CML: Series Low Resistance Chip Resistor Specification

Transcription

1 CML: Series Low Resistnce Chip Resistor Specifiction 1. Scope This specifiction pplies to CML**** Series Low Resistnce Chip Resistor for use in electric equipment. *****METAL FOIL***** 2. Prt number CML C - R050 - F - T* (1) (2) (3) (4) (5) (6) (1) Product series (2) Size designtor (3) Product type C: Higher operting temperture type M: Low therml EMF type (4) Nominl resistnce vlue: (5) Resistnce tolernce: (6) Tping quntity/reel Explntion of resistnce vlue F (±1.0%), G (±2.0%), J (±5.0%) T1=1,000pcs/reel, T5=5,000pcs/reel (Note: T1 only for CML50110 nd CML11050) E.g.) 10mΩ -> R Specifiction Prmeter A: Short side electrode B: Long side electrode Prt Number Inch Size Power Rting Prt Number Inch Size Power Rting Inch Size & Power Rting Resistnce Vlue Rnge Resistnce Tolernce TCR Prmeter Rted mbient temperture Operting temperture Rted Voltge CML0816 (0603) 0.3W CML2012 (0805) 1.0W CML1220 (0805) 0.5W CML3216 (1206) 1.5W CML1632 (1206) 0.75W CML5025 (2010) 2.0W CML2550 (2010) 1.5W CML6432 (2512) 3.0W CML3264 (2512) 2.0W CML7638 (3015) 4.0W CML50110 (4320) 5.0W CML9045 (3518) 5.0W CML ~500mΩ (E-12) nd *1 CML1220 5~10mΩ (1mΩ step), CML ~500mΩ (E-12) nd *1 CML2550 CML3264 CML ~10mΩ (1mΩ step), 10~1000mΩ (E-12) nd *1 CML11050 (4320) 6.0W CML2012 CML3216 CML5025 1~10mΩ (1mΩ step), CML ~500mΩ (E-6) CML7638 nd *1 CML9045 CML11050 *1: 20mΩ, 25mΩ, 50mΩ 5~9mΩ G: ±2.0% 1mΩ J: ±5.0% 10mΩ F: ±1.0% 2mΩ G: ±2.0% 3mΩ~ F: ±1.0% 5~9mΩ ±100ppm/ 1mΩ ±150ppm/ 10mΩ~ ±50ppm/ 2mΩ ±100ppm/ 3mΩ~ ±50ppm/ Specifiction Type C: +120 Type M: +100 Refer to Derting curve, Figure-1 Type C: -55~+175 Type M: -55~+155 Power Resistnce Vlue (V) Figure-1 Derting curve: % of Rted Power (%) Temperture( ) /9

2 W 4. Structure Metl lloy (Ni-Cu) foil resistive element is dhered to the cermic substrte. The terminls re formed by tin-plting on the foil. 5. Dimensions A: Short side electrode B: Long side electrode L L t (2) (1) (5) (3) (4) No. Components Mteril / process (1) Substrte Alumin 96% (2) Resistor Ni-Cu lloy (3) Terminls Plted Sn+Ni (on Cu) (4) Protection cot Epoxy resin (Green) (5) Mrking Epoxy resin (Blck) * No Mrking in CML0816 Stndrd dimension Type of Electrode A: Short side electrode B: Long side electrode Prt Number Resistnce Dimensions (mm) Vlue Rnge L W t 10mΩ~18mΩ 0.70±0.15 CML mΩ~39mΩ 1.60± ± ± mΩ~ 0.30±0.15 CML1220 5mΩ~ 2.00± ± ±0.20 CML1632 5mΩ~8mΩ 1.10± ± ±0.20 9mΩ~ CML2550 5mΩ~8mΩ 1.40± ± ±0.20 9mΩ~ 0.60±0.20 CML3264 3mΩ~8mΩ 1.90± ± ±0.20 9mΩ~ 1.00±0.20 CML mΩ~7mΩ 3.60± ± ±0.20 8mΩ~ 2.36± ±0.20 CML2012 1mΩ 0.55± ± ± ±0.20 CML3216 1mΩ 0.55± ± ± ±0.20 CML5025 1mΩ 0.55± ± ± ±0.20 CML6432 1mΩ 1.20± ± ±0.20 CML7638 1mΩ 1.35± ± ± ±0.20 CML9045 1mΩ 1.60± ± ± ±0.20 CML mΩ 1.60± ± ± ±0.20 W t (1) (5) (2) (3) (4) 2/9

3 6. Mrking Resistnce vlue code is mrked on the top surfce. E.g.) 5mΩ -> R005 Note: No mrking in CML mΩ -> R mΩ -> R Schemtic Digrm, Mesurement (probing) re A: Short side electrode B: Long side electrode ( bottom ) Voltge terminl (-) Voltge terminl (+) Current terminl (-) Voltge terminl (-) Current terminl (-) ( bottom ) Current terminl (+) Voltge terminl (+) Current terminl (+) 8. Relibility Chrcteristics Test Item Test Conditions Specifiction Apply surge current, clculted in the following eqution for 10 ms for 10 times with 60s intervl. Mximum Refer to Tble-1 for mximum current for ech prt. Over current I = (P/R) [A] ±(1.0% Ω) P = Mximum power (W) R = Resistnce vlue (Ω) Lod life Rted power on for 90 min, off for 30 min t 70±3 for 1000h. ±(1.0% Ω) Moisture Rted power for 90 min, off for 30 min t 60±2, Lod life reltive humidity of 90% for 1000h. ±(2.0% Ω) Temperture [ min -> R.T. 3 min -> 100 cycles ±(1.0% Ω) Cycle Resistnce to soldering het Bord Bending Solderbility min -> R.T. 3 min] 1000 cycles ±(2.0% Ω) 260±5 solder, 10±1sec dip ±(0.5% Ω) Test bord length: 90mm Bend depth: 2mm Test bord: Glss-Epoxy t=1.6mm 245±5 solder, 3+1/-0 sec dip. ±(1.0% Ω) 90% terminl surfce coverge by fresh solder 3/9

4 Tble-1: Mximum current <Condition> Impression time 10 m sec, Repetition 10 times, nd Intervl 60sec. A: Short side electrode Prt number Mx dissiption Mx current CML W 15A CML W 25A CML W 35A CML W 55A CML W 70A CML W 120A B: Long side electrode Resistnce >10.1mΩ & 100mΩ & 200mΩ & 500mΩ & 10mΩ rnge <100mΩ <200mΩ <500mΩ 1000mΩ The Mx Power is common. Prt Mx Mx Mx Mx Mx number dissiption current dissiption current Mx current dissiption CML W 45A 14W 20A 3W 6A 4A 2.4A CML W 64A 36W 35A 14W 10A 7A 5A CML W 100A 56W 47A 22W 11A 8A 7A CML W 125A 150W 70A 36W 19A 14A 8A CML W 150A 210W 80A 50W 23A 17A 10A CML W 180A 300W 100A 72W 27A 20A 12A CML W 240A 440W 120A 100W 33A 23A 14A Clcultion of the mximum over-current Mximum Over current = (Mximum dissiption Resistnce Vlue) Or it becomes which of the mximum current, or smll vlue. Exmple) CML mΩ Mximum Over current = (300W 0.03Ω) = 100A CML3216 1mΩ Mximum Over current = (56W 0.001Ω) = 237A Since the mximum current is specified s 64A An over-current is set to 64A t the mximum moment. 9. Country of origin Country of origin : Jpn 10. Pckging Pcking quntity: 1,000 or 5,000pieces/reel (1000/reel only for CML11050 nd CML50110) Tpe digrm/dimension Figure-2 Peeling strength of seled tpe Figure-3 Reel digrm/dimension Figure-4 Tping direction Figure-5 4/9

5 Figure-2 Tpe digrm: T2 T 0 B Push forwrd holes Cvity D 0 P 0 P 2 A0 P 1 Pulling direction E F D1 W Mteril: Plstic Tpe dimension (mm): Short / (Long) electrode Symbol (7638) (9045) (2012) (3216) (5025) (6432) (11050) A0 0.95± ± ± ± ± ± ± ±0.10 B0 1.85± ± ± ± ± ± ± ±0.10 W 8.0± /-0 8.0± ± ± ± ± ±0.30 F 3.5± ± ± ± ± ± ± ±0.10 E 1.75± ± ± ± ± ± ± ±0.10 P0 4.0± ± ± ± ± ± ± ±0.10 P1 4.0± ± ± ± ± ± ± ±0.10 P2 2.0± ± ± ± ± ± ± ±0.10 D / / / / / ± ± ±0.10 D1 0.6± / / / ± ± ±0.10 T 0.2± ± ± Mx 0.20± ± ± ±0.05 T2 0.55± ± ± Mx 0.76± ± ± ±0.15 End portion more thn 200mm Portion filled with prts Led portion more thn 500mm Unseled prt Pulling direction Figure-3 Peeling strength of seled tpe: F = peeling strength: N (10-71gf) 165~180 F 5/9

6 Figure-4 Reel digrm: E φh Lbel ラベル貼付位置 W2 φn φa W1 Mteril: Plstic Reel dimension (mm): Short / (Long) electrode Size 0816, 1220, , (7638), (9045) (2012), (3216) (5025), (6432) (11050) Pieces 1,000 / 5,000 1,000 5,000 1,000 5,000 1,000 φa / / ± / ± ±2.0 φh 13.0± ± ± ± ± ±0.2 E 2.0± ± ± ± ± ±0.5 φn / / ± / ± ±1.0 W1 9.0± ± ± ± ± ±1.0 W2 13.0± ±1.4 Less thn ± ± ±1.0 Figure-5 Tping direction: Cvity Sprocket hole Lbel Pulling direction 6/9

7 11. Recommended implementtion temperture profile 11.1 Reflow temperture profile Twice reflows re llowed by the following temperture profile Temperture 温度 temperture ( ) Pek ピーク Pek 50 Pre-heting プレヒート 時間 time Pre-heting Time Surfce temperture of resistnce nd time Pre-heting 130~180 60~90sec Reflow 220 Mx 30~90sec Pek 240~260 10sec Mx 11.2 Flow temperture profile Less thn sec Mx Reflow リフロー Reflow 11.3 Hnd solder ttchment conditions Work in 3 seconds or less is [temperture of 350 ] possible. When soldering with soldering iron, heting is performed on lnd nd the point does not hit the min prt of product. Plese crry out. 7/9

8 12. Recommended lnd pttern (for current sensing) Bord mterils: Glss epoxy (FR-4) t=0.6mm Note: The terminl temperture should not exceed 100 (M type) or 120 (C type) t the rted power. Note: M* type, C* type: Product Type See Prt number (4) <Recommended lnd pttern> A: Short side electrode (*1) CML ~39mΩ b c solder resist Component outline b c solder resist Component outline B: Long side electrode (*2) CML2012, CML3216, CML5025, CML6432 Series: 1.0mΩ b Type of electrode A: Short side electrode B: Long side electrode Solder resist c Component outline b c Solder resist Component outline Prt number Resistnce Thickness of Dimensions (mm) Vlue Rnge copper foil (um) b c 10~18mΩ (*1) CML ~39mΩ (*1) mΩ~ CML1220 5mΩ~ CML1632 5~8mΩ mΩ~ CML2550 5~8mΩ mΩ~ CML3264 5~8mΩ mΩ~ CML ~7mΩ mΩ~ CML2012 1mΩ (*2) CML3216 1mΩ (*2) CML5025 1mΩ (*2) CML6432 1mΩ (*2) CML7638 1mΩ CML9045 1mΩ CML mΩ /9

9 13. Storge note (1) To mintin good solderbility, Store the components in the temperture nd humidity controlled room. Temperture: 5~35 Humidity: 45~85% RH (2) Store the components t the plce voiding moisture, dust nd corrosive hrmful gs (hydrogen chloride, sulfurous cid gs nd hydrogen sulfide) tht my cuse the decrese in solderbility. (3) Store the components t the plce voiding direct sunlight. 9/9