74HC540; 74HCT540. Octal buffer/line driver; 3-state; inverting

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1 Rev January 2013 Product data sheet 1. General description 2. Features and benefits 3. Ordering information The is an 8-bit inverting buffer/line driver with 3-state outputs. The device features two output enables (OE1 and OE2). HIGH on OEn causes the outputs to assume a high-impedance OFF-state. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of V CC. Inverting outputs Complies with JEDEC standard no. 7 Input levels: For 74HC540: CMOS level For 74HCT540: TTL level ESD protection: HBM JESD22-114F exceeds 2000 V MM JESD exceeds 200 V Multiple package options Specified from 40 C to +85 C and from 40 C to +125 C Table 1. Ordering information Type number Package Temperature range Name Description Version 74HC540N 40 C to+125c DIP20 plastic dual in-line package; 20 leads (300 mil) SOT HCT540N 74HC540D 40 C to +125 C SO20 plastic small outline package; 20 leads; SOT HCT540D 74HC540DB 74HCT540DB 40 C to+125c SSOP20 body width 7.5 mm plastic shrink small outline package; 20 leads; body width 5.3 mm SOT339-1

2 4. Functional diagram Fig 1. Logic symbol Fig 2. IEC logic symbol Product data sheet Rev January of 18

3 Fig 3. Functional diagram Product data sheet Rev January of 18

4 Fig 4. Logic diagram Product data sheet Rev January of 18

5 5. Pinning information 5.1 Pinning Fig 5. Pin configuration DIP20, SO20 and SSOP Pin description Table 2. Pin description Symbol Pin Description OE1 1 output enable input (active LOW) 0 to 7 2, 3, 4, 5, 6, 7, 8, 9 data input GND 10 ground (0 V) Y0 to Y7 18, 17, 16, 15, 14, 13, 12, 11 data output OE2 19 output enable input (active LOW) V CC 20 supply voltage 6. Functional description Table 3. Functional table [1] Control Input Output OE1 OE2 n Yn L L L H L L H L X H X Z H X X Z [1] H = HIGH voltage level; L = LOW voltage level; X = don t care; Z = high-impedance OFF-state. Product data sheet Rev January of 18

6 7. Limiting values Table 4. Limiting values In accordance with the bsolute Maximum Rating System (IEC 60134). Voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions Min Max Unit V CC supply voltage V I IK input clamping current V I < 0.5 V or V I >V CC +0.5 V [1] - 20 m I OK output clamping current V O < 0.5 V or V O >V CC +0.5V [1] - 20 m I O output current 0.5 V < V O < V CC +0.5V - 35 m I CC supply current - 70 m I GND ground current 70 - m T stg storage temperature C P tot total power dissipation [2] DIP mw SO20, SSOP mw [1] The input and output voltage ratings may be exceeded if the input and output current ratings are observed. [2] For DIP20 packages: above 70 C the value of P tot derates linearly with 12 mw/k. For SO20 packages: above 70 C the value of P tot derates linearly with 8 mw/k. For SSOP20 packages: above 60 C the value of P tot derates linearly with 5.5 mw/k. 8. Recommended operating conditions Table 5. Recommended operating conditions Voltages are referenced to GND (ground = 0 V) Symbol Parameter Conditions 74HC540 74HCT540 Unit Min Typ Max Min Typ Max V CC supply voltage V V I input voltage 0 - V CC 0 - V CC V V O output voltage 0 - V CC 0 - V CC V T amb ambient temperature C t/v input transition rise and fall rate V CC = 2.0 V ns/v V CC = 4.5 V ns/v V CC = 6.0 V ns/v Product data sheet Rev January of 18

7 9. Static characteristics Table 6. Static characteristics t recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions T amb = 25 C T amb = 40 C to +85 C T amb = 40 C to +125 C Unit Min Typ Max Min Max Min Max 74HC540 V IH HIGH-level V CC = 2.0 V V input voltage V CC = 4.5 V V V CC = 6.0 V V V IL LOW-level V CC = 2.0 V V input voltage V CC = 4.5 V V V CC = 6.0 V V V OH HIGH-level output voltage V I =V IH or V IL I O = 20 ; V CC = 2.0 V V I O = 20 ; V CC = 4.5 V V I O = 20 ; V CC = 6.0 V V I O = 6.0 m; V CC = 4.5 V V I O = 7.8 m; V CC = 6.0 V V V OL LOW-level output voltage V I =V IH or V IL I O = 20 ; V CC = 2.0 V V I O = 20 ; V CC = 4.5 V V I O = 20 ; V CC = 6.0 V V I O = 6.0 m; V CC = 4.5 V V I O = 7.8 m; V CC = 6.0 V V I I input leakage V I = V CC or GND; V CC =6.0V current I OZ OFF-state per input pin; V I =V IH or V IL ; output current V O =V CC or GND; other inputs at V CC or GND; V CC =6.0V; I O =0 I CC supply current V I = V CC or GND; I O =0; V CC =6.0V C I input capacitance pf 74HCT540 V IH HIGH-level V CC = 4.5 V to 5.5 V V input voltage V IL LOW-level V CC = 4.5 V to 5.5 V V input voltage V OH HIGH-level output voltage V I =V IH or V IL ; V CC = 4.5 V I O = V I O = 6.0 m V Product data sheet Rev January of 18

8 Table 6. Static characteristics continued t recommended operating conditions; voltages are referenced to GND (ground = 0 V). Symbol Parameter Conditions T amb = 25 C T amb = 40 C T amb = 40 C Unit to +85 C to +125 C Min Typ Max Min Max Min Max V OL LOW-level V I =V IH or V IL ; V CC = 4.5 V output voltage I O = 20 ; V I O = 6.0 m; V V I = V CC or GND; V CC =5.5V I I I OZ input leakage current OFF-state output current per input pin; V I =V IH or V IL ; V O =V CC or GND; other inputs at V CC or GND; V CC =5.5V; I O =0 I CC supply current V I =V CC or GND; I O = 0 ; V CC =5.5V I CC C I additional supply current input capacitance 10. Dynamic characteristics per input pin; I O =0; V I =V CC 2.1 V; other inputs at V CC or GND; V CC = 4.5 V to 5.5 V n input OE1 input OE2 input pf Table 7. Dynamic characteristics GND = 0 V; C L = 50 pf; for test circuit see Figure 8. Symbol Parameter Conditions T amb = 25 C T amb = 40 C to +125 C Unit Min Typ Max Max (85 C) Max (125 C) 74HC540 t pd propagation delay n to Yn; see Figure 6 [1] V CC = 2.0 V ns V CC = 4.5 V ns V CC = 5.0 V; C L =15pF ns V CC = 6.0 V ns t en enable time OEn to Yn; see Figure 7 [1] V CC = 2.0 V ns V CC = 4.5 V ns V CC = 6.0 V ns t dis disable time OEn to Yn; see Figure 7 [1] V CC = 2.0 V ns V CC = 4.5 V ns V CC = 6.0 V ns Product data sheet Rev January of 18

9 Table 7. Dynamic characteristics GND = 0 V; C L = 50 pf; for test circuit see Figure 8. Symbol Parameter Conditions T amb = 25 C T amb = 40 C to +125 C Unit Min Typ Max Max (85 C) Max (125 C) t t transition time see Figure 6 [2] V CC = 2.0 V ns V CC = 4.5 V ns V CC = 6.0 V ns C PD power dissipation capacitance per package; V I =GNDtoV CC [3] pf 74HCT540 t pd propagation delay n to Yn; see Figure 6 [1] V CC = 4.5 V ns V CC = 5.0 V; C L =15pF ns t en enable time OEn to Yn; see Figure 7 [1] V CC = 4.5 V ns t dis disable time OEn to Yn; see Figure 7 [1] V CC = 4.5 V ns t t transition time V CC = 4.5 V; see Figure 6 [2] ns C PD power dissipation capacitance per package; V I =GNDtoV CC 1.5 V [3] pf [1] t pd is the same as t PLH and t PHL. t en is the same as t PZL and t PZH. t dis is the same as t PLZ and t PHZ. [2] t t is the same as t THL and t TLH. [3] C PD is used to determine the dynamic power dissipation (P D in W): P D =C PD V CC 2 f i N+ (C L V CC 2 f o ) where: f i = input frequency in MHz; f o = output frequency in MHz; C L = output load capacitance in pf; V CC = supply voltage in V; N = number of inputs switching; (C L V 2 CC f o ) = sum of outputs. Product data sheet Rev January of 18

10 11. Waveforms Fig 6. Measurement points are given in Table 8. V OL and V OH are typical voltage output levels that occur with the output load. Input to output propagation delays Fig 7. Measurement points are given in Table 8. V OL and V OH are typical voltage output levels that occur with the output load. 3-state enable and disable times Table 8. Measurement points Type Input Output V M V M V X V Y 74HC V CC 0.5V CC 0.1V CC 0.9V CC 74HCT V 1.3 V 0.1V CC 0.9V CC Product data sheet Rev January of 18

11 V I negative pulse 0 V 90 % V M 10 % t W V M t f t r t r t f V I positive pulse 0 V 10 % 90 % V M t W V M V CC V CC G VI DUT VO RL S1 open RT CL 001aad983 Fig 8. Test data is given in Table 9. Definitions test circuit: R T = Termination resistance should be equal to output impedance Z o of the pulse generator C L = Load capacitance including jig and probe capacitance R L = Load resistance S1 = Test selection switch Test circuit for measuring switching times Table 9. Test data Type Input Load S1 position V I t r, t f C L R L t PHL, t PLH t PZH, t PHZ t PZL, t PLZ 74HC540 V CC 6ns 15pF, 50 pf 1k open GND V CC 74HCT540 3 V 6 ns 15 pf, 50 pf 1 k open GND V CC Product data sheet Rev January of 18

12 12. Package outline DIP20: plastic dual in-line package; 20 leads (300 mil) SOT146-1 D M E seating plane 2 L 1 Z 20 e b b 1 11 w M c (e ) 1 M H pin 1 index E mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches max. 1 2 (1) (1) min. max. b b 1 c D E e e 1 L M E M H w (1) Z max Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC JEIT EUROPEN PROJECTION ISSUE DTE SOT146-1 MS-001 SC Fig 9. Package outline SOT146-1 (DIP20) Product data sheet Rev January of 18

13 SO20: plastic small outline package; 20 leads; body width 7.5 mm SOT163-1 D E X c y H E v M Z Q 2 1 ( ) 3 pin 1 index L p L θ 1 e b p 10 w M detail X mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches max b p c D (1) E (1) e H (1) E L L p Q v w y Z Note 1. Plastic or metal protrusions of 0.15 mm (0.006 inch) maximum per side are not included θ o 8 o OUTLINE VERSION REFERENCES IEC JEDEC JEIT EUROPEN PROJECTION ISSUE DTE SOT E04 MS Fig 10. Package outline SOT163-1 (SO20) Product data sheet Rev January of 18

14 SSOP20: plastic shrink small outline package; 20 leads; body width 5.3 mm SOT339-1 D E X c y H E v M Z Q pin 1 index 2 1 ( ) 3 θ L p L 1 10 detail X e b p w M mm scale DIMENSIONS (mm are the original dimensions) UNIT b p c D (1) E (1) e H E L L p Q v w y Z (1) max mm θ o 8 o 0 Note 1. Plastic or metal protrusions of 0.2 mm maximum per side are not included. OUTLINE VERSION REFERENCES IEC JEDEC JEIT SOT339-1 MO-150 EUROPEN PROJECTION ISSUE DTE Fig 11. Package outline SOT339-1 (SSOP20) Product data sheet Rev January of 18

15 13. bbreviations Table 10. cronym CMOS DUT ESD HBM LSTTL MM bbreviations Description Complementary Metal-Oxide Semiconductor Device Under Test ElectroStatic Discharge Human Body Model Low-power Schottky Transistor-Transistor Logic Machine Model 14. Revision history Table 11. Revision history Document ID Release date Data sheet status Change notice Supersedes 74HC_HCT540 v Product data sheet - 74HC_HCT540_CNV v.2 Modifications: The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. 74HC_HCT540_CNV v Product specification - - Product data sheet Rev January of 18

16 15. Legal information 15.1 Data sheet status Document status [1][2] Product status [3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term short data sheet is explained in section Definitions. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL Definitions Draft The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet short data sheet is an extract from a full data sheet with the same product type number(s) and title. short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet Disclaimers Limited warranty and liability Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer s own risk. pplications pplications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer s applications and products planned, as well as for the planned application and use of customer s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer s applications or products, or the application or use by customer s third party customer(s). Customer is responsible for doing all necessary testing for the customer s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer s third party customer(s). NXP does not accept any liability in this respect. Limiting values Stress above one or more limiting values (as defined in the bsolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Product data sheet Rev January of 18

17 Export control This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of non-automotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors specifications such use shall be solely at customer s own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors standard warranty and NXP Semiconductors product specifications Trademarks Notice: ll referenced brands, product names, service names and trademarks are the property of their respective owners. 16. Contact information For more information, please visit: For sales office addresses, please send an to: salesaddresses@nxp.com Product data sheet Rev January of 18

18 17. Contents 1 General description Features and benefits Ordering information Functional diagram Pinning information Pinning Pin description Functional description Limiting values Recommended operating conditions Static characteristics Dynamic characteristics Waveforms Package outline bbreviations Revision history Legal information Data sheet status Definitions Disclaimers Trademarks Contact information Contents Please be aware that important notices concerning this document and the product(s) described herein, have been included in section Legal information. NXP B.V ll rights reserved. For more information, please visit: For sales office addresses, please send an to: salesaddresses@nxp.com Date of release: 21 January 2013 Document identifier: 74HC_HCT540

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