Features. Typical Applications. ProLight PM2B-1LxE 1W Power LED Technical Datasheet Version: /07

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1 ProLight PM2B-1LxE 1W Power LED Technical Datasheet Version: 1.9 Features High flux per LED Various colors Good color uniformity Low-temp. & lead free reflow soldering RoHS compliant More energy efficient than incandescent and most halogen lamps Low Voltage DC operated Instant light (less than 0ns) No UV Superior ESD protection Typical pplications Reading lights (car, bus, aircraft) Portable (flashlight, bicycle) Uplighters/Downlighters Decorative/Entertainment Bollards/Security/Garden Cove/Undershelf/Task Indoor/Outdoor Commercial and Residential rchitectural utomotive Ext (Stop-Tail-Turn, CHMSL, Mirror Side Repeat) LCD backlights /07

2 Emitter Mechanical Dimensions TOP VIEW BOTTOM VIEW Notes: 1. The node side of the device is denoted by a hole in the lead frame. 2. Electrical insulation between the case and the board is required --- slug of device is not electrically neutral. Do not electrically connect either the anode or cathode to the slug. 3. Drawing not to scale. 4. ll dimensions are in millimeters. 5. ll dimendions without tolerances are for reference only. 6. Please do not bend the leads of the LED, otherwise it will damage the LED. 7. Please do not use a force of over 3kgf impact or pressure on the lens of the LED, otherwise it will cause a catastrophic failure. *The appearance and specifications of the product may be modified for improvement without notice. 2

3 Flux Characteristics at 350m, T J = 25 C Radiation Part Number LumiousFlux or Power Color Pattern Emitter Minimum Typical Lambertian White PM2B-1LWE 87.4 lm 118 lm Warm White PM2B-1LVE 76.6 lm 113 lm Crimson PM2B-1LME 13.9 lm 21 lm Red PM2B-1LRE 39.8 lm 50 lm mber PM2B-1LE 39.8 lm 57 lm Green PM2B-1LGE 67.2 lm 82 lm Cyan PM2B-1LCE 51.7 lm 57 lm Blue PM2B-1LBE 13.9 lm 21 lm Royal Blue PM2B-1LDE 355 mw 470 mw Cherry Red PM2B-1LEE 115 mw 160 mw ProLight maintains a tolerance of ± % on flux and power measurements. Please do not drive at rated current more than 1 second without proper heat sink. Electrical Characteristics at 350m, T J = 25 C Color Forward Voltage V F (V) Min. Typ. Max. Thermal Resistance Junction to Slug ( C/ W) White Warm White Crimson Red mber Green Cyan Blue Royal Blue Cherry Red

4 Optical Characteristics at 350m, T J = 25 C Color Dominant Wavelength λ D, Peak Wavelength [1] λ P, or Color Temperature CCT Total included ngle (degrees) Viewing ngle (degrees) Min. Typ. Max. θ 0.90V 2 θ 1/2 White 40 K 5500 K 000 K Warm White 2700 K 3300 K 40 K Crimson nm 640 nm 645 nm Red nm 623 nm 631 nm mber 587 nm 592 nm 597 nm Green 515 nm 525 nm 535 nm Cyan 495 nm 505 nm 515 nm Blue 455 nm 465 nm 475 nm Royal Blue 450 nm 455 nm 460 nm Cherry Red 720 nm 730 nm 740 nm ProLight maintains a tolerance of ± 1nm for dominant wavelength measurements. ProLight maintains a tolerance of ± 5% for CCT measurements. Cherry Red product is binned by peak wavelength rather than dominant wavelength. 2 Dominant wavelength 640nm equals to peak wavelength around 660nm. bsolute Maximum Ratings Parameter DC Forward Current (m) Peak Pulsed Forward Current (m) verage Forward Current (m) ESD Sensitivity (HBM per MIL-STD-883E Method ) LED Junction Temperature ( C) luminum-core PCB Temperature ( C) Storage & Operating Temperature ( C) Soldering Temperature( C) White/Warm White/Crimson/Red/ mber/green/cyan/blue/royal Blue/Cherry Red ±4000V (Class III) to C 4

5 Radiometric Power Bin Structure Color Bin Code Minimum Maximum vailable Radiometric Power (mw) Radiometric Power (mw) Color Bins Royal Blue P Q R ll ll Cherry Red J K L ll ll ProLight maintains a tolerance of ± % on flux and power measurements. The flux bin of the product may be modified for improvement without notice. The rest of color bins are not 0% ready for order currently. Please ask for quote and order possibility. Photometric Luminous Flux Bin Structure Color Bin Code Minimum Photometric Flux (lm) Maximum Photometric Flux (lm) vailable Color Bins White U1 U2 V1 V2 W ll 0 1 ll ll Xx,Wx,Vx Warm White T2 U1 U2 V1 V ll ll 120 ll Crimson M N P ll ll R ll Red S ll S R ll mber S1 S ll T Green T1 T2 U1 U ll ll ll 0 1 Cyan S1 S ll Blue M N P ,1,1,1 ProLight maintains a tolerance of ± % on flux and power measurements. The flux bin of the product may be modified for improvement without notice. The rest of color bins are not 0% ready for order currently. Please ask for quote and order possibility. 5

6 y Color Bin White and Warm White Binning Structure Graphical Representation K 3250 K 3050 K 2850 K 2700 K K 5650 K 6300 K VN WN V0 XN W K 5000 K TN UN T0 U0 40 K S0 S K R0 R1 Q0 Q1 P0 P1 Warm White N0 N1 M0 M1 Planckian (BBL) K Y0 Y X0 WP XP White x 6

7 Color Bins Y0 Y CCT 8000KCCT 7000K CCT 6000K X0X1 CCT W W05500K V0 CCT 5000K V1 CCT 4500K White Bin Structure Bin Code x y Typ. CCT Typ. CCT Bin Code x y (K) (K) T WN TN WP U X UN XN V XP VN Y W Y Tolerance on each color bin (x, y) is ± 0.01 Note: lthough several bins are outlined, product availability in a particular bin varies by production run and by product performance. Not all bins are available in all colors. 7

8 Color Bins Y0 Y CCT 8000KCCT 7000K CCT 6000K X0X1 CCT W W05500K V0 CCT 5000K V1 CCT 4500K Warm White Bin Structure Bin Code x y Typ. CCT Typ. CCT Bin Code x y (K) (K) M Q M Q N R N R P S P S Tolerance on each color bin (x, y) is ± 0.01 Note: lthough several bins are outlined, product availability in a particular bin varies by production run and by product performance. Not all bins are available in all colors. 8

9 Peak Wavelength Bin Structure Color Bin Code Minimum Peak Wavelength (nm) Maximum Peak Wavelength (nm) Cherry Red ProLight maintains a tolerance of ± 1nm for peak wavelength measurements. Dominant Wavelength Bin Structure Color Bin Code Minimum Dominant Wavelength (nm) Maximum Dominant Wavelength (nm) Crimson Red mber Green Cyan Blue Royal Blue ProLight maintains a tolerance of ± 1nm for dominant wavelength measurements. Note: lthough several bins are outlined, product availability in a particular bin varies by production run and by product performance. Not all bins are available in all colors. 9

10 Forward Voltage Bin Structure Color Bin Code Minimum Voltage (V) Maximum Voltage (V) White Warm White Crimson Red B D E F B D E F B D E F B D E F mber B D E F Green B D E F Cyan B D E F Blue Royal Blue Cherry Red B D E F B D E F B D E F ProLight maintains a tolerance of ± 0.1 for Voltage measurements. Note: lthough several bins are outlined, product availability in a particular bin varies by production run and by product performance. Not all bins are available in all colors.

11 Relative Spectral Power Distribution Relative Spectral Power Distribution Relative Spectral Power Distribution Color Spectrum, T J = 25 C 1. White White Standard Eye Response Cruve Wavelength(nm) 2. Warm White Standard Eye Response Cruve Warm White Wavelength(nm) 3. Royal Blue Blue Cyan Green mber Red Crimson Cherry Red Royal Blue Blue Cyan 1.0 mber Red Cherry Red Crimson 0.8 Green Wavelength(nm) 11

12 Relative Light Output (%) Relative Light Output (%) Light Output Characteristics Relative Light Output vs. Junction Temperature at 350m White, Warm White Green, Cyan, Royal Blue Blue Junction Temperature, T J ( ) Crimson, Red Cherry Red mber Junction Temperature, T J ( ) 12

13 Relative Luminous Flux Relative Luminous Flux verage Forward Current (m) verage Forward Current (m) Forward Current Characteristics, T J = 25 C 1. Forward Voltage vs. Forward Current White, Warm White, Green, Cyan, Blue, Royal Blue Crimson, Red, Cherry Red, mber Forward Voltage (V) Forward Voltage (V) 2. Forward Current vs. Normalized Relative Luminous Flux White, Warm White, Green, Cyan, Blue, Royal Blue Crimson, Red, Cherry Red, mber Forward Current (m) Forward Current (m) 13

14 Forward Current (m) Forward Current (m) mbient Temperature vs. Maximum Forward Current 1. White, Warm White, Green, Cyan, Blue, Royal Blue (T JMX = 120 C) Rθ J- = 60 C/W Rθ J- = 50 C/W Rθ J- = 40 C/W Rθ J- = 30 C/W mbient Temperature ( ) 2. Crimson, Red, mber, Cherry Redr (T JMX = 120 C) Rθ J- = 60 C/W Rθ J- = 50 C/W Rθ J- = 40 C/W Rθ J- = 30 C/W mbient Temperature ( ) 14

15 Relative Intensity Typical Representative Spatial Radiation Pattern Lambertian Radiation Pattern ngular Displacement (Degrees) 15

16 Qualification Reliability Testing Stress Test Stress Conditions Stress Duration Failure Criteria Room Temperature Operating Life (RTOL) Wet High Temperature Operating Life (WHTOL) Wet High Temperature Storage Life (WHTSL) High Temperature Storage Life (HTSL) Low Temperature Storage Life (LTSL) 25 C, I F = max DC (Note 1) 85 C/60%RH, I F = max DC (Note 1) 85 C/85%RH, non-operating 1 C, non-operating -40 C, non-operating 00 hours 00 hours 00 hours 00 hours 00 hours Note 2 Note 2 Note 2 Note 2 Note 2 Non-operating Non-operating -40 C to 120 C, 30 min. dwell, -40 C to 120 C, 20 min. dwell, Temperature Cycle (TMCL) Thermal Shock (TMSK) <5 min. transfer <20 sec. transfer 200 cycles 200 cycles Note 2 Note 2 Mechanical Shock 1500 G, 0.5 msec. pulse, 5 shocks each 6 axis Note 3 Natural Drop On concrete from 1.2 m, 3X Note 3 Variable Vibration Frequency Solderability Hz, log or linear sweep rate, 20 G about 1 min., 1.5 mm, 3X/axis Steam age for 16 hrs., then solder dip at 260 C for 5 sec. Note 3 Solder coverage on lead Notes: 1. Depending on the maximum derating curve. 2. Criteria for judging failure Item Test Condition Criteria for Judgement Min. Max. Forward Voltage (V F ) I F = max DC -- Initial Level x 1.1 Luminous Flux or Radiometric Power (Φ V ) I F = max DC Initial Level x Reverse Current (I R ) V R = 5V μ * The test is performed after the LED is cooled down to the room temperature. 3. failure is an LED that is open or shorted. 16

17 Recommended Solder Pad Design ll dimensions are in millimeters. Electrical isolation is required between Slug and Solder Pad. 17

18 Reflow Soldering Condition Profile Feature Preheat & Soak Temperature min (T smin ) Temperature max (T smax ) Time (T smin to T smax ) verage Ramp-Up Rate (T smax to T P ) Liquidous temperature (T L ) Time at liquidous (t L ) Peak package body temperature (T P ) Time (t P ) within 5 C of the specified classification temperature (T C ) verage ramp-down rate (T P to T smax ) Time 25 C to Peak Temperature Sn-Pb Eutectic ssembly 0 C 150 C seconds 3 C / second max. 183 C seconds 235 C 20 seconds 6 C/second max. 6 minutes max. Low-Temp. & Pb-Free ssembly (58Bi-42Sn Eutectic lloy) 90 C 120 C seconds 2 C / second max. 138 C seconds 185 C 20 seconds 3 C/second max. 4 minutes max. ll temperatures refer to topside of the package, measured on the package body surface. Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a heat plate should be used. It should be confirmed beforehand whether the characteristics of LEDs will or will not be damaged by repairing. Reflow soldering should not be done more than two times. When soldering, do not put stress on the LEDs during heating. fter soldering, do not warp the circuit board. 18

19 Emitter Tube Packaging Notes: pieces per tube. 2. Drawing not to scale. 3. ll dimensions are in millimeters. 4. ll dimendions without tolerances are for reference only. **Please do not open the moisture barrier bag (MBB) more than one week. This may cause the leads of LED discoloration. We recommend storing ProLight s LEDs in a dry box after opening the MBB. The recommended storage conditions are temperature 5 to 30 C and humidity less than 40% RH. 19

20 Precaution for Use Storage Please do not open the moisture barrier bag (MBB) more than one week. This may cause the leads of LED discoloration. We recommend storing ProLight s LEDs in a dry box after opening the MBB. The recommended storage conditions are temperature 5 to 30 C and humidity less than 40% RH. It is also recommended to return the LEDs to the MBB and to reseal the MBB. The slug is is not electrically neutral. Therefore, we recommend to isolate the heat sink. ny mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. Please avoid rapid cooling after soldering. Components should not be mounted on warped direction of PCB. Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, a heat plate should be used. It should be confirmed beforehand whether the characteristics of the LEDs will or will not be damaged by repairing. This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When cleaning is required, isopropyl alcohol should be used. When the LEDs are illuminating, operating current should be decide after considering the package maximum temperature. The appearance, specifications and flux bin of the product may be modified for improvement without notice. Please refer to the below website for the latest datasheets. 20