BSS84P. SIPMOS Small-Signal-Transistor Feature P-Channel Enhancement mode Logic Level Avalanche rated dv/dt rated. Class 0

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1 SIPMOS Small-Signal-Transistor Feature P-Channel Enhancement mode Logic Level valanche rated dv/dt rated Product Summary V DS -6 V R DS(on) 8 W I D -.17 PG-SOT-3 3 Qualified according to EC Q11 Halogen-free according to IEC VPS5161 Type Package Tape and Reel BSS84P PG-SOT-3 H637:3pcs/r. Marking YBs BSS84P PG-SOT-3 H6433:1pcs/r. YBs Maximum Ratings, at T = 5 C, unless otherwise specified Parameter Symbol Value Unit Continuous drain current T =5 C T =7 C Pulsed drain current T =5 C valanche energy, single pulse I D =-.17, VDD=-5V, RGS=5W I D I D puls -.68 Gate pin1 E S.6 mj valanche energy, periodic limited by T jmax E R.36 Reverse diode dv/dt I S =-.17, V DS =-48V, di/dt=-/µs, T jmax =15 C Drain pin 3 Source pin dv/dt -6 kv/µs Gate source voltage V GS ± V Power dissipation T =5 C P tot.36 W Operating and storage temperature T j, T stg C IEC climatic category; DIN IEC /15/56 ESD Class JESD-114-HBM Class Rev.7 Page

2 Thermal Characteristics Parameter Symbol Values Unit min. typ. max. Characteristics Thermal resistance, junction - soldering point (Pin 3) R thjs - - K/W SMD version, device on min. 6 cm cooling area 1) R thj Electrical Characteristics, at T = 5 C, unless otherwise specified Parameter Symbol Values Unit min. typ. max. Static Characteristics Drain-source breakdown voltage V (BR)DSS V V GS =, I D =-5µ Gate threshold voltage, V GS = V DS V GS(th) I D =-µ Zero gate voltage drain current V DS =-6V, V GS =, T =5 C V DS =-6V, V GS =, T =15 C I DSS µ Gate-source leakage current I GSS n V GS =-V, V DS = Drain-source on-state resistance R DS(on) W VGS=-4.5V, I D =-.14 Drain-source on-state resistance R DS(on) V GS =-1V, I D = Device on 4mm*4mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 7 µm thick) copper area for drain connection. PCB is vertical without blown air. Rev.7 Page

3 Electrical Characteristics, at T = 5 C, unless otherwise specified Parameter Symbol Conditions Values Unit min. typ. max. Dynamic Characteristics Transconductance g fs V DS *I D *R DS(on)max, S I D =-.14 Input capacitance C iss V GS =, V DS =-5V, pf Output capacitance C oss f=1mhz Reverse transfer capacitance C rss - 3 Turn-on delay time t d(on) V DD =-3V, V GS =-4.5V, ns Rise time t r I D =-.14, R G =5W Turn-off delay time t d(off) Fall time t f Gate Charge Characteristics Gate to source charge Q gs V DD =-48V, I D = nc Gate to drain charge Q gd Gate charge total Q g V DD =-48V, I D =-.17, V GS = to -1V Gate plateau voltage V(plateau) V DD =-48V, I D = V Reverse Diode Inverse diode continuous forward current I S T =5 C Inv. diode direct current, pulsed I SM Inverse diode forward voltage V SD V GS =, I F = V Reverse recovery time t rr V R =-3V, I F =l S, ns Reverse recovery charge Q rr di F /dt=1/µs nc Rev.7 Page

4 1 Power dissipation P tot = f (T ).38 W Drain current I D = f (T ) parameter: V GS ³ 1 V Ptot ID C 16 T C 16 T 3 Safe operating area I D = f ( V DS ) parameter : D =, T = 5 C Transient thermal impedance Z thj = f (t p ) parameter : D = t p /T 3 1 K/W -1 t p = 17.µs 1 ID -1-1 R DS(on) = V DS / I D 1 ms 1 ms ZthJ 1 1 D = DC 1 single pulse V -1 V DS Rev.7 Page s 1 4 t p

5 5 Typ. output characteristic I D = f (V DS ) parameter: T j = 5 C ID -.4 P tot =.36W l k j i h V GS [V] g a -.5 f b -3. c -3.5 e d -4. e -4.5 f -5. d g -5.5 h -6. i -6.5 c j -7. k -8. l -1. b a 6 Typ. drain-source on resistance R DS(on) = f (I D ) parameter: V GS ; T j = 5 C RDS(on) 6 W a V GS [V] = a -.5 b -3. b c -3.5 d -4. c e -4.5 f -5. d g -5.5 e h -6. i -6.5 BSS84P f j -7. g l h j k i k l V -5 V DS 7 Typ. transfer characteristics I D = f ( V GS ); V DS ³ x I D x R DS(on)max parameter: T j = 5 C I D 8 Typ. forward transconductance g fs = f(i D ) parameter: T j = 5 C.16 S ID.5 gfs V 6 - V GS I D Rev.7 Page

6 9 Drain-source on-state resistance R DS(on) = f (T j ) parameter : I D = -.17, V GS = -1 V W 1 1 Typ. gate threshold voltage V GS(th) = f (T j ) parameter: V GS = V DS.4 V RDS(on) VGS(th) typ. 98% % typ % C Typ. capacitances C = f (V DS ) parameter: V GS =, f=1 MHz 1 T C 16 T 1 Forward character. of reverse diode I F = f (V SD ) parameter: T j, tp = 8 µs -1 pf Ciss -1-1 C IF 1 1 Coss Crss -1 - T j = 5 C typ T j = 15 C typ T j = 5 C (98%) T j = 15 C (98%) V - V DS Rev.7 Page V -3 V SD

7 13 Typ. avalanche energy E S = f (T ), parameter: I D = -.17, V DD = -5 V, R GS = 5 W 3 mj 14 Typ. gate charge V GS = f (Q Gate ) parameter: I D = -.17 pulsed; T j = 5 C -16 V -1 ES VGS -1, V DS max,8 V DS max C 165 T nc 1.5 Q Gate 15 Drain-source breakdown voltage V (BR)DSS = f (T ) -7 V V(BR)DSS C 18 T Rev.7 Page

8 Published by W Infineon Technologies G 8176 Munich, Germany 1 Infineon Technologies G ll Rights Reserved. Legal Disclaimer The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Infineon Technologies hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. Information For further information on technology, delivery terms and conditions and prices, please contact the nearest Infineon Technologies Office ( Warnings Due to technical requirements, components may contain dangerous substances. For information on the types in question, please contact the nearest Infineon Technologies Office. Infineon Technologies components may be used in life-support devices or systems only with the express written approval of Infineon Technologies, if a failure of such components can reasonably be expected to cause the failure of that life-support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Rev.7 Page

BSL211SP. Rev 2.0. Product Summary V DS -20 V R DS(on) 67 mω I D -4.7 A. Type Package Tape and reel BSL211SP P-TSOP6-6 H6327: 3000pcs/r.

BSL211SP. Rev 2.0. Product Summary V DS -20 V R DS(on) 67 mω I D -4.7 A. Type Package Tape and reel BSL211SP P-TSOP6-6 H6327: 3000pcs/r. OptiMOS -P Small-Signal-Transistor Feature P-Channel Enhancement mode Super Logic Level (.5 V rated) 5 C operating temperature valanche rated dv/dt rated Pb-free lead plating; RoHS compliant Qualified