ANGULAR DEPENDENCE OF ELECTRON VELOCITY DISTRIBUTIONS IN LOW-PRESSURE INDUCTIVELY COUPLED PLASMAS 1
|
|
- Bennett Davis
- 5 years ago
- Views:
Transcription
1 ANGULAR DEPENDENCE OF ELECTRON VELOCITY DISTRIBUTIONS IN LOW-PRESSURE INDUCTIVELY COUPLED PLASMAS 1 Alex V. Vasenkov 2, and Mark J. Kushner Department of Electrical and Computer Engineering Urbana, IL vasenkov@uiuc.edu mjk@uiuc.edu October Work supported by CFD Research Corp., NSF, Applied Materials, Inc. and the SRC 2 Present address: CFD Research Corp., Huntsville, AL 35805
2 AGENDA Angular dependent electron velocity distributions (AEVDs) in inductively coupled plasmas (ICPs) Description of the Monte Carlo (MC) algorithm for modeling of AEVDs Plasma properties, Legendre coefficients, and AEVDs for ICPs in Ar/c-C 4 F 8 Linear and nonlinear forces in ICPs Variations of AEVDs from collisionless to collisional conditions Summary GEC
3 AEVDs IN ICPs ICPs are the workhorse of the microelectronics industry for etching and deposition of materials. Electron kinetics is usually non-equilibrium at typical operating conditions (< 10s mtorr, < 10s MHz, 100s W kw). Little is known about the angular dependence of the AEVDs in and near the skin layer, particularly, when the skin layer is anomalous. The angular anisotropy of the AEVD in ICPs is often assumed to be small so that a two-term spherical harmonic expansion is valid. GEC
4 MC model for calculating Legendre expansion coefficients and AVED was incorporated into Hybrid Plasma Equipment Model (HPEM). HPEM is a two-dimensional, plasma equipment model consisting of an Electromagnetic Module, an Electron MC Simulation Module and Fluid Kinetics Module. Method was developed in which AEEDs is given by r r f ( ε,, φ ) = al( ε, ) P l(cos φ ) l where ε = electron energy r = spatial location P l = l th Legendre polynomial a l = l th Legendre polynomial coefficient φ = angle of the electron trajectory with respect to a reference direction, φ 0. GEC DESCRIPTION OF THE MODEL
5 r r r 1 1 Φ ikj = w j t jδ(( ε i ± εi ) ε j ) αmδ(( m+ k ± m+ k ) j ) 2 where ε, r = energy and location of the i th energy bin µ n = cos(φ n ) ε, r = spatial and energy widths of k th spatial mesh cell r a ( ε,r ) are obtained from the raw statistics as a l l A ( ε l i k i r,r DESCRIPTION OF THE MODEL (CONT.) Raw statistics A l, from which a l are computed, are updated as GEC k ) A ( ε l r,r Φikj j n ) + 2l+ 1 δ(( µ n ± 2 1 r r r ( εi,rk ) = A l ( εi,r k) / A0 ( εi,r k) i i k m P0 dµ µ n ) µ 2 j n ) )P l ( µ.
6 DOMINANT FORCES IN ICP CELL An ICP reactor patterned after Oeherlein et al. was used for investigation. There are at least five dominant forces that act upon electrons: 1. Electrodynamic force F θ (1) = - q E θ. GEC Electrostatic force F θ s = - q E s. 3. Second order non-linear r Lorentz ( 2 ) r force (NLF) F. z = v Brf r r r 4. Force F sh resulting from F ~ E B (Makabe et al, 1998). sh 5. Third order non-linear force F θ (3) acting on the electrons in the θr plane. s rf
7 PLASMA PROPERTIES FOR THE BASE CASE CONDITIONS The peak [e] results from the drift of thermal electrons towards the peak of the plasma potential (Φ pot ). The lower [e] in Ar/C 4 F 8 is due to the higher rate of power dissipation in the molecular mixture. Due to higher rates of loss by attachment to C 4 F 8 and its fragments a higher T e is required. Ar and Ar/C 4 F 8 = 90/10 at 3 mtorr, 400 W, 3.39 MHz. GEC
8 LEGENDRE COEFFICIENTS IN RZ PLANE Large odd a n in the skin layer imply high energies electrons are accelerated out of the skin layer into the bulk plasma by the NLF. In the bulk plasma, NLF is small and electrons experience a large number of collisions. Odd a n are large only for e > 30 ev. Near the substrate, the even a n are large for e > 20 ev producing an AEVD stretched in -v z and +v z. 3 mtorr, 400 W, 3.39 MHz. GEC
9 LEGENDRE COEFFICIENTS IN Rθ PLANE Even a n dominate implying that the AEVDs are stretched in +v θ and -v θ. Harmonic acceleration by E θ should produce symmetric anisotropy (even a n ). Even a n are smaller in the bulk plasma and near the substrate due to collisions reducing the anisotropy. 3 mtorr, 400 W, 3.39 MHz. GEC
10 AEVDs IN V θ V r PLANE IN THE MIDDLE OF SKIN LAYER 3 mtorr, 400 W, 3.39 MHz. AEVDs are obtained with seven a n. AEVDs are anisotropic at low and high energies as they include electrons from different portions of the rf cycle. The angular anisotropy of AEVDs results in large v θ (1.3x10 8 cm/s). GEC
11 AEVDs IN V z V r PLANE IN THE MIDDLE OF SKIN LAYER AEVD of low-energy electrons is nearly isotropic and shifted to -v z due to the energy pooling. The anisotropy of the AEVDs increases with energy owing to increased NLF. GEC mtorr, 400 W, 3.39 MHz.
12 THIRD ORDER NON-LINEAR FORCE The third order equation of motion in the collisionless limit is (Chen, 2001) r ( 3 ) r dv { v r = = } ( 3 ) r ( 2 ) ( 2 ) v F m q ( z )E θ + vz Bre θ dt v ( ) Substituting for r 2 v ( ) and with their expressions a 3 rd order z 2 z force is directed along the tangent r F 3 ( 3 ) v θ r 2 q 0 = e E 2 2 θ θ 4m ω [ ] 0 2 ( 2 2 B ω t + 2ωt + cos( 2ωt ) / 2 sin( ωt )) With the base case conditions (3 mtorr, 400 W ) F θ (3) / F θ (1) = 5 at MHz = 100 at 1.13 MHz. GEC
13 EFFECT OF FREQUENCY ON a n /a 0 in RZ plane a n /a 0 at 1.13 MHz are larger than a n /a 0 at MHz as NLF increases with decreasing frequency. The odd a n /a 0 are larger than even a n /a 0 in the skin layer at 1.13 MHz and are commensurate with the even a n /a 0 at MHz. In the bulk plasma and at the edge of the skin layer (z = 8 cm and z = 5 cm), the even a n /a 0 at 1.13 MHz are larger than odd a n /a 0 at ε < 25 ev, producing AEEDs elongated in +v z and v z and symmetric with respect to r axis. Ar, 3 mtorr, 400 W, 3.39 MHz. GEC
14 EFFECT OF FREQUENCY ON a n /a 0 in Rθ plane Only even a n /a 0 are shown as odd a n /a 0 are small. a n /a 0 are the largest in the skin layer, where F θ (1) and F θ (3) peak. a n /a 0 for MHz are larger than or commensurate with a n /a 0 at 1.13 MHz for e < Φ pot due to increased E rf. At e > Φ pot, a n /a 0 at 1.13 MHz are commensurate with or larger than a n /a 0 for MHz implying that F θ (1) exceeds F θ (3). Ar, 3 mtorr, 400 W, 3.39 MHz. GEC
15 EFFECT OF B rf ON a n /a 0 in RZ plane Without B rf, the NLF is zero and the anisotropy of the AEVDs in the rz plane is due only to the thermal diffusion of electrons. In the skin layer, high energy electrons are lost from the plasma leaving only those directed downward to contribute to odd a n /a 0. In the bulk plasma and at the edge of the skin layer (z = 8 and z = 5 cm) small a n /a 0 at low ε implies that without B rf the AEEDs are fairly isotropic. Ar, 3 mtorr, 400 W, 3.39 MHz. GEC
16 EFFECT OF B rf ON a n /a 0 in Rθ plane F θ (1) is not affected by B rf, whereas F θ (3) is directly proportional to B rf. a n /a 0 with B rf are similar to a n /a 0 without B rf for e < Φ pot as AEVD at these energies is determined by F θ (1). At e > Φ pot, a n /a 0 with B rf are larger than a n /a 0 without B rf implying that anisotropy is determined by F θ (3). Ar, 3 mtorr, 400 W, 3.39 MHz. GEC
17 High-order a n in rz plane decrease with increased pressure due to diminished NLF and warm plasma effects. Even a n in the rθ plane are large at both 1 mtorr and 50 mtorr as they originate from both F θ (1) and F θ (3). Even a n in the rθ plane at 1 mtorr are larger than a n at 50 mtorr, due to decreased F θ (3) with increased pressure. EFFECT OF PRESSURE ON a n Ar, 3 mtorr, 400 W, 3.39 MHz. GEC
18 The anisotropy of AEVDs in low-pressure ICPs was investigated using MC techniques by sampling the trajectories of the electrons and computing Legendre coefficients. The anisotropy in the rz plane is largest at higher energies, favoring the high-order odd coefficients due largely to NLF. The anisotropy in the θr plane is due to electron acceleration by linear electrodynamic and nonlinear third-order forces. Anisotropy in the rz plane dominantly occurs when the skin layer is anomalous, whereas anisotropy in the θr plane persists to higher pressures. For operating conditions typical of plasma processing reactors, higher Legendre coefficients in both rz plane and θr plane have significant values. GEC Summary
Angular anisotropy of electron energy distributions in inductively coupled plasmas
JOURNAL OF APPLIED PHYSICS VOLUME 94, NUMBER 9 1 NOVEMBER 2003 Angular anisotropy of electron energy distributions in inductively coupled plasmas Alex V. Vasenkov a) and Mark J. Kushner b) Department of
More informationOPTIMIZATION OF PLASMA UNIFORMITY USING HOLLOW-CATHODE STRUCTURE IN RF DISCHARGES*
51th Gaseous Electronics Conference & 4th International Conference on Reactive Plasmas Maui, Hawai i 19-23 October 1998 OPTIMIZATION OF PLASMA UNIFORMITY USING HOLLOW-CATHODE STRUCTURE IN RF DISCHARGES*
More informationCONSEQUENCES OF RADIATION TRAPPING ON ELECTRON ENERGY DISTRIBUTIONS IN LOW PRESSURE INDUCTIVELY COUPLED Hg/Ar DISCHARGES*
CONSEQUENCES OF RADIATION TRAPPING ON ELECTRON ENERGY DISTRIBUTIONS IN LOW PRESSURE INDUCTIVELY COUPLED Hg/Ar DISCHARGES* Kapil Rajaraman**, Alex Vasenkov*** and Mark J. Kushner*** **Department of Physics
More informationMODELING OF SEASONING OF REACTORS: EFFECTS OF ION ENERGY DISTRIBUTIONS TO CHAMBER WALLS*
MODELING OF SEASONING OF REACTORS: EFFECTS OF ION ENERGY DISTRIBUTIONS TO CHAMBER WALLS* Ankur Agarwal a) and Mark J. Kushner b) a) Department of Chemical and Biomolecular Engineering University of Illinois,
More informationEFFECT OF PRESSURE AND ELECTRODE SEPARATION ON PLASMA UNIFORMITY IN DUAL FREQUENCY CAPACITIVELY COUPLED PLASMA TOOLS *
EFFECT OF PRESSURE AND ELECTRODE SEPARATION ON PLASMA UNIFORMITY IN DUAL FREQUENCY CAPACITIVELY COUPLED PLASMA TOOLS * Yang Yang a) and Mark J. Kushner b) a) Department of Electrical and Computer Engineering
More informationINVESTIGATION of Si and SiO 2 ETCH MECHANISMS USING an INTEGRATED SURFACE KINETICS MODEL
46 th AVS International Symposium Oct. 25-29, 1999 Seattle, WA INVESTIGATION of Si and SiO 2 ETCH MECHANISMS USING an INTEGRATED SURFACE KINETICS MODEL Da Zhang* and Mark J. Kushner** *Department of Materials
More informationSPUTTER-WIND HEATING IN IONIZED METAL PVD+
SPUTTER-WIND HEATING IN IONIZED METAL PVD+ Junqing Lu* and Mark Kushner** *Department of Mechanical and Industrial Engineering **Department of Electrical and Computer Engineering University of Illinois
More informationINTRODUCTION TO THE HYBRID PLASMA EQUIPMENT MODEL
INTRODUCTION TO THE HYBRID PLASMA EQUIPMENT MODEL Prof. Mark J. Kushner Department of Electrical and Computer Engineering 1406 W. Green St. Urbana, IL 61801 217-144-5137 mjk@uiuc.edu http://uigelz.ece.uiuc.edu
More informationEFFECT OF REACTOR GEOMETRY ON ION ENERGY DISTRIBUTIONS FOR PULSED PLASMA DOPING (P 2 LAD)*
EFFECT OF REACTOR GEOMETRY ON ION ENERGY DISTRIBUTIONS FOR PULSED PLASMA DOPING (P 2 LAD)* Ankur Agarwal a) and Mark J. Kushner b) a) Department of Chemical and Biomolecular Engineering University of Illinois
More informationEffect of Gas Flow Rate and Gas Composition in Ar/CH 4 Inductively Coupled Plasmas
COMSOL CONFERENCE BOSTON 2011 Effect of Gas Flow Rate and Gas Composition in Ar/CH 4 Inductively Coupled Plasmas Keisoku Engineering System Co., Ltd., JAPAN Dr. Lizhu Tong October 14, 2011 1 Contents 1.
More informationMONTE CARLO SIMULATION OF RADIATION TRAPPING IN ELECTRODELESS LAMPS: A STUDY OF COLLISIONAL BROADENERS*
MONTE CARLO SIMULATION OF RADIATION TRAPPING IN ELECTRODELESS LAMPS: A STUDY OF COLLISIONAL BROADENERS* Kapil Rajaraman** and Mark J. Kushner*** **Department of Physics ***Department of Electrical and
More informationPIC-MCC/Fluid Hybrid Model for Low Pressure Capacitively Coupled O 2 Plasma
PIC-MCC/Fluid Hybrid Model for Low Pressure Capacitively Coupled O 2 Plasma Kallol Bera a, Shahid Rauf a and Ken Collins a a Applied Materials, Inc. 974 E. Arques Ave., M/S 81517, Sunnyvale, CA 9485, USA
More informationSIMULATIONS OF ECR PROCESSING SYSTEMS SUSTAINED BY AZIMUTHAL MICROWAVE TE(0,n) MODES*
25th IEEE International Conference on Plasma Science Raleigh, North Carolina June 1-4, 1998 SIMULATIONS OF ECR PROCESSING SYSTEMS SUSTAINED BY AZIMUTHAL MICROWAVE TE(,n) MODES* Ron L. Kinder and Mark J.
More informationPIC-MCC/Fluid Hybrid Model for Low Pressure Capacitively Coupled O 2 Plasma
PIC-MCC/Fluid Hybrid Model for Low Pressure Capacitively Coupled O 2 Plasma Kallol Bera a, Shahid Rauf a and Ken Collins a a Applied Materials, Inc. 974 E. Arques Ave., M/S 81517, Sunnyvale, CA 9485, USA
More informationSCALING OF HOLLOW CATHODE MAGNETRONS FOR METAL DEPOSITION a)
SCALING OF HOLLOW CATHODE MAGNETRONS FOR METAL DEPOSITION a) Gabriel Font b) Novellus Systems, Inc. San Jose, CA, 95134 USA and Mark J. Kushner Dept. of Electrical and Computer Engineering Urbana, IL,
More informationMODELING OF AN ECR SOURCE FOR MATERIALS PROCESSING USING A TWO DIMENSIONAL HYBRID PLASMA EQUIPMENT MODEL. Ron L. Kinder and Mark J.
TECHCON 98 Las Vegas, Nevada September 9-11, 1998 MODELING OF AN ECR SOURCE FOR MATERIALS PROCESSING USING A TWO DIMENSIONAL HYBRID PLASMA EQUIPMENT MODEL Ron L. Kinder and Mark J. Kushner Department of
More informationA3D Hybrid Model of ahelicon Source +
A3D Hybrid Model of ahelicon Source + Eric R. Keiter* and Mark J. Kushner** Department of Electrical and Computer Engineering 146 W. Green St., Urbana, IL 6181 USA Http://uigelz.ece.uiuc.edu 1st Gaseous
More informationModel for noncollisional heating in inductively coupled plasma processing sources
Model for noncollisional heating in inductively coupled plasma processing sources Shahid Rauf a) and Mark J. Kushner b) Department of Electrical and Computer Engineering, University of Illinois, 1406 West
More informationDEPOSITION AND COMPOSITION OF POLYMER FILMS IN FLUOROCARBON PLASMAS*
DEPOSITION AND COMPOSITION OF POLYMER FILMS IN FLUOROCARBON PLASMAS* Kapil Rajaraman and Mark J. Kushner 1406 W. Green St. Urbana, IL 61801 rajaramn@uiuc.edu mjk@uiuc.edu http://uigelz.ece.uiuc.edu November
More informationCONTROL OF UNIFORMITY IN CAPACITIVELY COUPLED PLASMAS CONSIDERING EDGE EFFECTS*
CONTROL OF UNIFORMITY IN CAPACITIVELY COUPLED PLASMAS CONSIDERING EDGE EFFECTS* Junqing Lu and Mark J. Kushner Department of Electrical and Computer Engineering at Urbana-Champaign mjk@uiuc.edu, jqlu@uiuc.edu
More informationSCALING OF PLASMA SOURCES FOR O 2 ( 1 ) GENERATION FOR CHEMICAL OXYGEN-IODINE LASERS
SCALING OF PLASMA SOURCES FOR O 2 ( 1 ) GENERATION FOR CHEMICAL OXYGEN-IODINE LASERS D. Shane Stafford and Mark J. Kushner Department of Electrical and Computer Engineering Urbana, IL 61801 http://uigelz.ece.uiuc.edu
More informationELECTRON ENERGY DISTRIBUTIONS AND NON-COLLISIONAL HEATING IN MAGNETICALLY ENHANCED INDUCTIVELY COUPLED PLASMAS*
ELECTRON ENERGY DISTRIUTIONS AND NON-COLLISIONAL HEATING IN MAGNETICALLY ENHANCED INDUCTIVELY COUPLED PLASMAS* Ronald L. Kinde and Mak J. Kushne Depatment of Electical and Compute Engineeing Ubana, IL
More informationA time dependent propagator method for long mean free path transport of neutral particles in plasma processing reactors
A time dependent propagator method for long mean free path transport of neutral particles in plasma processing reactors Wen-yi Tan, Robert J. Hoekstra, and Mark J. Kushner a) Department of Electrical and
More informationPARTICLE CONTROL AT 100 nm NODE STATUS WORKSHOP: PARTICLES IN PLASMAS
PARTICLE CONTROL AT 100 nm NODE STATUS WORKSHOP: PARTICLES IN PLASMAS Mark J. Kushner University of Illinois Department of Electrical and Computer Engineering Urbana, IL 61801 mjk@uiuc.edu December 1998
More informationPlasma transport around dust agglomerates having complex shapes
JOURNAL OF APPLIED PHYSICS VOLUME 83, NUMBER 11 1 JUNE 1998 Plasma transport around dust agglomerates having complex shapes Eric R. Keiter a) and Mark J. Kushner b) Department of Electrical and Computer
More informationA Working Electron Impact Cross Section Set for CHF 3. Mark J. Kushner a) and Da Zhang b) University of Illinois 1406 W. Green St Urbana, IL 61801
A Working Electron Impact Cross Section Set for CHF 3 Mark J. Kushner a) and Da Zhang b) University of Illinois 1406 W. Green St Urbana, IL 61801 Abstract Trifluoromethane, CHF 3, is used for plasma etching
More informationA MONTE CARLO SIMULATION OF RADIATION TRAPPING IN ELECTRODELESS GAS DISCHARGES HAVING COMPLEX GEOMETRIES*
A MONTE CARLO SIMULATION OF RADIATION TRAPPING IN ELECTRODELESS GAS DISCHARGES HAVING COMPLEX GEOMETRIES* Kapil Rajaraman** and Mark J. Kushner*** **Department of Physics ***Department of Electrical and
More informationMulti-fluid Simulation Models for Inductively Coupled Plasma Sources
Multi-fluid Simulation Models for Inductively Coupled Plasma Sources Madhusudhan Kundrapu, Seth A. Veitzer, Peter H. Stoltz, Kristian R.C. Beckwith Tech-X Corporation, Boulder, CO, USA and Jonathan Smith
More informationInvestigation of the DSMC Approach for Ion/neutral Species in Modeling Low Pressure Plasma Reactor
Investigation of the DSMC Approach for Ion/neutral Species in Modeling Low Pressure Plasma Reactor Hao Deng, Z. Li, D. Levin, and L. Gochberg Department of Aerospace Engineering The Pennsylvania State
More informationI. INTRODUCTION J. Vac. Sci. Technol. A 16 4, Jul/Aug /98/16 4 /2454/9/$ American Vacuum Society 2454
Consequences of three-dimensional physical and electromagnetic structures on dust particle trapping in high plasma density material processing discharges Helen H. Hwang, a) Eric R. Keiter, b) and Mark
More informationEffect of sputter heating in ionized metal physical vapor deposition reactors
JOURNAL OF APPLIED PHYSICS VOLUME 87, NUMBER 10 15 MAY 2000 Effect of sputter heating in ionized metal physical vapor deposition reactors Junqing Lu a) Department of Mechanical and Industrial Engineering,
More informationSolution of time-dependent Boltzmann equation for electrons in non-thermal plasma
Solution of time-dependent Boltzmann equation for electrons in non-thermal plasma Z. Bonaventura, D. Trunec Department of Physical Electronics Faculty of Science Masaryk University Kotlářská 2, Brno, CZ-61137,
More informationDual-RadioFrequency Capacitively-Coupled Plasma Reactors. Tomás Oliveira Fartaria nº58595
Dual-RadioFrequency Capacitively-Coupled Plasma Reactors Tomás Oliveira Fartaria nº58595 Index Capacitive Reactors Dual Frequency Capacitively-Coupled reactors o Apparatus for improved etching uniformity
More informationThe plasma simulation system Brochure.
1 The plasma simulation system 2016 Brochure www.quantemol.com 2 What does Q-VT do? Quantemol-Virtual Tool is an expert software system for the simulation of industrial plasma processing tools. Q-VT builds
More informationConsequences of asymmetric pumping in low pressure plasma processing reactors: A three-dimensional modeling study
Consequences of asymmetric pumping in low pressure plasma processing reactors: A three-dimensional modeling study Mark J. Kushner a) University of Illinois, Department of Electrical and Computer Engineering,
More informationThe Plasma Simulation System Brochure.
The Plasma Simulation System 2018 Brochure www.quantemol.com Benefits of Q-VT An experimentally validated simulation system focused on modelling plasma tools User-friendly interface Sets of validated cross-sections
More informationMODELING AND SIMULATION OF LOW TEMPERATURE PLASMA DISCHARGES
MODELING AND SIMULATION OF LOW TEMPERATURE PLASMA DISCHARGES Michael A. Lieberman University of California, Berkeley lieber@eecs.berkeley.edu DOE Center on Annual Meeting May 2015 Download this talk: http://www.eecs.berkeley.edu/~lieber
More informationDOE WEB SEMINAR,
DOE WEB SEMINAR, 2013.03.29 Electron energy distribution function of the plasma in the presence of both capacitive field and inductive field : from electron heating to plasma processing control 1 mm PR
More informationSIMULATION OF POROUS LOW-k DIELECTRIC SEALING BY COMBINED He AND NH 3 PLASMA TREATMENT *
SIMULATION OF POROUS LOW-k DIELECTRIC SEALING BY COMBINED He AND NH 3 PLASMA TREATMENT * JULINE_ICOPS09_01 Juline Shoeb a) and Mark J. Kushner b) a) Department of Electrical and Computer Engineering Iowa
More informationPlasma Modeling with COMSOL Multiphysics
Plasma Modeling with COMSOL Multiphysics Copyright 2014 COMSOL. Any of the images, text, and equations here may be copied and modified for your own internal use. All trademarks are the property of their
More informationNONLINEAR ELECTROMAGNETICS MODEL OF AN ASYMMETRICALLY DRIVEN CAPACITIVE DISCHARGE
NONLINEAR ELECTROMAGNETICS MODEL OF AN ASYMMETRICALLY DRIVEN CAPACITIVE DISCHARGE M.A. Lieberman Department of Electrical Engineering and Computer Sciences University of California Berkeley, CA 94720 Collaborators:
More informationPlasma abatement of perfluorocompounds in inductively coupled plasma reactors
Plasma abatement of perfluorocompounds in inductively coupled plasma reactors Xudong Peter Xu, a) Shahid Rauf, b) and Mark J. Kushner c) University of Illinois, Department of Electrical and Computer Engineering,
More informationWave propagation and power deposition in magnetically enhanced inductively coupled and helicon plasma sources
Wave propagation and power deposition in magnetically enhanced inductively coupled and helicon plasma sources Ronald L. Kinder a) and Mark J. Kushner b) Department of Electrical and Computer Engineering,
More informationModelling of low-temperature plasmas: kinetic and transport mechanisms. L.L. Alves
Modelling of low-temperature plasmas: kinetic and transport mechanisms L.L. Alves llalves@tecnico.ulisboa.pt Instituto de Plasmas e Fusão Nuclear Instituto Superior Técnico, Universidade de Lisboa Lisboa,
More informationElectron Temperature Modification in Gas Discharge Plasma
Electron Temperature Modification in Gas Discharge Plasma Valery Godyak University of Michigan and RF Plasma Consulting egodyak@comcast.net Workshop: Control of Distribution Functions in Low Temperature
More informationTrench filling by ionized metal physical vapor deposition
Trench filling by ionized metal physical vapor deposition Junqing Lu a) and Mark J. Kushner b) University of Illinois, 1406 W. Green Street, Urbana, Illinois 61801 Received 25 January 2001; accepted 16
More informationPlasma atomic layer etching using conventional plasma equipment
Plasma atomic layer etching using conventional plasma equipment Ankur Agarwal a Department of Chemical and Biomolecular Engineering, University of Illinois, 600 S. Mathews Ave., Urbana, Illinois 61801
More informationTwo-Dimensional Particle-in-Cell Simulation of a Micro RF Ion Thruster
Two-Dimensional Particle-in-Cell Simulation of a Micro RF Ion Thruster IEPC--7 Presented at the nd International Electric Propulsion Conference, Wiesbaden Germany September 5, Yoshinori Takao, Koji Eriguchi,
More informationMWP MODELING AND SIMULATION OF ELECTROMAGNETIC EFFECTS IN CAPACITIVE DISCHARGES
MWP 1.9 MODELING AND SIMULATION OF ELECTROMAGNETIC EFFECTS IN CAPACITIVE DISCHARGES Insook Lee, D.B. Graves, and M.A. Lieberman University of California Berkeley, CA 9472 LiebermanGEC7 1 STANDING WAVES
More informationTwo-dimensional Fluid Simulation of an RF Capacitively Coupled Ar/H 2 Discharge
Two-dimensional Fluid Simulation of an RF Capacitively Coupled Ar/H 2 Discharge Lizhu Tong Keisoku Engineering System Co., Ltd., Japan September 18, 2014 Keisoku Engineering System Co., Ltd., 1-9-5 Uchikanda,
More informationSimulation of Low Pressure Plasma Processing Reactors: Kinetics of Electrons and Neutrals
Simulation of Low Pressure Plasma Processing Reactors: Kinetics of Electrons and Neutrals R. R. Arslanbekov and V. I. Kolobov CFD Research Corporation, Huntsville, AL, USA Abstract. In this paper, we illustrate
More informationSingle Particle Motion
Single Particle Motion C ontents Uniform E and B E = - guiding centers Definition of guiding center E gravitation Non Uniform B 'grad B' drift, B B Curvature drift Grad -B drift, B B invariance of µ. Magnetic
More informationarxiv: v1 [physics.plasm-ph] 10 Nov 2014
arxiv:1411.2464v1 [physics.plasm-ph] 10 Nov 2014 Effects of fast atoms and energy-dependent secondary electron emission yields in PIC/MCC simulations of capacitively coupled plasmas A. Derzsi 1, I. Korolov
More informationLow-field helicon discharges
Plasma Phys. Control. Fusion 39 (1997) A411 A420. Printed in the UK PII: S0741-3335(97)80958-X Low-field helicon discharges F F Chen, X Jiang, J D Evans, G Tynan and D Arnush University of California,
More informationMICRODISCHARGES AS SOURCES OF PHOTONS, RADICALS AND THRUST*
MICRODISCHARGES AS SOURCES OF PHOTONS, RADICALS AND THRUST* Ramesh Arakoni a) and Mark J. Kushner b) a) Dept. Aerospace Engineering b) Dept. Electrical and Computer Engineering Urbana, IL 61801 USA mjk@uiuc.edu
More informationControl of Ion Energy Distributions on Plasma Electrodes
Control of Ion Energy Distributions on Plasma Electrodes P. Diomede, D. J. Economou and V. M. Donnelly Plasma Processing Laboratory, University of Houston DOE Plasma Science Center Teleseminar, February
More informationPlasma properties determined with induction loop probes in a planar inductively coupled plasma source
Plasma properties determined with induction loop probes in a planar inductively coupled plasma source J. A. Meyer, a) R. Mau, and A. E. Wendt b) Engineering Research Center for Plasma-Aided Manufacturing,
More informationFeature-level Compensation & Control
Feature-level Compensation & Control 2 Plasma Eray Aydil, UCSB, Mike Lieberman, UCB and David Graves UCB Workshop November 19, 2003 Berkeley, CA 3 Feature Profile Evolution Simulation Eray S. Aydil University
More informationSpatial distributions of power and ion densities in RF excited remote plasma reactors
Plasma Sources Sci. Technol. 5 (1996) 499 509. Printed in the UK Spatial distributions of power and ion densities in RF excited remote plasma reactors Irène Pérès and Mark J Kushner University of Illinois,
More information65 th GEC, October 22-26, 2012
65 th GEC, October 22-26, 2012 2D Fluid/Analytical Simulation of Multi-Frequency Capacitively-Coupled Plasma Reactors (CCPs) E. Kawamura, M.A. Lieberman, D.B. Graves and A.J. Lichtenberg A fast 2D hybrid
More informationEtching Issues - Anisotropy. Dry Etching. Dry Etching Overview. Etching Issues - Selectivity
Etching Issues - Anisotropy Dry Etching Dr. Bruce K. Gale Fundamentals of Micromachining BIOEN 6421 EL EN 5221 and 6221 ME EN 5960 and 6960 Isotropic etchants etch at the same rate in every direction mask
More informationShapes of agglomerates in plasma etching reactors
Shapes of agglomerates in plasma etching reactors Fred Y. Huang a) and Mark J. Kushner b) University of Illinois, Department of Electrical and Computer Engineering, 1406 West Green Street, Urbana, Illinois
More informationP. Diomede, D. J. Economou and V. M. Donnelly Plasma Processing Laboratory, University of Houston
P. Diomede, D. J. Economou and V. M. Donnelly Plasma Processing Laboratory, University of Houston 1 Outline Introduction PIC-MCC simulation of tailored bias on boundary electrode Semi-analytic model Comparison
More informationLecture 6 Plasmas. Chapters 10 &16 Wolf and Tauber. ECE611 / CHE611 Electronic Materials Processing Fall John Labram 1/68
Lecture 6 Plasmas Chapters 10 &16 Wolf and Tauber 1/68 Announcements Homework: Homework will be returned to you on Thursday (12 th October). Solutions will be also posted online on Thursday (12 th October)
More informationScattering in Cold- Cathode Discharges
Simulating Electron Scattering in Cold- Cathode Discharges Alexander Khrabrov, Igor Kaganovich*, Vladimir I. Demidov**, George Petrov*** *Princeton Plasma Physics Laboratory ** Wright-Patterson Air Force
More informationReactive Ion Etching (RIE)
Reactive Ion Etching (RIE) RF 13.56 ~ MHz plasma Parallel-Plate Reactor wafers Sputtering Plasma generates (1) Ions (2) Activated neutrals Enhance chemical reaction 1 2 Remote Plasma Reactors Plasma Sources
More informationVOLUMETRIC CONTROL OF ANISOTROPIC ELECTRON DISTRIBUTION FUNCTION IN PLASMAS WITH LANGMUIR OSCILLATIONS
VOLUMETRIC CONTROL OF ANISOTROPIC ELECTRON DISTRIBUTION FUNCTION IN PLASMAS WITH LANGMUIR OSCILLATIONS A.S. Mustafaev St. Petersburg State Mining University, Russia V.I. Demidov West Virginia University,
More informationGTC Simulation of Turbulence and Transport in Tokamak Plasmas
GTC Simulation of Turbulence and Transport in Tokamak Plasmas Z. Lin University it of California, i Irvine, CA 92697, USA and GPS-TTBP Team Supported by SciDAC GPS-TTBP, GSEP & CPES Motivation First-principles
More informationPhysics and Modelling of a Negative Ion Source Prototype for the ITER Neutral Beam Injection
1 ITR/P1-37 Physics and Modelling of a Negative Ion Source Prototype for the ITER Neutral Beam Injection J.P. Boeuf a, G. Fubiani a, G. Hagelaar a, N. Kohen a, L. Pitchford a, P. Sarrailh a, and A. Simonin
More informationPhysique des plasmas radiofréquence Pascal Chabert
Physique des plasmas radiofréquence Pascal Chabert LPP, Ecole Polytechnique pascal.chabert@lpp.polytechnique.fr Planning trois cours : Lundi 30 Janvier: Rappels de physique des plasmas froids Lundi 6 Février:
More informationLOW-PRESSURE radio-frequency (RF) inductive-coupled
IEEE TRANSACTIONS ON PLASMA SCIENCE, VOL. 34, NO. 3, JUNE 2006 767 Self-Consistent Modeling of Nonlocal Inductively Coupled Plasmas Oleg V. Polomarov, Constantine E. Theodosiou, Igor D. Kaganovich, Demetre
More informationPIC-MCC simulations for complex plasmas
GRADUATE SUMMER INSTITUTE "Complex Plasmas August 4, 008 PIC-MCC simulations for complex plasmas Irina Schweigert Institute of Theoretical and Applied Mechanics, SB RAS, Novosibirsk Outline GRADUATE SUMMER
More informationForce, Energy & Periodic Motion. Preparation for unit test
Force, Energy & Periodic Motion Preparation for unit test Summary of assessment standards (Unit assessment standard only) In the unit test you can expect to be asked at least one question on each sub-skill.
More informationClassical Field Theory
April 13, 2010 Field Theory : Introduction A classical field theory is a physical theory that describes the study of how one or more physical fields interact with matter. The word classical is used in
More information2D Hybrid Fluid-Analytical Model of Inductive/Capacitive Plasma Discharges
63 rd GEC & 7 th ICRP, 2010 2D Hybrid Fluid-Analytical Model of Inductive/Capacitive Plasma Discharges E. Kawamura, M.A. Lieberman, and D.B. Graves University of California, Berkeley, CA 94720 This work
More informationIon Induced Beam disruption Mechanism
Ion Induced Beam disruption Mechanism C. Vermare CEA, Polygone d Expérimentation de Moronvilliers, France H. Davis, D.C. Moir, R. Olson Los Alamos National Laboratory, NM, USA T. Hughes Mission Research
More informationThe effect of radio frequency plasma processing reactor circuitry on plasma characteristics
JOURNAL OF APPLIED PHYSICS VOLUME 83, NUMBER 1 15 MAY 1998 The effect of radio frequency plasma processing reactor circuitry on plasma characteristics Shahid Rauf a) and Mark J. Kushner b) Department of
More informationEffects of fast atoms and energy-dependent secondary electron emission yields in PIC/ MCC simulations of capacitively coupled plasmas
(14pp) Plasma Sources Science and Technology doi:10.1088/0963-0252/24/3/034002 Effects of fast atoms and energy-dependent secondary electron emission yields in PIC/ MCC simulations of capacitively coupled
More informationAMSC 663 Project Proposal: Upgrade to the GSP Gyrokinetic Code
AMSC 663 Project Proposal: Upgrade to the GSP Gyrokinetic Code George Wilkie (gwilkie@umd.edu) Supervisor: William Dorland (bdorland@umd.edu) October 11, 2011 Abstract Simulations of turbulent plasma in
More informationSection 3: Etching. Jaeger Chapter 2 Reader
Section 3: Etching Jaeger Chapter 2 Reader Etch rate Etch Process - Figures of Merit Etch rate uniformity Selectivity Anisotropy d m Bias and anisotropy etching mask h f substrate d f d m substrate d f
More informationAccelerators. W. Udo Schröder, 2004
1 Accelerators Overview Electrostatic Accelerators Cascade Van de Graaff V.d.G. Tandem generator Accelerator 2-3 stages steady (DC) beam, high quality focusing, energy, currents; but low energies Accelerators
More informationPlasma Technology. FLCC Workshop & Review September 13, 2006 FLCC
1 Plasma Technology Professors Jane P. Chang (UCLA), Michael A. Lieberman, David B. Graves (UCB) and Allan J. Lichtenberg, John P. Verboncoeur, Alan Wu, Emi Kawamura, Chengche Hsu, Joe Vegh, Insook Lee
More informationP. Diomede, D. J. Economou and V. M. Donnelly Plasma Processing Laboratory, University of Houston
P. Diomede, D. J. Economou and V. M. Donnelly Plasma Processing Laboratory, University of Houston Acknowledgements: DoE Plasma Science Center, NSF Presented at the 57 th AVS Conference, Albuquerque, NM
More informationDiffusion during Plasma Formation
Chapter 6 Diffusion during Plasma Formation Interesting processes occur in the plasma formation stage of the Basil discharge. This early stage has particular interest because the highest plasma densities
More informationPLASMA processing (etching, deposition, cleaning) is one
486 IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, VOL. 11, NO. 3, AUGUST 1998 Virtual Plasma Equipment Model: A Tool for Investigating Feedback Control in Plasma Processing Equipment Shahid Rauf, Member,
More informationMonte Carlo Collisions in Particle in Cell simulations
Monte Carlo Collisions in Particle in Cell simulations Konstantin Matyash, Ralf Schneider HGF-Junior research group COMAS : Study of effects on materials in contact with plasma, either with fusion or low-temperature
More information1. (3) Write Gauss Law in differential form. Explain the physical meaning.
Electrodynamics I Midterm Exam - Part A - Closed Book KSU 204/0/23 Name Instructions: Use SI units. Where appropriate, define all variables or symbols you use, in words. Try to tell about the physics involved,
More informationKINETIC DESCRIPTION OF MAGNETIZED TECHNOLOGICAL PLASMAS
KINETIC DESCRIPTION OF MAGNETIZED TECHNOLOGICAL PLASMAS Ralf Peter Brinkmann, Dennis Krüger Fakultät für Elektrotechnik und Informationstechnik Lehrstuhl für Theoretische Elektrotechnik Magnetized low
More informationElectron kinetics and non-joule heating in near-collisionless inductively coupled plasmas
PHYSICAL REVIEW E VOLUME 55, NUMBER 3 MARCH 1997 Electron kinetics and non-joule heating in near-collisionless inductively coupled plasmas V. I. Kolobov Plasma Processing Laboratory, Department of Chemical
More informationInductance, RL and RLC Circuits
Inductance, RL and RLC Circuits Inductance Temporarily storage of energy by the magnetic field When the switch is closed, the current does not immediately reach its maximum value. Faraday s law of electromagnetic
More informationModeling ionization by helicon waves
Modeling ionization by helicon waves Space Plasma & Plasma Processing Group, Plasma Research Laboratory, Research School of Physical Sciences and Engineering, Australian National University, Australian
More informationNARROW GAP ELECTRONEGATIVE CAPACITIVE DISCHARGES AND STOCHASTIC HEATING
NARRW GAP ELECTRNEGATIVE CAPACITIVE DISCHARGES AND STCHASTIC HEATING M.A. Lieberman, E. Kawamura, and A.J. Lichtenberg Department of Electrical Engineering and Computer Sciences University of California
More informationKinetic Solvers with Adaptive Mesh in Phase Space for Low- Temperature Plasmas
Kinetic Solvers with Adaptive Mesh in Phase Space for Low- Temperature Plasmas Vladimir Kolobov, a,b,1 Robert Arslanbekov a and Dmitry Levko a a CFD Research Corporation, Huntsville, AL 35806, USA b The
More informationLow Temperature Plasma Technology Laboratory
Low Temperature Plasma Technology Laboratory Equilibrium theory for plasma discharges of finite length Francis F. Chen and Davide Curreli LTP-6 June, Electrical Engineering Department Los Angeles, California
More informationCharged particle motion in external fields
Chapter 2 Charged particle motion in external fields A (fully ionized) plasma contains a very large number of particles. In general, their motion can only be studied statistically, taking appropriate averages.
More informationTwo-dimensional simulation of a miniaturized inductively coupled plasma reactor
JOURNAL OF APPLIED PHYSICS VOLUME 95, NUMBER 5 1 MARCH 2004 Two-dimensional simulation of a miniaturized inductively coupled plasma reactor Sang Ki Nam and Demetre J. Economou a) Plasma Processing Laboratory,
More informationExploration COMSOL in Modeling RLSA TM CVD Processes
Exploration COMSOL in Modeling RLSA TM CVD Processes Ar+H 2 +SiH 4 +C 2 H 6 and Dopant Gas Jozef Brcka 1 *, Sundar Gandhi 2, Raymond Joe 2 1 Tokyo Electron U.S. Holdings, Inc., U.S. Technology Development
More informationNanopantography: A method for parallel writing of etched and deposited nanopatterns
Nanopantography: A method for parallel writing of etched and deposited nanopatterns Vincent M. Donnelly 1, Lin Xu 1, Azeem Nasrullah 2, Zhiying Chen 1, Sri C. Vemula 2, Manish Jain 1, Demetre J. Economou
More informationArgon metastable densities in radio frequency Ar, Ar/O 2 and Ar/CF 4 electrical discharges
Argon metastable densities in radio frequency Ar, Ar/O 2 and Ar/CF 4 electrical discharges Shahid Rauf a) and Mark J. Kushner b) Department of Electrical and Computer Engineering, University of Illinois,
More informationA KINETIC MODEL FOR EXCIMER UV AND VUV RADIATION IN DIELECTRIC BARRIER DISCHARGES*
A KINETIC MODEL FOR EXCIMER UV AND VUV RADIATION IN DIELECTRIC BARRIER DISCHARGES* Xudong Peter Xu and Mark J. Kushner University of Illinois Department of Electrical and Computer Engineering Urbana, IL
More information