Hybrid Energy Storage Capacitors

Transcription

1 9 HVC ENYCAP Hybrid Energy Storage Capacitors EATURES Polarized energy storage capacitor with high capacity and energy density flexibility:. V (single cell) to.8 V /. V /. V / 7. V / 8. V (multiple cells) Available in stacked throughhole (STH, radial), surfacemount flat (SM) and lay flat configurations (LC) with wire and connectors Useful life: up to h at 8 C No cell balancing necessary Soft and low transientvoltagecontrolled charging characteristic Nonhazardous electrolyte Maintenancefree, no service necessary Evaluation kits for engineering are available under ordering code: MAL999E Material categorization: for definitions of compliance please see APPLICATIONS Power backup for memory controller, flash backup, RAID systems, SRAM, DRAM Power failure and write cache protection for enterprise SSD and HDD Real time clock power source Burst power support for flash lights, wireless transmitters Backup power for industrial PC s and industrial controls Storage device for energy harvesting Emergency light and micro UPS power source Image is not to scale MARKING The capacitors are marked with the following information: Rated capacitance (in ) Rated voltage (in V) Date code Negative / positive terminal identification PACKAGING Supplied in ESD trays only Revision: Mar8 Document Number: 89 ARE SUBJECT TO SPECIIC DISCLAIMERS, SET ORTH AT

2 9 HVC ENYCAP QUICK REERENCE DATA DESCRIPTION Nominal case size (Ø D x L in mm) Stacked ThroughHole (STH) Nominal case size (Ø W x L x H in mm) SurfaceMount lat (SM) Nominal case size (W x L x H in mm) Lay lat (LC) Rated capacitance range, C R VALUE SINGLE CELL CELLS CELLS CELLS CELLS CELLS 7 x. x. x x 7 x 7 x. x x. 7 x x x x x x 7. 7 x x. x x. 7 x 7. x 7. x x 7. x x x x. x x. 7 x x x x x x x x. x x. 7 x. x. x x 7. 7 x x x x. x x.. x x.. x x.. x 8 x.. x x.. x 7 x Tolerance on C R at C % to 8 % Rated voltage, U R. V.8 V. V. V 7. V 8. V Maximum surge voltage, U S (max. s). V. V.8 V. V 8. V 9. V Minimum stored energy Energy density Ws 7 Ws Ws 9 Ws Ws Ws Ws Ws Ws Ws Ws 8 Ws 7 Ws Ws Ws 9 Ws/g to Ws/g Category temperature range. : C to 7 C. /. / 9. : C to 8 C Storage temperature range C to 8 C Ws 87 Ws 7 Ws 7 Ws Ws 9 Ws., Useful life at U R at C: 8 h at 7 C: 8 h at 7 C: h. : at 7 C: h. : at 8 C: h 9. : at 8 C: h at C: h at C: h at C: h Shelf life h at upper category temperature Climatic category IEC 8 / 8 / SELECTION CHART OR C R, U R, AND ORM AT UPPER CATEGORY TEMPERATURE (UCT) C R U R (V) ORM () A 7. x. 7. x. 7. x x. 7. x. 7. x. B B 7. x. 7. x. 7. x x. 7. x. 7. x. C 7. x 7. x. D 7. x 7. x. E 7. x. x.. x. x.. x. x. A. x.. x.. x 7.. x.. x.. x. B B. x.. x.. x 7.. x.. x.. x. C. x. x. D. x. x. E. x. x.. x. x.. x. x.. x. x.. x. x.. x. x.. x 8. x.. x. x.. x 7. x. I K G H x x x x 7. x x x x x x 7. x x x x x x 7. x x Revision: Mar8 Document Number: 89 ARE SUBJECT TO SPECIIC DISCLAIMERS, SET ORTH AT

3 9 HVC ENYCAP DIMENSIONS in millimeters AND AVAILABLE ORMS STACKED THROUGH HOLE CONIGURATION (STH): Examples VERTICAL MOUNT Ø D max. L max. Ø.8 Ø... ( x) ig. orm A: Stacked Through Hole (example cells, pins) () STACKED THROUGH HOLE CONIGURATION (STH): Examples HORIZONTAL MOUNT Ø D max. L max. Ø. ig. orm B: Stacked Through Hole (example cells, pins) ()... ( x) Ø D max. L max. Ø. ( x)... ( x) Note () Bottom and top are not isolated ig. orm B: Stacked Through Hole (example cells, keyed polarity pins) () SURACE MOUNT LAT CONIGURATION (SM): Examples L max..8 max... ( x). ( x). ( x)... ( x) Ø D max. ( x) ig. orm C: Surface Mount lat (single cell, keyed polarity) Revision: Mar8 Document Number: 89 ARE SUBJECT TO SPECIIC DISCLAIMERS, SET ORTH AT

4 9 HVC ENYCAP.8 max. (including tags thickness). ( x) _ ( x) R. (inner radius).. Ø 7. max..7 ( x).. ig. orm D: Surface Mount lat (single cell, keyed polarity). ( x).8 max. Ø D max.... Ø. max.. ( x).. ig. orm D: Surface Mount lat (single cell, keyed polarity). ( x). ( x) ( x).. ( x) Ø D max. ( x).8 max. ig. 7 orm E: Surface Mount lat. ( x) ( x).8 max. H max. ± ( x). ( x) ( x) L max. ig. 8 orm E: Surface Mount lat ( x) ( x). ( x) ( x). ( x).8 max. H max. L max. ig. 9 orm E: Surface Mount lat Revision: Mar8 Document Number: 89 ARE SUBJECT TO SPECIIC DISCLAIMERS, SET ORTH AT

5 9 HVC ENYCAP LAY LAT CONIGURATION (LC) WITH CONNECTOR: Example cells in series Red (AWG 8, UL ) Pin : red Ø Dmax. Black (AWG 8, UL ) Pin : black Molex connector; Housing: Terminal: 8. max. Lmax. ig. orm : Lay lat (example for cells) 7 max. Lmax.. max.. ( x). ( x). ( x) ig. orm I: Stacked Through Hole Oval (PCBD).. ( x) 7 max. Lmax..... ( x) ( x) ig. orm K: Stacked Through Hole Oval Horizontal max. max. Lmax... ( x) ( x). ( x) ig. orm G: Stacked Through Hole Oval (PCBD) Revision: Mar8 Document Number: 89 ARE SUBJECT TO SPECIIC DISCLAIMERS, SET ORTH AT

6 9 HVC ENYCAP max.. L max... ( x).. ( x). ( x) ig. orm H: Stacked Through Hole Oval Horizontal Table DIMENSIONS in millimeters, MASS AND PACKAGING QUANTITIES NOMINAL CASE SIZE ORM Ø D D x L x H (mm) max. L max. L max. H MASS max. (g) 7. x 7. x. A, B, B x 7. x. C x 7. x. D x 7. x. A, B, B x 7. x 7. A, B, B x 7. x. A, B, B x 7. x. A, B, B x 7. x. A, B, B x. x. A, B, B x. x. C x. x. D x. x. A, B, B x. x 7. A, B, B x. x. A, B, B x. x. A, B, B x. x. A, B, B x. x. E x. x. E x. x. E x. x. E x. x. E x. x. E x. x x. x x. x x 8. x x. x x 7. x x x. I, K 7 x... ±.. x x 7. I, K 7 x ±.. x x. I, K 7 x ±.. x x. G, H x.7. ±. 7. x x 7. G, H x x x. G, H x.... x x. G, H x.... x x 7. G, H x ±.. x x. G, H x.. ±.. Revision: Mar8 Document Number: 89 ARE SUBJECT TO SPECIIC DISCLAIMERS, SET ORTH AT

7 ELECTRICAL DATA SYMBOL C R UCT DESCRIPTION Rated capacitance, tolerance % / 8 %, measured by constant current discharge method Upper category temperature I L Max. leakage current after h at U R R I Max. internal resistance at khz Note Unless otherwise specified, all electrical values in Table apply at T amb = C, P = 8 kpa to kpa and RH = % to 7 % 9 HVC ENYCAP ORDERING EXAMPLE Hybrid Storage Capacitor /. V Nominal case size: Ø. mm x. mm; orm B Ordering code: MAL99E Table ELECTRICAL DATA AND ORDERING INORMATION U R (V) C R () NOMINAL CASE SIZE Ø D x L D x L x H (mm) CASE CODE OR M (mm) (mm) UCT ( C) I L h (ma) ESR AC () khz () ESR DC () () MIN. STORAGE ENERGY (Ws) PACKAGING QUANTITIES ORDERING CODE STACKED THROUGH HOLE CONIGURATION (STH) VERTICAL MOUNT. 7. x. pin A MAL99E.8 7. x. pin A MAL99E. 7. x 7. pin A MAL99E. 7. x. pin A MAL99E x. pin A MAL99E x. pin A MAL99E.. x. pin A MAL99E.8. x. pin A MAL99E.. x 7. pin A MAL99E.. x. pin A MAL99E 7.. x. pin A MAL99E 8.. x. pin A MAL99E STACKED THROUGH HOLE CONIGURATION (STH) HORIZONTAL MOUNT. 7. x. pin B MAL99E.8 7. x. pin B MAL99E. 7. x 7. pin B MAL99E. 7. x. pin B MAL99E x. pin B MAL99E x. pin B MAL99E.. x. pin B MAL99E.8. x. pin B MAL99E.. x 7. pin B MAL99E.. x. pin B MAL99E 7.. x. pin B MAL99E 8.. x. pin B MAL99E. 7. x. pin B MAL99E.8 7. x. pin B MAL99E. 7. x 7. pin B MAL99E. 7. x. pin B MAL99E x. pin B MAL99E x. pin B MAL99E.. x. pin B MAL99E.8. x. pin B MAL99E.. x 7. pin B MAL99E.. x. pin B MAL99E 7.. x. pin B MAL99E 8.. x. pin B MAL99E Revision: Mar8 7 Document Number: 89 ARE SUBJECT TO SPECIIC DISCLAIMERS, SET ORTH AT

8 9 HVC ENYCAP ELECTRICAL DATA AND ORDERING INORMATION U R (V) C R () NOMINAL CASE SIZE Ø D x L D x L x H (mm) CASE CODE OR M (mm) (mm) UCT ( C) I L h (ma) ESR AC () khz () ESR DC () () MIN. STORAGE ENERGY (Ws) PACKAGING QUANTITIES ORDERING CODE SURACE MOUNT LAT CONIGURATION (SM). 7. x 7. x. pin C MAL99E.. x. x. pin C MAL99E. 7. x 7. x. pin D MAL99E.. x. x. pin D MAL99E.8 7. x. x. pin E MAL99E.8. x. x. pin E MAL99E.. x. x. pin E MAL99E.. x. x. pin E MAL99E.. x. x. pin E MAL99E.. x. x. pin E MAL99E LAY LAT CONIGURATION (LC).. x. x. pin MAL99E.8. x. x. pin MAL99E.. x. x. pin MAL99E.. x 8. x. pin MAL99E 7.. x. x. pin MAL99E 8.. x 7. x. pin MAL99E STACKED THROUGH HOLE OVAL.8 x x. pin I MAL99E. x x 7. pin I MAL99E. x x. pin I MAL99E. 9 x x. pin G MAL99E.8 9 x x 7. pin G MAL99E. 9 x x. pin G MAL99E. 9 x x. pin G MAL99E 7. 9 x x 7. pin G MAL997E 8. 9 x x. pin G MAL998E STACKED THROUGH HOLE OVAL HORIZONTAL.8 x x. pin K MAL99E. x x 7. pin K MAL99E. x x. pin K MAL99E. 9 x x. pin H MAL99E.8 9 x x 7. pin H MAL99E. 9 x x. pin H MAL99E. 9 x x. pin H MAL99E 7. 9 x x 7. pin H MAL997E 8. 9 x x. pin H MAL998E Notes () ESR AC khz are typical values () ESR DC are typical values Table LOAD CURRENTS AND VOLTAGES C R RECOMMENDED () CHARGE CURRENT MAX. CHARGE CURRENT Note () n... number of cells, permanent operation below lowest discharge voltage is not permitted MAX. DISCHARGE CURRENT LOWEST DISCHARGE VOLTAGE () ma to 8 ma ma ma n x.8 V ma to ma ma 7 ma n x.8 V ma to ma. A. A n x.8 V 9. A to A. A A n x.8 V Revision: Mar8 8 Document Number: 89 ARE SUBJECT TO SPECIIC DISCLAIMERS, SET ORTH AT

9 9 HVC ENYCAP MEASURING O CHARACTERISTICS CAPACITANCE (C) Capacitance shall be measured by constant current discharge method. DISCHARGE CURRENT AS A UNCTION O RATED CAPACITANCE PARAMETER VALUE UNIT Rated capacitance, C R 9 Discharge current, I D 9 ma U R U U ΔU CAPACITANCE C () I D (A) U R (V) U (V) U (V) t (s) t (s) > >.... >.... > > > > > > > Note or U see also Table A min t t (s) ig. Diagram for Capacitance Measurement V C Constant current discharger Capacitance value C R is given by discharge current I D, time t and rated voltage U R, according to the following equation: C R U R U U U t t I D C R or I D, U, and U the following definitions have to be used: Table Rated capacitance, in Rated voltage, in V Starting voltage, in V Ending voltage, in V drop at internal resistance, in V Time from start of discharge until voltage U is reached, in s Time from start of discharge until voltage U is reached, in s Discharge current, in A I D A x t s t s = U V U V CAPACITANCE C () I D (A) U R (V) U (V) U (V) t (s) t (s)....7 > >.... >.... > > >....7 > >.... >.... > > ig. Test Circuit for Capacitance Measurement INTERNAL RESISTANCE (R I ) AT khz R I U C V = ig. 7 Test Circuit for R I Measurement LEAKAGE CURRENT (I L ) A ma Leakage current shall be measured after min application of rated voltage U R : I L A khz U S V = V ig. 8 Test Circuit for Leakage R S Ω C V C Revision: Mar8 9 Document Number: 89 ARE SUBJECT TO SPECIIC DISCLAIMERS, SET ORTH AT

10 9 HVC ENYCAP I L (μa) Curve : 9 (. V to 8. V) Curve : (.8 V to. V) Curve : (. V to 8. V) Curve : (. V to 8. V) 7 8 Time (h) ig. 9 Typical Leakage at C as a unction of Time Table VOLTAGE TO BE USED OR SERIES CONNECTION N CELLS IN SERIES U R (V) U (V) U (V) DISCHARGE CHARACTERISTICS Backup time of 9 HVC series capacitors depends on minimum memory holding voltage and discharge current (corresponding with the current consumption of the load). or minimum backup times of standard and vertical miniaturized series see ig. to ig. (charging time h and CCCV charging according to table ). Backup time (s) C = (. V to 8. V). Discharge current (ma) ig. Typical Backup Time as a unction of Discharge Backup time (s) C = (. V to 8. V). Discharge current (ma) ig. Typical Backup Time as a unction of Discharge Revision: Mar8 Document Number: 89 ARE SUBJECT TO SPECIIC DISCLAIMERS, SET ORTH AT

11 9 HVC ENYCAP Backup time (s) Backup time (s) C = (.8 V to. V). Discharge current (ma) ig. Typical Backup Time as a unction of Discharge C = 9 (. V to 8. V) Discharge current (ma) ig. Typical Backup Time as a unction of Discharge CHARGE CHARACTERISTICS Charge cc ma/. V and discharge ma/. V Charge cccv ma/. V min and discharge ma/. V (V). (V)... ig. Constant (CC) with VLimit Charging Method at RT Typical Charge / Discharge Characteristics at RT: /. V 7 8 ig. Constant (CC)Constant (CV) Charging Method at RT Typical Charge / Discharge Characteristics at RT: /. V Charge cc ma/. V and discharge ma/. V Charge cccv ma/. V min and discharge ma/. V (V) (V) ig. Constant (CC) with VLimit Charging Method at RT Typical Charge / Discharge Characteristics at RT: /. V ig. 7 Constant (CC)Constant (CV) Charging Method at RT Typical Charge / Discharge Characteristics at RT: /. V Note Charge and discharge cycles at room temperature (RT) maximal cycles at room temperature allowed! Revision: Mar8 Document Number: 89 ARE SUBJECT TO SPECIIC DISCLAIMERS, SET ORTH AT

12 9 HVC ENYCAP Charge cc ma /. V and discharge ma /. V Charge cccv ma /. V min and discharge ma /. V (V) (V) 8 8 ig. 8 Constant (CC) with VLimit Charging Method at RT Typical Charge / Discharge Characteristics at RT: /. V ig. 9 Constant (CC)Constant (CV) Charging Method at RT Typical Charge / Discharge Characteristics at RT: /. V Charge cc ma /. V and discharge A /. V Charge cccv ma /. V min and discharge A /. V (V) (V) 8 8 ig. Constant (CC) with VLimit Charging Method at RT Typical Charge / Discharge Characteristics at RT: 9 /. V ig. Constant (CC)Constant (CV) Charging Method at RT Typical Charge / Discharge Characteristics at RT: 9 /. V Note Charge and discharge cycles at room temperature (RT) maximal cycles at room temperature allowed! CHARGING VOLTAGE AT DIERENT TEMPERATURES OPERATING TEMPERATURE RANGE C UP TO C C UP TO C C UP TO 7 C / 8 C cell U R. V cells U Charge voltage R. V U R U R n () x. x (T[ C] ) cells U R.9 V > cells U R. V Notes Capacitor is polarized, product will be damaged if reverse charged s higher than specified need to be avoided; otherwise reduction of life time, internal gas generation or damage of HVC hybrid capacitor will occur or other operating temperatures, a temperature derating factor has to be considered for correct charging voltage Surge voltage is only allowed a few seconds per day, but not as a charging process () n... number of cells DERATING Working voltage at temperatures above C should be below rated voltage U R. A deratingfactor of. mv/ C per cell is recommended. Revision: Mar8 Document Number: 89 ARE SUBJECT TO SPECIIC DISCLAIMERS, SET ORTH AT

13 9 HVC ENYCAP PRODUCT AND MOUNTING CHARACTERISTICS Attention: parts are precharged at delivery handle appropriate. At delivery products are precharged and voltage over terminals is near nominal voltage. Short circuiting of product terminals is permitted. Do not short circuit permanently. Short circuiting of charged cells may heat up the cells. or printed circuit board mounting it has to be taken into account, that for certain form factors top and bottom of products may not be insulated. Capacitor disposal methods should be in accordance with local and state regulations. Table. TEST PROCEDURES AND REQUIREMENTS NAME O TEST Notes () n... number of cells () R I equals ESR AC or ESR DC ENYCAP TESTS SUBCLAUSE PROCEDURE (quick reference) Damp heat, steady state. h at C; RH 9 % to 9 %; no voltage applied Endurance.. Useful life.. Storage at upper category temperature.7 Self discharge.. Characteristics at high and low temperature.9 Surge voltage. T amb = 7 C / 8 C; rated voltage U R applied;., : h, 9 : h T amb = 7 C / 8 C; rated voltage U R applied;., : h, 9 : h T amb = 7 C / 8 C; no voltage applied; h h storage at room temperature after application of U R for h Step : reference measurement at C of C, R I, and I L Step : measurement at C Step : measurement at C Step : measurement at 7 C Step : measurement at C Max. s at room temperature U S = n () x. V REQUIREMENTS () C/C: ± % R I x spec. limit I L x spec. limit C/C: ± % R I x spec. limit I L x spec. limit C/C: ± % R I x spec. limit I L x spec. limit C/C: ± % R I x spec. limit I L x spec. limit Remaining voltage: (U R x.9) C/C: ± % of C value R I x the C value I L x the C value No change of parameter! After surge voltage, discharge product below rated voltage Table.: Stacked Through Hole configuration (STH), Surface Mount lat configuration (SM), and Lay lat configuration with Connector TEST PROCEDURES AND REQUIREMENTS NAME O TEST ENYCAP TESTS SUBCLAUSE PROCEDURE (quick reference) Notes Robustness bending limited to ±, force in direction of tab / pin, no twisting allowed Solder bath test: max. allowed case temperature during test is e.g. 8 C or immersion of one () pad only Wave soldering allowed () R I equals ESR AC or ESR DC REQUIREMENTS () Robustness of terminations. Tensile strength; application of load force in pin / tab direction for s: N: for product size Ø 8 mm No breaks N: for product size Ø < 8 mm Resistance to soldering heat. C; s C/C: ± % R I and I L spec. limit Solderability. Solder bath; C; s; one pin immersed 7 % tinning Vibration.8 Hz to Hz;. mm; directions; h per direction C/C: ± % R I and I L spec. limit Revision: Mar8 Document Number: 89 ARE SUBJECT TO SPECIIC DISCLAIMERS, SET ORTH AT

14 9 HVC ENYCAP SOLDERING As a general principle, temperature and duration shall be the minimum necessary required to ensure good soldering connections. However, the maximum specified soldering time and case temperature should never be exceeded. EVALUATION KIT Evaluation kits are available under ordering code: MAL999E. The engineering kit includes a charge and discharge demo board with different 9 HVC capacitor samples. or further details, please contact hybridstorage@vishay.com. Statements about product lifetime are based on calculations and internal testing. They should only be interpreted as estimations. Also due to external factors, the lifetime in the field application may deviate from the calculated lifetime. In general, nothing stated herein shall be construed as a guarantee of durability. Revision: Mar8 Document Number: 89 ARE SUBJECT TO SPECIIC DISCLAIMERS, SET ORTH AT

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