling was performed at 3 Hz (the maximum possible with the EIS system). While we opted to use a formal EIS system to characterize the device performance, a much lighter, lower-cost solution for use in the field can be constructed using a simple capacitive Wheatstone bridge design. This approach is analogous to the resistive Wheatstone bridges typically used for piezoresistive strain gauges, except that it incorporates a reference capacitor (see AN990 by Microchip Inc. for a detailed discussion of designing such a bridge). Parallel plate model While the traditional parallel plate model serves to illustrate the functioning of the Poisson capacitor, the way it treats the field between the electrodes is idealized and ignores fringe fields. In order to obtain a better fit to the empirical data, it is necessary to treat the electrodes as finite regions that create fringing fields that lie outside of the dielectric region. This model is much more accurate for situations where the plate gap (g) is large with respect to the width (w) (e.g. use when w >~ w/10). The analytical solution for this, Equation S1, is known as the Palmer model and corrects for fringing fields by introducing a geometric scaling factor. The result is a more accurate model that still exhibits the same linear output in response to strain as was seen in the simple model. "C Palmer =# 0 # PDMS (1+$ z ) wl g & 1+ g & 2%w ))& ( ( 1+ log g & 2%w )) ( ( 1+ log + ' %w ' g **' %L ' L ** + (S1)

4 Here, ν is Poisson s ratio (typically ~0.5 for silicone elastomers); ε is strain; σ is stress [Pa]; and L, w and g are the initial dimensions of the capacitor (see Figure 1). ϵ 0 is the permittivity of free space [F/m], and ϵ PDMS is the relative permittivity of PDMS. The accuracy of this model can be seen in Figure 2a in the main text. Frequency response Ideal capacitors function independent of the AC excitation frequency. We ran diagnostic frequency sweeps vs. capacitance on the Poisson capacitors to characterize their general performance. Figure S2 presents the frequency sweep data, indicating that the baseline capacitance for this sensor was approximately 16 pf. Higher excitation frequencies are beneficial for improving the signal-to-noise performance, so we used the frequency response data to choose an excitation of 10 khz for all future measurements of strain vs. capacitance. Figure S2. Frequency vs. capacitance. The Poisson capacitor behaves nearly like an ideal capacitor up to an excitation frequency of around 10 5 Hz, so we performed all future measurements at 10 khz. The baseline capacitance in this range was approximately 16 pf. Robotic linkage design and fabrication The four-bar linkage was created using a scaled version of the smart composite microstructure (SCM) process. 1 This process allows flexure mechanisms to be quickly prototyped using cardboard as rigid links and polyethylene terephthalate (PET) film as the flexure material. Simple linkages can be fabricated in under twenty minutes, allowing for a working design to be quickly iterated. Once a working linkage has been validated, the process can be scaled to other materials and sizes, such as the fiberglass process used for MEDIC. 2,3 Video S1. Video of four-bar linkage leg. Please see the separate video file. Here, the four-bar linkage is attached to the stretching apparatus and the strain sensor. The plastic L structure pulls on the top of the linkage and causes it to rotate, simultaneously resulting in the stretching of

5 the sensor. By coupling the sensor output to the angle, we can use the sensor either for angle transduction or, knowing the dynamics of the linkage, position feedback.

Supplementary Figure 1 shows overall fabrication process and detailed illustrations are given

Supplementary Figure 1 shows overall fabrication process and detailed illustrations are given Supplementary Figure 1. Pressure sensor fabrication schematics. Supplementary Figure 1 shows overall fabrication process and detailed illustrations are given in Methods section. (a) Firstly, the sacrificial

More information

b. The displacement of the mass due to a constant acceleration a is x=

b. The displacement of the mass due to a constant acceleration a is x= EE147/247A Final, Fall 2013 Page 1 /35 2 /55 NO CALCULATORS, CELL PHONES, or other electronics allowed. Show your work, and put final answers in the boxes provided. Use proper units in all answers. 1.

More information

Supporting Information

Supporting Information Supporting Information Oh et al. 10.1073/pnas.0811923106 SI Text Hysteresis of BPE-PTCDI MW-TFTs. Fig. S9 represents bidirectional transfer plots at V DS 100VinN 2 atmosphere for transistors constructed

More information

Outline. 4 Mechanical Sensors Introduction General Mechanical properties Piezoresistivity Piezoresistive Sensors Capacitive sensors Applications

Outline. 4 Mechanical Sensors Introduction General Mechanical properties Piezoresistivity Piezoresistive Sensors Capacitive sensors Applications Sensor devices Outline 4 Mechanical Sensors Introduction General Mechanical properties Piezoresistivity Piezoresistive Sensors Capacitive sensors Applications Introduction Two Major classes of mechanical

More information

SENSOR DEVICES MECHANICAL SENSORS

SENSOR DEVICES MECHANICAL SENSORS SENSOR DEVICES MECHANICAL SENSORS OUTLINE 4 Mechanical Sensors Introduction General mechanical properties Piezoresistivity Piezoresistive sensors Capacitive sensors Applications INTRODUCTION MECHANICAL

More information

Super-stretchable, Transparent Carbon Nanotube-Based Capacitive Strain Sensors for Human Motion Detection

Super-stretchable, Transparent Carbon Nanotube-Based Capacitive Strain Sensors for Human Motion Detection Supplementary Information for: Super-stretchable, Transparent Carbon Nanotube-Based Capacitive Strain Sensors for Human Motion Detection Le Cai 1,2, Li Song 3*, Pingshan Luan 1,2, Qiang Zhang 1,2, Nan

More information

Biosensors and Instrumentation: Tutorial 2

Biosensors and Instrumentation: Tutorial 2 Biosensors and Instrumentation: Tutorial 2. One of the most straightforward methods of monitoring temperature is to use the thermal variation of a resistor... Suggest a possible problem with the use of

More information

SUPPLEMENTARY FIGURES

SUPPLEMENTARY FIGURES SUPPLEMENTARY FIGURES a b c Supplementary Figure 1 Fabrication of the near-field radiative heat transfer device. a, Main fabrication steps for the bottom Si substrate. b, Main fabrication steps for the

More information

Supplementary Materials for

Supplementary Materials for advances.sciencemag.org/cgi/content/full/3/9/e1701222/dc1 Supplementary Materials for Moisture-triggered physically transient electronics Yang Gao, Ying Zhang, Xu Wang, Kyoseung Sim, Jingshen Liu, Ji Chen,

More information

Figure 1: Graphene release, transfer and stacking processes. The graphene stacking began with CVD

Figure 1: Graphene release, transfer and stacking processes. The graphene stacking began with CVD Supplementary figure 1 Graphene Growth and Transfer Graphene PMMA FeCl 3 DI water Copper foil CVD growth Back side etch PMMA coating Copper etch in 0.25M FeCl 3 DI water rinse 1 st transfer DI water 1:10

More information

Supplementary Information. Rapid Stencil Mask Fabrication Enabled One-Step. Polymer-Free Graphene Patterning and Direct

Supplementary Information. Rapid Stencil Mask Fabrication Enabled One-Step. Polymer-Free Graphene Patterning and Direct Supplementary Information Rapid Stencil Mask Fabrication Enabled One-Step Polymer-Free Graphene Patterning and Direct Transfer for Flexible Graphene Devices Keong Yong 1,, Ali Ashraf 1,, Pilgyu Kang 1,

More information

Stretchable Graphene Transistors with Printed Dielectrics and Gate Electrodes

Stretchable Graphene Transistors with Printed Dielectrics and Gate Electrodes Stretchable Graphene Transistors with Printed Dielectrics and Gate Electrodes Seoung-Ki Lee, Beom Joon Kim, Houk Jang, Sung Cheol Yoon, Changjin Lee, Byung Hee Hong, John A. Rogers, Jeong Ho Cho, Jong-Hyun

More information

Supplementary Figure 1 Detailed illustration on the fabrication process of templatestripped

Supplementary Figure 1 Detailed illustration on the fabrication process of templatestripped Supplementary Figure 1 Detailed illustration on the fabrication process of templatestripped gold substrate. (a) Spin coating of hydrogen silsesquioxane (HSQ) resist onto the silicon substrate with a thickness

More information

MEMS Tuning-Fork Gyroscope Mid-Term Report Amanda Bristow Travis Barton Stephen Nary

MEMS Tuning-Fork Gyroscope Mid-Term Report Amanda Bristow Travis Barton Stephen Nary MEMS Tuning-Fork Gyroscope Mid-Term Report Amanda Bristow Travis Barton Stephen Nary Abstract MEMS based gyroscopes have gained in popularity for use as rotation rate sensors in commercial products like

More information

Lecture 20. Measuring Pressure and Temperature (Chapter 9) Measuring Pressure Measuring Temperature MECH 373. Instrumentation and Measurements

Lecture 20. Measuring Pressure and Temperature (Chapter 9) Measuring Pressure Measuring Temperature MECH 373. Instrumentation and Measurements MECH 373 Instrumentation and Measurements Lecture 20 Measuring Pressure and Temperature (Chapter 9) Measuring Pressure Measuring Temperature 1 Measuring Acceleration and Vibration Accelerometers using

More information

Cut-and-Paste Organic FET Customized ICs for Application to Artificial Skin

Cut-and-Paste Organic FET Customized ICs for Application to Artificial Skin Cut-and-Paste Organic FET Customized ICs for Application to Artificial Skin Takao Someya 1, Hiroshi Kawaguchi 2, Takayasu Sakurai 3 1 School of Engineering, University of Tokyo, Tokyo, JAPAN 2 Institute

More information

Thin Wafer Handling Challenges and Emerging Solutions

Thin Wafer Handling Challenges and Emerging Solutions 1 Thin Wafer Handling Challenges and Emerging Solutions Dr. Shari Farrens, Mr. Pete Bisson, Mr. Sumant Sood and Mr. James Hermanowski SUSS MicroTec, 228 Suss Drive, Waterbury Center, VT 05655, USA 2 Thin

More information

1

1 Process methodologies for temporary thin wafer handling solutions By Justin Furse, Technology Strategist, Brewer Science, Inc. Use of temporary bonding/debonding as part of thin wafer handling processes

More information

DEPOSITION OF THIN TiO 2 FILMS BY DC MAGNETRON SPUTTERING METHOD

DEPOSITION OF THIN TiO 2 FILMS BY DC MAGNETRON SPUTTERING METHOD Chapter 4 DEPOSITION OF THIN TiO 2 FILMS BY DC MAGNETRON SPUTTERING METHOD 4.1 INTRODUCTION Sputter deposition process is another old technique being used in modern semiconductor industries. Sputtering

More information

Supporting Information. Fabrication, Testing and Simulation of All Solid State Three Dimensional Li-ion Batteries

Supporting Information. Fabrication, Testing and Simulation of All Solid State Three Dimensional Li-ion Batteries Supporting Information Fabrication, Testing and Simulation of All Solid State Three Dimensional -ion Batteries A. Alec Talin* 1, Dmitry Ruzmetov 2, Andrei Kolmakov 2, Kim McKelvey 3, Nicholas Ware 4, Farid

More information

Strain Measurement MEASUREMENT EXPERIMENT

Strain Measurement MEASUREMENT EXPERIMENT Strain Measurement MEASUREMENT EXPERIMENT 1. OBJECT The objective of this experiment is to become familiar with the electric resistance strain gage techniques and utilize such gages for the determination

More information

Supplementary Figures

Supplementary Figures Supplementary Figures I n t e g r a l 2. 0 1 3 9 2. 0 4 1 5 0. 0 4 4 2 1. 0 0 0 0 1. 0 0 3 2 4. 1 0 0 6 2. 9 8 6 5 1 0. 1 9 4 8. 5 8. 0 7. 5 7. 0 6. 5 6. 0 5. 5 5. 0 4. 5 4. 0 ( p p m ) 3. 5 3. 0 2. 5

More information

Supplementary Information Our InGaN/GaN multiple quantum wells (MQWs) based one-dimensional (1D) grating structures

Supplementary Information Our InGaN/GaN multiple quantum wells (MQWs) based one-dimensional (1D) grating structures Polarized white light from hybrid organic/iii-nitrides grating structures M. Athanasiou, R. M. Smith, S. Ghataora and T. Wang* Department of Electronic and Electrical Engineering, University of Sheffield,

More information

SCB10H Series Pressure Elements PRODUCT FAMILY SPEFICIFATION. Doc. No B

SCB10H Series Pressure Elements PRODUCT FAMILY SPEFICIFATION. Doc. No B PRODUCT FAMILY SPEFICIFATION SCB10H Series Pressure Elements SCB10H Series Pressure Elements Doc. No. 82 1250 00 B Table of Contents 1 General Description... 3 1.1 Introduction... 3 1.2 General Description...

More information

Dielectric constant measurement of P3HT, polystyrene, and polyethylene

Dielectric constant measurement of P3HT, polystyrene, and polyethylene Dielectric constant measurement of P3HT, polystyrene, and polyethylene Supervisor: prof. dr. J.C. Hummelen Daily supervisor: Jenny Douvogianni Name: Si Chen (s2660482) 1. Introduction Dielectric constant

More information

UNIT 3. By: Ajay Kumar Gautam Asst. Prof. Dev Bhoomi Institute of Technology & Engineering, Dehradun

UNIT 3. By: Ajay Kumar Gautam Asst. Prof. Dev Bhoomi Institute of Technology & Engineering, Dehradun UNIT 3 By: Ajay Kumar Gautam Asst. Prof. Dev Bhoomi Institute of Technology & Engineering, Dehradun 1 Syllabus Lithography: photolithography and pattern transfer, Optical and non optical lithography, electron,

More information

Supplementary Figure 1: Micromechanical cleavage of graphene on oxygen plasma treated Si/SiO2. Supplementary Figure 2: Comparison of hbn yield.

Supplementary Figure 1: Micromechanical cleavage of graphene on oxygen plasma treated Si/SiO2. Supplementary Figure 2: Comparison of hbn yield. 1 2 3 4 Supplementary Figure 1: Micromechanical cleavage of graphene on oxygen plasma treated Si/SiO 2. Optical microscopy images of three examples of large single layer graphene flakes cleaved on a single

More information

A Novel Approach to the Layer Number-Controlled and Grain Size- Controlled Growth of High Quality Graphene for Nanoelectronics

A Novel Approach to the Layer Number-Controlled and Grain Size- Controlled Growth of High Quality Graphene for Nanoelectronics Supporting Information A Novel Approach to the Layer Number-Controlled and Grain Size- Controlled Growth of High Quality Graphene for Nanoelectronics Tej B. Limbu 1,2, Jean C. Hernández 3, Frank Mendoza

More information

Multilayer Ceramic Chip Capacitors

Multilayer Ceramic Chip Capacitors HIGH VOLTAGE SERIES JARO high voltage series Multilayer Ceramic Capacitors are constructed by depositing alternative layers of ceramic dielectric materials and internal metallic electrodes, by using advanced

More information

4FNJDPOEVDUPS 'BCSJDBUJPO &UDI

4FNJDPOEVDUPS 'BCSJDBUJPO &UDI 2010.5.4 1 Major Fabrication Steps in CMOS Process Flow UV light oxygen Silicon dioxide Silicon substrate Oxidation (Field oxide) photoresist Photoresist Coating Mask exposed photoresist Mask-Wafer Exposed

More information

UNIVERSITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences. Fall Exam 1

UNIVERSITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences. Fall Exam 1 UNIVERSITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences EECS 143 Fall 2008 Exam 1 Professor Ali Javey Answer Key Name: SID: 1337 Closed book. One sheet

More information

Physical Properties Testing Technical Bulletin

Physical Properties Testing Technical Bulletin Technical Bulletin MANUFACTURER Raven Lining Systems 13105 E. 61 st Street, Suite A Broken Arrow, OK 74012 (918) 615-0020 TENSILE TESTING OF PLASTICS ASTM D638, ISO 527 Tensile tests measure the force

More information

A Transparent Perovskite Light Emitting Touch-

A Transparent Perovskite Light Emitting Touch- Supporting Information for A Transparent Perovskite Light Emitting Touch- Responsive Device Shu-Yu Chou, Rujun Ma, Yunfei Li,, Fangchao Zhao, Kwing Tong, Zhibin Yu, and Qibing Pei*, Department of Materials

More information

CHAPTER 4 DESIGN AND ANALYSIS OF CANTILEVER BEAM ELECTROSTATIC ACTUATORS

CHAPTER 4 DESIGN AND ANALYSIS OF CANTILEVER BEAM ELECTROSTATIC ACTUATORS 61 CHAPTER 4 DESIGN AND ANALYSIS OF CANTILEVER BEAM ELECTROSTATIC ACTUATORS 4.1 INTRODUCTION The analysis of cantilever beams of small dimensions taking into the effect of fringing fields is studied and

More information

Supporting Information

Supporting Information Fully-Printed Stretchable Thin-Film Transistors and Integrated Logic Circuits Le Cai 1, Suoming Zhang 1, Jinshui Miao 1, Zhibin Yu 2, Chuan Wang 1, * 1 Department of Electrical and Computer Engineering,

More information

The Basic Capacitor. Dielectric. Conductors

The Basic Capacitor. Dielectric. Conductors Chapter 9 The Basic Capacitor Capacitors are one of the fundamental passive components. In its most basic form, it is composed of two conductive plates separated by an insulating dielectric. The ability

More information

Supplementary Information

Supplementary Information ature anotechnology reference number: AO-06110617A Growth and alignment of polyaniline nanofibres with superhydrophobic, superhydrophilic and other properties an-rong Chiou 1,2,3, Chunmeng Lu 1, Jingjiao

More information

Published by: PIONEER RESEARCH & DEVELOPMENT GROUP(

Published by: PIONEER RESEARCH & DEVELOPMENT GROUP( MEMS based Piezo resistive Pressure Sensor Swathi Krishnamurthy 1, K.V Meena 2, E & C Engg. Dept., The Oxford College of Engineering, Karnataka. Bangalore 560009 Abstract The paper describes the performance

More information

MCE 403 MACHINERY LABORATORY EXPERIMENT 10

MCE 403 MACHINERY LABORATORY EXPERIMENT 10 1 1.OBJECTIVE The objective of this experiment is to become familiar with the electric resistance strain gauge techniques and utilize such gauges for the determination of unknown quantities (such as strain,

More information

Fast Bonding of Substrates for the Formation of Microfluidic Channels at Room Temperature

Fast Bonding of Substrates for the Formation of Microfluidic Channels at Room Temperature Supplementary Material (ESI) for Lab on a Chip This journal is The Royal Society of Chemistry 2005 Supporting Information Fast Bonding of Substrates for the Formation of Microfluidic Channels at Room Temperature

More information

SUPPORTING INFORMATION. Si wire growth. Si wires were grown from Si(111) substrate that had a low miscut angle

SUPPORTING INFORMATION. Si wire growth. Si wires were grown from Si(111) substrate that had a low miscut angle SUPPORTING INFORMATION The general fabrication process is illustrated in Figure 1. Si wire growth. Si wires were grown from Si(111) substrate that had a low miscut angle of 0.1. The Si was covered with

More information

SUPPORTING INFORMATION

SUPPORTING INFORMATION SUPPORTING INFORMATION TRMC using planar microwave resonators: Application to the study of long-lived charge pairs in photoexcited titania nanotube arrays M. H. Zarifi, 1 A. Mohammadpour, 1 S. Farsinezhad,

More information

Midterm 2 PROBLEM POINTS MAX

Midterm 2 PROBLEM POINTS MAX Midterm 2 PROBLEM POINTS MAX 1 30 2 24 3 15 4 45 5 36 1 Personally, I liked the University; they gave us money and facilities, we didn't have to produce anything. You've never been out of college. You

More information

custom reticle solutions

custom reticle solutions custom reticle solutions 01 special micro structures Pyser Optics has over 60 years experience in producing high quality micro structure products. These products are supplied worldwide to industries including

More information

Slide 1. Temperatures Light (Optoelectronics) Magnetic Fields Strain Pressure Displacement and Rotation Acceleration Electronic Sensors

Slide 1. Temperatures Light (Optoelectronics) Magnetic Fields Strain Pressure Displacement and Rotation Acceleration Electronic Sensors Slide 1 Electronic Sensors Electronic sensors can be designed to detect a variety of quantitative aspects of a given physical system. Such quantities include: Temperatures Light (Optoelectronics) Magnetic

More information

Photolithography 光刻 Part II: Photoresists

Photolithography 光刻 Part II: Photoresists 微纳光电子材料与器件工艺原理 Photolithography 光刻 Part II: Photoresists Xing Sheng 盛兴 Department of Electronic Engineering Tsinghua University xingsheng@tsinghua.edu.cn 1 Photolithography 光刻胶 负胶 正胶 4 Photolithography

More information

Peak Strain and Displacement Sensors for Structural Health Monitoring

Peak Strain and Displacement Sensors for Structural Health Monitoring Peak Strain and Displacement Sensors for Structural Health Monitoring AKIRA MITA and SHINPEI TAKAHIRA ABSTRACT Simple and inexpensive passive sensors that can monitor the peak strain or displacement of

More information

High Yield Synthesis of Aspect Ratio Controlled. Graphenic Materials from Anthracite Coal in

High Yield Synthesis of Aspect Ratio Controlled. Graphenic Materials from Anthracite Coal in Supporting Information High Yield Synthesis of Aspect Ratio Controlled Graphenic Materials from Anthracite Coal in Supercritical Fluids Suchithra Padmajan Sasikala 1, Lucile Henry 1, Gulen Yesilbag Tonga

More information

A Stacked-type Electrostatic Actuator and Measurement of its Energy Efficiency

A Stacked-type Electrostatic Actuator and Measurement of its Energy Efficiency A Stacked-type Electrostatic Actuator and Measurement of its Energy Efficiency Yoshiyuki Hata Tokyo Institute of Technology yoshiyuki@ric.titech.ac.jp Keiji Saneyoshi Tokyo Institute of Technology ksaneyos@ric.titech.ac.jp

More information

Electrochemically Exfoliated Graphene as Solution-Processable, Highly-Conductive Electrodes for Organic Electronics

Electrochemically Exfoliated Graphene as Solution-Processable, Highly-Conductive Electrodes for Organic Electronics Supporting Information Electrochemically Exfoliated Graphene as Solution-Processable, Highly-Conductive Electrodes for Organic Electronics Khaled Parvez, Rongjin Li, Sreenivasa Reddy Puniredd, Yenny Hernandez,

More information

Piezoelectric Fabrics for Energy Harvesting F06-GT05

Piezoelectric Fabrics for Energy Harvesting F06-GT05 Piezoelectric Fabrics for Energy Harvesting F06-GT05 Project Leader: Principal Investigators: François M. Guillot, Georgia Institute of Technology, ME (francois.guillot@me.gatech.edu) Haskell W. Beckham,

More information

EIS of Organic Coatings and Paints

EIS of Organic Coatings and Paints EIS of Organic Coatings and Paints Introduction All My Impedance Spectra Look the Same! "I m an experienced polymer chemist. I m trying to use Electrochemical Impedance Spectroscopy (EIS) to predict the

More information

Optimizing micromechanical force detectors for measuring. magnetization at high magnetic fields

Optimizing micromechanical force detectors for measuring. magnetization at high magnetic fields Abstract Optimizing micromechanical force detectors for measuring magnetization at high magnetic fields Jeremy Paster University of Florida July 30, 2008 MEMS devices prove to be advantageous in magnetometry.

More information

Modelling of Different MEMS Pressure Sensors using COMSOL Multiphysics

Modelling of Different MEMS Pressure Sensors using COMSOL Multiphysics International Journal of Current Engineering and Technology E-ISSN 2277 4106, P-ISSN 2347 5161 2017 INPRESSCO, All Rights Reserved Available at http://inpressco.com/category/ijcet Research Article Modelling

More information

Y. C. Lee. Micro-Scale Engineering I Microelectromechanical Systems (MEMS)

Y. C. Lee. Micro-Scale Engineering I Microelectromechanical Systems (MEMS) Micro-Scale Engineering I Microelectromechanical Systems (MEMS) Y. C. Lee Department of Mechanical Engineering University of Colorado Boulder, CO 80309-0427 leeyc@colorado.edu January 15, 2014 1 Contents

More information

Supplementary Materials for

Supplementary Materials for advances.sciencemag.org/cgi/content/full/3/9/e1700159/dc1 Supplementary Materials for Ultratransparent and stretchable graphene electrodes Nan Liu, Alex Chortos, Ting Lei, Lihua Jin, Taeho Roy Kim, Won-Gyu

More information

Introduction to Photolithography

Introduction to Photolithography http://www.ichaus.de/news/72 Introduction to Photolithography Photolithography The following slides present an outline of the process by which integrated circuits are made, of which photolithography is

More information

Supplementary information for Tunneling Spectroscopy of Graphene-Boron Nitride Heterostructures

Supplementary information for Tunneling Spectroscopy of Graphene-Boron Nitride Heterostructures Supplementary information for Tunneling Spectroscopy of Graphene-Boron Nitride Heterostructures F. Amet, 1 J. R. Williams, 2 A. G. F. Garcia, 2 M. Yankowitz, 2 K.Watanabe, 3 T.Taniguchi, 3 and D. Goldhaber-Gordon

More information

Supporting Information: PDMS Nanocomposites for Heat Transfer Enhancement in. Microfluidic Platforms

Supporting Information: PDMS Nanocomposites for Heat Transfer Enhancement in. Microfluidic Platforms Electronic Supplementary Material (ESI) for Lab on a Chip. This journal is The Royal Society of Chemistry 2014 Supporting Information: PDMS Nanocomposites for Heat Transfer Enhancement in Microfluidic

More information

A WHISKER-LIKE ARTIFICAL SENSOR FOR FLUID MOTION SENSING. Jonathan Stocking Advisor: Prof. Ben Calhoun University of Virginia

A WHISKER-LIKE ARTIFICAL SENSOR FOR FLUID MOTION SENSING. Jonathan Stocking Advisor: Prof. Ben Calhoun University of Virginia A WHISKER-LIKE ARTIFICAL SENSOR FOR FLUID MOTION SENSING Jonathan Stocking Advisor: Prof. Ben Calhoun University of Virginia ABSTRACT This research aims to develop a whisker-like artificial fluid motion

More information

Piezoelectric Resonators ME 2082

Piezoelectric Resonators ME 2082 Piezoelectric Resonators ME 2082 Introduction K T : relative dielectric constant of the material ε o : relative permittivity of free space (8.854*10-12 F/m) h: distance between electrodes (m - material

More information

ETCHING Chapter 10. Mask. Photoresist

ETCHING Chapter 10. Mask. Photoresist ETCHING Chapter 10 Mask Light Deposited Substrate Photoresist Etch mask deposition Photoresist application Exposure Development Etching Resist removal Etching of thin films and sometimes the silicon substrate

More information

Nanopores: Solid-state nanopores for these experiments were produced by using the

Nanopores: Solid-state nanopores for these experiments were produced by using the Materials and Methods Nanopores: Solid-state nanopores for these experiments were produced by using the highly focused electron beam of a transmission electron microscope (TEM) to drill a single pore in

More information

Improving signal-to-noise performance for DNA translocation in solid-state nanopores at MHz bandwidths

Improving signal-to-noise performance for DNA translocation in solid-state nanopores at MHz bandwidths Supporting Information Improving signal-to-noise performance for DNA translocation in solid-state nanopores at MHz bandwidths Adrian Balan *1, Bartholomeus Machielse *1, David Niedzwiecki 1, Jianxun Lin

More information

Electrochemical fouling of dopamine and recovery of carbon electrodes

Electrochemical fouling of dopamine and recovery of carbon electrodes Supporting Information Electrochemical fouling of dopamine and recovery of carbon electrodes Emilia Peltola 1,2*, Sami Sainio 1, Katherine B. Holt 2, Tommi Palomäki 1, Jari Koskinen 3, Tomi Laurila 1 1

More information

CUSTOM RETICLE SOLUTIONS

CUSTOM RETICLE SOLUTIONS CUSTOM RETICLE SOLUTIONS Special Micro Structures Pyser-SGI has over 60 years experience in producing high quality micro structure products. These products are supplied worldwide to industries including

More information

STRAIN GAUGES YEDITEPE UNIVERSITY DEPARTMENT OF MECHANICAL ENGINEERING

STRAIN GAUGES YEDITEPE UNIVERSITY DEPARTMENT OF MECHANICAL ENGINEERING STRAIN GAUGES YEDITEPE UNIVERSITY DEPARTMENT OF MECHANICAL ENGINEERING 1 YEDITEPE UNIVERSITY ENGINEERING FACULTY MECHANICAL ENGINEERING LABORATORY 1. Objective: Strain Gauges Know how the change in resistance

More information

Title: ASML Stepper Semiconductor & Microsystems Fabrication Laboratory Revision: B Rev Date: 12/21/2010

Title: ASML Stepper Semiconductor & Microsystems Fabrication Laboratory Revision: B Rev Date: 12/21/2010 Approved by: Process Engineer / / / / Equipment Engineer 1 SCOPE The purpose of this document is to detail the use of the ASML PAS 5500 Stepper. All users are expected to have read and understood this

More information

AXTRUSION SUPPLEMENTARY MATERIALS. An approximate formula for estimating a bearing s stiffness is 1. P s A 2 h

AXTRUSION SUPPLEMENTARY MATERIALS. An approximate formula for estimating a bearing s stiffness is 1. P s A 2 h Appendix A AXTRUSION SUPPLEMENTARY MATERIALS A. Carriage Stiffness Estimates This section describes the steps to predict the stiffness performance of the carriage. First an accurate stiffness model of

More information

Strain, Force, and Pressure

Strain, Force, and Pressure 10-1 10-1 Strain, Force, and Pressure Force is that which results in acceleration (when forces don t cancel). Strain is the change in shape of an object...... usually due to some force. (Force is usually

More information

Supporting Information for: Inkjet Printing of High Conductivity, Flexible Graphene Patterns

Supporting Information for: Inkjet Printing of High Conductivity, Flexible Graphene Patterns Supporting Information for: Inkjet Printing of High Conductivity, Flexible Graphene Patterns Ethan B. Secor, Pradyumna L. Prabhumirashi, Kanan Puntambekar, Michael L. Geier, and,,, * Mark C. Hersam Department

More information

DEA. Dielectric Cure Monitoring

DEA. Dielectric Cure Monitoring E Dielectric Cure Monitoring DEA Dielectric Analysis (DEA) for Cure Monitoring and More... Dipolar and Ionic Behavior The NETZSCH Dielectric Cure Monitoring Systems are based on technology and research

More information

SUPPORTING INFORMATION: Titanium Contacts to Graphene: Process-Induced Variability in Electronic and Thermal Transport

SUPPORTING INFORMATION: Titanium Contacts to Graphene: Process-Induced Variability in Electronic and Thermal Transport SUPPORTING INFORMATION: Titanium Contacts to Graphene: Process-Induced Variability in Electronic and Thermal Transport Keren M. Freedy 1, Ashutosh Giri 2, Brian M. Foley 2, Matthew R. Barone 1, Patrick

More information

DEPARTMENT OF ELECTRICAL ENGINEERING DIT UNIVERSITY HIGH VOLTAGE ENGINEERING

DEPARTMENT OF ELECTRICAL ENGINEERING DIT UNIVERSITY HIGH VOLTAGE ENGINEERING UNIT 1: BREAKDOWN IN SOLIDS 1.) Introduction: The solid dielectric materials are used in all kinds of electrical apparatus and devices to insulate current carrying part from another when they operate at

More information

Solution-processable graphene nanomeshes with controlled

Solution-processable graphene nanomeshes with controlled Supporting online materials for Solution-processable graphene nanomeshes with controlled pore structures Xiluan Wang, 1 Liying Jiao, 1 Kaixuan Sheng, 1 Chun Li, 1 Liming Dai 2, * & Gaoquan Shi 1, * 1 Department

More information

Capacitive Sensors. Contents

Capacitive Sensors. Contents Contents Capacitive sensors detect the change in capacitance caused by the approach of an object. Their advantage lies in the ability to detect virtually any material, from metals to oils. 4.2 Definitions,

More information

University of Pennsylvania Center for Sensor Technologies PORPHYRIN THIN FILM DIELECTRICS

University of Pennsylvania Center for Sensor Technologies PORPHYRIN THIN FILM DIELECTRICS SUNFEST Technical Report TR-CST01NOV04, Center for Sensor Technologies, Univ. of Pennsylvania, Philadelphia, PA, 2004 University of Pennsylvania Center for Sensor Technologies SUNFEST NSF REU Program Summer

More information

Supplementary information

Supplementary information Supplementary information Highly Conductive Graphene/Ag Hybrid Fibers for Flexible Fiber-Type Transistors Sang Su Yoon, 1 Kang Eun Lee, 1 Hwa-Jin Cha, 1 Dong Gi Seong, 1 Moon-Kwang Um, 1 Joon Hyung Byun,

More information

Technology Brief 9: Capacitive Sensors

Technology Brief 9: Capacitive Sensors 218 TEHNOLOGY BRIEF 9: APAITIVE SENSORS Technology Brief 9: apacitive Sensors To sense is to respond to a stimulus. (See Tech Brief 7 on resistive sensors.) A capacitor can function as a sensor if the

More information

Ferroelectric Zinc Oxide Nanowire Embedded Flexible. Sensor for Motion and Temperature Sensing

Ferroelectric Zinc Oxide Nanowire Embedded Flexible. Sensor for Motion and Temperature Sensing Supporting information for: Ferroelectric Zinc Oxide Nanowire Embedded Flexible Sensor for Motion and Temperature Sensing Sung-Ho Shin 1, Dae Hoon Park 1, Joo-Yun Jung 2, Min Hyung Lee 3, Junghyo Nah 1,*

More information

SENSORS and TRANSDUCERS

SENSORS and TRANSDUCERS SENSORS and TRANSDUCERS Tadeusz Stepinski, Signaler och system The Mechanical Energy Domain Physics Surface acoustic waves Silicon microresonators Variable resistance sensors Piezoelectric sensors Capacitive

More information

Supplementary materials for: Large scale arrays of single layer graphene resonators

Supplementary materials for: Large scale arrays of single layer graphene resonators Supplementary materials for: Large scale arrays of single layer graphene resonators Arend M. van der Zande* 1, Robert A. Barton 2, Jonathan S. Alden 2, Carlos S. Ruiz-Vargas 2, William S. Whitney 1, Phi

More information

SUPPORTING INFORMATION

SUPPORTING INFORMATION Electronic Supplementary Material (ESI) for Nanoscale. This journal is The Royal Society of Chemistry 2014 SUPPORTING INFORMATION Materials Graphite powder (SP-1 graphite) was obtained from Bay carbon.

More information

Visualizing the bi-directional electron transfer in a Schottky junction consisted of single CdS nanoparticles and a planar gold film

Visualizing the bi-directional electron transfer in a Schottky junction consisted of single CdS nanoparticles and a planar gold film Electronic Supplementary Material (ESI) for Chemical Science. This journal is The Royal Society of Chemistry 2017 Electronic Supplementary Information Visualizing the bi-directional electron transfer in

More information

FILM DIELECTRICS USED IN FILM CAPACITOR PRODUCTS

FILM DIELECTRICS USED IN FILM CAPACITOR PRODUCTS FILM DIELECTRICS USED IN FILM CAPACITOR PRODUCTS Overview PARAMETER Dielectric constant: DIELECTRIC (1) KT KN KI KP UNIT at 1 khz 3.3 3.0 3.0. Dissipation factor at 1 khz 50 40 3 1 10-4 at 10 khz 110 6

More information

Sensors, Signals and Noise 1 COURSE OUTLINE. Introduction Signals and Noise Filtering Sensors: Strain Gauges. Signal Recovery, 2017/2018 Strain Gauges

Sensors, Signals and Noise 1 COURSE OUTLINE. Introduction Signals and Noise Filtering Sensors: Strain Gauges. Signal Recovery, 2017/2018 Strain Gauges Sensors, Signals and Noise 1 COURSE OUTLINE Introduction Signals and Noise Filtering Sensors: Strain Gauges Strain Gauges 2 Stress and strain in elastic materials Piezoresistive Effect Strain Gauge principle

More information

Pattern Transfer- photolithography

Pattern Transfer- photolithography Pattern Transfer- photolithography DUV : EUV : 13 nm 248 (KrF), 193 (ArF), 157 (F 2 )nm H line: 400 nm I line: 365 nm G line: 436 nm Wavelength (nm) High pressure Hg arc lamp emission Ref: Campbell: 7

More information

Quantitative Measurement of Sweat as a Diagnostic. Abstract

Quantitative Measurement of Sweat as a Diagnostic. Abstract Joel Therneau In collaboration with Dr. Stephen Campbell, Jun Young Lim. Quantitative Measurement of Sweat as a Diagnostic Abstract The metal oxide field-effect transistor (MOSFET) structure is exploited

More information

Elizabethtown College Department of Physics and Engineering PHY104

Elizabethtown College Department of Physics and Engineering PHY104 Elizabethtown College Department of Physics and Engineering PHY104 Lab #7- Capacitors 1. Introduction The capacitor is one of the essential elements of analog circuitry. It is highly useful for its energy

More information

Mechatronics II Laboratory EXPERIMENT #1: FORCE AND TORQUE SENSORS DC Motor Characteristics Dynamometer, Part I

Mechatronics II Laboratory EXPERIMENT #1: FORCE AND TORQUE SENSORS DC Motor Characteristics Dynamometer, Part I Mechatronics II Laboratory EXPEIMENT #1: FOCE AND TOQUE SENSOS DC Motor Characteristics Dynamometer, Part I Force Sensors Force and torque are not measured directly. Typically, the deformation or strain

More information

Temporary Wafer Bonding - Key Technology for 3D-MEMS Integration

Temporary Wafer Bonding - Key Technology for 3D-MEMS Integration Temporary Wafer Bonding - Key Technology for 3D-MEMS Integration 2016-06-15, Chemnitz Chemnitz University of Technology Basic Research Fraunhofer ENAS System-Packaging (SP) Back-End of Line (BEOL) Applied

More information

Supporting Information. Temperature dependence on charge transport behavior of threedimensional

Supporting Information. Temperature dependence on charge transport behavior of threedimensional Supporting Information Temperature dependence on charge transport behavior of threedimensional superlattice crystals A. Sreekumaran Nair and K. Kimura* University of Hyogo, Graduate School of Material

More information

- CAUTION AND WARNING -

- CAUTION AND WARNING - - CAUTION AND WARNING - Please contact us for complete technical specification before use and confirm the appropriate condition of your application. If used in a specific appliance that requires an extremely

More information

Three-dimensional flexible and conductive interconnected graphene networks grown by chemical vapour deposition

Three-dimensional flexible and conductive interconnected graphene networks grown by chemical vapour deposition SUPPLEMENTARY INFORMATION Three-dimensional flexible and conductive interconnected graphene networks grown by chemical vapour deposition S1. Characterization of the graphene foam (GF) and GF/PDMS composites

More information

A Carbon-Based Photocatalyst Efficiently Converted CO 2 to CH 4

A Carbon-Based Photocatalyst Efficiently Converted CO 2 to CH 4 Supporting information A Carbon-Based Photocatalyst Efficiently Converted CO 2 to CH 4 and C 2 H 2 In Visible Light Tongshun Wu, a Luyi Zou, b Dongxue Han, *a Fenghua Li, a Qixian Zhang a and Li Niu a

More information

Techniken der Oberflächenphysik (Techniques of Surface Physics)

Techniken der Oberflächenphysik (Techniques of Surface Physics) Techniken der Oberflächenphysik (Techniques of Surface Physics) Prof. Yong Lei & Dr. Yang Xu (& Liying Liang) Fachgebiet 3D-Nanostrukturierung, Institut für Physik Contact: yong.lei@tu-ilmenau.de; yang.xu@tu-ilmenau.de;

More information

Nanofabrication Lab Process Development for High-k Dielectrics

Nanofabrication Lab Process Development for High-k Dielectrics Nanofabrication Lab Process Development for Highk Dielectrics Each lab group consists of 4 to 5 students. The dates of these Labs are: Lab 1 Date 14.02.2013 Time: 812 am Lab 2 Date 14.02.2013 Time: 15

More information

Hopping in CVD Grown Single-layer MoS 2

Hopping in CVD Grown Single-layer MoS 2 Supporting Information for Large Thermoelectricity via Variable Range Hopping in CVD Grown Single-layer MoS 2 Jing Wu 1,2,3, Hennrik Schmidt 1,2, Kiran Kumar Amara 4, Xiangfan Xu 5, Goki Eda 1,2,4, and

More information

Superconducting-Insulating Quantum Phase Transition in Homogenous Thin Films

Superconducting-Insulating Quantum Phase Transition in Homogenous Thin Films Superconducting-Insulating Quantum Phase Transition in Homogenous Thin Films Jonathan K. Whitmer Department of Physics, University of Illinois at Urbana-Champaign 1110 West Green Street, Urbana, IL 61801,

More information

The strain response of silicone dielectric elastomer actuators

The strain response of silicone dielectric elastomer actuators The strain response of silicone dielectric elastomer actuators G. Yang a, G. Yao b, W. Ren a, G. Akhras b, J.P. Szabo c and B.K. Mukherjee a* a Department of Physics, Royal Military College of Canada,

More information