In search for the limits of
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1 In search for the limits of rotating cylindrical magnetron sputtering W. P. Leroy, S. Mahieu, R. De Gryse, D. Depla DRAFT Dept. Solid State Sciences Ghent University Belgium
2 Planar Magnetron Sputtering Major disadvantage = non uniform target erosion shorter campaign time more maintenance less target utilization ~45% Harold E. McKelvey 1982 : A rotatable magnetron sputtering apparatus 2
3 Rotating Cylindrical Magnetron Magnets N Cooling Water Target 3 Plasma Target (cylindrical tube) rotates around a stationary magnet system, introducing each time different segments of the target into the race-track
4 Benefits Drawbacks Scaling 4 The benefits of rotating cylindrical magnetrons Better target materials utilization (~80% - 90%) => Longer lifetime & Lower costs Better cooling efficiency allowing higher power densities and consequently higher deposition rates No or little variation in sputtering behaviour due to race track deepening Higher stability in reactive sputtering processes Reduced debris formation
5 Benefits Drawbacks Scaling The drawbacks of rotating cylindrical magnetrons Complexity of the equipment, which translates itself into cost. Almost always working in unbalanced mode Availability of targets sometimes a nightmare, requiring complex metallurgical techniques Not available on a laboratory scale, i.e. hardly any fundamental research 5 Large sizes for industry for increased substrate-sizes, and hence cost reduction
6 Benefits Drawbacks Scaling Industrial scale of rotating cylindrical magnetrons ~20cm diam. >2.5m long ~12cm diam >1.6m long 6
7 Benefits Drawbacks Scaling Small-scaled rotating cylindrical magnetron Down-scaling allows (affordable) fundamental research! changeable ISO-K 100 gear box to water cooling 7 20 cm target in vacuum chamber To power supply
8 Benefits Drawbacks Scaling Advantage for fundamental research on sputtering Rotating target Dynamic system where the sputtered target surface moves in and out of the racetrack Possible to analyze parts of the target surface, which just come out of the race track 8 Possible to analyze the evolution in time of the target surface Different processes come to light, which also occur for planar magnetrons!
9 9 A first example: influence of the rotation speed discharge voltage (V V) Reactive magnetron sputtering: hysteresis behavior (Al O) oxygen flow (sccm) 0.0 RPM 0.2 RPM 0.6 RPM 0.8 RPM 1.0 RPM 2.0 RPM 4 0 RPM 8.0 RPM 21 RPM 60 RPM Hysteresis shifts to lower oxygen flow on increasing the rotation speed D. Depla, J. Haemers, G. Buyle, R. De Gryse, J. Vac. Sci. Technol. Science A 24 (2006) 934
10 Influence of the rotation speed Differently plotted: the transition points for each rotation speed 10
11 The first attempt to model To the target Including : chemisorption knock on implantation The vacuum chamber direct ion implantation q o q t q p 11 dp k T q s To the substrate ( ) B = qo qp qt qs dt V + + To the pump q = P.S p
12 12 New experiments needed! Pre-sputtering a stationary target (Aluminium) in metallic mode and afterwards sputter cleaning in pure argon while rotating (and recording V d ) Discharge Voltage (V) Start sputtering cleaning 200 Time (s) pre-sputtering in metallic mode X.Y. Li, D. Depla, W.P. Leroy, J. Haemers, R. De Gryse, J. Phys. D: Appl. Phys. 41 (2008)
13 The peaks in more detail peak 1 peak 2 peak 3 peak discharge voltage (V) time (s) round 13 round 11 round 9 round 7 round 5 More rounds
14 on the target During pre-sputtering: deposition of material onto the target, which forms an oxide layer 14
15 15 Comparison of the two pre-sputter modes discharge voltage (V) time (s) poisoned mode metallic mode In poisoned mode : faster sputter cleaning than in metallic mode Reason : the deposited layer is much thinner because the deposition rate is much lower
16 Back to the modelling (with redeposition) 16 D. Depla, X.Y. Li, S. Mahieu, K. Van Aeken, W.P. Leroy, J. Haemers, R. De Gryse, A. Bogaerts, J. Appl. Phys. 107 (2010)
17 How to obtain a good deposition profile? 17 Download the latest version: K. Van Aeken, S. Mahieu, D. Depla, J. Phys. D.:Appl. Phys. 41 (2008)
18 A MC code called SImulation of Metal TRAnsport through the gas phase: is a neutral test particle Monte Carlo code designed to simulate the metal flux during magnetron sputter deposition SRIM Geometry Source type energy distr. at target 18 deposition profile, energy & angle arriving particles K. Van Aeken, S. Mahieu, D. Depla, J. Phys. D.:Appl. Phys. 41 (2008)
19 : making depositions obsolete 19 download it free at K. Van Aeken, S. Mahieu, D. Depla, J. Phys. D.:Appl. Phys. 41 (2008)
20 Noble gas retention? Sputtering Ti in Xe/N 2 while examining with in-situ RBS Done at Rossendorf W. Möller T i 20 Steady-state concentration of Xe of 3.4% (Ti) and 9.8% (TiN) found in the race track!! Angular resolved measurements -> no desorption of the Xe! (short time-scale) S. Mahieu, W.P. Leroy, D. Depla, S. Schreiber, W. Möller, APL 93 (2008)
21 Noble gas retention! Steady-state concentration stable in function of time after sputtering Xe % time (sec) Energy Resolved Mass Spectrometry: Xe-atoms get sputtered from the target! S. Mahieu, W.P. Leroy, D. Depla, S. Schreiber, W. Möller, APL 93 (2008)
22 effects: detrimental for layers Superconducting films YBCO N S S N S N S N N S S N 22 N S S S N N => negative atomic oxygen? Position 1: transition Position 2 : T c <69 K Position 3 : no Tc
23 effects: energy distribution of the species Y sputtered in Ar/O 2 Cps (a.u.) Al sputtered in Ar/O 2 Cps (a.u.) E (ev) 10 6 O E (ev) O - O 2 - YO YO AlO - AlO O 2 - Not only O -, but also O 2-, MO -, MO 2 -
24 effects: direction of the species Comparison between a planar and a rotatable magnetron Masspec Masspec Masspec Masspec Masspec Measuring the angular distribution of O - ions Masspec 0 Masspec S. Mahieu, W.P. Leroy, K. Van Aeken, D. Depla J. Appl. Phys. 106 (2009)
25 effects: angular distribution Al in Ar/O 'O exp' 'O SiMTRA' 'O/Al SiMTRA (a.u.)' 'magnetron' 'O exp' 'O SiMTRA' 'O/Al SiMTRA (a.u.)' 'magnetron' huge difference in behaviour planar rotatable: low amount O - / Al for angles >15 low amount O - / Al for angles >30 AND angles <15 S. Mahieu, W.P. Leroy, K. Van Aeken, D. Depla J. Appl. Phys. 106 (2009)
26 26 Pushing the limits: on a rotating cylindrical magnetron 6x10 3 Intensity HiPIMS (a.u.) DC HiPIMS 300 Al-target Al (1+) Al (1+) Al (1+) wavelength (nm) 380 (a) Al (0) Al (0) is possible on rotating cylindrical magnetrons, with increased metal ionization 400 Intensity HiPIMS (a.u.) 2x x x x10 3 5x10 3 0x10 3 In ntensity DC (a.u.) DC HiPIMS Ti (1+) Wavelength (nm) W. P. Leroy, S. Mahieu, D. Depla, A. P. Ehiasarian, JVST A 28 (2010) Ti-target Ti (0) Ti (0) Ti (1+) (b) 375 2x10 3 1x10 3 Intensity DC (a.u.)
27 on a rotating cylindrical magnetron: angular distributions Measuring the angular distribution of the deposition rate DC 5µs 15µs 20µs Dep Rate / Pav Huge decrease of deposition rate Angular distribution of adparticles looks similar W. P. Leroy, S. Konstantinidis S. Mahieu, R. Snyders, D. Depla, in preparation 80 Preliminary Results
28 on a rotating cylindrical magnetron: angular distributions Measuring the angular distribution of the total Energy Flux DC 5µs 15µs 15µs Total energy Flux (a.u.) Only limited drop in total energy flux Change in the angular distribution W. P. Leroy, S. Konstantinidis S. Mahieu, R. Snyders, D. Depla, in preparation 80 Preliminary Results
29 Small-scaled rotating cylindrical magnetron enables (affordable) fundamental research 340 discharge voltage (V) time (s) poisoned mode metallic mode plays an important role in the reactive behaviour of magnetrons (both rotatable as planar) 29 can be used to simulate any deposition profile in any possible set-up
30 30 Xe % time (sec) 'O exp' 'O SiMTRA' 'O/Al SiMTRA (a.u.)' 'magnetron' DC 5µs 15µs 15µs Total energy Flux (a.u.) Noble gas atoms are retained within the target Angular distribution of (detrimental) negative species is very different for planar and rotatable is possible on a rotatable and angular resolved measurements can give more fundamental insights in
31 Acknowledgements Financial Support: A.P. Ehiasarian (SHU) S. Konstantinidis & R. Snyders (UMH) DRAFT colleagues: 31
32 JOIN US at RSD2010 in Ghent!!! RSD 2010 International Conference on Reactive Sputter Deposition 9 & 10 December 2010 Ghent, Belgium 32 * Ion - Solid Interactions Invited Speaker: prof. dr. W. Möller Keynote Speaker: prof. dr. S. Lucas * Stress in polycrystalline films Invited Speaker: prof. dr. E. Chason Keynote Speaker: prof. dr. G. Abadias * Smart Coatings Invited Speaker: prof. dr. Matthias Wuttig Keynote Speaker: prof. dr. A. Billard * Pulsed Plasmas Invited Speaker: prof. dr. U. Helmersson Keynote Speaker: dr. Stephanos
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