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1 ionbeam.kigam.re.kr Ion Application Group

2 Project Schedule Major subjects Ion Analysis Setup of 1.7MV Tandem VDG Accelerator PIXE (Proton Induced X- ray Emission) RBS (Rutherford Backscattering Spectrometry)/Channeling NRA (Nuclear Reaction Analysis) PIGE (Proton Induced Gamma-ray Emission) ERD-TO (Elastic Recoil Detection by Time Of light) SPM (Scanning Proton Microprobe) Environmental Radioisotope Measurements Setup of Compact AMS System Radiocarbon Dating (Decay Counting) Natural Radioactivity Measurements in Soil & Ground Water Radiocarbon Monitoring from Nuclear Power Plant AMS (Accelerator Mass Spectrometry) Ion Material Modification Introduction of 5 kv Implantor Surface Modification of Polymers & Development of Proton LIGA Technique Modification of Semiconductor Devices by Ion Implantation Development of Microstructure abrication Technique using Ion Nanocrystal Synthesis by Heavy Ion Implantation & application to Nanophotonic devices Semiconductors Thin Layer Transfer by Ion-cut Process Nuclear Spectroscopy Neutron Capture CX Measurements Development of Industrial Digital Radiography for Nondestructive Imaging

3 1.7 MV Tandem VDG Accelerator & 5 kv Implanter Neutron Spectroscopy System Implantation Chamber R Ion Source Sputter Heavy Ion Source Buncher Tandem Accelerator Room Accelerator Tank Switching Magnet PIXE & Microprobe B/L TO-ARM(1) ERD TO-ARM(2) Heavy Ion RBS Accelerator Control Room Implanter Room

4 Ion Analysis (I) Particle Induced X-ray (γ-ray) Emission (PIXE & PIGE) Rutherford Backscattering Spectrometry (RBS)/channeling Elastic Recoil Detection (ERD) Nuclear Reaction Analysis (NRA) Scanning Nuclear Microscopy (SNM) Micro-PIXE, RBS Scanning Transmission Ion Microscopy (STIM) Ion Induced Charge (IBIC) Ion Induced Luminescence (IBIL) Secondary Electron Imaging (SEI) Accelerator Mass Spectrometry (AMS) Medium Energy Ion Scattering Spectrometry (MEIS) Charged Particle Activation Analysis (CPAA) in service, under contemplation, not in consideration Proton Induced X-ray X Emission Rutherford Backscattering Spectrometry (RBS) Backscattered Yield 6Å Ru Å TiN N Energy [kev] Ti Ru Ion Channeling Non-destructive analysis for solid samples Detectible elements : Mg ~ U Detection limits : ppm ~ sub ppm High sensitivity :1-12 g Analysis time : ~1 min. Micro beam & external beam systems can be applied. Counts Ca e Ti Mn Al P Cr Cu X-ray energy [kev] Detection limit Proton Induced Gamma-ray Emission Stereographic projection for a fcc () Counts Na 44 Al 843 Al Mg(+Al) (+Al) 1779 Na 1634 O 1982 Al MeV, USGS SCo Energy [MeV] Non-destructive analysis of solid samples High sensitivities in light elements detection (Li, Be, B, N, O, ) Detection limit Elements Li Be B Na Mg Al P S Cl K SCO Conceptual view of ion flight by artist (upper) & 3D contour of channeling /blocking image (lower) GaN epitaxy on sapphire

5 Y (μm) Y (μm) Y (μm) Ion Analysis (II) Elastic Recoil Detection (ERD)-Time Of light (TO) Scanning Nuclear Microprobe (SNM) SNM beamline SNM Chamber ocusing Lens Scanned Sample MeV proton from Accelerator Elemental Information By PIXE Internal Structure Revelation by Transmitted Ions (STIM) max. beam energy : 3 MeV H +, 5 MeV He ++ spatial resolution : 5 μm (.2 na) Mn-Nodule (Mn) Mn-Nodule () Mn-Nodule (Ti) Count Count Count X (μm) X (μm) X (μm) Elemental Mapping on Mn Nodule (5 μm x 5 μm scan size, 1 μm resolution)

6 Ion Material Modification Damaged region Incident ions Ion Material Modification Nuclear reaction products of p,n,α,γ (NRA, CPAA) Sputtered Particles (AMS, SIMS) orward Scattered Particles (Channeling, STIM) Backscattered Particles (RBS, MEIS) Secondary Electrons (SEI) Incident ions Ion Analysis X-ray, γ-ray Emission (PIXE, PIGE) Charge Pulse (IBIC) Recoiled Nuclei (ERD) Ion Engineering Semiconductors LOCOS (Local oxidation of ) N & P type well implants Poly-silicon (implantation + annealing) Defect gettering Buried layer SIMOX Defect formation (VCSEL laser) Life-time killing ( power diode) metals Corrosion & wear resistance enhancement (B,C,N,O, Ti, Zr ion implantation in steel and Al alloys) Tc increase in superconductors (N in Nb) Coloring of iron surface Neutron radiation damage simulation Ceramics & glasses luminescence characteristics change (Eu, Th, Cr, Ti in Ca2, Al2O3) Mechanical properties (C, N, O, Ti, Cu in C, AlN, 3N4...) Optical properties of glasses Inorganic optical waveguides (LiNbO3, KnbO3, BaTiO3) polymers Conducting polymers (EMI shield, electrode) Mechanical property (plastic gear, bearing) Biocompatibility of PS, PU Metal-polymer adhesion P-N junction formation Optical waveguides ion beam techniques applied, under consideration Micro & nanotechnology Proton-LIGA & MEMS Maskless (direct) micro-machining with microprobe Ion projection lithography Ion-cut technique Magnetic nanostructure patterning Nano-crystal synthesis (metallic, semiconductor & ferromagnetic NCs) ngle ion implantation Micro-Engineering using Ion Proton LIGA Technology Micro Gear Ion-cut Technology Ion implantation technology (precise definition of layer thickness) + Wafer Bonding technology (keeping the original quality) = Ion-cut SOI wafers Honey-comb Array Polymeric Micro-lens abrication proton beam SOI BOX SOI BOX BOX SOI IRRADIATION metal mask PMMA substrate -sub -sub DIUSION monomer vapour Nanocrystal Synthesis with Ion Implantation monomer UV illumination before annealing: gaussian profile crystal size increases in: - initial conc. (dose) - annealing temp. & time Average size red shift in PL POLYMERIZATION O 2 Waveguide Generation PMMA (2-SEC LD) LD SA MZ Modulator Bended WG super-saturated solid solution ion implantation NCs precipitate nano-crystals High temp. annealing CdS NCs Crystal size vs. anneal. Temp. Y-branch WG in PMMA Inorganic WG in PIC (by Ion Implantation)

7 Nuclear Spectroscopy ast neutron capture cross section measurement CW proton Deflector R Slit Pulsed proton R Buncher R Response & weight function Sample Pulsed neutron Ti- 3 H 1e-5 1e-6 1 MeV 2 MeV γ-ray R (I,E) 1e-7 8 MeV 9 MeV 1 MeV 1e Channel number g-counts W(I) 1e+6 1e+5 1e+4 a1= *1^-8 a2= a3= e+3 a4= a5= a6= W(E)=a1*x^.5+a2*x+a3*x^1.5+a4*x^2+a5*x^2.5+a6*x^3 1e I (channel) Elapsed time [ns] ns bunched beam with period of 125 ns & widths of 1~2 ns Available neutron flux : ~1 7 n/sr/s at o Available neutron energy : 1.5 ~2.6 MeV Inner Image scanning system for core samples Granite core Source Shale core with a crack PC control system Detector module Andesite core (picture) Andesite core (scan image) Sample transfer system Density variation of the andesite core

8 Accelerator Mass Spectrometry (I) Reduction line Ion Source Accelerator Analyzing Magnet ESA urnace Graphite surface Auto Sampler Gas Ionization Detector Trap Element Analyzer Control PC Heater unit made of silver 12C 14C Radioisotopes used in age dating proton 6 6 neutron 6 8 Isotope Half-life Producing rate (atoms ㆍ cm -1 ㆍ s -1 ) Natural abandance 3 H 12.3 yr kg 7 Be 53 days g 1 Be yr tons 1 stable 1-12 radioactive 14 C 573 yr tons 26 Al yr tons yr g 36 Cl yr tons 14C: produced by (n, p) reaction with thermal neutron at altitude 9 m (cross section : 1.7 ⅹ 1-24 cm 2 ) 41 Ca yr 129 I yr

9 Accelerator Mass Spectrometry (II) tree cut in 1999A.D. radiocarbon sampling transect 1821A.D. by ring-counting What you need: absolute age & radiocarbon age What you get: history of 14 C atmos A = Ae λt 4± 4 yrbp 1 cm Tombs of Acient Kings in Kyung-Joo where was the capital of Shilla Kingdom (2 C AD ~ 935 AD) O Left-coiled N. pachyderma; cold water indicator O Right-coiled N. pachyderma; warm water indicator Neogloboquadrina pachyderma(leftcoiled) Atmospheric CO 2 Concentration at Mauna Loa, Hawaii, from 197 to 21 (ppm) Atmospheric increase = Emissions from fossil fuels + Net emissions from changes in land use - Oceanic uptake - Missing carbon sink 3.2 (±.2) = 6.3 (±.4) (±.8) (±.7) (±1.1) Ice of Northpole

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