PHOTODARLINGTON OPTOCOUPLERS

Transcription

1 DESCRIPTION The CNX48U, HBX, and TIL3 have a gallium arsenide infrared emitter optically coupled to a silicon planar photodarlington. CNX48U HB HB2 HB255 HB3 TIL3 FEATURES High sensitivity to low input drive current Meets or exceeds all JEDEC Registered Specifications VDE 0884 approval available as a test option -add option.300. (e.g., HB.300) SCHEMATIC APPLICATIONS Low power logic circuits Telecommunications equipment Portable electronics Solid state relays Interfacing coupling systems of different potentials and impedances. ANODE CATHODE 2 N/C 3 BASE 5 COLLECTOR 4 EMITTER Parameter Symbol Device Value Units TOTAL DEVICE Storage Temperature T STG All -55 to +50 C Operating Temperature T OPR All -55 to +00 C Lead Solder Temperature T SOL All 20 for 0 sec C Total Device Power T A = 25 C 250 mw P D All Derate above 25 C 3.3 mw/ C EMITTER Continuous Forward Current I F All 00 ma Reverse Voltage V R All V Forward Current - Peak (300 µs, 2% Duty Cycle) I F (pk) All 3.0 A LED Power T A = 25 C 00 mw P D All Derate above 25 C.8 mw/ C DETECTOR CNX48U, TIL3 30 Collector-Emitter Breakdown Voltage HB, HB2 25 BV CEO HB3 V HB CNX48U, HB HB2, HB3 30 V Collector-Base Breakdown Voltage BV CBO TIL3 HB V Emitter-Collector Breakdown Voltage BV ECO All 7 V Detector Power T A = 25 C 50 mw P D All Derate above 25 C 2.0 mw/ C // A

2 CNX48U HB HB2 HB255 HB3 TIL3 ELECTRICAL CHARACTERISTICS (T A = 25 C Unless otherwise specified.) INDIVIDUAL COMPONENT CHARACTERISTICS Parameter Test Conditions Symbol Device Min Typ** Max Unit EMITTER (I F = 0 ma) HB, HB2 HB TIL3 Input Forward Voltage V (I F F = 0 ma) CNX48U.2.3 (I F = 0 ma, T A = -55 C) (I F = 0 ma, T A = 00 C) (I F = 50 ma) HB Reverse Leakage Current (V R = V) I R All µa Capacitance (V F = 0 V, f =.0 MHz) C All 50 pf DETECTOR Collector-Emitter (I C = ma, I F = 0) CNX48U (I C = 00 µa, I F = 0) Breakdown Voltage (I C = 0 ma, I F = 0) Collector-Base Breakdown Voltage Emitter-Collector Breakdown Voltage Collector-Emitter Dark Current Note ** Typical values at T A = 25 C BV CEO TIL3 HB, HB2 HB3 (I C = 00 µa, I F = 0) HB255 (I C = ma, I F = 0) CNX48U, HB (I C = 00 µa, I E = 0) HB2, HB (I C = 00 µa, I F = 0) BV CBO TIL3 V HB (I E = 00 µa, I B = 0) BV ECO All 7 0 V (V CE = 0 V, Base Open) I CEO All 00 na V V // A

3 CNX48U HB HB2 HB255 HB3 TIL3 TRANSFER CHARACTERISTICS (T A = 25 C Unless otherwise specified.) DC Characteristics Test Conditions Symbol Device Min Typ** Max Units (I F = 0 ma, V CE = 5 V) 50 (500) HB255 0 (00) CNX48U 0 (00) (I F = 0 ma, V CE = V) Collector Output TIL3 30 (300) Current () I C (CTR) HB 5 (500) ma (%) (I F = ma, V CE = 5 V) HB2 2 (200) HB3 (00) (I F = ma, V CE = V) 5 (500) CNX48U (I F = 0.5 ma, V CE = V).75 (350) (I F = ma, I C = ma) HB, HB2 HB3, Saturation Voltage (I F = 5 ma, I C = 0 ma) V CE(sat) CNX48U.0 V AC Characteristics Switching Times (I F = 50 ma, I C = 50 ma) HB255.0 (I F = 8 ma, I C = 2 ma) TIL3.25 HB t (I on C = 0 ma, V CE = 0 V) HB2 (R L = 00 ) (Fig.7) t off HB255 HB3 (I F = 0 ma, V CC = 5 V) t on 3.5 (R E = 00 ), (R BE = M ) (Fig. 8) t off 3 (I F = ma, V CC = 5 V) t on CNX48U 70 (R E = k ), (R BE = 0M ) (Fig. 8) t off 90 (I F = 5 ma, V CC = 0 V) t on 3.5 (R L = 00 ) (Fig.7) t off 25 (I F = 200 ma, I C = 50 ma) t on (V CC = 0 V) (R L = 00 ) TIL3 (Fig.7) t off µs ISOLATION CHARACTERISTICS Characteristic Test Conditions Symbol Min Typ** Max Units Input-Output Isolation Voltage (2) (I I-O µa, Vrms, t = min.) 5300 Vac(rms) Isolation Resistance (2) (V I-O = 500 VDC) R ISO 0 Isolation Capacitance (2) (V I-O =, f = MHz) C ISO 0.8 pf Note ** Typical values at T A = 25 C // A

4 Fig. 3 Collector Current vs. Collector-Emitter Voltage IC - COLLECTOR CURRENT (NORMALIZED) CTR - CURRENT TRANSFER RATIO (NORMALIZED) CTR - CURRENT TRANSFER RATIO (NORMALIZED) PHOTODARLINGTON OPTOCOUPLERS CNX48U HB HB2 HB255 HB3 TIL3 Fig. Output Current vs. Input Current Fig. 2 Current Transfer Ratio vs. Ambient Temperature 0 T A = 0 C, 25 C T A = 70 C T A = 00 C T A = -55 C NORMALIZED TO: I F = 0 ma T A = 25 C V CE = 5 V I F - LED INPUT CURRENT (ma) NORMALIZED TO: I F = 0 ma T A = 25 C V CE = 0 V T A - AMBIENT TEMPERATURE ( C) NORMALIZED TO: I F = ma V CE = 5 V I F = 0 ma I F = 5 ma I F = 2 ma I F = ma V CE - COLLECTOR -EMITTER VOLTAGE (V) ICEO - COLLECTOR-EMITTER DARK CURRENT (na) Fig. 4 Dark Current vs. Ambient Temperature V CE = 0 V T A - AMBIENT TEMPERATURE ( C) 000 Fig. 5 Turn-On Time vs. Input Current 000 Fig. Turn-Off Time vs. Input Current R L = k TON - TIME (µs) 00 0 R L = 00 R L = 0 VCC = 0 V TOFF - TIME (µs) 00 0 R L = k R L = 00 R L = I F - LED INPUT CURRENT (ma) VCC = 0 V I F - LED INPUT CURRENT (ma) // A

5 ICAL ELECTRO-OPTICAL CHARACTERISTIC CURVES (25 C Free air temperature unless otherwise specified) (Cont.) CNX48U HB HB2 HB255 HB3 TIL3 VCC INPUT RL INPUT RIN PULSE OUTPUT OUTPUT 0% 5 V 90%.5 V t on t off IF Test Circuit (All devices except CNX48U) Switching Waveforms (All devices except CNX48U) Fig. 7 Switching Time Test Circuit and Waveforms (All devices except CNX48U) VCC INPUT INPUT 50 RBE 90% OUTPUT 0% RE t on t off Test Circuit (CNX48U only) Switching Waveforms (CNX48U only) Fig. 8 Switching Time Test Circuit and Waveforms (CNX48U only) Notes. The current transfer ratio(i C /I F ) is the ratio of the detector collector current to the LED input current with V 0 V. 2. For this test, LED pins and 2 are common and phototransistor pins 4,5 and are common. // A

6 CNX48U HB HB2 HB255 HB3 TIL3 Package Dimensions (Through Hole) Package Dimensions (Surface Mount) PIN ID (8.89) (8.38) (.8) (.0) 3 2 PIN ID (.8) (.0) SEATING PLANE (.78) (.4) (8.89) (8.38) (.78) (.4) (7.2) (5.08) 0.5 (2.92) (5.08) 0.5 (4.8) 0.0 (0.4) (0.20) 0.54 (3.90) 0.00 (2.54) (0.5) 0.0 (0.4) (0.5) MIN 0.0 (0.40) (0.20) 0 to (7.2) (0.5) 0.0 (0.4) (0.5) MIN 0.00 (2.54) 0.0 (0.40) MIN 0.35 (8.00) MIN (0.30) MAX 0.00 (2.54) Lead Coplanarity : (0.0) MAX Package Dimensions (0.4 Lead Spacing) Recommended Pad Layout for Surface Mount Leadform (.8) (.0) (.78) 0.00 (.52) (8.89) (8.38) 0.45 (0.54) 0.00 (2.54) SEATING PLANE (5.08) 0.5 (2.92) (.78) (.4) (7.49) (0.7) 0.54 (3.90) 0.00 (2.54) (0.0) MIN 0.0 (0.40) (0.20) (0.5) 0.0 (0.4) 0.00 (2.54) (0.) 0 to 5 NOTE All dimensions are in inches (millimeters) // A

7 ORDERING INFORMATION CNX48U HB HB2 HB255 HB3 TIL3 Option Order Entry Identifier Description S.S Surface Mount Lead Bend SD.SD Surface Mount; Tape and reel W.W 0.4 Lead Spacing VDE W.300W VDE 0884, 0.4 Lead Spacing 3S.3S VDE 0884, Surface Mount 3SD.3SD VDE 0884, Surface Mount, Tape & Reel QT Carrier Tape Specifications ( D Taping Orientation) 4.85 ± ± ± ± ± 0. Ø.55 ± ± ± ± ± 0..0 ± MAX 0.30 ± 0.20 Ø. ± 0. User Direction of Feed NOTE All dimensions are millimeters // A

8 DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. LIFE SUPPORT POLICY FAIRCHILD S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein:. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body, or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness Fairchild Semiconductor Corporation // A