BC556B, BC557A, B, C, BC558B. Amplifier Transistors. PNP Silicon BC556B PNP AUDIO 100MA 65V 500MW TO92.
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- Ezra Cross
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1 B, A, B, C, B Amplifier Transistors PNP Silicon Features PbFree Packages are Available* B PNP AUDIO 1MA 65 5MW TO92 COLLECTOR 1 MAXIMUM RATINGS Collector - Emitter oltage Collector - Base oltage Rating Symbol alue Unit CEO CBO dc dc Emitter - Base oltage EBO 5. dc Collector Current Continuous Collector Current Peak I C I CM 1 2 madc Base Current Peak I BM 2 madc Total Device Derate above 25 C Total Device T C = 25 C Derate above 25 C Operating and Storage Junction Temperature Range P D P D mw mw/ C W mw/ C T J, T stg 55 to +15 C TO92 CASE 29 STYLE 17 2 BASE 3 EMITTER STRAIGHT LEAD BENT LEAD BULK PACK TAPE & REEL AMMO PACK MARKING DIAGRAM THERMAL CHARACTERISTICS Characteristic Symbol Max Unit Thermal Resistance, JunctiontoAmbient R JA 2 C/W Thermal Resistance, JunctiontoCase R JC 83.3 C/W Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. BC 55xx AYWW xx = 6B, 7A, 7B, 7C, or 8B A = Assembly Location Y = Year WW = Work Week = PbFree Package (Note: Microdot may be in either location) *For additional information on our PbFree strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 6 of this data sheet.
2 B, A, B, C, B ELECTRICAL CHARACTERISTICS ( unless otherwise noted) Characteristic Symbol Min Typ Max Unit OFF CHARACTERISTICS CollectorEmitter Breakdown oltage (BR)CEO (I C = madc, I B = ) CollectorBase Breakdown oltage (I C = 1 Adc) EmitterBase Breakdown oltage (I E = 1 Adc, I C = ) CollectorEmitter Leakage Current ( CES = 4 ) ( CES = 2 ) ( CES = 2, T A = 125 C) ON CHARACTERISTICS DC Current Gain (I C = 1 Adc, CE = 5. ) A Series Device (I C = madc, CE = 5. ) A Series Device (I C = 1 madc, CE = 5. ) A Series Device CollectorEmitter Saturation oltage (I C = 1 madc, I B =.5 madc) (I C = 1 madc, I B = see Note 1) (I C = 1 madc, I B = 5. madc) BaseEmitter Saturation oltage (I C = 1 madc, I B =.5 madc) (I C = 1 madc, I B = 5. madc) BaseEmitter On oltage (I C = madc, CE = 5. dc) (I C = 1 madc, CE = 5. dc) (BR)CBO (BR)EBO I CES h FE CE(sat) BE(sat) BE(on) SMALLSIGNAL CHARACTERISTICS CurrentGain Bandwidth Product f T MHz (I C = 1 ma, CE = 5., f = 1 MHz) Output Capacitance C ob pf ( CB = 1, I C =, f = MHz) Noise Figure NF db (I C = madc, CE = 5., 1 R S = k, f = khz, f = 2 Hz) 1 1 SmallSignal Current Gain (I C = madc, CE = 5., f = khz) A Series Device fe I C = 1 madc on the constant base current characteristics, which yields the point I C = 11 madc, CE = na A
3 B, A, B, C, B / hfe, NORMALIZED DC CURRENT GAIN CE = 1 I C, COLLECTOR CURRENT (madc), OLTAGE (OLTS) I C /I B = 1 CE = 1 I C /I B = I C, COLLECTOR CURRENT (madc) Figure 1. Normalized DC Current Gain Figure 2. Saturation and On oltages CE, COLLECTOREMITTER OLTAGE () I C = 1 ma I C = 2 ma I C = 5 ma I B, BASE CURRENT (ma) I C = 2 ma I C = 1 ma 2 B, TEMPERATURE COEFFICIENT (m/ C) θ C to +125 C 1 1 Figure 3. Collector Saturation Region Figure 4. BaseEmitter Temperature Coefficient C, CAPACITANCE (pf) C ib C ob R, REERSE OLTAGE (OLTS) f, T CURRENTGAIN BANDWIDTH PRODUCT (MHz) I C, COLLECTOR CURRENT (madc) CE = 1 Figure 5. Capacitances Figure 6. CurrentGain Bandwidth Product
4 B, A, B, C, B hfe, DC CURRENT GAIN (NORMALIZED).5 CE = 5., OLTAGE (OLTS) I C /I B = 1 CE = 5. I C /I B = Figure 7. DC Current Gain Figure 8. On oltage CE, COLLECTOREMITTER OLTAGE (OLTS) I C = 1 ma 2 ma 5 ma I B, BASE CURRENT (ma) 1 ma 2 ma 2 B, TEMPERATURE COEFFICIENT (m/ C) θ B for BE 55 C to 125 C Figure 9. Collector Saturation Region Figure 1. BaseEmitter Temperature Coefficient C, CAPACITANCE (pf) 4 2 C ib C ob R, REERSE OLTAGE (OLTS) f, T CURRENTGAIN BANDWIDTH PRODUCT CE = Figure 11. Capacitance Figure 12. CurrentGain Bandwidth Product
5 B, A, B, C, B r(t), TRANSIENT THERMAL RESISTANCE (NORMALIZED) D = SINGLE PULSE SINGLE PULSE.5 5. P (pk) k k 5. k 1 t, TIME (ms) t 1 t2 DUTY CYCLE, D = t 1 /t 2 Z JC (t) = (t) R JC R JC = 83.3 C/W MAX Z JA (t) = r(t) R JA R JA = 2 C/W MAX D CURES APPLY FOR POWER PULSE TRAIN SHOWN READ TIME AT t 1 T J(pk) T C = P (pk) R JC (t) Figure 13. Thermal Response IC, COLLECTOR CURRENT (ma) s BONDING WIRE LIMIT THERMAL LIMIT SECOND BREAKDOWN LIMIT 3 ms CE, COLLECTOREMITTER OLTAGE () The safe operating area curves indicate I C CE limits of the transistor that must be observed for reliable operation. Collector load lines for specific circuits must fall below the limits indicated by the applicable curve. The data of Figure 14 is based upon T J(pk) = 15 C; T C or T A is variable depending upon conditions. Pulse curves are valid for duty cycles to 1% provided T J(pk) 15 C. T J(pk) may be calculated from the data in Figure 13. At high case or ambient temperatures, thermal limitations will reduce the power than can be handled to values less than the limitations imposed by second breakdown. Figure 14. Active Region Safe Operating Area
6 B, A, B, C, B ORDERING INFORMATION Device Package Shipping BG BZL1G AZL1G BG TO92 (PbFree) TO92 (PbFree) TO92 (PbFree) TO92 (PbFree) 5 Units / Bulk 5 Units / Bulk BRL1 TO92 2 / Tape & Reel BRL1G BZL1G CG CZL1G BRLG BRL1G TO92 (PbFree) TO92 (PbFree) TO92 (PbFree) TO92 (PbFree) TO92 (PbFree) TO92 (PbFree) 2 / Tape & Reel 5 Units / Bulk 2 / Tape & Reel 2 / Tape & Reel BZL1G TO92 (PbFree) For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD811/D.
7 B, A, B, C, B PACKAGE DIMENSIONS TO92 (TO226) CASE 2911 ISSUE AM R A N B STRAIGHT LEAD BULK PACK NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, CONTROLLING DIMENSION: INCH. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. P L SEATING INCHES MILLIMETERS PLANE K DIM MIN MAX MIN MAX A B C D X X D G H G J H J K C L N P SECTION XX R N R T SEATING PLANE P G A X X 1 B K C N BENT LEAD TAPE & REEL AMMO PACK D J SECTION XX NOTES: 1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, CONTROLLING DIMENSION: MILLIMETERS. 3. CONTOUR OF PACKAGE BEYOND DIMENSION R IS UNCONTROLLED. 4. LEAD DIMENSION IS UNCONTROLLED IN P AND BEYOND DIMENSION K MINIMUM. MILLIMETERS DIM MIN MAX A B C D.4.54 G J.39.5 K 12.7 N P R STYLE 17: PIN 1. COLLECTOR 2. BASE 3. EMITTER 7 B/D
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