DATA SHEET LWK3333-X. LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only DOC. NO : REV. : A. DATE : 24 - Nov ROUND TYPE LED LAMPS

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1 ROUND TYPE LED LAMPS Pb Lead-Free Parts LWK3333-X DATA SHEET DOC. NO : QW95-LWK3333-X REV. : A DATE : 24 - Nov. - 26

2 Page 1/6 Package Dimensions MAX.5 TYP 25.MIN 2.54TYP 1.MIN + - Note : 1.All dimension are in millimeter tolerance is ±.25mm unless otherwise noted. 2.Specifications are subject to change without notice. Directivity Radiation % 75% 5% 25% 25% 5% 75%1%

3 Page 2/6 Absolute Maximum Ratings at Ta=25 Parameter Symbol Ratings WK UNIT Forward Current Peak Forward Current Duty Power Dissipation IF IFP PD 3 ma 1 ma 12 mw Reverse Ir 5 μa Electrostatic Discharge( * ) ESD 15 V Operating Temperature Topr -2~ +8 Storage Temperature * Tstg -3~ +1 Static Electricity or power surge will damage the LED. Use of a conductive wrist band or anti-electrosatic glove is recommended when handing these LED. All devices, equipment and machinery must be properly grounded. Typical Electrical & Optical Characteristics (Ta=25 ) PART NO MATERIAL Emitted COLOR Lens Color Temperature ( K) Min. Max. Forward Typ. Max. Luminous Min. Typ. Viewing angle 2θ 1/2 (deg) LWK3333-X InGaN/GaN White Water Clear Note : 1.The forward voltage data did not including ±.1V testing tolerance. 2. The luminous intensity data did not including ±15% testing tolerance.

4 Page 3/6 Correspondence table of Color Temperature CIE(Reference) Color Temperature 1931 CIE Color Temperature 1931 CIE Kelvin( K) X Y Kelvin( K) X Y

5 Page 4/6 Typical Electro-Optical Characteristics Curve WK CHIP Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current Forward Current(mA) Relative Intensity Forward Voltage(V) Forward Current(mA) Fig.3 Forward Voltage vs. Temperature Fig.4 Relative Intensity vs. Temperature Forward Voltage@2mA Relative Intensity@2mA Ambient Temperature( ) Ambient Temperature( ) Fig.5 Luminous Spectrum(Ta=25 ) SPECTRAL RADIANCE 1 8 Intensity Wavelength (nm)

6 Page 5/6 Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:3W Max Temperature 35 C Max Soldering Time:3 Seconds Max(One Time) Distance:2mm Min(From solder joint to body) 2.Wave Soldering Profile Dip Soldering Preheat: 12 C Max Preheat time: 6seconds Max Ramp-up 2 C/sec(max) Ramp-Down:-5 C/sec(max) Solder Bath:26 C Max Dipping Time:3 seconds Max Distance:2mm Min(From solder joint to body) Temp( C) C3sec Max 5 /sec max /sec max Preheat 6 Seconds Max Time(sec)

7 Page 6/6 Reliability Test: Test Item Test Condition Description Reference Standard Operating Life Test 1.Under Room Temperature 2.If=2mA 3.t=1 hrs (-24hrs, +72hrs) This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. MIL-STD-75: 126 MIL-STD-883: 15 JIS C 721: B-1 High Temperature Storage Test 1.Ta=15 ±5 2.t=1 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of high temperature for hours. MIL-STD-883:18 JIS C 721: B-1 Low Temperature Storage Test 1.Ta=-4 ±5 2.t=1 hrs (-24hrs, +72hrs) The purpose of this is the resistance of the device which is laid under condition of low temperature for hours. JIS C 721: B-12 High Temperature High Humidity Test 1.Ta=65 ±5 2.RH=9%~95% 3.t=24hrs ±2hrs The purpose of this test is the resistance of the device under tropical for hours. MIL-STD-22:13B JIS C 721: B-11 Thermal Shock Test 1.Ta=15 ±5 &-4 ±5 (1min) (1min) 2.total 1 cycles The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. MIL-STD-22: 17D MIL-STD-75: 151 MIL-STD-883: 111 Solder Resistance Test 1.T.Sol=26 ±5 2.Dwell time= 1 ±1sec. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. MIL-STD-22: 21A MIL-STD-75: 231 JIS C 721: A-1 Solderability Test 1.T.Sol=23 ±5 2.Dwell time=5 ±1sec This test intended to see soldering well performed or not. MIL-STD-22: 28D MIL-STD-75: 226 MIL-STD-883: 23 JIS C 721: A-2

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