GENERAL PURPOSE 6-PIN PHOTOTRANSISTOR OPTOCOUPLERS

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1 TIL TIL-M TIL7-M MOC800-M WHITE PACKAGE (-M SUFFIX) SCHEMATIC 2 3 NC 5 4 PIN. ANODE 2. CATHODE 3. NO CONNECTION 4. EMITTER 5. COLLECTOR. BASE BLACK PACKAGE (NO -M SUFFIX) DESCRIPTION The MOC800, TIL and TIL7 optocouplers consist of a gallium arsenide infrared emitting diode driving a silicon phototransistor in a -pin dual in-line package. FEATURES The TIL is also available in both black and white packages by specifying -M suffix, e.g. TIL-M for the white package and no suffix for the black package. UL recognized (File # E90700) VDE recognized (File # 947); (File #02497 for white package) - Add option V for white package (e.g., TILV-M) - Add option 300 for black package (e.g., TIL.300) APPLICATIONS Power supply regulators Digital logic inputs Microprocessor inputs Appliance sensor systems Industrial controls Page of 4 /5/05

2 TIL TIL-M TIL7-M MOC800-M ABSOLUTE MAXIMUM RATINGS (T A = 25 C unless otherwise specified) Parameter Device Symbol Value Units TOTAL DEVICE Storage Temperature All T STG -55 to +50 C Operating Temperature All T OPR -55 to +00 C Lead Solder Temperature All T SOL 20 for 0 sec C Total Device Power T A = 25 C Derate above 25 C EMITTER All P D 250 mw 3.3 (non-m) 2.94 (-M) mw/ C DC/Average Forward Input Current All I F 00 (non-m), 0 (-M) ma TIL/TIL-M 3 Reverse Input Voltage V R V MOC800-M/TIL7-M Forward Current - Peak (300µs, 2% Duty Cycle) All I F (pk) 3 A LED Power T A = 25 C Derate above 25 C DETECTOR All P D 50 (non-m), 20 (-M) mw 2.0 (non-m),.4 (-M) mw/ C Collector-Emitter Voltage All V CEO 30 V Collector-Base Voltage All V CBO 70 V Emitter-Collector Voltage TIL-M/TIL7-M V ECO 7 Emitter-Base Voltage All V EBO 7 V Detector Power T A = 25 C Derate above 25 C All P D 50 mw 2.0 (non-m),.7 (-M) mw/ C Page 2 of 4 /5/05

3 TIL TIL-M TIL7-M MOC800-M ELECTRICAL CHARACTERISTICS (T A = 25 C unless otherwise specified) INDIVIDUAL COMPONENT CHARACTERISTICS Parameter Test Conditions Device Symbol Min Typ* Max Unit EMITTER Input Forward Voltage (I F = ma) (T A = 25 C) TIL/TIL-M.2.4 (I F = 0 ma; for (T A = 0-70 C).2.4 MOC800-M) V (T MOC800-M/ F A = -55 C).32 (I F = ma; for TIL7-M V TIL7-M) (T A = +00 C).0 Reverse Leakage Current DETECTOR (V R = 3.0 V) TIL/TIL-M/ TIL7-M I R µa (V R =.0V) MOC800-M µa Collector-Emitter Breakdown Voltage (I C =.0 ma, I F = 0) All BV CEO V Collector-Base Breakdown Voltage (I C = 0 µa, I F = 0) All BV CBO V Emitter-Base Breakdown Voltage (I E = 0 µa, I F = 0) All BV EBO 7 0 V Emitter-Collector Breakdown Voltage (I F = 00µA, I F = 0) Collector-Emitter Dark Current TIL-M TIL7-M BV ECO 7 0 V (V CE = 0 V, I F = 0) TIL/TIL-M/ TIL7-M I CEO 50 na (V CE = 5V, T A = 25 C) MOC800-M I CEO na (V CE = 30 V, I F = 0, T A = 70 C) TIL7-M/ MOC800-M I CEO 50 µa TIL/TIL-M/ (V CB = 0 V) I Collector-Base Dark Current TIL7-M CBO 20 na (V CB = 5 V) MOC800-M I CBO 0 na Capacitance (V CE = 0 V, f = MHz) All C CE 8 pf ISOLATION CHARACTERISTICS Characteristic Test Conditions Symbol Min Typ* Max Units (Non -M, Black Package) (f = 0 Hz, t = min) 5300 Vac(rms) Input-Output Isolation Voltage V ISO ( -M, White Package) (f = 0 Hz, t = sec) 7500 Vac(pk) Isolation Resistance (V I-O = 500 VDC) R ISO 0 Ω Isolation Capacitance (V I-O = 0, f = MHz) C ISO 2 pf Note * Typical values at T A = 25 C unless otherwise noted Page 3 of 4 /5/05

4 TIL TIL-M TIL7-M MOC800-M TRANSFER CHARACTERISTICS (T A = 25 C Unless otherwise specified.) DC Characteristic Test Conditions Symbol Device Min Typ* Max Unit Current Transfer Ratio, Collector to Emitter On-State Collector Current (Phototransistor Operation) On-State Collector Current (Photodiode Operation) Collector-Emitter Saturation Voltage AC Characteristic * Typical values at T A = 25 C (I F = 0 ma, V CE = 0 V) TIL7-M 50 % (I F = ma, V CE = 5 V) CTR CE 50 MOC800-M % (I F = ma, V CE = 5 V, T A = 0 to +70 C) 30 (I F = ma, V CE = V) 2 ma TIL I C(ON) TIL-M (I F = ma, V CB = V) 7 µa (I C = 500 µa, I F = 0 ma) TIL7-M (I C = 2 ma, I F = ma) V CE (SAT) TIL TIL-M (I C = 00 µa, I F = ma) MOC800-M 0.5 Turn-On Time MOC800-M 20 T ON TIL7-M 0 Turn-Off Time (I C = 2 ma, V CC = 0 V, MOC800-M 20 T R L = 00Ω) (Fig. 20) OFF TIL7-M 0 Rise Time t r MOC800-M 2 Fall Time t f TIL7-M 2 Rise Time (Phototransistor Operation) (I C(ON) = 2 ma, V CC = 0 V, Fall Time R L = 00Ω) (Fig. 20) (Phototransistor Operation) t r t f TIL TIL-M V µs µs µs 0 µs Page 4 of 4 /5/05

5 NORMALIZED CTR NORMALIZED CTR NORMALIZED CTR NORMALIZED CTR GENERAL PURPOSE -PIN TIL TIL-M TIL7-M MOC800-M TYPICAL PERFORMANCE CURVES Fig. LED Forward Voltage vs. Forward Current Fig. 2 LED Forward Voltage vs. Forward Current VF - FORWARD VOLTAGE (V) T A = -55 C TA = 25 C VF - FORWARD VOLTAGE (V) TA = -55 C T A = 25 C. TA = 00 C. T A = 00 C I F - LED FORWARD CURRENT (ma) I F - LED FORWARD CURRENT (ma) Fig.3 Normalized CTR vs. Forward Current Fig.4 Normalized CTR vs. Forward Current.4.2 VCE = 5.0V TA = 25 C Normalized to IF = 0 ma..4 VCE = 5.0V TA = 25 C Normalized to IF = 0 ma I F - FORWARD CURRENT (ma) I F - FORWARD CURRENT (ma) Fig. 5 Normalized CTR vs. Ambient Temperature Fig. Normalized CTR vs. Ambient Temperature..4.4 I F = 5 ma.2 I F = 5 ma.2.0 IF = 0 ma IF = 0 ma.0 0. I F = 20 ma 0. Normalized to IF = 0 ma TA = 25 C I F = 20 ma Normalized to IF = 0 ma TA = 25 C T A - AMBIENT TEMPERATURE ( C) T A - AMBIENT TEMPERATURE ( C) Page 5 of 4 /5/05

6 TIL TIL-M TIL7-M MOC800-M NORMALIZED CTR ( CTRRBE / CTRRBE(OPEN)) Fig. 7 CTR vs. RBE (Unsaturated) IF = 20 ma IF = 0 ma IF = 5 ma V CE= 5.0 V Fig. 8 CTR vs. RBE (Unsaturated) R BE- BASE RESISTANCE (kω) R BE- BASE RESISTANCE (kω) NORMALIZED CTR ( CTRRBE / CTRRBE(OPEN)) I F = 20 ma IF = 0 ma IF = 5 ma VCE= 5.0 V Fig. 9 CTR vs. RBE (Saturated) Fig. 0 CTR vs. RBE (Saturated).0.0 NORMALIZED CTR ( CTRRBE / CTRRBE(OPEN)) IF = 20 ma I F = 0 ma IF = 5 ma VCE= 0.3 V NORMALIZED CTR ( CTRRBE / CTRRBE(OPEN)) I F = 20 ma IF = 0 ma IF = 5 ma V CE= 0.3 V R BE- BASE RESISTANCE (k Ω) R BE- BASE RESISTANCE (k Ω) Fig. Collector-Emitter Saturation Voltage vs Collector Current Fig. 2 Collector-Emitter Saturation Voltage vs Collector Current VCE (SAT) - COLLECTOR-EMITTER SATURATION VOLTAGE (V) I F = 5 ma I F = 2.5 ma IF = 0 ma I C - COLLECTOR CURRENT (ma) IF = 20 ma TA = 25 C VCE (SAT) - COLLECTOR-EMITTER SATURATION VOLTAGE (V) TA = 25 C I F = 5 ma I F = 2.5 ma I F = 0 ma I F = 20 ma I C - COLLECTOR CURRENT (ma) Page of 4 /5/05

7 SWITCHING SPEED - (µs) SWITCHING SPEED - (µs) GENERAL PURPOSE -PIN TIL TIL-M TIL7-M MOC800-M Fig. 3 Switching Speed vs. Load Resistor Fig. 4 Switching Speed vs. Load Resistor I F = 0 ma V CC = 0 V TA = 25 C I F = 0 ma VCC = 0 V TA = 25 C T off T f 0 Toff T f Ton Ton Tr T r R-LOAD RESISTOR (kω) R-LOAD RESISTOR (kω) Fig. 5 Normalized t on vs. R BE Fig. Normalized t on vs. R BE NORMALIZED ton - (ton(r BE) / ton(open)) VCC = 0 V IC = 2 ma RL = 00 Ω NORMALIZED ton - (ton(r BE) / ton(open)) VCC = 0 V IC = 2 ma RL = 00 Ω R BE- BASE RESISTANCE (k Ω) R BE- BASE RESISTANCE (k Ω) Fig. 7 Normalized t off vs. R BE Fig. 8 Normalized t off vs. R BE NORMALIZED toff - (toff(r BE) / toff(open)) VCC = 0 V IC = 2 ma RL = 00 Ω NORMALIZED toff - (toff(r BE) / toff(open)) VCC = 0 V IC = 2 ma RL = 00 Ω R BE- BASE RESISTANCE (k Ω) R BE- BASE RESISTANCE (k Ω) Page 7 of 4 /5/05

8 I CEO - COLLECTOR -EMITTER DARK CURRENT (na) GENERAL PURPOSE -PIN TIL TIL-M TIL7-M MOC800-M Fig. 9 Dark Current vs. Ambient Temperature V CE = 0 V T A = 25 C T A - AMBIENT TEMPERATURE ( C) TEST CIRCUIT WAVE FORMS I F V CC = 0V I C R L INPUT PULSE INPUT R BE OUTPUT 0% 90% t r t f OUTPUT PULSE Adjust I F to produce IC = 2 ma t on t off Figure 20. Switching Time Test Circuit and Waveforms Page 8 of 4 /5/05

9 TIL TIL-M TIL7-M MOC800-M White Package (-M Suffix) Package Dimensions (Through Hole) Package Dimensions (Surface Mount) (8.89) (8.3) (8.89) (8.3) Pin ID 0 (.0) 40 (.0) Pin ID 0 (.0) 40 (.0) (9.90) (8.43) SEATING PLANE (.77) (.02) 00 (5.08) 0.5 (2.93) 0.04 (0.3) 0.00 (5) (8.3) Seating Plane (.77) (.02) 00 (5.08) 0.5 (2.93) 0.04 (0.3) 0.00 (5) 0.02 (0.30) (0) (8.3) 0.00 (2.54) 0.05 (0.38) (0.50) 0.0 () 0.00 (2.54) (0.30) (0.3) (0.5) (0.50) 0.0 () 0.00 [2.54] (8) 0.02 (0.30) Package Dimensions ( Lead Spacing) (8.89) (8.3) PIN ID Recommended Pad Layout for Surface Mount Leadform (.78) 0 (.0) 40 (.0) 0.00 (.52) SEATING PLANE (.77) (.02) 00 (5.08) 0.5 (2.93) 0.04 (0.3) 0.00 (5) 25 (0.79) (7.75) 0.00 (2.54) (0.7) 0.00 (2.54) 0.05 (0.38) (0.50) 0.0 () 0.00 [2.54] 0.02 (0.30) () 25 (0) 00 (0.) NOTE All dimensions are in inches (millimeters) Page 9 of 4 /5/05

10 TIL TIL-M TIL7-M MOC800-M Black Package (No -M Suffix) Package Dimensions (Through Hole) Package Dimensions (Surface Mount) PIN ID (8.89) (8.38) 70 (.8) 40 (.0) 3 2 PIN ID. 70 (.8) 40 (.0) SEATING PLANE (.78) (.4) (8.89) (8.38) (.78) (.4) (7.2) TYP 00 (5.08) 0.5 (2.92) 00 (5.08) 0.5 (4.8) 0.0 () (0) 0.54 (3.90) 0.00 (2.54) (0.5) 0.0 () 0.00 (2.54) TYP (0.5) MIN 0.0 (0) (0) 0 to (7.2) TYP (0.5) 0.0 () (0.5) MIN 0.00 (2.54) TYP Lead Coplanarity : (0.0) MAX 0.0 (0) MIN 0.35 (8.00) MIN 05 (0.30) MAX Package Dimensions ( Lead Spacing) Recommended Pad Layout for Surface Mount Leadform PIN ID 70 (.8) 40 (.0) (.78) 0.00 (.52) SEATING PLANE 00 (5.08) 0.35 (3.43) (8.89) (8.38) (.78) (.4) 5 (0.54) 95 (7.49) 0.00 (2.54) (0.7) 0.54 (3.90) 0.00 (2.54) (0.0) MIN 0.0 (0) (0) (0.5) 0.0 () 0.00 (2.54) TYP 00 (0.) TYP 0 to 5 NOTE All dimensions are in inches (millimeters) Page 0 of 4 /5/05

11 TIL TIL-M TIL7-M MOC800-M ORDERING INFORMATION Order Entry Identifier Black Package (No Suffix) White Package (-M Suffix) Option.S S Surface Mount Lead Bend.SD SR2 Surface Mount; Tape and reel.w T " Lead Spacing.300 V VDE W TV VDE 0884, " Lead Spacing.3S SV VDE 0884, Surface Mount.3SD SR2V VDE 0884, Surface Mount, Tape & Reel MARKING INFORMATION TIL 2 TIL 2 V XX YY K V X YY Q Black Package, No Suffix White Package, -M Suffix Definitions Fairchild logo 2 Device number VDE mark (Note: Only appears on parts ordered with VDE 3 option See order entry table) One or two digit year code 4 Two digits for black package parts, e.g., 03 One digit for white package parts, e.g., 3 5 Two digit work week ranging from 0 to 53 Assembly package code *Note Parts built in the white package (M suffix) that do not have the V option (see definition 3 above) that are marked with date code 325 or earlier are marked in the portrait format. Page of 4 /5/05

12 TIL TIL-M TIL7-M MOC800-M Carrier Tape Specifications (Black Package, No Suffix) 4.85 ± ± ± ± ± 0. Ø.55 ± ± ± 7.5 ± 0..0 ± ± 0 0. MAX 0.30 ± 0 Ø. ± 0. User Direction of Feed Carrier Tape Specifications (White Package, -M Suffix) 4.5 ± ± ± ± ± 0.05 Ø.5 MIN.75 ± ± 0..5 ± ± ± 0 0. MAX 0. ± 0 Ø.5 ± 0./-0 User Direction of Feed Page 2 of 4 /5/05

13 TIL TIL-M TIL7-M MOC800-M Reflow Profile (White Package, -M Suffix) C C/Sec Ramp up rate 33 Sec Time (s) 20 C Time above 83 C = 90 Sec >245 C = 42 Sec 30 Reflow Profile (Black Package, No Suffix) Temperature ( C) C, 0 30 s 225 C peak Time above 83 C, 0 50 sec Ramp up = 3C/sec Peak reflow temperature: 225 C (package surface temperature) Time of temperature higher than 83 C for 0 50 seconds One time soldering reflow is recommended Time (Minute) Page 3 of 4 /5/05

14 TIL TIL-M TIL7-M MOC800-M DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. Page 4 of 4 /5/05

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