ESE 570: Digital Integrated Circuits and VLSI Fundamentals

Size: px
Start display at page:

Download "ESE 570: Digital Integrated Circuits and VLSI Fundamentals"

Transcription

1 ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 7: February 4, 2016 MOS SPICE Models, MOS Parasitic Details

2 Lecture Outline! MOS Capacitances " Extrinsic " Intrinsic! Lumped Capacitance Model! First Order Capacitor Summary! Capacitance Implications 2

3 Review: nmos IV Characteristics I D = I S! # " W L! # " $ &e % V GS V th nkt /q $ & %!! # " 1 e # " V DS $ & kt /q % $ & 1+ λv DS % ( ) V GS V Tn Subthreshold µ n C ox W ( 2 L 2 ( V GS V Tn (V SB ))V DS V 2 DS )(1+ λ V DS ) V GS > V Tn,V DS < V GS Linear µ n C ox W ( 2 L V V (V ) GS Tn SB ) 2 (1+ λ V DS ) V GS > V Tn,V DS V GS V Tn Saturation, v sat C OX W ( V GS V th ) V / dsat E y > E cn (short channel) Velocity Saturation 3

4 Simplified Design Flow! Design a circuit to perform a function with specified minimum speed and optimized power (minimized with an upper bound) " Zero order model to design topology " First order model to meet speed spec " Rise/fall times, propogation delay, gate capacitance, output stage equivalent resistance " Transistor IV curves today " Iterative SPICE simulation tweak knobs to optimize for power (switching (dynamic), leakage (static), etc.) 4

5 MOSFET Parasitic Capacitance! Any two conductors separated by an insulator form a parallel-plate capacitor! Two types " Extrinsic Outside the box (e.g. junction, overlap) " Intrinsic Inside the box (e.g. gate-to-channel) 5

6 Capacitance Roundup! C GS =C GCS +C GSO! C GD =C GCD +C GDO! C GB =C GCB! C SB =C diff! C DB =C diff intrinsic extrinsic 6

7 Extrinsic Overlap Capacitance

8 Overlap! gate/source and gate/drain overlap 8

9 Overlap! Length of overlap L D = L M L eff 2 L M L D L eff 9

10 Overlap Capacitance L M L D C = ε r ε 0 A d L eff C o = ε ox WL D t ox 10

11 Overlap Capacitance L M L D C = ε r ε 0 A d L eff C OX = ε OX t OX C o = ε ox WL D t ox C o = C ox WL D 11

12 Overlap Capacitance L M L D C = ε r ε 0 A d L eff C OX = ε OX t OX C o = ε ox WL D t ox C o = C ox WL D = C GSO = C GDO 12

13 Overlap Capacitance! It turns out that fringing field lines add significantly to the total capacitance! Estimates of the fringing field capacitances based on measurements are normally used! The gate-to-drain overlap capacitances are generally given as measured parameters in the MOSFET model files! The values are per-width values 13

14 Overlap Capacitance Name LEVEL Model Parameters Model type (1, 2, or 3) Units CBD Bulk-drain zero-bias p-n cap (not used) F CBS Bulk-source zero-bias p-n cap (not used) F CJ Bulk p-n zero-bias bottom cap/area F/m**2 CJSW Bulk p-n zero-bias perimeter cap/length F/m MJ Bulk p-n bottom grading coefficient MJSW Bulk p-n sidewall grading coefficient FC Empirical bulk p-n forward-bias cap coefficient CGSO Gate-source overlap cap/channel width F/m CGDO Gate-drain overlap cap/channel width F/m CGBO Gate-bulk overlap cap/channel width F/m NSUB Substate doping density 1/cm**3 NSS NFS Surface-state density Fast surface-state density 1/cm**2 1/cm**2 TOX Oxide thickness m TPG Gate material type: + 1 = opposite of substrate, - 1 = same as substrate, 0 = aluminum XJ Metallurgical junction depth m Scales with Width (W) 14

15 Extrinsic Junction Capacitance

16 Diode Capacitance! When a reverse voltage is applied to a PN junction, a depletion region containing almost no charge carriers is generated and acts similarly to the dielectric of a capacitor.! The depletion region increases in width as the reverse voltage across it increases.! If we imagine that the diode capacitance can be likened to a parallel plate capacitor, then as the plate spacing (i.e. the depletion region width) increases, the capacitance should decrease.! Increasing the reverse bias voltage across the PN junction therefore decreases the diode capacitance.! Worst case is in zero-bias case 16

17 Junction Capacitance n + n + 17

18 Junction Capacitance! 1 * -4: Sidewall Junction Capacitance, C jsw! 5: (Bottom) Junction Capacitance, C j 18

19 (Bottom) Junction Capacitance n + n + N D + V = Ext Bias --> V SB, V DB 19

20 (Bottom) Junction Capacitance n + n + N D + V = Ext Bias --> V SB, V DB C j0 = ε si x d = ε si q 2 N A N D N A + N D 1 φ 0 Zero-bias capacitance (F/cm 2 ) 20

21 Sidewall Junction Capacitance C j0sw = ε si q 2 N A (sw) N D N A (sw)+ N D 1 φ 0 (F/cm 2 ) (F/cm) 21

22 Junction Capacitance 22

23 Junction Capacitance C diff = C j WY + C jsw ( 2Y +W ) 23

24 Junction Capacitance Name LEVEL Model Parameters Model type (1, 2, or 3) Units CBD Bulk-drain zero-bias p-n cap (not used) F CBS Bulk-source zero-bias p-n cap (not used) F CJ Bulk p-n zero-bias bottom cap/area F/m**2 CJSW Bulk p-n zero-bias perimeter cap/length F/m MJ Bulk p-n bottom grading coefficient MJSW Bulk p-n sidewall grading coefficient FC Empirical bulk p-n forward-bias cap coefficient CGSO Gate-source overlap cap/channel width F/m CGDO Gate-drain overlap cap/channel width F/m CGBO Gate-bulk overlap cap/channel width F/m NSUB Substate doping density 1/cm**3 NSS NFS Surface-state density Fast surface-state density 1/cm**2 1/cm**2 TOX Oxide thickness m TPG Gate material type: + 1 = opposite of substrate, - 1 = same as substrate, 0 = aluminum XJ Metallurgical junction depth m Scales with Junction area or width 24

25 Capacitance Roundup! C GS =C GCS +C GSO! C GD =C GCD +C GDO! C GB =C GCB! C SB =C diff! C DB =C diff intrinsic extrinsic 25

26 Intrinsic

27 Gate-to-Channel Capacitance! Looks like parallel plate capacitance! Two components: " What is C GC? " What is C GB? 27

28 Gate-to-Channel Capacitance! Looks like parallel plate capacitance! Two components: Case: Strong Inversion " C GC " C GB =0 C GC = C ox WL eff 28

29 Gate-to-Channel Capacitance! Looks like parallel plate capacitance! Two components: Case: Strong Inversion " C GC Split evenly between S and D " C GB =0 C GC = C ox WL eff C GCS = C GCD = 1 2 C ox WL eff 29

30 Gate-to-Source Capacitance! Channel + Overlap C GS = C GCS + C GSO C GS = C OX WL D C WL " OX eff = C OX W L L M eff $ # 2 % '+ 1 & 2 C WL OX eff C GS = 1 2 C OX WL M 30

31 Gate-to-Drain Capacitance! Channel + Overlap C GD = C GCD + C GDO C GD = C OX WL D C WL " OX eff = C OX W L L M eff $ # 2 % '+ 1 & 2 C WL OX eff C GD = 1 2 C OX WL M 31

32 Channel Evolution: Weak Inversion 32

33 Channel Evolution: Weak Inversion! What happens to capacitance here? " Capacitor plate distance? 33

34 Channel Evolution: Weak Inversion! Capacitance becomes dominated by Gate-to-Body capacitance (C GCS,D =0)! Gate-to-body capacitance drops as V GS increases toward V th 34

35 Capacitance vs V GS (V DS =0) WLC OX C GC 0.5WLC OX C GCS =C GCD C GCB V GS Increasing V GS 35

36 Saturation Capacitance? 36

37 Saturation Capacitance?! Source end of channel in inversion! Voltage at drain end of channel at or below threshold! Capacitance shifts to source " Total capacitance reduced 37

38 Saturation Capacitance WLC OX 0.5WLC OX C GC C GCS C GCD (2/3)WLC OX 0 1 V DS /(V GS -V T ) 38

39 Capacitance Roundup! C GS =C GCS +C GSO! C GD =C GCD +C GDO Simplifiy: what is C G?! C GB =C GCB! C SB =C diff! C DB =C diff intrinsic extrinsic 39

40 First Order Capacitance Summary Opearation Region Subthreshold Linear Saturation C GCB C GCS C GCD C GC C G 40

41 First Order Capacitance Summary Opearation Region Subthreshold C GCB C GCS C GCD C GC C G Linear 0 C OX WL/2 C OX WL/2 Saturation C GCS = C GCD = 1 2 C oxwl effective 41

42 First Order Capacitance Summary Opearation Region C GCB C GCS C GCD C GC C G Subthreshold C OX WL 0 0 Linear 0 C OX WL/2 C OX WL/2 Saturation WLC OX C GC 0.5WLC OX C GCS =C GCD C GCB V GS 42

43 First Order Capacitance Summary Opearation Region C GCB C GCS C GCD C GC C G Subthreshold C OX WL 0 0 Linear 0 C OX WL/2 C OX WL/2 Saturation 0 (2/3)C OX WL 0 WLC OX 0.5WLC OX C GC C GCS C GCD (2/3)WLC OX 0 1 V DS /(V GS -V T ) 43

44 First Order Capacitance Summary Opearation Region + + = C GCB C GCS C GCD C GC C G Subthreshold C OX WL 0 0 C OX WL Linear 0 C OX WL/2 C OX WL/2 C OX WL Saturation 0 (2/3)C OX WL 0 (2/3)C OX WL 44

45 First Order Capacitance Summary Opearation Region C GCB C GCS C GCD C GC C G Subthreshold C OX WL 0 0 C OX WL C OX WL+2C O Linear 0 C OX WL/2 C OX WL/2 C OX WL C OX WL+2C O Saturation 0 (2/3)C OX WL 0 (2/3)C OX WL (2/3)C OX WL +2C O C o = C ox WL D = C GSO = C GDO 45

46 Capacitance Roundup! C GS =C GCS +C GSO! C GD =C GCD +C GDO! C GB =C GCB! C SB =C diff! C DB =C diff intrinsic extrinsic 46

47 One Implication 47

48 Step Response? 48

49 Step Response Voltage peaking! 49

50 Impact of C GD! What does C GD do to the switching response here? " V 2 " V out 50

51 Impact of C GD 51

52 Big Idea! Capacitance " From-To every terminal " Voltage dependent WLC OX C GC 0.5WLC OX C GCS =C GCD C GCB V GS WLC OX 0.5WLC OX C GC C GCS C GCD 0 1 V DS /(V GS -V T ) (2/3)WLC OX 52

53 Journal Thursday Fengbo Ren, A Configurable ks/s 12.8 mw Sparse-Approximation Engine for Mobile Data Aggregation of Compressively Sampled Physiological Signals

54 Compressive Sampling! Sample at lower than the Nyquist rate and still accurately recover the signal, and in some cases exactly recover 54

55 Compressive Sampling! Sample at lower than the Nyquist rate and still accurately recover the signal, and in some cases exactly recover Sparse signal in time Frequency spectrum 55

56 Compressive Sampling! Sample at lower than the Nyquist rate and still accurately recover the signal, and in some cases exactly recover Undersampled in time 56

57 Compressive Sampling! Sample at lower than the Nyquist rate and still accurately recover the signal, and in some cases exactly recover Undersampled in time Undersampled in frequency (reconstructed in time with IFFT) 57

58 Compressive Sampling! Sample at lower than the Nyquist rate and still accurately recover the signal, and in some cases exactly recover! Requires sparsity and incoherent sampling Undersampled in time Undersampled in frequency (reconstructed in time with IFFT) 58

59 Example: Sum of Sinusoids! Sense signal randomly M times " M > C μ2(φ,ψ) S log N! Recover with linear program 59

60 Compressive Sampling Implications! Useful for real-time signal reconstruction to promote on-site analysis and processing for realtime applications " Timely prediction and decision-making! data size for on-site storage or transmission to the cloud can be further reduced " Save on power hungry memory operations with reduced data " Shuffle-mode memory scheme to reduce memory size/ space and therefore leakage " Reported 2x memory size reduction, and 40% power savings due to leakage reduction 60

61 Chip Implementation! 40nm CMOS Process! Leakage reduction using high-threshold (HVT) standard cells only! I DS = I S # " W L $ &e %! # " V GS V th nkt /q $ & %!! # " 1 e # " V DS $ & kt /q % $ & 1+ λv DS % ( ) " Standard-threshold (SVT) devices used to reduce delay in critical paths 61

62 Admin! HW 4 due Thursday, 2/18! Homework posted over the weekend " Need next weeks lectures to complete 62

! MOS Capacitances. " Extrinsic. " Intrinsic. ! Lumped Capacitance Model. ! First Order Capacitor Summary. ! Capacitance Implications

! MOS Capacitances.  Extrinsic.  Intrinsic. ! Lumped Capacitance Model. ! First Order Capacitor Summary. ! Capacitance Implications ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 7: February, 07 MOS SPICE Models, MOS Parasitic Details Lecture Outline! MOS Capacitances " Extrinsic " Intrinsic! Lumped Capacitance Model!

More information

ESE 570: Digital Integrated Circuits and VLSI Fundamentals

ESE 570: Digital Integrated Circuits and VLSI Fundamentals ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 6: January 30, 2018 MOS Operating Regions, pt. 2 Lecture Outline! Operating Regions (review) " Subthreshold " Resistive " Saturation! Intro.

More information

The Devices. Devices

The Devices. Devices The The MOS Transistor Gate Oxyde Gate Source n+ Polysilicon Drain n+ Field-Oxyde (SiO 2 ) p-substrate p+ stopper Bulk Contact CROSS-SECTION of NMOS Transistor Cross-Section of CMOS Technology MOS transistors

More information

EE115C Winter 2017 Digital Electronic Circuits. Lecture 3: MOS RC Model, CMOS Manufacturing

EE115C Winter 2017 Digital Electronic Circuits. Lecture 3: MOS RC Model, CMOS Manufacturing EE115C Winter 2017 Digital Electronic Circuits Lecture 3: MOS RC Model, CMOS Manufacturing Agenda MOS Transistor: RC Model (pp. 104-113) S R on D CMOS Manufacturing Process (pp. 36-46) S S C GS G G C GD

More information

MOSFET: Introduction

MOSFET: Introduction E&CE 437 Integrated VLSI Systems MOS Transistor 1 of 30 MOSFET: Introduction Metal oxide semiconductor field effect transistor (MOSFET) or MOS is widely used for implementing digital designs Its major

More information

VLSI Design and Simulation

VLSI Design and Simulation VLSI Design and Simulation Performance Characterization Topics Performance Characterization Resistance Estimation Capacitance Estimation Inductance Estimation Performance Characterization Inverter Voltage

More information

The Devices. Digital Integrated Circuits A Design Perspective. Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic. July 30, 2002

The Devices. Digital Integrated Circuits A Design Perspective. Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic. July 30, 2002 Digital Integrated Circuits A Design Perspective Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic The Devices July 30, 2002 Goal of this chapter Present intuitive understanding of device operation Introduction

More information

EEC 118 Lecture #2: MOSFET Structure and Basic Operation. Rajeevan Amirtharajah University of California, Davis Jeff Parkhurst Intel Corporation

EEC 118 Lecture #2: MOSFET Structure and Basic Operation. Rajeevan Amirtharajah University of California, Davis Jeff Parkhurst Intel Corporation EEC 118 Lecture #2: MOSFET Structure and Basic Operation Rajeevan Amirtharajah University of California, Davis Jeff Parkhurst Intel Corporation Announcements Lab 1 this week, report due next week Bring

More information

ESE 570: Digital Integrated Circuits and VLSI Fundamentals

ESE 570: Digital Integrated Circuits and VLSI Fundamentals ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 5: January 25, 2018 MOS Operating Regions, pt. 1 Lecture Outline! 3 Regions of operation for MOSFET " Subthreshold " Linear " Saturation!

More information

University of Pennsylvania Department of Electrical Engineering. ESE 570 Midterm Exam March 14, 2013 FORMULAS AND DATA

University of Pennsylvania Department of Electrical Engineering. ESE 570 Midterm Exam March 14, 2013 FORMULAS AND DATA University of Pennsylvania Department of Electrical Engineering ESE 570 Midterm Exam March 4, 03 FORMULAS AND DATA. PHYSICAL CONSTANTS: n i = intrinsic concentration undoped) silicon =.45 x 0 0 cm -3 @

More information

HW 5 posted due in two weeks Lab this week Midterm graded Project to be launched in week 7

HW 5 posted due in two weeks Lab this week Midterm graded Project to be launched in week 7 HW 5 posted due in two weeks Lab this week Midterm graded Project to be launched in week 7 2 What do digital IC designers need to know? 5 EE4 EECS4 6 3 0< V GS - V T < V DS Pinch-off 7 For (V GS V T )

More information

MOS Transistor I-V Characteristics and Parasitics

MOS Transistor I-V Characteristics and Parasitics ECEN454 Digital Integrated Circuit Design MOS Transistor I-V Characteristics and Parasitics ECEN 454 Facts about Transistors So far, we have treated transistors as ideal switches An ON transistor passes

More information

ESE 570 MOS TRANSISTOR THEORY Part 2

ESE 570 MOS TRANSISTOR THEORY Part 2 ESE 570 MOS TRANSISTOR THEORY Part 2 GCA (gradual channel approximation) MOS Transistor Model Strong Inversion Operation CMOS = NMOS + PMOS 2 TwoTerminal MOS Capacitor > nmos Transistor VGS

More information

Chapter 4 Field-Effect Transistors

Chapter 4 Field-Effect Transistors Chapter 4 Field-Effect Transistors Microelectronic Circuit Design Richard C. Jaeger Travis N. Blalock 5/5/11 Chap 4-1 Chapter Goals Describe operation of MOSFETs. Define FET characteristics in operation

More information

EE 560 MOS TRANSISTOR THEORY PART 2. Kenneth R. Laker, University of Pennsylvania

EE 560 MOS TRANSISTOR THEORY PART 2. Kenneth R. Laker, University of Pennsylvania 1 EE 560 MOS TRANSISTOR THEORY PART nmos TRANSISTOR IN LINEAR REGION V S = 0 V G > V T0 channel SiO V D = small 4 C GC C BC substrate depletion region or bulk B p nmos TRANSISTOR AT EDGE OF SATURATION

More information

MOSFET Capacitance Model

MOSFET Capacitance Model MOSFET Capacitance Model So far we discussed the MOSFET DC models. In real circuit operation, the device operates under time varying terminal voltages and the device operation can be described by: 1 small

More information

Lecture 3: CMOS Transistor Theory

Lecture 3: CMOS Transistor Theory Lecture 3: CMOS Transistor Theory Outline Introduction MOS Capacitor nmos I-V Characteristics pmos I-V Characteristics Gate and Diffusion Capacitance 2 Introduction So far, we have treated transistors

More information

EEC 116 Lecture #3: CMOS Inverters MOS Scaling. Rajeevan Amirtharajah University of California, Davis Jeff Parkhurst Intel Corporation

EEC 116 Lecture #3: CMOS Inverters MOS Scaling. Rajeevan Amirtharajah University of California, Davis Jeff Parkhurst Intel Corporation EEC 116 Lecture #3: CMOS Inverters MOS Scaling Rajeevan Amirtharajah University of California, Davis Jeff Parhurst Intel Corporation Outline Review: Inverter Transfer Characteristics Lecture 3: Noise Margins,

More information

Check course home page periodically for announcements. Homework 2 is due TODAY by 5pm In 240 Cory

Check course home page periodically for announcements. Homework 2 is due TODAY by 5pm In 240 Cory EE141 Fall 005 Lecture 6 MOS Capacitances, Propagation elay Important! Check course home page periodically for announcements Homework is due TOAY by 5pm In 40 Cory Homework 3 will be posted TOAY ue Thursday

More information

The Devices: MOS Transistors

The Devices: MOS Transistors The Devices: MOS Transistors References: Semiconductor Device Fundamentals, R. F. Pierret, Addison-Wesley Digital Integrated Circuits: A Design Perspective, J. Rabaey et.al. Prentice Hall NMOS Transistor

More information

VLSI Design The MOS Transistor

VLSI Design The MOS Transistor VLSI Design The MOS Transistor Frank Sill Torres Universidade Federal de Minas Gerais (UFMG), Brazil VLSI Design: CMOS Technology 1 Outline Introduction MOS Capacitor nmos I-V Characteristics pmos I-V

More information

Lecture 4: CMOS Transistor Theory

Lecture 4: CMOS Transistor Theory Introduction to CMOS VLSI Design Lecture 4: CMOS Transistor Theory David Harris, Harvey Mudd College Kartik Mohanram and Steven Levitan University of Pittsburgh Outline q Introduction q MOS Capacitor q

More information

Lecture 5: CMOS Transistor Theory

Lecture 5: CMOS Transistor Theory Lecture 5: CMOS Transistor Theory Slides courtesy of Deming Chen Slides based on the initial set from David Harris CMOS VLSI Design Outline q q q q q q q Introduction MOS Capacitor nmos I-V Characteristics

More information

ESE 570: Digital Integrated Circuits and VLSI Fundamentals

ESE 570: Digital Integrated Circuits and VLSI Fundamentals ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 4: January 23, 2018 MOS Transistor Theory, MOS Model Penn ESE 570 Spring 2018 Khanna Lecture Outline! CMOS Process Enhancements! Semiconductor

More information

MOS Transistor Theory

MOS Transistor Theory CHAPTER 3 MOS Transistor Theory Outline 2 1. Introduction 2. Ideal I-V Characteristics 3. Nonideal I-V Effects 4. C-V Characteristics 5. DC Transfer Characteristics 6. Switch-level RC Delay Models MOS

More information

ELEC 3908, Physical Electronics, Lecture 26. MOSFET Small Signal Modelling

ELEC 3908, Physical Electronics, Lecture 26. MOSFET Small Signal Modelling ELEC 3908, Physical Electronics, Lecture 26 MOSFET Small Signal Modelling Lecture Outline MOSFET small signal behavior will be considered in the same way as for the diode and BJT Capacitances will be considered

More information

Device Models (PN Diode, MOSFET )

Device Models (PN Diode, MOSFET ) Device Models (PN Diode, MOSFET ) Instructor: Steven P. Levitan steve@ece.pitt.edu TA: Gayatri Mehta, José Martínez Book: Digital Integrated Circuits: A Design Perspective; Jan Rabaey Lab Notes: Handed

More information

CMPEN 411 VLSI Digital Circuits. Lecture 03: MOS Transistor

CMPEN 411 VLSI Digital Circuits. Lecture 03: MOS Transistor CMPEN 411 VLSI Digital Circuits Lecture 03: MOS Transistor Kyusun Choi [Adapted from Rabaey s Digital Integrated Circuits, Second Edition, 2003 J. Rabaey, A. Chandrakasan, B. Nikolic] CMPEN 411 L03 S.1

More information

ESE 570: Digital Integrated Circuits and VLSI Fundamentals

ESE 570: Digital Integrated Circuits and VLSI Fundamentals ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 4: January 24, 2017 MOS Transistor Theory, MOS Model Penn ESE 570 Spring 2017 Khanna Lecture Outline! Semiconductor Physics " Band gaps "

More information

Circuits. L2: MOS Models-2 (1 st Aug. 2013) B. Mazhari Dept. of EE, IIT Kanpur. B. Mazhari, IITK. G-Number

Circuits. L2: MOS Models-2 (1 st Aug. 2013) B. Mazhari Dept. of EE, IIT Kanpur. B. Mazhari, IITK. G-Number EE610: CMOS Analog Circuits L: MOS Models- (1 st Aug. 013) B. Mazhari Dept. of EE, IIT Kanpur 3 NMOS Models MOS MODEL Above Threshold Subthreshold ( GS > TN ) ( GS < TN ) Saturation ti Ti Triode ( DS >

More information

EE5311- Digital IC Design

EE5311- Digital IC Design EE5311- Digital IC Design Module 1 - The Transistor Janakiraman V Assistant Professor Department of Electrical Engineering Indian Institute of Technology Madras Chennai October 28, 2017 Janakiraman, IITM

More information

Device Models (PN Diode, MOSFET )

Device Models (PN Diode, MOSFET ) Device Models (PN Diode, MOSFET ) Instructor: Steven P. Levitan steve@ece.pitt.edu TA: Gayatri Mehta, José Martínez Book: Digital Integrated Circuits: A Design Perspective; Jan Rabaey Lab Notes: Handed

More information

ESE570 Spring University of Pennsylvania Department of Electrical and System Engineering Digital Integrated Cicruits AND VLSI Fundamentals

ESE570 Spring University of Pennsylvania Department of Electrical and System Engineering Digital Integrated Cicruits AND VLSI Fundamentals University of Pennsylvania Department of Electrical and System Engineering Digital Integrated Cicruits AND VLSI Fundamentals ESE570, Spring 2018 Final Monday, Apr 0 5 Problems with point weightings shown.

More information

ECE321 Electronics I

ECE321 Electronics I EE31 Electronics I Lecture 8: MOSET Threshold Voltage and Parasitic apacitances Payman Zarkesh-Ha Office: EE Bldg. 3B Office hours: Tuesday :-3:PM or by appointment E-mail: payman@ece.unm.edu Slide: 1

More information

Lecture Outline. ESE 570: Digital Integrated Circuits and VLSI Fundamentals. Review: MOS Capacitor with External Bias

Lecture Outline. ESE 570: Digital Integrated Circuits and VLSI Fundamentals. Review: MOS Capacitor with External Bias ESE 57: Digital Integrated Circuits and VLSI Fundamentals Lec 5: Januar 6, 17 MOS Operating Regions, pt. 1 Lecture Outline! 3 Regions of operation for MOSFET " Subthreshold " Linear " Saturation! Level

More information

MOS Transistor Theory MOSFET Symbols Current Characteristics of MOSFET. MOS Symbols and Characteristics. nmos Enhancement Transistor

MOS Transistor Theory MOSFET Symbols Current Characteristics of MOSFET. MOS Symbols and Characteristics. nmos Enhancement Transistor MOS Transistor Theory MOSFET Symbols Current Characteristics of MOSFET Calculation of t and Important 2 nd Order Effects SmallSignal Signal MOSFET Model Summary Material from: CMOS LSI Design By Weste

More information

Digital Microelectronic Circuits ( )

Digital Microelectronic Circuits ( ) Digital Microelectronic ircuits (361-1-3021 ) Presented by: Dr. Alex Fish Lecture 5: Parasitic apacitance and Driving a Load 1 Motivation Thus far, we have learned how to model our essential building block,

More information

EE105 Fall 2014 Microelectronic Devices and Circuits. NMOS Transistor Capacitances: Saturation Region

EE105 Fall 2014 Microelectronic Devices and Circuits. NMOS Transistor Capacitances: Saturation Region EE105 Fall 014 Microelectronic Devices and Circuits Prof. Ming C. Wu wu@eecs.berkeley.edu 511 Sutardja Dai Hall (SDH) 1 NMOS Transistor Capacitances: Saturation Region Drain no longer connected to channel

More information

Lecture 10 MOSFET (III) MOSFET Equivalent Circuit Models

Lecture 10 MOSFET (III) MOSFET Equivalent Circuit Models Lecture 10 MOSFET (III) MOSFET Equivalent Circuit Models Outline Lowfrequency smallsignal equivalent circuit model Highfrequency smallsignal equivalent circuit model Reading Assignment: Howe and Sodini;

More information

Announcements. EE141- Fall 2002 Lecture 7. MOS Capacitances Inverter Delay Power

Announcements. EE141- Fall 2002 Lecture 7. MOS Capacitances Inverter Delay Power - Fall 2002 Lecture 7 MOS Capacitances Inverter Delay Power Announcements Wednesday 12-3pm lab cancelled Lab 4 this week Homework 2 due today at 5pm Homework 3 posted tonight Today s lecture MOS capacitances

More information

The Devices. Digital Integrated Circuits A Design Perspective. Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic. July 30, 2002

The Devices. Digital Integrated Circuits A Design Perspective. Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic. July 30, 2002 igital Integrated Circuits A esign Perspective Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic The evices July 30, 2002 Goal of this chapter Present intuitive understanding of device operation Introduction

More information

Introduction to CMOS VLSI. Chapter 2: CMOS Transistor Theory. Harris, 2004 Updated by Li Chen, Outline

Introduction to CMOS VLSI. Chapter 2: CMOS Transistor Theory. Harris, 2004 Updated by Li Chen, Outline Introduction to MOS VLSI Design hapter : MOS Transistor Theory copyright@david Harris, 004 Updated by Li hen, 010 Outline Introduction MOS apacitor nmos IV haracteristics pmos IV haracteristics Gate and

More information

ESE370: Circuit-Level Modeling, Design, and Optimization for Digital Systems. Today. Refinement. Last Time. No Field. Body Contact

ESE370: Circuit-Level Modeling, Design, and Optimization for Digital Systems. Today. Refinement. Last Time. No Field. Body Contact ESE370: Circuit-Level Modeling, Design, and Optimization for Digital Systems Day 10: September 6, 01 MOS Transistor Basics Today MOS Transistor Topology Threshold Operating Regions Resistive Saturation

More information

Digital Integrated Circuits A Design Perspective. Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic. The Devices. July 30, Devices.

Digital Integrated Circuits A Design Perspective. Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic. The Devices. July 30, Devices. Digital Integrated Circuits A Design Perspective Jan M. Rabaey Anantha Chandrakasan Borivoje Nikolic The July 30, 2002 1 Goal of this chapter Present intuitive understanding of device operation Introduction

More information

MOS Transistor Theory

MOS Transistor Theory MOS Transistor Theory So far, we have viewed a MOS transistor as an ideal switch (digital operation) Reality: less than ideal EE 261 Krish Chakrabarty 1 Introduction So far, we have treated transistors

More information

Lecture 15: MOS Transistor models: Body effects, SPICE models. Context. In the last lecture, we discussed the modes of operation of a MOS FET:

Lecture 15: MOS Transistor models: Body effects, SPICE models. Context. In the last lecture, we discussed the modes of operation of a MOS FET: Lecture 15: MOS Transistor models: Body effects, SPICE models Context In the last lecture, we discussed the modes of operation of a MOS FET: oltage controlled resistor model I- curve (Square-Law Model)

More information

Integrated Circuits & Systems

Integrated Circuits & Systems Federal University of Santa Catarina Center for Technology Computer Science & Electronics Engineering Integrated Circuits & Systems INE 5442 Lecture 10 MOSFET part 1 guntzel@inf.ufsc.br ual-well Trench-Isolated

More information

ECE 497 JS Lecture - 12 Device Technologies

ECE 497 JS Lecture - 12 Device Technologies ECE 497 JS Lecture - 12 Device Technologies Spring 2004 Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jose@emlab.uiuc.edu 1 NMOS Transistor 2 ρ Source channel charge density

More information

! CMOS Process Enhancements. ! Semiconductor Physics. " Band gaps. " Field Effects. ! MOS Physics. " Cut-off. " Depletion.

! CMOS Process Enhancements. ! Semiconductor Physics.  Band gaps.  Field Effects. ! MOS Physics.  Cut-off.  Depletion. ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 4: January 3, 018 MOS Transistor Theory, MOS Model Lecture Outline! CMOS Process Enhancements! Semiconductor Physics " Band gaps " Field Effects!

More information

Lecture Outline. ESE 570: Digital Integrated Circuits and VLSI Fundamentals. Review: MOSFET N-Type, P-Type. Semiconductor Physics.

Lecture Outline. ESE 570: Digital Integrated Circuits and VLSI Fundamentals. Review: MOSFET N-Type, P-Type. Semiconductor Physics. ESE 57: Digital Integrated Circuits and VLSI Fundamentals Lec 4: January 24, 217 MOS Transistor Theory, MOS Model Lecture Outline! Semiconductor Physics " Band gaps " Field Effects! MOS Physics " Cutoff

More information

ESE 570: Digital Integrated Circuits and VLSI Fundamentals

ESE 570: Digital Integrated Circuits and VLSI Fundamentals ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 4: January 29, 2019 MOS Transistor Theory, MOS Model Penn ESE 570 Spring 2019 Khanna Lecture Outline! CMOS Process Enhancements! Semiconductor

More information

N Channel MOSFET level 3

N Channel MOSFET level 3 N Channel MOSFET level 3 mosn3 NSource NBulk NSource NBulk NSource NBulk NSource (a) (b) (c) (d) NBulk Figure 1: MOSFET Types Form: mosn3: instance name n 1 n n 3 n n 1 is the drain node, n is the gate

More information

Midterm. ESE 570: Digital Integrated Circuits and VLSI Fundamentals. Lecture Outline. Pass Transistor Logic. Restore Output.

Midterm. ESE 570: Digital Integrated Circuits and VLSI Fundamentals. Lecture Outline. Pass Transistor Logic. Restore Output. ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 16: March 21, 2017 Transmission Gates, Euler Paths, Energy Basics Review Midterm! Midterm " Mean: 79.5 " Standard Dev: 14.5 2 Lecture Outline!

More information

EE 435. Lecture 37. Parasitic Capacitances in MOS Devices. String DAC Parasitic Capacitances

EE 435. Lecture 37. Parasitic Capacitances in MOS Devices. String DAC Parasitic Capacitances EE 435 Lecture 37 Parasitic Capacitances in MOS Devices String DAC Parasitic Capacitances Parasitic Capacitors in MOSFET (will initially consider two) Parasitic Capacitors in MOSFET C GCH Parasitic Capacitors

More information

Chapter 2 CMOS Transistor Theory. Jin-Fu Li Department of Electrical Engineering National Central University Jungli, Taiwan

Chapter 2 CMOS Transistor Theory. Jin-Fu Li Department of Electrical Engineering National Central University Jungli, Taiwan Chapter 2 CMOS Transistor Theory Jin-Fu Li Department of Electrical Engineering National Central University Jungli, Taiwan Outline Introduction MOS Device Design Equation Pass Transistor Jin-Fu Li, EE,

More information

ESE570 Spring University of Pennsylvania Department of Electrical and System Engineering Digital Integrated Cicruits AND VLSI Fundamentals

ESE570 Spring University of Pennsylvania Department of Electrical and System Engineering Digital Integrated Cicruits AND VLSI Fundamentals University of Pennsylvania Department of Electrical and System Engineering Digital Integrated Cicruits AND VLSI Fundamentals ESE570, Spring 2016 Final Friday, May 6 5 Problems with point weightings shown.

More information

EE 560 MOS TRANSISTOR THEORY

EE 560 MOS TRANSISTOR THEORY 1 EE 560 MOS TRANSISTOR THEORY PART 1 TWO TERMINAL MOS STRUCTURE V G (GATE VOLTAGE) 2 GATE OXIDE SiO 2 SUBSTRATE p-type doped Si (N A = 10 15 to 10 16 cm -3 ) t ox V B (SUBSTRATE VOLTAGE) EQUILIBRIUM:

More information

LECTURE 3 MOSFETS II. MOS SCALING What is Scaling?

LECTURE 3 MOSFETS II. MOS SCALING What is Scaling? LECTURE 3 MOSFETS II Lecture 3 Goals* * Understand constant field and constant voltage scaling and their effects. Understand small geometry effects for MOS transistors and their implications modeling and

More information

MOS Transistors. Prof. Krishna Saraswat. Department of Electrical Engineering Stanford University Stanford, CA

MOS Transistors. Prof. Krishna Saraswat. Department of Electrical Engineering Stanford University Stanford, CA MOS Transistors Prof. Krishna Saraswat Department of Electrical Engineering S Stanford, CA 94305 saraswat@stanford.edu 1 1930: Patent on the Field-Effect Transistor! Julius Lilienfeld filed a patent describing

More information

Fig. 1 CMOS Transistor Circuits (a) Inverter Out = NOT In, (b) NOR-gate C = NOT (A or B)

Fig. 1 CMOS Transistor Circuits (a) Inverter Out = NOT In, (b) NOR-gate C = NOT (A or B) 1 Introduction to Transistor-Level Logic Circuits 1 By Prawat Nagvajara At the transistor level of logic circuits, transistors operate as switches with the logic variables controlling the open or closed

More information

ESE 570: Digital Integrated Circuits and VLSI Fundamentals

ESE 570: Digital Integrated Circuits and VLSI Fundamentals ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 15: March 15, 2018 Euler Paths, Energy Basics and Optimization Midterm! Midterm " Mean: 89.7 " Standard Dev: 8.12 2 Lecture Outline! Euler

More information

Digital Integrated Circuits EECS 312

Digital Integrated Circuits EECS 312 14 12 10 8 6 Fujitsu VP2000 IBM 3090S Pulsar 4 IBM 3090 IBM RY6 CDC Cyber 205 IBM 4381 IBM RY4 2 IBM 3081 Apache Fujitsu M380 IBM 370 Merced IBM 360 IBM 3033 Vacuum Pentium II(DSIP) 0 1950 1960 1970 1980

More information

II III IV V VI B C N. Al Si P S. Zn Ga Ge As Se Cd In Sn Sb Te. Silicon (Si) the dominating material in IC manufacturing

II III IV V VI B C N. Al Si P S. Zn Ga Ge As Se Cd In Sn Sb Te. Silicon (Si) the dominating material in IC manufacturing II III IV V VI B N Al Si P S Zn Ga Ge As Se d In Sn Sb Te Silicon (Si) the dominating material in I manufacturing ompound semiconductors III - V group: GaAs GaN GaSb GaP InAs InP InSb... The Energy Band

More information

The Devices. Jan M. Rabaey

The Devices. Jan M. Rabaey The Devices Jan M. Rabaey Goal of this chapter Present intuitive understanding of device operation Introduction of basic device equations Introduction of models for manual analysis Introduction of models

More information

EE 330. Lecture 35. Parasitic Capacitances in MOS Devices

EE 330. Lecture 35. Parasitic Capacitances in MOS Devices EE 330 Lecture 35 Parasitic Capacitances in MOS Devices Exam 2 Wed Oct 24 Exam 3 Friday Nov 16 Review from Last Lecture Cascode Configuration Discuss V CC gm1 gm1 I B VCC V OUT g02 g01 A - β β VXX Q 2

More information

Lecture 12: MOS Capacitors, transistors. Context

Lecture 12: MOS Capacitors, transistors. Context Lecture 12: MOS Capacitors, transistors Context In the last lecture, we discussed PN diodes, and the depletion layer into semiconductor surfaces. Small signal models In this lecture, we will apply those

More information

Scaling Issues in Planar FET: Dual Gate FET and FinFETs

Scaling Issues in Planar FET: Dual Gate FET and FinFETs Scaling Issues in Planar FET: Dual Gate FET and FinFETs Lecture 12 Dr. Amr Bayoumi Fall 2014 Advanced Devices (EC760) Arab Academy for Science and Technology - Cairo 1 Outline Scaling Issues for Planar

More information

! CMOS Process Enhancements. ! Semiconductor Physics. " Band gaps. " Field Effects. ! MOS Physics. " Cut-off. " Depletion.

! CMOS Process Enhancements. ! Semiconductor Physics.  Band gaps.  Field Effects. ! MOS Physics.  Cut-off.  Depletion. ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 4: January 9, 019 MOS Transistor Theory, MOS Model Lecture Outline CMOS Process Enhancements Semiconductor Physics Band gaps Field Effects

More information

and V DS V GS V T (the saturation region) I DS = k 2 (V GS V T )2 (1+ V DS )

and V DS V GS V T (the saturation region) I DS = k 2 (V GS V T )2 (1+ V DS ) ECE 4420 Spring 2005 Page 1 FINAL EXAMINATION NAME SCORE /100 Problem 1O 2 3 4 5 6 7 Sum Points INSTRUCTIONS: This exam is closed book. You are permitted four sheets of notes (three of which are your sheets

More information

Lecture 10 MOSFET (III) MOSFET Equivalent Circuit Models

Lecture 10 MOSFET (III) MOSFET Equivalent Circuit Models Lecture 1 MOSFET (III) MOSFET Equivalent Circuit Models Outline Lowfrequency smallsignal equivalent circuit model Highfrequency smallsignal equivalent circuit model Reading Assignment: Howe and Sodini;

More information

Today s lecture. EE141- Spring 2003 Lecture 4. Design Rules CMOS Inverter MOS Transistor Model

Today s lecture. EE141- Spring 2003 Lecture 4. Design Rules CMOS Inverter MOS Transistor Model - Spring 003 Lecture 4 Design Rules CMOS Inverter MOS Transistor Model Today s lecture Design Rules The CMOS inverter at a glance An MOS transistor model for manual analysis Important! Labs start next

More information

MOS Transistor Properties Review

MOS Transistor Properties Review MOS Transistor Properties Review 1 VLSI Chip Manufacturing Process Photolithography: transfer of mask patterns to the chip Diffusion or ion implantation: selective doping of Si substrate Oxidation: SiO

More information

ESE570 Spring University of Pennsylvania Department of Electrical and System Engineering Digital Integrated Cicruits AND VLSI Fundamentals

ESE570 Spring University of Pennsylvania Department of Electrical and System Engineering Digital Integrated Cicruits AND VLSI Fundamentals University of Pennsylvania Department of Electrical and System Engineering Digital Integrated Cicruits AND VLSI Fundamentals ESE570, Spring 017 Final Wednesday, May 3 4 Problems with point weightings shown.

More information

EKV MOS Transistor Modelling & RF Application

EKV MOS Transistor Modelling & RF Application HP-RF MOS Modelling Workshop, Munich, February 15-16, 1999 EKV MOS Transistor Modelling & RF Application Matthias Bucher, Wladek Grabinski Electronics Laboratory (LEG) Swiss Federal Institute of Technology,

More information

ECEN474/704: (Analog) VLSI Circuit Design Spring 2018

ECEN474/704: (Analog) VLSI Circuit Design Spring 2018 ECEN474/704: (Analog) SI Circuit Design Spring 2018 ecture 2: MOS ransistor Modeling Sam Palermo Analog & Mixed-Signal Center exas A&M University Announcements If you haven t already, turn in your 0.18um

More information

EE105 - Fall 2005 Microelectronic Devices and Circuits

EE105 - Fall 2005 Microelectronic Devices and Circuits EE105 - Fall 005 Microelectronic Devices and Circuits ecture 7 MOS Transistor Announcements Homework 3, due today Homework 4 due next week ab this week Reading: Chapter 4 1 ecture Material ast lecture

More information

2.CMOS Transistor Theory

2.CMOS Transistor Theory MOS VLSI esign 2.MOS Transistor Theory Fu yuzhuo School of microelectronics,sjtu Introduction outline P junction principle MOS transistor introduction Ideal I-V characteristics under static conditions

More information

P. R. Nelson 1 ECE418 - VLSI. Midterm Exam. Solutions

P. R. Nelson 1 ECE418 - VLSI. Midterm Exam. Solutions P. R. Nelson 1 ECE418 - VLSI Midterm Exam Solutions 1. (8 points) Draw the cross-section view for A-A. The cross-section view is as shown below.. ( points) Can you tell which of the metal1 regions is the

More information

The Physical Structure (NMOS)

The Physical Structure (NMOS) The Physical Structure (NMOS) Al SiO2 Field Oxide Gate oxide S n+ Polysilicon Gate Al SiO2 SiO2 D n+ L channel P Substrate Field Oxide contact Metal (S) n+ (G) L W n+ (D) Poly 1 Transistor Resistance Two

More information

ESE 570: Digital Integrated Circuits and VLSI Fundamentals

ESE 570: Digital Integrated Circuits and VLSI Fundamentals ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 10: February 15, 2018 MOS Inverter: Dynamic Characteristics Penn ESE 570 Spring 2018 Khanna Lecture Outline! Inverter Power! Dynamic Characteristics

More information

Practice 7: CMOS Capacitance

Practice 7: CMOS Capacitance Practice 7: CMOS Capacitance Digital Electronic Circuits Semester A 2012 MOSFET Capacitances MOSFET Capacitance Components 3 Gate to Channel Capacitance In general, the gate capacitance is similar to a

More information

ECE 342 Electronic Circuits. 3. MOS Transistors

ECE 342 Electronic Circuits. 3. MOS Transistors ECE 342 Electronic Circuits 3. MOS Transistors Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jschutt@emlab.uiuc.edu 1 NMOS Transistor Typically L = 0.1 to 3 m, W = 0.2 to

More information

CMOS INVERTER. Last Lecture. Metrics for qualifying digital circuits. »Cost» Reliability» Speed (delay)»performance

CMOS INVERTER. Last Lecture. Metrics for qualifying digital circuits. »Cost» Reliability» Speed (delay)»performance CMOS INVERTER Last Lecture Metrics for qualifying digital circuits»cost» Reliability» Speed (delay)»performance 1 Today s lecture The CMOS inverter at a glance An MOS transistor model for manual analysis

More information

EE105 - Fall 2006 Microelectronic Devices and Circuits

EE105 - Fall 2006 Microelectronic Devices and Circuits EE105 - Fall 2006 Microelectronic Devices and Circuits Prof. Jan M. Rabaey (jan@eecs) Lecture 7: MOS Transistor Some Administrative Issues Lab 2 this week Hw 2 due on We Hw 3 will be posted same day MIDTERM

More information

Lecture 11: MOS Transistor

Lecture 11: MOS Transistor Lecture 11: MOS Transistor Prof. Niknejad Lecture Outline Review: MOS Capacitors Regions MOS Capacitors (3.8 3.9) CV Curve Threshold Voltage MOS Transistors (4.1 4.3): Overview Cross-section and layout

More information

ELEC 3908, Physical Electronics, Lecture 23. The MOSFET Square Law Model

ELEC 3908, Physical Electronics, Lecture 23. The MOSFET Square Law Model ELEC 3908, Physical Electronics, Lecture 23 The MOSFET Square Law Model Lecture Outline As with the diode and bipolar, have looked at basic structure of the MOSFET and now turn to derivation of a current

More information

! PN Junction. ! MOS Transistor Topology. ! Threshold. ! Operating Regions. " Resistive. " Saturation. " Subthreshold (next class)

! PN Junction. ! MOS Transistor Topology. ! Threshold. ! Operating Regions.  Resistive.  Saturation.  Subthreshold (next class) ESE370: ircuitlevel Modeling, Design, and Optimization for Digital Systems Lec 7: September 20, 2017 MOS Transistor Operating Regions Part 1 Today! PN Junction! MOS Transistor Topology! Threshold! Operating

More information

ESE 570: Digital Integrated Circuits and VLSI Fundamentals

ESE 570: Digital Integrated Circuits and VLSI Fundamentals ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 8: February 9, 016 MOS Inverter: Static Characteristics Lecture Outline! Voltage Transfer Characteristic (VTC) " Static Discipline Noise Margins!

More information

6.012 Electronic Devices and Circuits Spring 2005

6.012 Electronic Devices and Circuits Spring 2005 6.012 Electronic Devices and Circuits Spring 2005 May 16, 2005 Final Exam (200 points) -OPEN BOOK- Problem NAME RECITATION TIME 1 2 3 4 5 Total General guidelines (please read carefully before starting):

More information

Topics to be Covered. capacitance inductance transmission lines

Topics to be Covered. capacitance inductance transmission lines Topics to be Covered Circuit Elements Switching Characteristics Power Dissipation Conductor Sizes Charge Sharing Design Margins Yield resistance capacitance inductance transmission lines Resistance of

More information

Lecture Outline. ESE 570: Digital Integrated Circuits and VLSI Fundamentals. Review: CMOS Inverter: Visual VTC. Review: CMOS Inverter: Visual VTC

Lecture Outline. ESE 570: Digital Integrated Circuits and VLSI Fundamentals. Review: CMOS Inverter: Visual VTC. Review: CMOS Inverter: Visual VTC ESE 570: Digital Integrated Circuits and LSI Fundamentals Lec 0: February 4, 207 MOS Inverter: Dynamic Characteristics Lecture Outline! Review: Symmetric CMOS Inverter Design! Inverter Power! Dynamic Characteristics

More information

Practice 3: Semiconductors

Practice 3: Semiconductors Practice 3: Semiconductors Digital Electronic Circuits Semester A 2012 VLSI Fabrication Process VLSI Very Large Scale Integration The ability to fabricate many devices on a single substrate within a given

More information

Quantitative MOSFET. Step 1. Connect the MOS capacitor results for the electron charge in the inversion layer Q N to the drain current.

Quantitative MOSFET. Step 1. Connect the MOS capacitor results for the electron charge in the inversion layer Q N to the drain current. Quantitative MOSFET Step 1. Connect the MOS capacitor results for the electron charge in the inversion layer Q N to the drain current. V DS _ n source polysilicon gate y = y * 0 x metal interconnect to

More information

CMOS Digital Integrated Circuits Analysis and Design

CMOS Digital Integrated Circuits Analysis and Design MOS igital ntegrated ircuits Analysis and esign hapter 4 Modeling of MOS ransistors Using SPE 1 ntroduction he SPE software that was distributed by U Berkeley beginning in the late 1970s had three built-in

More information

The Intrinsic Silicon

The Intrinsic Silicon The Intrinsic ilicon Thermally generated electrons and holes Carrier concentration p i =n i ni=1.45x10 10 cm-3 @ room temp Generally: n i = 3.1X10 16 T 3/2 e -1.21/2KT cm -3 T= temperature in K o (egrees

More information

Objective and Outline. Acknowledgement. Objective: Power Components. Outline: 1) Acknowledgements. Section 4: Power Components

Objective and Outline. Acknowledgement. Objective: Power Components. Outline: 1) Acknowledgements. Section 4: Power Components Objective: Power Components Outline: 1) Acknowledgements 2) Objective and Outline 1 Acknowledgement This lecture note has been obtained from similar courses all over the world. I wish to thank all the

More information

Lecture Outline. ESE 570: Digital Integrated Circuits and VLSI Fundamentals. Review: 1st Order RC Delay Models. Review: Two-Input NOR Gate (NOR2)

Lecture Outline. ESE 570: Digital Integrated Circuits and VLSI Fundamentals. Review: 1st Order RC Delay Models. Review: Two-Input NOR Gate (NOR2) ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 14: March 1, 2016 Combination Logic: Ratioed and Pass Logic Lecture Outline! CMOS Gates Review " CMOS Worst Case Analysis! Ratioed Logic Gates!

More information

Conduction in Semiconductors -Review

Conduction in Semiconductors -Review Conduction in Semiconductors Review Intrinsic (undoped) Semiconductors intrinsic carrier concentration n i =.45x0 0 cm 3, at room temp. n = p = n i, in intrinsic (undoped) material n number of electrons,

More information

Microelectronic Devices and Circuits Lecture 13 - Linear Equivalent Circuits - Outline Announcements Exam Two -

Microelectronic Devices and Circuits Lecture 13 - Linear Equivalent Circuits - Outline Announcements Exam Two - 6.012 Microelectronic Devices and Circuits Lecture 13 Linear Equivalent Circuits Outline Announcements Exam Two Coming next week, Nov. 5, 7:309:30 p.m. Review Subthreshold operation of MOSFETs Review Large

More information

Operation and Modeling of. The MOS Transistor. Second Edition. Yannis Tsividis Columbia University. New York Oxford OXFORD UNIVERSITY PRESS

Operation and Modeling of. The MOS Transistor. Second Edition. Yannis Tsividis Columbia University. New York Oxford OXFORD UNIVERSITY PRESS Operation and Modeling of The MOS Transistor Second Edition Yannis Tsividis Columbia University New York Oxford OXFORD UNIVERSITY PRESS CONTENTS Chapter 1 l.l 1.2 1.3 1.4 1.5 1.6 1.7 Chapter 2 2.1 2.2

More information