PSMN8R3-40YS. N-channel LFPAK 40 V 8.6 mω standard level MOSFET

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1 Rev June 29 Product data sheet 1. Product profile 1.1 General description Standard level N-channel MOSFET in LFPAK package qualified to 175 C. This product is designed and qualified for use in a wide range of industrial, communications and domestic equipment. 1.2 Features and benefits Advanced TrenchMOS provides low RDSon and low gate charge High efficiency gains in switching power converters Improved mechanical and thermal characteristics LFPAK provides maximum power density in a Power SO8 package 1.3 Applications DC-to-DC convertors Lithium-ion battery protection Load switching Motor control Server power supplies 1.4 Quick reference data Table 1. Quick reference Symbol Parameter Conditions Min Typ Max Unit V DS drain-source voltage T j 25 C; T j 175 C V I D drain current T mb =25 C; V GS =1V; A see Figure 1 P tot total power T mb = 25 C; see Figure W dissipation T j junction temperature C Avalanche ruggedness E DS(AL)S non-repetitive drain-source avalanche energy V GS =1V; T j(init) =25 C; I D =62A; V sup 4 V; unclamped; R GS =5Ω mj Dynamic characteristics Q GD gate-drain charge V GS =1V; I D =25A; nc Q G(tot) total gate charge V DS = 2 V; see Figure 14; see Figure nc

2 2. Pinning information Table 1. Quick reference continued Symbol Parameter Conditions Min Typ Max Unit Static characteristics R DSon drain-source on-state resistance V GS =1V; I D =15A; T j = 1 C; see Figure 12 V GS =1V; I D =15A; T j = 25 C; see Figure 12; see Figure mω mω Table 2. Pinning information Pin Symbol Description Simplified outline Graphic symbol 1 S source 2 S source mb 3 S source 4 G gate G mb D drain mbb SOT669 (LFPAK) 3. Ordering information D S Table 3. Ordering information Type number Package Name Description Version LFPAK plastic single-ended surface-mounted package (LFPAK); 4 leads SOT669 _1 Product data sheet Rev June 29 2 of 13

3 4. Limiting values Table 4. Limiting values In accordance with the Absolute Maximum Rating System (IEC 6134). Symbol Parameter Conditions Min Max Unit V DS drain-source voltage T j 25 C; T j 175 C - 4 V V DGR drain-gate voltage T j 25 C; T j 175 C; R GS =2kΩ - 4 V V GS gate-source voltage -2 2 V I D drain current V GS =1V; T mb = 1 C; see Figure 1-5 A V GS =1V; T mb =25 C; see Figure 1-7 A I DM peak drain current t p 1 µs; pulsed; T mb =25 C; see Figure A P tot total power dissipation T mb =25 C; see Figure 2-74 W T stg storage temperature C T j junction temperature C T sld(m) peak soldering temperature - 26 C Source-drain diode I S source current T mb =25 C - 7 A I SM peak source current t p 1 µs; pulsed; T mb =25 C A Avalanche ruggedness E DS(AL)S non-repetitive drain-source avalanche energy V GS =1V; T j(init) =25 C; I D =62A; V sup 4 V; unclamped; R GS =5Ω - 33 mj 8 3aad aa16 I D (A) 6 P der (%) T mb ( C) T mb ( C) Fig 1. Continuous drain current as a function of mounting base temperature Fig 2. Normalized total power dissipation as a function of mounting base temperature _1 Product data sheet Rev June 29 3 of 13

4 1 3 I D (A) 1 2 Limit R DSon = V DS / I D 3aad32 1μs 1 1μs 1 DC 1ms 1ms 1ms V DS (V) Fig 3. Safe operating area; continuous and peak drain currents as a function of drain-source voltage 5. Thermal characteristics Table 5. Thermal characteristics Symbol Parameter Conditions Min Typ Max Unit R th(j-mb) thermal resistance from junction to mounting base see Figure K/W 1 3aac558 Z th(j-mb) (K/W) 1 δ = P t p δ = T single shot t p (s) 1 t p T t Fig 4. Transient thermal impedance from junction to mounting base as a function of pulse duration _1 Product data sheet Rev June 29 4 of 13

5 6. Characteristics Table 6. Characteristics Symbol Parameter Conditions Min Typ Max Unit Static characteristics V (BR)DSS drain-source I D =25µA; V GS =V; T j =-55 C V breakdown voltage I D =25µA; V GS =V; T j =25 C V V GS(th) gate-source threshold I D =1mA; V DS = V GS ; T j =-55 C; V voltage see Figure 1; see Figure 11 I D =1mA; V DS = V GS ; T j = 175 C; V see Figure 1; see Figure 11 I D =1mA; V DS = V GS ; T j =25 C; V see Figure 1; see Figure 11 I DSS drain leakage current V DS =4V; V GS =V; T j = 25 C µa V DS =4V; V GS =V; T j = 125 C µa I GSS gate leakage current V GS =2V; V DS =V; T j = 25 C na V GS =-2V; V DS =V; T j = 25 C na R DSon drain-source on-state V GS =1V; I D =15A; T j = 1 C; mω resistance see Figure 12 V GS =1V; I D =15A; T j = 175 C; mω see Figure 12 V GS =1V; I D =15A; T j =25 C; mω see Figure 12; see Figure 13 R G internal gate resistance (AC) f=1mhz Ω Dynamic characteristics Q G(tot) total gate charge I D =25A; V DS =2V; V GS =1V; nc see Figure 14; see Figure 15 I D =A; V DS =V; V GS =1V nc Q GS gate-source charge I D =25A; V DS =2V; V GS =1V; nc Q GS(th) pre-threshold see Figure 14; see Figure nc gate-source charge Q GS(th-pl) post-threshold nc gate-source charge Q GD gate-drain charge nc V GS(pl) gate-source plateau voltage I D =25A; V DS =2V; see Figure 14; see Figure V C iss input capacitance V DS =2V; V GS = V; f = 1 MHz; pf C oss output capacitance T j =25 C; see Figure pf C rss reverse transfer pf capacitance t d(on) turn-on delay time V DS =3V; R L =1.5Ω; V GS =1V; ns t r rise time R G(ext) =4.7Ω ns t d(off) turn-off delay time ns t f fall time ns _1 Product data sheet Rev June 29 5 of 13

6 Table 6. Characteristics continued Symbol Parameter Conditions Min Typ Max Unit Source-drain diode V SD source-drain voltage I S =25A; V GS =V; T j =25 C; V see Figure 17 t rr reverse recovery time I S =5A; di S /dt = -1 A/µs; V GS =V; ns Q r recovered charge V DS =2V nc [1] Tested to JEDEC standards where applicable. 8 I D (A) aad163 6 I D 7 (A) 6 5 3aad T j = 175 C T j = 25 C V GS (V) = V DS (V) V GS (V) Fig 5. Output characteristics: drain current as a function of drain-source voltage; typical values Fig 6. Transfer characteristics: drain current as a function of gate-source voltage; typical values 4 3aad aad17 R DSon (mω) g fs (S) V GS (V) I D (A) Fig 7. Drain-source on-state resistance as a function of gate-source voltage; typical values Fig 8. Forward transconductance as a function of drain current; typical values _1 Product data sheet Rev June 29 6 of 13

7 18 3aad aa35 C (pf) 15 C iss I D (A) 1 2 min typ max C rss V GS (V) V GS (V) Fig 9. Input and reverse transfer capacitances as a function of gate-source voltage; typical values Fig 1. Sub-threshold drain current as a function of gate-source voltage 5 3aad28 2 3aa27 V GS(th) (V) 4 max a typ min T j ( C) T j ( C) Fig 11. Gate-source threshold voltage as a function of junction temperature Fig 12. Normalized drain-source on-state resistance factor as a function of junction temperature _1 Product data sheet Rev June 29 7 of 13

8 2 R DSon (mω) V GS (V) = 6 3aad V DS I D 15 V GS(pl) 7 V GS(th) V GS Q GS1 Q GS2 1 Q GS Q GD Q G(tot) I D (A) 2 3aaa58 Fig 14. Gate charge waveform definitions Fig 13. Drain-source on-state resistance as a function of drain current; typical values 1 3aad aad168 V GS (V) 8 8V 32V V DS = 2V C (pf) C iss 4 2 C oss Q G (nc) C rss V DS (V) 1 2 Fig 15. Gate-source voltage as a function of gate charge; typical values Fig 16. Input, output and reverse transfer capacitances as a function of drain-source voltage; typical values _1 Product data sheet Rev June 29 8 of 13

9 1 3aad166 I S (A) T j = 175 C T j = 25 C V SD (V) Fig 17. Source (diode forward) current as a function of source-drain (diode forward) voltage; typical values _1 Product data sheet Rev June 29 9 of 13

10 7. Package outline Plastic single-ended surface-mounted package (LFPAK); 4 leads SOT669 E A A 2 C b 2 c 2 E 1 L 1 b 3 mounting base b 4 D 1 H D L e b w M A c X 1/2 e A A 1 C (A ) 3 θ detail X L y C mm scale DIMENSIONS (mm are the original dimensions) UNIT mm A A A 2 A 3 b b 2 b 3 b 4 c c 2 D (1) D 1 (1) max Note 1. Plastic or metal protrusions of.15 mm maximum per side are not included. E (1) E 1 (1) e H L L 1 L 2 w y θ 8 OUTLINE VERSION REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION ISSUE DATE SOT669 MO Fig 18. Package outline SOT669 (LFPAK) _1 Product data sheet Rev June 29 1 of 13

11 8. Revision history Table 7. Revision history Document ID Release date Data sheet status Change notice Supersedes _ Product data sheet - - _1 Product data sheet Rev June of 13

12 9. Legal information 9.1 Data sheet status Document status [1][2] Product status [3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term 'short data sheet' is explained in section "Definitions". [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL Definitions Draft The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. Nexperia does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local Nexperia sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. 9.3 Disclaimers General Information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes Nexperia reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use Nexperia products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or malfunction of a Nexperia product can reasonably be expected to result in personal injury, death or severe property or environmental damage. Nexperia accepts no liability for inclusion and/or use of Nexperia products in such equipment or applications and therefore such inclusion and/or use is at the customer s own risk. Applications Applications that are described herein for any of these products are for illustrative purposes only. Nexperia makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Quick reference data The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Limiting values Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 6134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale Nexperia products are sold subject to the general terms and conditions of commercial sale, as published at including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by Nexperia. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from national authorities. 9.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 1. Contact information For more information, please visit: For sales office addresses, please send an to: _1 Product data sheet Rev June of 13

13 11. Contents 1 Product profile General description Features and benefits Applications Quick reference data Pinning information Ordering information Limiting values Thermal characteristics Characteristics Package outline Revision history Legal information Data sheet status Definitions Disclaimers Trademarks Contact information For more information, please visit: For sales office addresses, please send an to: Date of release: 25 June 29

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