BAW56 BAW56S BAW56T BAW56U BAW56W
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1 Silicon Switching Diode For highspeed switching applications Common anode configuration BAW56S / U: For orientation in reel see package information below BAW56 BAW56T BAW56W BAW56S BAW56U! $ # ",!, ",,,,! Type Package Configuration Marking BAW56 BAW56S BAW56T BAW56U BAW56W SOT SOT6 SC75 SC74 SOT common anode double common anode common anode double common anode common anode As As A As As 6
2 Maximum Ratings at T A = 5 C, unless otherwise specified Parameter Symbol Value Unit Diode reverse voltage V R 8 V Peak reverse voltage V RM 85 Forward current I F ma Nonrepetitive peak surge forward current t = µs t = ms t = s, single t = s, double I FSM A Total power dissipation BAW56, T S 8 C BAW56S, T S 85 C BAW56T, T S 4 C BAW56U, T S 9 C BAW56W, T S C P tot mw Junction temperature T j 5 C Storage temperature T stg Thermal Resistance Parameter Symbol Value Unit Junction soldering point ) BAW56 BAW56S BAW56T BAW56U BAW56W R thjs For calculation of R thja please refer to Application Note Thermal Resistance K/W
3 Electrical Characteristics at T A = 5 C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. DC Characteristics Breakdown voltage I (BR) = µa V (BR) 85 V Reverse current I R µa V R = 7 V.5 V R = 5 V, T A = 5 C V R = 7 V, T A = 5 C 5 Forward voltage V F mv I F = ma 75 I F = ma 855 I F = 5 ma I F = ma I F = 5 ma 5 AC Characteristics Diode capacitance V R = V, f = MHz Reverse recovery time I F = ma, I R = ma, measured at I R = ma, R L = Ω C T pf t rr 4 ns Test circuit for reverse recovery time Ι F D.U.T. Oscillograph Pulse generator: t p = ns, D =.5, t r =.6ns, R i = 5Ω Oscillograph: R = 5Ω, t r =.5ns, C pf EHN9 6
4 Reverse current I R = ƒ (T A ) V R = Parameter Forward Voltage V F = ƒ (T A ) I F = Parameter 5. na 4.9 IR VF V 5 V.4... IF = 5mA IF = ma IF = 5mA IF = ma IF = ma IF =,ma C 5 T A T A Forward current I F = ƒ (V F ) T A = 5 C Forward current I F = ƒ (T S ) BAW56 5 BAW 56 EHB9 5 ma Ι F ma IF 75 5 typ max V.5 V F C 5 T S 4 6
5 Forward current I F = ƒ (T S ) BAW56S Forward current I F = ƒ (T S ) BAW56T ma 5 5 ma IF 5 IF C 5Kei T S C 5 T S Forward current I F = ƒ (T S ) BAW56U Forward current I F = ƒ (T S ) BAW56W 5 ma 5 ma IF 5 IF C 5 T S C 5 T S 5 6
6 Permissible Puls Load R thjs = ƒ (t p ) BAW56 Permissible Pulse Load I Fmax / I FDC = ƒ (t p ) BAW56 RthJS D =,5,,,5,,,5 IFmax/IFDC D = s T P s T P Permissible Puls Load R thjs = ƒ (t p ) BAW56S Permissible Pulse Load I Fmax / I FDC = ƒ (t p ) BAW56S K/W RthJS D = IFmax/IFDC D = s t P s t P 6 6
7 Permissible Puls Load R thjs = ƒ (t p ) BAW56T Permissible Pulse Load I Fmax / I FDC = ƒ (t p ) BAW56T KW RthJS D= IFmax/ IFDC D= S t p s t p Permissible Puls Load R thjs = ƒ (t p ) BAW56U Permissible Pulse Load I Fmax / I FDC = ƒ (t p ) BAW56U K/W RthJS D= IFmax/IFDC K/W D= s t P s t P 7 6
8 Permissible Puls Load R thjs = ƒ (t p ) BAW56W Permissible Pulse Load I Fmax / I FDC = ƒ (t p ) BAW56W K/W RthJS D = IFmax/IFDC D = s t p s t P 8 6
9 Package SC74 BAW56... Package Outline.9 ±. (.5) B (.5) MAX. Pin marking M B 6x ±. ±..5.5 MAX.. M A MAX.. MAX..6 A ±. Foot Print Marking Layout (Example) Small variations in positioning of Date code, Type code and Manufacture are possible. Manufacturer 5, June Date code (Year/Month) Pin marking Laser marking BCW66H Type code Standard Packing Reel ø8 mm =. Pieces/Reel Reel ø mm =. Pieces/Reel For symmetric types no defined Pin orientation in reel Pin marking
10 Package SC75 BAW56... Package Outline.6 ± MAX..7 ±. A ±. MAX..5 ±..8 ±. MAX..5. M.5. M A Foot Print Marking Layout Date code 5, December Pin Type code BCR8T Example Standard Packing Reel ø8 mm =. Pieces/Reel Reel ø mm =. Pieces/Reel MAX Pin
11 Date Code marking for discrete packages with one digit (SCD8, SC79, SC75 ) ) CESCode Month a p A P a p A P a p A P b q B Q b q B Q b q B Q c r C R c r C R c r C R 4 d s D S d s D S d s D S 5 e t E T e t E T e t E T 6 f u F U f u F U f u F U 7 g v G V g v G V g v G V 8 h x H X h x H X h x H X 9 j y J Y j y J Y j y J Y k z K Z k z K Z k z K Z l L 4 l L 4 l L 4 n N 5 n N 5 n N 5 ) New Marking Layout for SC75, implemented at October 5.. 6
12 Package SOT BAW56... Package Outline +. ) ±..9 B C.95.4 ±.5.5 MIN. MAX. ±.. MAX....8 MAX ±. A.5 M BC. M A Foot Print ) Lead width can be.6 max. in dambar area Marking Layout Manufacturer s Date code (Year/Month) EH s 7, July Pin Type code BCW66 Example Standard Packing Reel ø8 mm =. Pieces/Reel Reel ø mm =. Pieces/Reel Pin.5.5 6
13 Package SOT BAW56... Package Outline ± x. M. MAX...9 ±. A ±.. MIN ±.. M A Foot Print.6 Marking Layout Standard Packing Reel ø8 mm =. Pieces/Reel Reel ø mm =. Pieces/Reel Manufacturer Date code (Year/Month) 5, June Pin Type code BCR8W Example Pin.5. 6
14 Package SOT6 BAW56... Package Outline ± x. M. MAX...9 ±. A Pin marking ±.. MIN Foot Print Marking Layout (Example) Small variations in positioning of Date code, Type code and Manufacture are possible. Manufacturer 5, June Date code (Year/Month) Pin marking Laser marking BCR8S Type code Standard Packing Reel ø8 mm =. Pieces/Reel Reel ø mm =. Pieces/Reel For symmetric types no defined Pin orientation in reel ±.. M A Pin marking
15 Published by Infineon Technologies AG, St.MartinStrasse 5, 8669 München Infineon Technologies AG 5. All Rights Reserved. Attention please! The information herein is given to describe certain components and shall not be considered as a guarantee of characteristics. Terms of delivery and rights to technical change reserved. We hereby disclaim any and all warranties, including but not limited to warranties of noninfringement, regarding circuits, descriptions and charts stated herein. Information For further information on technology, delivery terms and conditions and prices please contact your nearest Infineon Technologies Office ( Warnings Due to technical requirements components may contain dangerous substances. For information on the types in question please contact your nearest Infineon Technologies Office. Infineon Technologies Components may only be used in lifesupport devices or systems with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that lifesupport device or system, or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body, or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. 5 6
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