Reflow Soldering Processes Development Using Infrared Thermography

Size: px
Start display at page:

Download "Reflow Soldering Processes Development Using Infrared Thermography"

Transcription

1 Reflow Soldering Processes Development Using Infrared Thermography Petko Mashkov, Tamara Pencheva, and Berkant Gyoch Physics Department, University of Rousse, Bulgaria Abstract: Investigation deals with application of new kind of soldering equipment and development of reflow soldering processes for electronic devices using this equipment. It is based on low inert heaters for the middle IR spectral region. Due to low inertia of the heaters temperature changes in the soldering camera may be controlled precisely and the soldering cycle may be realized at the same place without conveyor belt. The printed circuit board (PCB) of the device is relatively big with different electronic components density in different zones of its surface. Used electronic components demand precise soldering cycle parameters realization. Temperature monitoring of the whole PCB s surface necessary for technological operation development practically is impossible by conventional measurement techniques. Good results are obtained using IR thermography with IR camera for the middle IR spectral region. Results of this investigation allow adjusting proper regime of operation of the soldering equipment and successful realization of soldering processes. 1. INTRODUCTION The purpose of this investigation is connected with development of soldering technological processes for an electronic device. The PCB for this device is relatively big with different electronic components density in different zones of its surface. Electronic components are with quite different properties and soldering of some of them (for example BGA packages) is quite delicate technological operation. Soldering equipment designed and produced in our laboratory is without conveyor belt [1-3]. Due to low inertia of heaters the temperature onto PCB may be controlled in situ during soldering cycle and a lot of operating parameters can be adjusted in dependence of size and type of the PCB, electronic components density, etc. Temperature usually is controlled in one point on PCB during soldering processes. In practice it is impossible to put a lot of thermocouples on PCB. Because of soldering cycle s duration is about 4 minutes, usage of more than one thermocouple would disturb operation and service of the soldering camera and may be a reason for different problems. At the same time it is desirable to have opportunity to control electronic elements temperature regimes, especially when electronic components are quite different, PCBs are big, etc. Temperature monitoring on the whole surface of PCB and different kind electronic components necessary for technological operation development practically is impossible by conventional measurement techniques. Our previous experiments [1] showed that this problem may be solved partially using infrared thermometers, but as it is shown [1], temperature can be measured at the moment in one point only. It is impossible to determine temperature distribution onto the whole PCB, surface temperature of different kind electronic components during soldering cycles which is necessary for optimization of soldering regimes technological parameters. More over, temperature measurements by IR thermometers can t be applied when the surface of the object is metal due to its high reflectivity [1]. This is a disadvantage because it is impossible to obtain reliable results concerning surface temperature of electronic components with metal packages during soldering. Proper solution of this problem is possible by application of IR thermography equipment for the middle IR spectral region (8-13 m). The method allows realizing precise measurement and control of temperature distribution on PCB during soldering processes, possibility of optimization of temperature profiles for different printed boards in dependence of their size and electronic components density [1, 4, 5].

2 2. EXPERIMENTAL EQUIPMENT Cross-section view of experimental soldering camera without conveyor is shown in Figure 1. In this equipment a lot of operating parameters may be controlled: direction and hot gas flow rate; cooling rate by entrance of outer air, etc. Operation regimes of upper and lower parts of the heaters can be controlled independently. Some small constructive changes in the equipment, Figure 1, allow investigation of thermal processes on PCB at different stages of the soldering cycle by IR camera. Experiments are carried out using ThermaCam E300 FLIR Systems b a 8 Fig. 1. Cross-section view of experimental soldering camera without conveyor: 1a and 1b heaters; 2 metal grid for PCBs mounting; 3 heating chamber; 4 PCB; 5 reflecting shields; 6 metal grid, 7 aluminum gate, 8 fan, 9 ThermaCam E300 camera. Some of parameters of the camera are: Thermal Sensitivity: <0.08 C at 25 C. Detector Type: Focal plane array (FPA) uncooled Vanadium Oxide microbolometer, 320 x 240 pixels. Spectral range: 7.5 to 13 µm. Measurement Temperature Ranges: -20 to C (-4 F to F) and 0 C to +500 C (+32 F to 932 F), Up to 1200 C (2192 F), optional. Accuracy (% of reading) ± 2 C (3.6 F) or ± 2% of absolute temperature in C. Application of IR camera at these conditions is a delicate process and obtaining correct results from temperature measurements demands keeping some very important rules. The radiation measured by the camera does not depend on the temperature of the object only but is also a function of its emissivity. Radiation also originates from the surroundings and is 9 reflected in the object. The influence of other parameters - atmosphere s temperature and relative humidity is weak but in the heating camera infrared radiation is quite intensive and it is very important to determine correctly its influence on obtained results Determination the reflected apparent temperature: The parameter reflected apparent temperature is used to compensate the radiation reflected in the object, especially when the object s emissivity is low and its temperature is relatively far from that of the reflected apparent temperature. That is why it is very important to be able to measure this temperature during soldering in the heating camera. Two methods for determining of reflected apparent temperature and avoiding the influence of radiation from surroundings reflected in the object are recommended [2]. The first (direct method) is impracticable it is impossible to put IR camera into the reflow oven during soldering cycle. The second described method (reflector method) [2] demands to place an aluminum shield over the PCB for determining the reflected apparent temperature Fig. 2. Measuring the reflected apparent temperature using aluminum shield. (Figure 2). Because the duration of this process is small (about 1 2 seconds) it can be made without disturbing a lot the soldering process. Small constructive changes in the heating camera are made and a moving aluminum shield is mounted in it. At a choused moment it can be placed over the PCB and

3 replaced when the value of reflected apparent temperature is read Determination emissivity of different electronic components on PCB: Fig. 3. Determination emissivity of IC s surface. Temperature measured by thermocouple is C. Good correspondence with temperature shown in thermo photograph is achieved when emissivity is set to be A lot of experiments for verification of the method s possibilities and accuracy of obtained results from thermal pictures are made. Some thermocouples (4-5) on different electronic components (with different emissivity and physical properties) upon the PCB were mounted. Temperatures in these points at chosen moments during typical soldering cycle were measured. The obtained results are compared to those from IR pictures for the same points and moments. IR photographs are processed by ThermaCAM Quick Report (Version 1.1) FLIR and results for reflected apparent temperature are used. The correspondence between temperature values obtained from these two methods is very good practically results are the same. Experiments show that this method for compensation the influence of reflected radiation from the object is applicable (despite of its high intensity in the reflow oven) and obtained temperature measurements results are correct. Fig. 4. Determination emissivity of metal surface of quartz resonator. Temperature measured by thermocouple is C. Good correspondence with temperature shown in thermo photograph is achieved when emissivity is set to be [2] allows determining object s emissivity easily and quickly but sometimes may be unpractical. When it is necessary to measure emissivity of electronic components mounted on PCB, usage of electrical tape with known high emissivity is not a good decision. The most interesting temperature interval for our investigations is between C and C. At these temperatures it is impossible to use plastic tape. Experiments show that it is possible to obtain correct results for emissivity values by a little different measuring method. A thermocouple is mounted on the surface of the electronic component which emissivity has to be measured. The object is heated by hot air flow which temperature is controlled to be constant. After reaching stationary conditions the temperature (measured by thermocouple) is read and thermo photo is made. During processing the IR picture by FLIR Quick Report application the emissivity setting has to be changed until temperature the same as measured by thermocouple to be read. Pictures shown in Figures 3

4 and 4 illustrate upper described measuring procedure. Experiments show that results obtained by the method recommended in [2] and by the method with thermocouple practically are the same. But the method proposed here has important advantages. It allows quickly determination of emissivity of the objects with very different optical properties directly on PCB in the whole temperature range between C and C. 3. RESULTS Investigations by IR thermograph measurements give a lot of advantages during development of characteristics power and operation parameters of the heaters (Fig.1), gas flow rate and its direction in the heating camera, parameters of soldering cycle and others. A lot of experiments are made to establish optimal operating parameters during soldering cycle for large size PCB (250/ 310 mm) with very different electronic components density on its surface. A considerable disadvantage of investigation method described above is determination of reflecting apparent temperature (RAT). This procedure delays measurement process, disturbs soldering and causes difficulties for operators. More over, the essential problems for this measuring method are connected with fast changes of radiation intensity in the heating camera during soldering process. That is why Fig. 5. Determination of reflected apparent temperature during soldering cycle using aluminum sheet and thermocouple under it. Temperature measured by thermocouple is C. Good correspondence with temperature shown in thermo photograph is achieved when reflected apparent temperature is set to be C. soldering processes. Thermograph photos allow receiving temperature distribution on the whole area of the PCB at each moment of soldering cycle independently on PCB s size and type of electronic components on it. Obtained data are very useful for optimization of the soldering equipment s Fig. 6. Determination of reflected apparent temperature during soldering cycle using aluminum sheet and thermocouple under it. Temperature measured by thermocouple is C. Good correspondence with temperature shown in thermo photograph is achieved when reflected apparent temperature is set to be C. different method to determine the reflecting apparent temperature much more fast and suitable is proposed. A thermocouple is mounted on the bottom side of a little piece thin aluminum sheet (15/15 mm). The surface of this aluminum sheet is good to have diffuse reflection. The emissivity of the sheet is determined

5 by methods described above. The sheet is fixed at a proper place on the PCB. When the thermo photo is made, at this moment the temperature measured by thermocouple is written down. Pictures processing includes: setting emissivity of the aluminum sheet (0.09); put the flying spot meter onto the sheet; change the reflected apparent temperature until reaching the temperature (shown by spot meter) equal and upper parts of the heaters. This is one of the main advantages of the method because it gives possibilities to achieve the whole view on thermal processes in the heating camera. IR PCB s photos illustrating different stages of soldering cycle are shown in Figures 7a and 7b. Fig. 7 a). IR photos of PCBs at different temperatures in heating camera during soldering cycles. to that measured by thermocouple; write down the value of reflected apparent temperature. After that this obtained value of RAT can be used during determination of temperature distribution onto the whole PCB. Some examples illustrating this procedure can be seen in Figures 5 and 6. Using upper mentioned methods thermal processes on PCB at different stages of soldering cycles are investigated. Processing and analysis of thermal photographs allow evaluation of uniformity of thermal distribution on different electronic components on PCB. It is very useful in order to adjust proper operation parameters of soldering equipment air flow rate, power and manner of operation of lower Fig. 7 b). IR photos of PCBs at different temperatures in heating camera during soldering cycles. Analyzing IR thermography pictures allow investigating real temperature conditions for different kinds of electronic components mounted on the PCB during soldering cycle. Obtained results of IR thermography measurements are used for determination of optimal operating parameters of the soldering equipment (temperature regimes for lower and upper parts of the heaters, gas flow rate and others). 4. CONCLUSIONS Investigation deals with development of reflow soldering processes for electronic devices using IR camera (ThermaCam E300 FLIR) for the middle IR

6 spectral region. Temperature monitoring of the whole PCB s surface is realized using IR thermography. Suitable method for fast determination of emissivity of different kind of electronic component on PCB in temperature range C C is proposed. New approach for determination of reflected apparent temperature in the heating camera during soldering cycle is proposed. It allows convenient realization of thermograph investigations of thermal processes on PCB during soldering. It is shown that IR thermography can be used successfully for investigations of thermal processes in heating camera during soldering cycles. Results of these investigations allow optimization of operations regime for soldering equipment in dependence of concrete technological requirements. ACKNOWLEDGEMENT The National Science Fund, Ministry of Education and Science of Bulgaria, is gratefully acknowledged for the financial support of research project VU-EES- 301/2007. Part of the investigation was supported by Project 09-FЕЕА-01, National Science Fund, Ministry of Education, Bulgaria. REFERENCES [1] Mashkov P. H., T. G. Pencheva, A. V. Valchev and B. S. Gyoch. In situ non contact temperature measurements on PCB during soldering process, IEEE, Proc. of 31 th International Spring Seminar on Electronics Technology - ISSE 2008, Budapest, Hungary, September 25 th 27 th 2008, pp [2] User s manual ThermaCam 300 FLIR system [3] Enachescu M., S. Belikov, L. Molnar. Infrared thermography for deffect detection and analysis. WO 03/ A1. [4] Mashkov P., T. Pencheva, D. Popov, B. Gyoch. Equipment and Method for Lead Free Soldering of SMDs. 15 th International Scientific and Applied Science Conference ELECTRONICS 2006, Sozopol, BULGARIA, September 2006, book 2, pp [5] Mashkov P., T. Pencheva, D. Popov, B. Gyoch. Apparatus and Method for Soldering Electronic Components to Printed Circuit Boards Proceedings of IEEE, 28 th International Spring Seminar on Electronics Technology ISSE 2005, Wiener Neustadt, Austria, May 2005, pp

For the Journal Electrical and Electronic Engineering, SAPUB Design of PCB for Power LEDs Thermal Investigations

For the Journal Electrical and Electronic Engineering, SAPUB Design of PCB for Power LEDs Thermal Investigations Electrical and Electronic Engineering 2012, 2(5): 303-308 DOI: 10.5923/j.eee.20120205.10 For the Journal Electrical and Electronic Engineering, SAPUB Design of PCB for Power LEDs Thermal Investigations

More information

True temperature measurement of electronics through infrared transparent materials

True temperature measurement of electronics through infrared transparent materials True temperature measurement of electronics through infrared transparent materials by R. Lehtiniemi, C.-M. Fager and J. Rantala Nokia Research Center, P. O. Box 407, FIN-00045 NOKIA GROUP, Finland Abstract

More information

PROCESS CONTROL BASIS FOR A COST-EFFECTIVE SELECTIVE SOLDERING PROCESS

PROCESS CONTROL BASIS FOR A COST-EFFECTIVE SELECTIVE SOLDERING PROCESS PROCESS CONTROL BASIS FOR A COST-EFFECTIVE SELECTIVE SOLDERING PROCESS Christian Ott Kreuzwertheim, Germany christian.ott@seho.de Heike Schlessmann heike.schlessmann@seho.de Reiner Zoch reiner.zoch@seho.de

More information

HL-800K Infrared Laser Thermometer. -50 C to +800 C (13:1 ratio) User Manual

HL-800K Infrared Laser Thermometer. -50 C to +800 C (13:1 ratio) User Manual HL-800K Infrared Laser Thermometer -50 C to +800 C (13:1 ratio) User Manual TABLE OF CONTENTS INTRODUCTION... 3 FEATURES... 3 WIDE APPLICATION RANGE... 3 SAFETY... 3 DISTANCE & SPOT SIZE... 4 SPECIFICATIONS...

More information

Fig. 1. Schema of a chip and a LED

Fig. 1. Schema of a chip and a LED More Info at Open Access Database www.ndt.net/?id=17742 Chip emissivity mapping for blue and white light emitting diodes Abstract by F. Belfio a,b, J.-F. Veneau b and O. Fudym a a Univ. Toulouse; Mines

More information

QIRT th International Conference on Quantitative InfraRed Thermography

QIRT th International Conference on Quantitative InfraRed Thermography 10 th International Conference on Quantitative InfraRed Thermography July 27-30, 2010, Québec (Canada) Quantitative infrared wall inspection *CE Dept., Cracow University of Technology, Kraków, Poland,

More information

Model ST-616CT. Instruction Manual. Infrared Thermo-Hygrometer. reedinstruments. www. com

Model ST-616CT. Instruction Manual. Infrared Thermo-Hygrometer. reedinstruments. www. com Model ST-616CT Infrared Thermo-Hygrometer Instruction Manual reedinstruments com Table of Contents Safety... 2 Features... 3 Specifications...4-5 Instrument Description...6-7 Operating Instructions...8-10

More information

Thermal Image Resolution on Angular Emissivity Measurements using Infrared Thermography

Thermal Image Resolution on Angular Emissivity Measurements using Infrared Thermography , March 18-20, 2015, Hong Kong Thermal Image Resolution on Angular Emissivity Measurements using Infrared Thermography T. Nunak, K. Rakrueangdet, N. Nunak, and T. Suesut Abstract This paper reports the

More information

9 th International Conference on Quantitative InfraRed Thermography July 2-5, 2008, Krakow - Poland Application of infrared thermography for validation of numerical analyses results of a finned cross-flow

More information

[ ] Sensors for Temperature Measurement, and Their Application 2L R 1 1 T 1 T 2

[ ] Sensors for Temperature Measurement, and Their Application 2L R 1 1 T 1 T 2 Sensors for Temperature Measurement, and Their Application In today s market, it is very rare to see electronic equipment that has not undergone extensive thermal evaluation, either by measurement or simulation.

More information

Ultraviolet LEDS as a Source of Emission for Resist Exposure on Printed Circuit Boards

Ultraviolet LEDS as a Source of Emission for Resist Exposure on Printed Circuit Boards Ultraviolet LEDS as a Source of Emission for Resist Exposure on Printed Circuit Boards Alexander V. Fomenko Institute of Robotics, Innopolis University, Innopolis, Russia xanderfomenko@gmail.com Alexander

More information

WK25V, WK20V, WK12V, WK08V, WK06V. Thick Film High Voltage Chip Resistors. Size 2512, 2010,1206, 0805, 0603

WK25V, WK20V, WK12V, WK08V, WK06V. Thick Film High Voltage Chip Resistors. Size 2512, 2010,1206, 0805, 0603 WK25V, WK20V, WK12V, WK08V, WK06V ±5%, ±2%, ±1%, ±0.5% Thick Film High Voltage Chip Resistors Size 2512, 2010,1206, 0805, 0603 *Contents in this sheet are subject to change without prior notice. Page 1

More information

User Manual. Stick-Style Water-Resistant Infrared Thermometer with 8:1 Distance-to-Sight Ratio. Model with NIST-Traceable Calibration

User Manual. Stick-Style Water-Resistant Infrared Thermometer with 8:1 Distance-to-Sight Ratio. Model with NIST-Traceable Calibration User Manual Stick-Style Water-Resistant Infrared Thermometer with 8:1 Distance-to-Sight Ratio with NIST-Traceable Calibration Model 20250-09 THE STANDARD IN PRECISION MEASUREMENT Introduction The Digi-Sense

More information

Use of Matlab package for external local calibration of IR camera with microbolometric FPA detector

Use of Matlab package for external local calibration of IR camera with microbolometric FPA detector Use of Matlab package for external local calibration of IR camera with microlometric FPA detector More info about this article: http://www.ndt.net/?id=20646 Abstract by T. Kruczek*, W. Adamczyk* and G.

More information

Technical Notes. Introduction. PCB (printed circuit board) Design. Issue 1 January 2010

Technical Notes. Introduction. PCB (printed circuit board) Design. Issue 1 January 2010 Technical Notes Introduction Thermal Management for LEDs Poor thermal management can lead to early LED product failure. This Technical Note discusses thermal management techniques and good system design.

More information

Stick-Style Water-Resistant Infrared Thermometer for Foodservice Applications with 4:1 Distance-to-Sight Ratio Model

Stick-Style Water-Resistant Infrared Thermometer for Foodservice Applications with 4:1 Distance-to-Sight Ratio Model Stick-Style Water-Resistant Infrared Thermometer for Foodservice Applications with 4:1 Distance-to-Sight Ratio Model 35625-15 THE STANDARD IN PRECISION MEASUREMENT 1 DGMAN_35625-15_(ENG_FR).indd 1 7/8/2014

More information

Emissivity: Understanding the difference between apparent and actual infrared temperatures

Emissivity: Understanding the difference between apparent and actual infrared temperatures Emissivity: Understanding the difference between apparent and actual infrared temperatures By L. Terry Clausing, P.E. ASNT Certified NDT Level III T/IR, for Fluke Corporation Application Note Taking infrared

More information

InfraRed Thermometer with Laser Pointer

InfraRed Thermometer with Laser Pointer User Manual 99 Washington Street Melrose, MA 02176 Phone 781-665-1400 Toll Free 1-800-517-8431 Visit us at www.testequipmentdepot.com InfraRed Thermometer with Laser Pointer MODEL IR400 Introduction Congratulations

More information

WW12C, WW08C, WW06C, WW04C, WW02C. Low ohm chip resistors ( power ) Size 1206, 0805, 0603, 0402, 0201

WW12C, WW08C, WW06C, WW04C, WW02C. Low ohm chip resistors ( power ) Size 1206, 0805, 0603, 0402, 0201 WW12C, WW08C, WW06C, WW04C, WW02C ±5%, ±1%, ±0.5% Low ohm chip resistors ( power ) Size 1206, 0805, 0603, 0402, 0201 *Contents in this sheet are subject to change without prior notice. Page 1 of 8 ASC_WWxxC_V05

More information

D501 and D501-RS. Microscanner D-Series IR Thermometers. no effect. no effect. no effect. no effect no effect

D501 and D501-RS. Microscanner D-Series IR Thermometers. no effect. no effect. no effect. no effect no effect Microscanner D-Series The Only Certified Accurate Surface Instruments in the World A MUST FOR ISO 9001 ISO 9002 ISO 9003 TRACEABILITY PROGRAMS Common Surface Measurement Errors D501 and D501-RS Microscanner

More information

Technical Data Sheet. Pb Free. Specification GR101 SSC. Customer. Rev. 02 January 서식번호 : SSC- QP (Rev.0.

Technical Data Sheet. Pb Free. Specification GR101 SSC. Customer. Rev. 02 January 서식번호 : SSC- QP (Rev.0. Specification GR101 Pb Free Drawn SSC Approval Customer Approval [ Contents ] 1. Description 2. Absolute maximum ratings 3. Electro-Optical characteristics 4. Characteristic diagrams 5. Reliability result

More information

INFRARED THERMOMETER Model : TM-959

INFRARED THERMOMETER Model : TM-959 LED target light, Emissivity adjustment INFRARED THERMOMETER Model : TM-959 Your purchase of this I N F R A R E D THERMOMETER marks a step forward for you into the field of precision measurement. Although

More information

High Accuracy High Speed in Your Process

High Accuracy High Speed in Your Process DX-Series Handheld Precision IR Thermometers EXERGEN C O R P O R A T I O N The Only Certified Accurate NIST Traceable Infrared Temperature Instruments in the World* High Accuracy High Speed in Your Process

More information

Surrounding Effects on Temperature and Emissivity Measurement of Equipment in Electrical Distribution System

Surrounding Effects on Temperature and Emissivity Measurement of Equipment in Electrical Distribution System , October 21-23, 2015, San Francisco, USA Surrounding Effects on Temperature and Emissivity Measurement of Equipment in Electrical Distribution System T. Nunak, N. Nunak, V. Tipsuwanporn, and T. Suesut

More information

Thermal behavior study of the mold surface in HPDC process by infrared thermography and comparison with simulation

Thermal behavior study of the mold surface in HPDC process by infrared thermography and comparison with simulation More Info at Open Access Database www.ndt.net/?id=17680 Thermal behavior study of the mold surface in HPDC process by infrared thermography and comparison with simulation Abstract By S. TAVAKOLI **, *,

More information

Specification for ViTron Photo Diode. Ø5 OVAL [Photo Diode] Part No. : VPD5V-BN60T. VISSEM Electronics Co., Ltd. Revision No. : Ver. 1.

Specification for ViTron Photo Diode. Ø5 OVAL [Photo Diode] Part No. : VPD5V-BN60T. VISSEM Electronics Co., Ltd. Revision No. : Ver. 1. ` Specification for ViTron Photo Diode Ø5 OVAL [Photo Diode] Part No. : Revision No. : Ver. 1.0 Date : Feb. 28. 2014 VISSEM Electronics Co., Ltd. 1. SPECIFICATION Absolute Maximum Rating (T a = 25 C) Parameter

More information

Infrared thermography as a tool to elaborate procedures for predictive maintenance of ball mills equipment

Infrared thermography as a tool to elaborate procedures for predictive maintenance of ball mills equipment 14 th Quantitative InfraRed Thermography Conference Infrared thermography as a tool to elaborate procedures for predictive maintenance of ball mills equipment by R. Władysiak*, T. Pacyniak* * Lodz University

More information

ASSET INTEGRITY INTELLIGENCE. Featured Article. ACHIEVING A COMPREHENSIVE FIRED HEATER HEALTH MONITORING PROGRAM By Tim Hill, Quest Integrity Group

ASSET INTEGRITY INTELLIGENCE. Featured Article. ACHIEVING A COMPREHENSIVE FIRED HEATER HEALTH MONITORING PROGRAM By Tim Hill, Quest Integrity Group ASSET INTEGRITY INTELLIGENCE Featured Article ACHIEVING A COMPREHENSIVE FIRED HEATER HEALTH MONITORING PROGRAM By Tim Hill, Quest Integrity Group VOLUME 20, ISSUE 5 SEPTEMBER OCTOBER 2014 ACHIEVING A COMPREHENSIVE

More information

Analysis of Thermal Diffusivity of Metals using Lock-in Thermography

Analysis of Thermal Diffusivity of Metals using Lock-in Thermography Analysis of Thermal Diffusivity of Metals using Lock-in Thermography by F. Wagner*, T. Malvisalo*, P. W. Nolte**, and S. Schweizer** * Department of Electrical Engineering, South Westphalia University

More information

(PT-A6) Visible Light Detector for Security Lighting

(PT-A6) Visible Light Detector for Security Lighting Version: July 4, 2017 (PT-A6) Visible Light Detector for Security Lighting Token Electronics Industry Co., Ltd. Web: www.token.com.tw Email: rfq@token.com.tw Taiwan: No.137, Sec. 1, Zhongxing Rd., Wugu

More information

Low Inductance Ceramic Capacitor (LICC)

Low Inductance Ceramic Capacitor (LICC) Low Inductance Ceramic Capacitor (LICC) LICC(Low Inductance Ceramic Capacitor) is a kind of MLCC that is used for decoupling in High Speed IC. The termination shape of LICC is different from that of MLCC.

More information

(PT-A6) Visible Light Detector for Security Lighting

(PT-A6) Visible Light Detector for Security Lighting Version: July 31, 2017 Electronics Tech. (PT-A6) Visible Light Detector for Security Lighting Web: www.direct-token.com Email: rfq@direct-token.com Direct Electronics Industry Co., Ltd. China: 12F, Zhong

More information

Semiconductor Thermal Resistance Standards versus Real Life. Bernie Siegal Thermal Engineering Associates, Inc.

Semiconductor Thermal Resistance Standards versus Real Life. Bernie Siegal Thermal Engineering Associates, Inc. Semiconductor Thermal Resistance Standards versus Real Life Bernie Siegal Thermal Engineering Associates, Inc. bsiegal@thermengr.com Overview Introduction Objective Temperature vs. Thermal Current Standard

More information

Coupled Electromagnetic and Thermal Field Modeling of a Laboratory Busbar System

Coupled Electromagnetic and Thermal Field Modeling of a Laboratory Busbar System Coupled Electromagnetic and Thermal Field Modeling of a Laboratory Busbar System Tatyana R. Radeva, Ivan S. Yatchev, Dimitar N. Karastoyanov, Nikolay I. Stoimenov, Stanislav D. Gyoshev Abstract The paper

More information

RIGHT ANGLE SURFACE MOUNT INFRARED PHOTOTRANSISTOR

RIGHT ANGLE SURFACE MOUNT INFRARED PHOTOTRANSISTOR PACKAGE DIMENSIONS.16 (3.).11 (.8).43 (1.1).3 (.9) FRONT. (.).87 (.).71 (1.8).39 (1.).87 (.).71 (1.8) TOP.3 (.9) R.17 (.4) COLLECTOR MARK 1 NOTE:.16 (.4) BACK 1. Emitter. Collector 3. Tolerance of ±.1

More information

Influence of sun radiation on results of non-contact temperature measurements in far infrared range

Influence of sun radiation on results of non-contact temperature measurements in far infrared range Contributed paper OPTO-ELECTRONICS REVIEW 13(3), 253 257 Influence of sun radiation on results of non-contact temperature measurements in far infrared range H. MADURA * and M. KO ODZIEJCZYK Institute of

More information

NJL6502R-1. Ambient Light Sensor GENERAL DESCRIPTION FEATURES APPLICATIONS. ABSOLUTE MAXIMUM RATINGS (Ta=25 C)

NJL6502R-1. Ambient Light Sensor GENERAL DESCRIPTION FEATURES APPLICATIONS. ABSOLUTE MAXIMUM RATINGS (Ta=25 C) Ambient Light Sensor GENERAL DESCRIPTION The NJL6502R-1 is the ambient light sensor with optical filter to solve the interference problem by the infrared. Also, the spectral response is close to human

More information

Thermography Pocket Guide. Theory Practice Tips & Tricks

Thermography Pocket Guide. Theory Practice Tips & Tricks Thermography Pocket Guide Theory Practice Tips & Tricks Copyrights, warranty and liability The information compiled in this Pocket Guide is protected by copyright. All rights belong exclusively to Testo

More information

Thermal Calculation for Linear Regulator

Thermal Calculation for Linear Regulator Linear Regulator Series Thermal Calculation for Linear Regulator The loss in linear regulators increases as the difference between the input and output voltages increases. Since most of the loss is converted

More information

Analysis of Thermal Stress in Fatigue Fracture Specimen using Lock-in Thermography

Analysis of Thermal Stress in Fatigue Fracture Specimen using Lock-in Thermography Analysis of Thermal Stress in Fatigue Fracture Specimen using Lock-in Thermography Won-Tae Kim*, Man-Yong Choi**, Jung-Hak Park** * Major of Bio-mechanical Engineering, Kongju National University, Chungnam,

More information

Customer Approval Sheet

Customer Approval Sheet Customer Approval Sheet Product: 3014 White SMD LED Part Number: PT30A02 V0 (5600K) Customer: Issue Date: 2011/01/03 Feature High brightness Top view LED Dice Technology : InGaN Small package outline (LxWxH)

More information

Use of Infrared Thermography for Building Inspection

Use of Infrared Thermography for Building Inspection Use of Infrared Thermography for Building Inspection Seminar on Building Diagnostic and Inspection Testing & Certification Association of Engineering Professionals in Society Ltd K.K. Lee, Kenneth Introduction

More information

SMD Switch SI-C3436A General specification. Soldering conditions Reflow Soldering condition. Standard Reel Dimensions (mm) Packing specification

SMD Switch SI-C3436A General specification. Soldering conditions Reflow Soldering condition. Standard Reel Dimensions (mm) Packing specification SMD Switch SI - C3436A - 7017 Features External Dimensions : 3.4mm x 3.6mm, Height 0.70mm Suitable for thinner and lighter portable devices Suitable for water proof devices Reflow soldering Package With

More information

MEASUREMENT TECHNIQUES OF CONVECTION REFLOW OVENS AND THERMAL MODELING OF THE REFLOW SOLDERING

MEASUREMENT TECHNIQUES OF CONVECTION REFLOW OVENS AND THERMAL MODELING OF THE REFLOW SOLDERING MEASUREMENT TECHNIQUES OF CONVECTION REFLOW OVENS AND THERMAL MODELING OF THE REFLOW SOLDERING PHD THESIS Balázs Illés Head of the depertment: Prof. Dr. Gábor Harsányi Supervisor of the work: Prof. Dr.

More information

Resistance (R 25) Ω Ω Ω. Tolerance of R 25 M ±20% H ±25% S ±35%

Resistance (R 25) Ω Ω Ω. Tolerance of R 25 M ±20% H ±25% S ±35% Features 1. RoHS & Halogen-free compliant 2. EIA size 63,85,121 3. Suitable for reflow soldering 4. Suitable for over-current or short circuit protection 5. Agency Recognition: UL&cUL:File No.E138827 TUV:File

More information

(1) SHAPES AND DIMENSIONS

(1) SHAPES AND DIMENSIONS Ⅰ. SCOPE: This specification applies to the Pb Free high current type SMD Common mode filter for MCM-2M-SERIES PRODUCT INDENTIFICATION MCM - 2M - 70 2 3 Product Code 2 Dimensions Code 3 Impedance Code

More information

Transient Thermal Measurement and Behavior of Integrated Circuits

Transient Thermal Measurement and Behavior of Integrated Circuits Transient Thermal Measurement and Behavior of Integrated Circuits Dustin Kendig¹*, Kazuaki Kazawa 1,2, and Ali Shakouri 2 ¹Microsanj LLC 3287 Kifer Rd, Santa Clara, CA 95051, USA ² Birck Nanotechnology

More information

EVERLIGHT ELECTRONICS CO.,LTD. Technical Data Sheet High Power LED 1W (Preliminary)

EVERLIGHT ELECTRONICS CO.,LTD. Technical Data Sheet High Power LED 1W (Preliminary) Features Feature of the device: small package with high efficiency Typical color temperature: 3500 K. Typical view angle: 120. Typical light flux output: 33 lm @ 350mA ESD protection. Soldering methods:

More information

Thermal Measurement and Simulation of the Component Rework Profile Temperature

Thermal Measurement and Simulation of the Component Rework Profile Temperature Thermal Measurement and Simulation of the Component Rework Profile Temperature J.T. Nurminen Oulu University of Applied Sciences, School of Engineering, Oulu, Finland janne.nurminen@osao.fi Abstract In

More information

DIRECT RADIOMETRIC TECHNIQUES

DIRECT RADIOMETRIC TECHNIQUES EMISSIVITY AND OTHER INFRARED-OPTICAL PROPERTIES MEASUREMENT METHODS DIRECT RADIOMETRIC TECHNIQUES Measuring principle The principle of direct radiometric techniques is shown schematically in the figure

More information

COBP Photo Diode for Front monitor

COBP Photo Diode for Front monitor COBP Photo Diode for Front monitor GENERAL DESCRIPTION The NJL640R- is a high-speed PIN photodiode capable of detecting in a wide wavelength range of up to infrared light from the blue-violet light. The

More information

Approval sheet. WLBD2012 Chip Bead. *Contents in this sheet are subject to change without prior notice.

Approval sheet. WLBD2012 Chip Bead. *Contents in this sheet are subject to change without prior notice. WLBD2012 Chip Bead *Contents in this sheet are subject to change without prior notice. Page 1 of 8 ASC_ WLBD2012 Series_V5.0 Jun. 2017 FEATURES 1. Closed magnetic circuit. APPLICATIONS 1. Noise reduction

More information

Approval sheet. WLBD1005 Chip Bead. *Contents in this sheet are subject to change without prior notice.

Approval sheet. WLBD1005 Chip Bead. *Contents in this sheet are subject to change without prior notice. WLBD1005 Chip Bead *Contents in this sheet are subject to change without prior notice. Page 1 of 8 ASC_ WLBD1005 Series_V4.0 Jun. 2017 FEATURES 1. Closed magnetic circuit. APPLICATIONS 1. Noise reduction

More information

Lednium Series Optimal X OVTL09LG3x Series

Lednium Series Optimal X OVTL09LG3x Series (10-watts,120 Viewing Angle) x x x x x Revolutionary 3-dimensional packaged LED source Robust energy-efficient design with long operating life Low thermal resistance (2.5 C/W) Exceptional spatial uniformity

More information

PTC Thermistor:TPM-S Series

PTC Thermistor:TPM-S Series SMD PTC Thermistor for Features 1. RoHS & Halogen-free compliant 2. Thermistor chip with lead-free tinned terminals 3. EIA size 0402,0603,0805 4. Fast and reliable response 5. Suitable for reflow soldering

More information

5mm Silicon PIN Photodiode, T-1 3/4 PD333-3B/H0/L2

5mm Silicon PIN Photodiode, T-1 3/4 PD333-3B/H0/L2 Features Fast response time High photo sensitivity Small junction capacitance Pb free This product itself will remain within RoHS compliant version. Description is a high speed and high sensitive PIN photodiode

More information

Specification YGHR411-H

Specification YGHR411-H Specification HR411H Pb Free Drawn SSC Approval Customer Approval [ Contents ] 1. Description 2. Absolute maximum ratings 3. ElectroOptical characteristics 4. Characteristic diagrams 5. Reliability result

More information

S150PTD-1A. Technical Data Sheet. 3.2x1.6mm, Phototransistor LED Surface Mount Chip LED. Features: Descriptions: Applications:

S150PTD-1A. Technical Data Sheet. 3.2x1.6mm, Phototransistor LED Surface Mount Chip LED. Features: Descriptions: Applications: Features: Fast response time. High photo sensitivity. Small junction capacitance. Package in 8mm tape on 7 diameter reel. The product itself will remain within RoHS compliant Version. Descriptions: The

More information

Application of thermography for microelectronic design and modelling

Application of thermography for microelectronic design and modelling Application of thermography for microelectronic design and modelling by G. De Mey 1 and B. Wi~cek2 1 University of.gent, ELlS, Sint Pieterniuwstraat 41, Gent, B-9000 Belgium, e-mail: demey@e/is.rug.ac.be

More information

Approval sheet. WLBD1608 Chip Bead. *Contents in this sheet are subject to change without prior notice.

Approval sheet. WLBD1608 Chip Bead. *Contents in this sheet are subject to change without prior notice. WLBD1608 Chip Bead *Contents in this sheet are subject to change without prior notice. Page 1 of 8 ASC_ WLBD1608 Series_V4.0 Sep. 2016 FEATURES 1. Closed magnetic circuit. APPLICATIONS 1. Noise reduction

More information

Electromagnetic Radiation and Scientific Instruments. PTYS April 1, 2008

Electromagnetic Radiation and Scientific Instruments. PTYS April 1, 2008 Electromagnetic Radiation and Scientific Instruments PTYS 206-2 April 1, 2008 Announcements Deep Impact 6 PM Wednesday Night Pizza, no beer Watch at home if you can t watch here. It will be discussed in

More information

INFRARED THERMOMETER TM0819

INFRARED THERMOMETER TM0819 INFRARED THERMOMETER Instruction Manual HORMES LIMITED cs@perfectprime.com G/F UNIT 3, 61 GLENTHORNE ROAD, LONDON W6 0LJ UNITED KINGDOM +44 203 7695377 Retailer Email Address Telephone P.1 CONTENTS 1.

More information

Light and Telescope 10/24/2018. PHYS 1403 Introduction to Astronomy. Reminder/Announcement. Chapter Outline. Chapter Outline (continued)

Light and Telescope 10/24/2018. PHYS 1403 Introduction to Astronomy. Reminder/Announcement. Chapter Outline. Chapter Outline (continued) PHYS 1403 Introduction to Astronomy Light and Telescope Chapter 6 Reminder/Announcement 1. Extension for Term Project 1: Now Due on Monday November 12 th 2. You will be required to bring your cross staff

More information

INFLUENCE OF THE AVERAGING PERIOD IN AIR TEMPERATURE MEASUREMENT

INFLUENCE OF THE AVERAGING PERIOD IN AIR TEMPERATURE MEASUREMENT INFLUENCE OF THE AVERAGING PERIOD IN AIR TEMPERATURE MEASUREMENT Hristomir Branzov 1, Valentina Pencheva 2 1 National Institute of Meteorology and Hydrology, Sofia, Bulgaria, Hristomir.Branzov@meteo.bg

More information

Thermal Resistance Measurement

Thermal Resistance Measurement Optotherm, Inc. 2591 Wexford-Bayne Rd Suite 304 Sewickley, PA 15143 USA phone +1 (724) 940-7600 fax +1 (724) 940-7611 www.optotherm.com Optotherm Sentris/Micro Application Note Thermal Resistance Measurement

More information

WW25R ±1%, ±5%, 2W Metal plate low ohm power chip resistors Size 2512 (6432)

WW25R ±1%, ±5%, 2W Metal plate low ohm power chip resistors Size 2512 (6432) WW25R ±1%, ±5%, 2W Metal plate low ohm power chip resistors Size 2512 (6432) Current Sensing Type Automotive AEC Q200 compliant *Contents in this sheet are subject to change without prior notice. Page

More information

Approval sheet. WLBD0603 Chip Bead. *Contents in this sheet are subject to change without prior notice.

Approval sheet. WLBD0603 Chip Bead. *Contents in this sheet are subject to change without prior notice. WLBD0603 Chip Bead *Contents in this sheet are subject to change without prior notice. Page 1 of 8 ASC_ WLBD0603 Series_V2.0 Sep. 2016 FEATURES 1. Closed magnetic circuit. APPLICATIONS 1. Noise reduction

More information

WW25Q ±1%, ±5%, 1W Metal plate low ohm power chip resistors Size 2512 (6432)

WW25Q ±1%, ±5%, 1W Metal plate low ohm power chip resistors Size 2512 (6432) WW25Q ±1%, ±5%, 1W Metal plate low ohm power chip resistors Size 2512 (6432) Current Sensing Type Automotive AEC Q200 compliant *Contents in this sheet are subject to change without prior notice. Page

More information

TEA10402V15A0 Engineering Specification

TEA10402V15A0 Engineering Specification TEA10402V15A0 Engineering 1. Scope This specification is applied to electrostatic discharge (ESD) protection. It is designed to protect the high-speed data lines against ESD transients. It has very low

More information

A wide variety of detector switches available for various Digital AV devices. Typical Specifications

A wide variety of detector switches available for various Digital AV devices. Typical Specifications Switch wide variety of detector switches available for various Digital V devices. Typical Specifications Items Rating max. min. Resistive load Contact resistance Initial /fter operating life Operating

More information

High Precision Thick Film chip resistors. Size 1206, 0805, 0603, 0402, 0201

High Precision Thick Film chip resistors. Size 1206, 0805, 0603, 0402, 0201 WK2K, WK08K, WK06K, WK04K, WK02K ±.0%, ±0.5% Thick Film TC50/TC00 High Precision Thick Film chip resistors Size 206, 0805, 0603, 0402, 020 Page of 7 ASC_WKxxK_V07 NOV- 205 FEATURE. SMD Thick film resistor

More information

The Increasing Importance of the Thermal Management for Modern Electronic Packages B. Psota 1, I. Szendiuch 1

The Increasing Importance of the Thermal Management for Modern Electronic Packages B. Psota 1, I. Szendiuch 1 Ročník 2012 Číslo VI The Increasing Importance of the Thermal Management for Modern Electronic Packages B. Psota 1, I. Szendiuch 1 1 Department of Microelectronics, Faculty of Electrical Engineering and

More information

AB3528-XXW-00. PIN 1 Mark 0.90(.035)

AB3528-XXW-00. PIN 1 Mark 0.90(.035) AB3528-XXW-00 1. Emitted Color : White, CCT:3700-5400K 2. Lens Appearance : Yello Diffuse 3. 3.5x2.8x1.9mm standard package 4. Suitable for all SMT assembly methods 5. Compatible

More information

This specification applies to the Pb Free high current type SMD inductors for

This specification applies to the Pb Free high current type SMD inductors for SCOPE: This specification applies to the Pb Free high current type SMD inductors for PRODUCT INDENTIFICATION MSCDRI - 4012X - 100 M 1 2 3 4 1 Product Code 2 Dimensions Code 3 Inductance Code 4 Tolerance

More information

Effect of wood modification and weathering progress on the radiation emissivity

Effect of wood modification and weathering progress on the radiation emissivity Effect of wood modification and weathering progress on the radiation emissivity Paolo Grossi 1, Jakub Sandak 2,3,, Marta Petrillo 5 and Anna Sandak 6 1 CNR-IVALSA, via Biasi 75, 30010 San Michele all Adige,

More information

EVERLIGHT ELECTRONICS CO.,LTD.

EVERLIGHT ELECTRONICS CO.,LTD. Technical Data Sheet High Power LED 0.5W (Preliminary) Features Feature of the device: small package with high efficiency Typical view angle: 120 Typical color temperature: 3500 K. ESD protection. Soldering

More information

Analysis algorithm for surface crack detection by thermography with UV light excitation

Analysis algorithm for surface crack detection by thermography with UV light excitation Analysis algorithm for surface crack detection by thermography with UV light excitation * University West, University West, SE-461 86 Trollhättan, Sweden, patrik.broberg@hv.se by P. Broberg* and A. Runnemalm*

More information

NTC Thermistor:TSM Series

NTC Thermistor:TSM Series Features. RoHS & Halogen Free (HF) compliant. EIA size: 00, 00, 00, 080. Highly reliable structure. Operating temperature range: -0 ~+. Wide resistance range. Cost effective. Agency recognition: UL / cul

More information

Deployment of Infrared Inspection Technologies at Sandia National Laboratories

Deployment of Infrared Inspection Technologies at Sandia National Laboratories Deployment of Infrared Inspection Technologies at Sandia National Laboratories Experimental Mechanics/NDE & Model Validation Non Destructive Test Laboratory Sandia National Laboratories Albuquerque, New

More information

EHP-A23/RGB33-P01/TR. Data Sheet. Materials. High Power LED 1W. 1 of 12 Release Date: :11:33.0 Expired Period: Forever

EHP-A23/RGB33-P01/TR. Data Sheet. Materials. High Power LED 1W. 1 of 12 Release Date: :11:33.0 Expired Period: Forever Data Sheet Features Feature of the device: Small package with high efficiency Typical view angle: 120. ESD protection. Soldering methods: SMT Grouping parameter: Brightness, Forward Voltage and wavelength.

More information

Infrared Thermometer Calibration A Complete Guide

Infrared Thermometer Calibration A Complete Guide Infrared Thermometer Calibration A Complete Guide Application note With proper setup and planning, infrared calibrations can be accurate. The steps outlined below should be followed to perform accurate

More information

Study of Reliability Test Methods for Die-attach Joints on Power Semiconductors

Study of Reliability Test Methods for Die-attach Joints on Power Semiconductors Technology Report Study of Reliability Test Methods for Die-attach Joints on Power Semiconductors Kazunobu Arii, Yuichi Aoki and Kuniaki Takahashi Test Consulting Service Headquarters, ESPEC CORP. Abstract

More information

ACTIVE THERMOGRAPHY FOR MATERIALS NON-DESTRUCTIVE TESTING

ACTIVE THERMOGRAPHY FOR MATERIALS NON-DESTRUCTIVE TESTING ACTIVE THERMOGRAPHY FOR MATERIALS NON-DESTRUCTIVE TESTING Michal ŠVANTNER a, Zdeněk VESELÝ b a University of West Bohemia, Univerzitní 8, 30614 Plzeň, msvantne@ntc.zcu.cz b University of West Bohemia,

More information

Approval sheet WF10A. 1%, 5% Ultra High Power Chip Resistors Size 1210, 3/4W. *Contents in this sheet are subject to change without prior notice.

Approval sheet WF10A. 1%, 5% Ultra High Power Chip Resistors Size 1210, 3/4W. *Contents in this sheet are subject to change without prior notice. WF10A 1%, 5% Ultra High Power Chip Resistors Size 1210, 3/4W *Contents in this sheet are subject to change without prior notice. Page 1 of 7 ASC_WF10A_V02 MAY - 2016 FEATURE 1. High reliability and stability

More information

S P E C I F I C A T I O N S

S P E C I F I C A T I O N S S P E C I F I C A T I O N S SMD TYPE SIDE VIEW WHITE LED Model : AS472TWPE1 Dongbu LED Co., Ltd. 90-1, Bongmyung-Ri, Namsa-Myun, Cheoin-Gu, Yongin-City, Gyeonggi-Do, Korea 449-882 Tel. : +82-70 - 7896-3600

More information

EHP-AX08EL/GT01H-P03/5063/Y/N13

EHP-AX08EL/GT01H-P03/5063/Y/N13 Data Sheet Features Feature of the device: Small package with high efficiency Typical color temperature: 5650 K. Typical viewing angle: 140 Typical light flux output: 160 lm @700mA. ESD protection. Soldering

More information

Detection of Subsurface Defects using Active Infrared Thermography

Detection of Subsurface Defects using Active Infrared Thermography Detection of Subsurface Defects using Active Infrared Thermography More Info at Open Access Database www.ndt.net/?id=15141 Suman Tewary 1,2,a, Aparna Akula 1,2, Ripul Ghosh 1,2, Satish Kumar 2, H K Sardana

More information

Specification KWT803-S

Specification KWT803-S Specification KWT803-S Drawn SSC Approval CUSTOMER Approval Contents 1. Description 2. Absolute Maximum Ratings 3. Electro-Optical Characteristics 4. Characteristic Graph 5. Reliability Test Item and Condition

More information

PRELIMINARY SPECIFICATIONS

PRELIMINARY SPECIFICATIONS PRELIMINARY SPECIFICATIONS SMD TYPE TOP VIEW WHITE COLOR LED Model : AT559 W E3 Dongbu LED Co., Ltd. 90-1, Bongmyung-Ri, Namsa-Myun, Cheoin-Gu, Yongin-City, Gyeonggi-Do, Korea 449-882 Tel. : +82-70 - 7896-3600

More information

RS INDUSTRY LIMITED. RS Chip Array ESD Suppressor APPROVAL SHEET. Customer Information. Part No. : Model No. : COMPANY PURCHASE R&D

RS INDUSTRY LIMITED. RS Chip Array ESD Suppressor APPROVAL SHEET. Customer Information. Part No. : Model No. : COMPANY PURCHASE R&D APPROVAL SHEET Customer Information Customer : Part Name : Part No. : Model No. : COMPANY PURCHASE R&D Vendor Information Name: RS INDUSTRY LIMITED Part Name ARRAY TYPE MULTILAYER VARISTOR Part No. RS

More information

Reliability Evaluation Method for Electronic Device BGA Package Considering the Interaction Between Design Factors

Reliability Evaluation Method for Electronic Device BGA Package Considering the Interaction Between Design Factors Reliability Evaluation Method for Electronic Device BGA Package Considering the Interaction Between Design Factors Satoshi KONDO *, Qiang YU *, Tadahiro SHIBUTANI *, Masaki SHIRATORI * *Department of Mechanical

More information

Effect of object-to-camera distance on temperature and spatial resolution of a Thermal imaging system FLIR SC 5000

Effect of object-to-camera distance on temperature and spatial resolution of a Thermal imaging system FLIR SC 5000 Effect of object-to-camera distance on temperature and spatial resolution of a Thermal imaging system FLIR SC 5000 B. B. Lahiri, S. Bagavathiappan, John Philip, B.P.C. Rao & T. Jayakumar Non-Destructive

More information

Xenics Presentation. A 25 minute crash course in Thermography

Xenics Presentation. A 25 minute crash course in Thermography Xenics Presentation A 25 minute crash course in Thermography How to improve accuracy / repeatability on non-contact temperature measurement by selecting the right IR spectrum Copyright 2015 Guido DEUTZ

More information

THERMAL ANALYSIS OF OVERGROUND BOUND CONSTRUCTIONS

THERMAL ANALYSIS OF OVERGROUND BOUND CONSTRUCTIONS ABSTRACT THERMAL ANALYSIS OF OVERGROUND BOUND CONSTRUCTIONS Sandris Liepins, Silvija Strausa, Uldis Iljins*, Uldis Gross* Latvia University of Agriculture, Faculty of Rural Engineering, *Latvia University

More information

the firm: Tel.: REMENT

the firm: Tel.: REMENT Evaluations performed by the firm: Alena Chmelová, Prokopa Holého 258/4, Opava, Czech Republic EU VAT no.: CZ7357281987 Tel.: (+420) 607 594 827, (+420) 602 769 785 Email: termotest@seznam.cz, http://

More information

Sensors & Transducers Published by IFSA Publishing, S. L., 2016

Sensors & Transducers Published by IFSA Publishing, S. L., 2016 Sensors & Transducers Published by IFSA Publishing, S. L., 2016 http://www.sensorsportal.com Ice Detection of Pure and Saline Ice Using Infrared Signature 1 Taimur Rashid, Hassan A. Khawaja and K. Edvardsen

More information

ADVANCED BOARD LEVEL MODELING FOR WAFER LEVEL PACKAGES

ADVANCED BOARD LEVEL MODELING FOR WAFER LEVEL PACKAGES As originally published in the SMTA Proceedings ADVANCED BOARD LEVEL MODELING FOR WAFER LEVEL PACKAGES Tiao Zhou, Ph.D. Southern Methodist University Dallas, TX, USA tiaoz@smu.edu Zhenxue Han, Ph.D. University

More information

Lednium Series Optimal X (10-watts,120 Viewing Angle)

Lednium Series Optimal X (10-watts,120 Viewing Angle) (10-watts,120 Viewing Angle) Revolutionary 3-dimensional packaged LED source Robust energy-efficient design with long operating life Low thermal resistance (2.5 C/W) Exceptional spatial uniformity Available

More information

MEI SEMI CO., LTD. Emitted Color Yellow Green Len's Color Water Clear. Chip Material AlGaInP -- --

MEI SEMI CO., LTD. Emitted Color Yellow Green Len's Color Water Clear. Chip Material AlGaInP -- -- Part No. WR-PB3216G-L8 Emitted Color Yellow Green Len's Color Water Clear Chip Material AlGaInP -- -- Features: Compatible with automatic placement equipment Compatible with reflow solder process Low power

More information

Telescopes (Chapter 6)

Telescopes (Chapter 6) Telescopes (Chapter 6) Based on Chapter 6 This material will be useful for understanding Chapters 7 and 10 on Our planetary system and Jovian planet systems Chapter 5 on Light will be useful for understanding

More information