SIPMOS Small-Signal Transistor BSP 149

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1 SIPMOS Small-Signal Transistor DS 200 I D 0.48 A R DS(on) 3.5 Ω N channel Depletion mode High dynamic resistance Available grouped in GS(th) Type Ordering Tape and Reel Information Pin Configuration Marking Package Code Q67000-S071 E6327: 1000 pcs/reel G D S D SOT-223 Maximum Ratings Parameter Symbol alues Unit Drain-source voltage DS 200 Drain-gate voltage, R GS = 20 kω DGR 200 Gate-source voltage GS ± 14 Gate-source peak voltage, aperiodic gs ± 20 Continuous drain current, T A = 28 C I D 0.48 A Pulsed drain current, T A = 25 C I D puls 1.44 Max. power dissipation, T A = 25 C P tot 1.8 W Operating and storage temperature range T j, T stg C Thermal resistance 1) chip-ambient chip-soldering point R thja 70 R thjs 10 DIN humidity category, DIN E IEC climatic category, DIN IEC /150/56 1) Transistor on epoxy pcb 40 mm 40 mm 1.5 mm with 6 cm 2 copper area for drain connection. K/W Semiconductor Group

2 Electrical Characteristics at T j = 25 C, unless otherwise specified. Parameter Symbol alues Unit min. typ. max. Static Characteristics Drain-source breakdown voltage GS = 3, I D = 0.25 ma Gate threshold voltage DS = 3, I D = 1 ma Drain-source cutoff current DS = 200, GS = 3 T j = 25 C = 125 C T j Gate-source leakage current GS = 20, DS = 0 Drain-source on-resistance GS = 0, I D = 0.03 A (BR)DSS 200 GS(th) I DSS I GSS R DS(on) µa na Ω Dynamic Characteristics Forward transconductance DS 2 I D R DS(on)max, I D = 0.48 A Input capacitance GS = 0, DS = 25, f = 1 MHz Output capacitance GS = 0, DS = 25, f = 1 MHz Reverse transfer capacitance GS = 0, DS = 25, f = 1 MHz Turn-on time t on, (t on = t d(on) + t r ) DD =30, GS = , R GS =50Ω, I D = 0.29 A Turn-off time t off, (t off = t d(off) + t f ) DD =30, GS = , R GS =50Ω, I D = 0.29 A g fs S C iss pf oss C rss t d(on) 7 10 ns t r t d(off) t f Semiconductor Group 2

3 Electrical Characteristics (cont d) at T j = 25 C, unless otherwise specified. Parameter Symbol alues Unit Reverse Diode Continuous reverse drain current T A = 25 C Pulsed reverse drain current T A = 25 C Diode forward on-voltage I F = 0.96 A, GS = 0 min. typ. max. I S 0.48 I SM 1.44 SD A GS(th) Grouping Symbol Limit alues Unit Test Condition min. max. Range of GS(th) GS(th) 0.15 Threshold voltage selected in groups 1) : P R S T U W 1) A specific group cannot be ordered separately. Each reel only contains transistors from one group. Package Outline GS(th) D1 = 0.2 ; D2 = 3 ; I D = 1 ma SOT-223 Dimensions in mm Semiconductor Group 3

4 Characteristics at T j = 25 C, unless otherwise specified. Total power dissipation P tot = f (T A ) Safe operating area I D = f ( DS ) parameter: D = 0.01, T C = 25 C Typ. output characteristics I D = f ( DS ) parameter: t p = 80 µs Typ. drain-source on-resistance R DS(on) = f (I D ) parameter: GS Semiconductor Group 4

5 Typ. transfer characteristics I D = f ( GS ) parameter: t p = 80 µs, DS 2 I D R DS(on)max. Typ. forward transconductance g fs = f (I D ) parameter: DS 2 I D R DS(on)max., t p = 80 µs Drain-source on-resistance R DS(on) = f(t j ) parameter: I D = 0.03 A, GS = 0, (spread) Typ. capacitances C = f ( DS ) parameter: GS = 0, f = 1 MHz Semiconductor Group 5

6 Gate threshold voltage GS(th) = f (T j ) parameter: DS = 3, I D = 1 ma, (spread) Forward characteristics of reverse diode I F = f ( SD ) parameter: t p = 80 µs, T j, (spread) Drain current I D = f (T A ) parameter: GS 3 Safe operating area I D = f ( DS ) parameter: D = 0, T C = 25 C Semiconductor Group 6

7 Drain-source breakdown voltage (BR) DSS = b (BR)DSS (25 C) Semiconductor Group 7

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