ECE Semiconductor Device and Material Characterization
|
|
|
- Ira Mills
- 6 years ago
- Views:
Transcription
1 ECE 4813 Semiconductor Device and Material Characterization Dr. Alan Doolittle School of Electrical and Computer Engineering Georgia Institute of Technology As with all of these lecture slides, I am indebted to Dr. Dieter Schroder from Arizona State University for his generous contributions and freely given resources. Most of (>80%) the figures/slides in this lecture came from Dieter. Some of these figures are copyrighted and can be found within the class text, Semiconductor Device and Materials Characterization. Every serious microelectronics student should have a copy of this book!
2 Welcome Welcome to ECE4813 Semiconductor Device and Material Characterization. This is a most useful course if You are working with semiconductor materials or devices You are involved with measurements You are looking for a job (answer interview questions) It will give you a good overview of most of the characterization techniques in the semiconductor industry Electrical measurements Optical measurements Electron and ion beam measurements X-ray and probe measurements The prerequisite for this course is a previous course in semiconductor device physics, e.g., ECE3040, 3080, or 4751 You should be familiar with the basic semiconductor devices: pn junctions, metal-semiconductor devices, and MOS devices
3 Learning Objectives The objective of this course is an understanding of most of the characterization techniques used in the semiconductor industry The major emphasis will be on electrical characterization, since these characterization techniques are most frequently used However, optical techniques, as well as electron beam, ion beam, and X-ray methods will also be discussed. Where necessary, device physics will be outlined to understand certain techniques
4 Your Responsibility It is your responsibility to master the material I will assign homework so that you have to apply the course material and reinforce learning The textbook is one of the best reference books available, Dr. Dieter Schroder s text Semiconductor Device and Materials Characterization. Every Serious Microelectronics Person should keep a copy of this book. An excellent complement to this book is: W.R. Runyan and T.J. Shaffner, Semiconductor Measurements and Instrumentation, McGraw-Hill, Occasionally I will provide a paper to read
5 References D.K. Schroder, Semiconductor Material and Device Characterization, 3 rd ed., Wiley Interscience, W.R. Runyan and T.J. Shaffner, Semiconductor Measurements and Instrumentation, McGraw-Hill, T.J. Shaffner, Semiconductor Characterization and Analytical Technology, Proc. IEEE, 88, , Sept C.R. Brundle, C.A. Evans, Jr. and S. Wilson, Eds., Encyclopedia of Materials Characterization, John Wiley & Sons, R.E. Whan, K. Mills, J.R. Davis, J.D. Destefani, D.A. Dieterich, G.M. Crankovic, H.J. Frissell, D.M. Jenkins, W.H. Cubberly, R.L. Stedfeld, eds. Materials Handbook Ninth Edition: Vol. 10 Materials Characterization, American Society for Metals, A.C. Diebold, ed., Handbook of Silicon Semiconductor Metrology, Marcel Dekker, New York, S. Cristoloveanu and S. S. Li, Electrical Characterization of Silicon-on- Insulator Materials and Devices, Kluwer Academic, Boston, 1995.
6 Course Outline Electrical Characterization 0. Basic Electrical Measurement Theory, Probe and Instrumentation 1. Resistivity 2. Carrier/Doping Densities 3. Contact Resistance 4. Series Resistance 5. Schottky Barriers 6. MOSFET Channel Length 7. Threshold Voltage 8. Defects, Impurities 9. MOS Capacitors 10. Oxide Charges 11. Interface States 12. Carrier Lifetime 13. Mobility 14. Charge-based Measurements 15. Probe Microscopy 16. Reliability 17. Failure Analysis
7 Course Outline Optical Characterization 1. Optical Microscopy 2. Ellipsometry 3. Transmission, Reflection 4. Photoluminescence 5. Emission Microscopy
8 Course Outline Physical/Chemical Characterization 1. Scanning Electron Microscopy 2. Auger Electron Spectroscopy 3. Transmission Electron Microscopy 4. Voltage Contrast 5. Secondary Ion Mass Spectrometry 6. Rutherford Backscattering 7. X-Ray Fluorescence 8. X-Ray Photoelectron Spectroscopy
9 Approximate Course Schedule Week 1 Introduction, Resistivity Week 2 Sheet Resistance Week 3 Doping Profiling Week 4 Series, Contact Resistance Week 5 Diodes Week 6 Threshold Voltage Channel Length Week 7 Defects Week 8 MOS Charges Week 9 Recombination Mobility Week 10 Charge-based Probes Week 11 Optical Electron Beam Week 12 Ion Beam X-Rays Week 13 Reliability (time permitting or presentations) Week 14 Failure Analysis (time permitting or presentations)
10 Material/Device Parameters Contact/Series Resistance Gate Length/Width Threshold Voltage S G Oxide Thickness Oxide Charges L D Junction Depth Doping Profile Resistivity Impurities Defects p-type n + n + Mobility Generation/ Recombination Lifetime IBM's POWER 6 7.9x10 8 transistors 4.7 GHz, 2007
ECE Semiconductor Device and Material Characterization
ECE 4813 Semiconductor Device and Material Characterization Dr. Alan Doolittle School of Electrical and Computer Engineering Georgia Institute of Technology As with all of these lecture slides, I am indebted
ECE Semiconductor Device and Material Characterization
ECE 4813 Semiconductor Device and Material Characterization Dr. Alan Doolittle School of Electrical and Computer Engineering Georgia Institute of Technology As with all of these lecture slides, I am indebted
EECS130 Integrated Circuit Devices
EECS130 Integrated Circuit Devices Professor Ali Javey 10/02/2007 MS Junctions, Lecture 2 MOS Cap, Lecture 1 Reading: finish chapter14, start chapter16 Announcements Professor Javey will hold his OH at
MENA9510 characterization course: Capacitance-voltage (CV) measurements
MENA9510 characterization course: Capacitance-voltage (CV) measurements 30.10.2017 Halvard Haug Outline Overview of interesting sample structures Ohmic and schottky contacts Why C-V for solar cells? The
ECE335F: Electronic Devices Syllabus. Lecture*
Lecture 1 - Introduction: Course Overview 1 - Introduction: Course Overview 2 1 Crystal Structure of Solids 2 1 Crystal Structure of Solids 1.1 Semiconductor materials 1.1 Semiconductor materials 1.2 Types
Introduction to Power Semiconductor Devices
ECE442 Power Semiconductor Devices and Integrated Circuits Introduction to Power Semiconductor Devices Zheng Yang (ERF 3017, email: yangzhen@uic.edu) Power Semiconductor Devices Applications System Ratings
MOS Capacitors ECE 2204
MOS apacitors EE 2204 Some lasses of Field Effect Transistors Metal-Oxide-Semiconductor Field Effect Transistor MOSFET, which will be the type that we will study in this course. Metal-Semiconductor Field
Operation and Modeling of. The MOS Transistor. Second Edition. Yannis Tsividis Columbia University. New York Oxford OXFORD UNIVERSITY PRESS
Operation and Modeling of The MOS Transistor Second Edition Yannis Tsividis Columbia University New York Oxford OXFORD UNIVERSITY PRESS CONTENTS Chapter 1 l.l 1.2 1.3 1.4 1.5 1.6 1.7 Chapter 2 2.1 2.2
Electronics Fets and Mosfets Prof D C Dube Department of Physics Indian Institute of Technology, Delhi
Electronics Fets and Mosfets Prof D C Dube Department of Physics Indian Institute of Technology, Delhi Module No. #05 Lecture No. #02 FETS and MOSFETS (contd.) In the previous lecture, we studied the working
Final Examination EE 130 December 16, 1997 Time allotted: 180 minutes
Final Examination EE 130 December 16, 1997 Time allotted: 180 minutes Problem 1: Semiconductor Fundamentals [30 points] A uniformly doped silicon sample of length 100µm and cross-sectional area 100µm 2
3C3 Analogue Circuits
Department of Electronic & Electrical Engineering Trinity College Dublin, 2014 3C3 Analogue Circuits Prof J K Vij jvij@tcd.ie Lecture 1: Introduction/ Semiconductors & Doping 1 Course Outline (subject
ECE 340 Lecture 39 : MOS Capacitor II
ECE 340 Lecture 39 : MOS Capacitor II Class Outline: Effects of Real Surfaces Threshold Voltage MOS Capacitance-Voltage Analysis Things you should know when you leave Key Questions What are the effects
ECE 305 Exam 5 SOLUTIONS: Spring 2015 April 17, 2015 Mark Lundstrom Purdue University
NAME: PUID: : ECE 305 Exam 5 SOLUTIONS: April 17, 2015 Mark Lundstrom Purdue University This is a closed book exam. You may use a calculator and the formula sheet at the end of this exam. Following the
Solid Surfaces, Interfaces and Thin Films
Hans Lüth Solid Surfaces, Interfaces and Thin Films Fifth Edition With 427 Figures.2e Springer Contents 1 Surface and Interface Physics: Its Definition and Importance... 1 Panel I: Ultrahigh Vacuum (UHV)
Lecture 20: Semiconductor Structures Kittel Ch 17, p , extra material in the class notes
Lecture 20: Semiconductor Structures Kittel Ch 17, p 494-503, 507-511 + extra material in the class notes MOS Structure Layer Structure metal Oxide insulator Semiconductor Semiconductor Large-gap Semiconductor
SECTION: Circle one: Alam Lundstrom. ECE 305 Exam 5 SOLUTIONS: Spring 2016 April 18, 2016 M. A. Alam and M.S. Lundstrom Purdue University
NAME: PUID: SECTION: Circle one: Alam Lundstrom ECE 305 Exam 5 SOLUTIONS: April 18, 2016 M A Alam and MS Lundstrom Purdue University This is a closed book exam You may use a calculator and the formula
Lecture 7 PN Junction and MOS Electrostatics(IV) Metal Oxide Semiconductor Structure (contd.)
Lecture 7 PN Junction and MOS Electrostatics(IV) Metal Oxide Semiconductor Structure (contd.) Outline 1. Overview of MOS electrostatics under bias 2. Depletion regime 3. Flatband 4. Accumulation regime
Sheng S. Li. Semiconductor Physical Electronics. Second Edition. With 230 Figures. 4) Springer
Sheng S. Li Semiconductor Physical Electronics Second Edition With 230 Figures 4) Springer Contents Preface 1. Classification of Solids and Crystal Structure 1 1.1 Introduction 1 1.2 The Bravais Lattice
Current mechanisms Exam January 27, 2012
Current mechanisms Exam January 27, 2012 There are four mechanisms that typically cause currents to flow: thermionic emission, diffusion, drift, and tunneling. Explain briefly which kind of current mechanisms
Semiconductor Physics fall 2012 problems
Semiconductor Physics fall 2012 problems 1. An n-type sample of silicon has a uniform density N D = 10 16 atoms cm -3 of arsenic, and a p-type silicon sample has N A = 10 15 atoms cm -3 of boron. For each
PHYSICAL ELECTRONICS(ECE3540) CHAPTER 9 METAL SEMICONDUCTOR AND SEMICONDUCTOR HETERO-JUNCTIONS
PHYSICAL ELECTRONICS(ECE3540) CHAPTER 9 METAL SEMICONDUCTOR AND SEMICONDUCTOR HETERO-JUNCTIONS Tennessee Technological University Wednesday, October 30, 013 1 Introduction Chapter 4: we considered the
Semiconductor Physical Electronics
Semiconductor Physical Electronics Sheng S. Li Department of Electrical Engineering University of Florida Gainesville, Florida Plenum Press New York and London Contents CHAPTER 1. Classification of Solids
Review Energy Bands Carrier Density & Mobility Carrier Transport Generation and Recombination
Review Energy Bands Carrier Density & Mobility Carrier Transport Generation and Recombination The Metal-Semiconductor Junction: Review Energy band diagram of the metal and the semiconductor before (a)
Solid State Device Fundamentals
Solid State Device Fundamentals ENS 345 Lecture Course by Alexander M. Zaitsev alexander.zaitsev@csi.cuny.edu Tel: 718 982 2812 Office 4N101b 1 Outline - Goals of the course. What is electronic device?
1 Name: Student number: DEPARTMENT OF PHYSICS AND PHYSICAL OCEANOGRAPHY MEMORIAL UNIVERSITY OF NEWFOUNDLAND. Fall :00-11:00
1 Name: DEPARTMENT OF PHYSICS AND PHYSICAL OCEANOGRAPHY MEMORIAL UNIVERSITY OF NEWFOUNDLAND Final Exam Physics 3000 December 11, 2012 Fall 2012 9:00-11:00 INSTRUCTIONS: 1. Answer all seven (7) questions.
Semiconductor Integrated Process Design (MS 635)
Semiconductor Integrated Process Design (MS 635) Instructor: Prof. Keon Jae Lee - Office: 응용공학동 #4306, Tel: #3343 - Email: keonlee@kaist.ac.kr Lecture: (Tu, Th), 1:00-2:15 #2425 Office hour: Tues & Thur
LECTURE 23. MOS transistor. 1 We need a smart switch, i.e., an electronically controlled switch. Lecture Digital Circuits, Logic
LECTURE 23 Lecture 16-20 Digital Circuits, Logic 1 We need a smart switch, i.e., an electronically controlled switch 2 We need a gain element for example, to make comparators. The device of our dreams
Part 5: Quantum Effects in MOS Devices
Quantum Effects Lead to Phenomena such as: Ultra Thin Oxides Observe: High Leakage Currents Through the Oxide - Tunneling Depletion in Poly-Si metal gate capacitance effect Thickness of Inversion Layer
Preamble: Emphasis: Material = Device? MTSE 719 PHYSICAL PRINCIPLES OF CHARACTERIZATION OF SOLIDS
MTSE 719 PHYSICAL PRINCIPLES OF CHARACTERIZATION OF SOLIDS MTSE 719 - PHYSCL PRIN CHARACTIZTN SOLIDS Section # Call # Days / Times 001 96175 -View Book Info - F:100PM - 355PM - TIER114 Preamble: Core course
Lecture #27. The Short Channel Effect (SCE)
Lecture #27 ANNOUNCEMENTS Design Project: Your BJT design should meet the performance specifications to within 10% at both 300K and 360K. ( β dc > 45, f T > 18 GHz, V A > 9 V and V punchthrough > 9 V )
ET3034TUx Utilization of band gap energy
ET3034TUx - 3.3.1 - Utilization of band gap energy In the last two weeks we have discussed the working principle of a solar cell and the external parameters that define the performance of a solar cell.
Auger Electron Spectroscopy
Auger Electron Spectroscopy Auger Electron Spectroscopy is an analytical technique that provides compositional information on the top few monolayers of material. Detect all elements above He Detection
PHYSICAL ELECTRONICS(ECE3540) CHAPTER 9 METAL SEMICONDUCTOR AND SEMICONDUCTOR HETERO-JUNCTIONS
PHYSICAL ELECTRONICS(ECE3540) CHAPTER 9 METAL SEMICONDUCTOR AND SEMICONDUCTOR HETERO-JUNCTIONS Tennessee Technological University Monday, November 11, 013 1 Introduction Chapter 4: we considered the semiconductor
Lecture 2. Introduction to semiconductors Structures and characteristics in semiconductors
Lecture 2 Introduction to semiconductors Structures and characteristics in semiconductors Semiconductor p-n junction Metal Oxide Silicon structure Semiconductor contact Literature Glen F. Knoll, Radiation
Part 4: Heterojunctions - MOS Devices. MOSFET Current Voltage Characteristics
MOS Device Uses: Part 4: Heterojunctions - MOS Devices MOSCAP capacitor: storing charge, charge-coupled device (CCD), etc. MOSFET transistor: switch, current amplifier, dynamic random access memory (DRAM-volatile),
Lecture 2. Introduction to semiconductors Structures and characteristics in semiconductors. Fabrication of semiconductor sensor
Lecture 2 Introduction to semiconductors Structures and characteristics in semiconductors Semiconductor p-n junction Metal Oxide Silicon structure Semiconductor contact Fabrication of semiconductor sensor
Lecture 12: MOS Capacitors, transistors. Context
Lecture 12: MOS Capacitors, transistors Context In the last lecture, we discussed PN diodes, and the depletion layer into semiconductor surfaces. Small signal models In this lecture, we will apply those
Electronics EC /2/2012. * In-class exams: 40% 7 th week exam 25% 12 th week exam 15%
Arab Academy for Science, Technology and Maritime Transport Electronics EC 331 Dr. Mohamed Hassan Course Assessment * In-class exams: 40% 7 th week exam 25% 12 th week exam 15% *Tutorial exams and activities:
Lecture 4: CMOS Transistor Theory
Introduction to CMOS VLSI Design Lecture 4: CMOS Transistor Theory David Harris, Harvey Mudd College Kartik Mohanram and Steven Levitan University of Pittsburgh Outline q Introduction q MOS Capacitor q
Charge Extraction. Lecture 9 10/06/2011 MIT Fundamentals of Photovoltaics 2.626/2.627 Fall 2011 Prof. Tonio Buonassisi
Charge Extraction Lecture 9 10/06/2011 MIT Fundamentals of Photovoltaics 2.626/2.627 Fall 2011 Prof. Tonio Buonassisi 2.626/2.627 Roadmap You Are Here 2.626/2.627: Fundamentals Every photovoltaic device
Long Channel MOS Transistors
Long Channel MOS Transistors The theory developed for MOS capacitor (HO #2) can be directly extended to Metal-Oxide-Semiconductor Field-Effect transistors (MOSFET) by considering the following structure:
8. Schottky contacts / JFETs
Technische Universität Graz Institute of Solid State Physics 8. Schottky contacts / JFETs Nov. 21, 2018 Technische Universität Graz Institute of Solid State Physics metal - semiconductor contacts Photoelectric
ECE Semiconductor Device and Material Characterization
EE 483 emiconductor Device and Material haracterization Dr. Alan Doolittle chool of Electrical and omputer Engineering Georgia Institute of Technology As with all of these lecture slides, I am indebted
Avalanche breakdown. Impact ionization causes an avalanche of current. Occurs at low doping
Avalanche breakdown Impact ionization causes an avalanche of current Occurs at low doping Zener tunneling Electrons tunnel from valence band to conduction band Occurs at high doping Tunneling wave decays
Semiconductor Physical Electronics
Semiconductor Physical Electronics Sheng S. Li Semiconductor Physical Electronics Second Edition With 230 Figures Sheng S. Li Department of Electrical and Computer Engineering University of Florida Gainesville,
Scaling Issues in Planar FET: Dual Gate FET and FinFETs
Scaling Issues in Planar FET: Dual Gate FET and FinFETs Lecture 12 Dr. Amr Bayoumi Fall 2014 Advanced Devices (EC760) Arab Academy for Science and Technology - Cairo 1 Outline Scaling Issues for Planar
Contact resistance and TLM measurements
Contact resistance and TLM measurements In measuring resistance with the four-point-probe or van der Pauw methods, we used 4 contacts (2 for current, 2 for voltage) to determine the sheet resistance of
UNIVERSITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences. EECS 130 Professor Ali Javey Fall 2006
UNIVERSITY OF CALIFORNIA College of Engineering Department of Electrical Engineering and Computer Sciences EECS 130 Professor Ali Javey Fall 2006 Midterm 2 Name: SID: Closed book. Two sheets of notes are
Metal-oxide-semiconductor field effect transistors (2 lectures)
Metal-ide-semiconductor field effect transistors ( lectures) MOS physics (brief in book) Current-voltage characteristics - pinch-off / channel length modulation - weak inversion - velocity saturation -
Erik Lind
High-Speed Devices, 2011 Erik Lind (Erik.Lind@ftf.lth.se) Course consists of: 30 h Lectures (H322, and Fys B check schedule) 8h Excercises 2x2h+4h Lab Excercises (2 Computer simulations, 4 RF measurment
Fundamentals of the Metal Oxide Semiconductor Field-Effect Transistor
Triode Working FET Fundamentals of the Metal Oxide Semiconductor Field-Effect Transistor The characteristics of energy bands as a function of applied voltage. Surface inversion. The expression for the
ECE 635. Advanced Semiconductor Devices
ECE 635 Advanced Semiconductor Devices Gong Gu Course website: http://web.eecs.utk.edu/~ggu1/files/gradhome.html Fall 2017 Why Semiconductors? Sometimes we say solid state Image, sound, temperature, pressure,
ESE370: Circuit-Level Modeling, Design, and Optimization for Digital Systems
ESE370: Circuit-Level Modeling, Design, and Optimization for Digital Systems Lec 6: September 14, 2015 MOS Model You are Here: Transistor Edition! Previously: simple models (0 and 1 st order) " Comfortable
Schottky diodes. JFETs - MESFETs - MODFETs
Technische Universität Graz Institute of Solid State Physics Schottky diodes JFETs - MESFETs - MODFETs Quasi Fermi level When the charge carriers are not in equilibrium the Fermi energy can be different
ECEN 3320 Semiconductor Devices Final exam - Sunday December 17, 2000
Your Name: ECEN 3320 Semiconductor Devices Final exam - Sunday December 17, 2000 1. Review questions a) Illustrate the generation of a photocurrent in a p-n diode by drawing an energy band diagram. Indicate
ECE 342 Electronic Circuits. Lecture 6 MOS Transistors
ECE 342 Electronic Circuits Lecture 6 MOS Transistors Jose E. Schutt-Aine Electrical & Computer Engineering University of Illinois jesa@illinois.edu 1 NMOS Transistor Typically L = 0.1 to 3 m, W = 0.2
Lecture 15 OUTLINE. MOSFET structure & operation (qualitative) Review of electrostatics The (N)MOS capacitor
Lecture 15 OUTLINE MOSFET structure & operation (qualitative) Review of electrostatics The (N)MOS capacitor Electrostatics t ti Charge vs. voltage characteristic Reading: Chapter 6.1 6.2.1 EE105 Fall 2007
Lecture 20 - Semiconductor Structures
Lecture 0: Structures Kittel Ch 17, p 494-503, 507-511 + extra material in the class notes MOS Structure metal Layer Structure Physics 460 F 006 Lect 0 1 Outline What is a semiconductor Structure? Created
Semiconductor Module
Semiconductor Module Optics Seminar July 18, 2018 Yosuke Mizuyama, Ph.D. COMSOL, Inc. The COMSOL Product Suite Governing Equations Semiconductor Schrödinger Equation Semiconductor Optoelectronics, FD Semiconductor
City University of Hong Kong. Course Syllabus. offered by Department of Physics and Materials Science with effect from Semester A 2016 / 17
City University of Hong Kong offered by Department of Physics and Materials Science with effect from Semester A 2016 / 17 Part I Course Overview Course Title: Nanostructures and Nanotechnology Course Code:
ECE 340 Lecture 27 : Junction Capacitance Class Outline:
ECE 340 Lecture 27 : Junction Capacitance Class Outline: Breakdown Review Junction Capacitance Things you should know when you leave M.J. Gilbert ECE 340 Lecture 27 10/24/11 Key Questions What types of
Hussein Ayedh. PhD Studet Department of Physics
Hussein Ayedh PhD Studet Department of Physics OUTLINE Introduction Semiconductors Basics DLTS Theory DLTS Requirements Example Summary Introduction Energetically "deep trapping levels in semiconductor
EE 3329 Electronic Devices Syllabus ( Extended Play )
EE 3329 - Electronic Devices Syllabus EE 3329 Electronic Devices Syllabus ( Extended Play ) The University of Texas at El Paso The following concepts can be part of the syllabus for the Electronic Devices
Lecture 2. Introduction to semiconductors Structures and characteristics in semiconductors
Lecture 2 Introduction to semiconductors Structures and characteristics in semiconductors Semiconductor p-n junction Metal Oxide Silicon structure Semiconductor contact Literature Glen F. Knoll, Radiation
Lecture 8 PN Junction and MOS Electrostatics (V) Electrostatics of Metal Oxide Semiconductor Structure (cont.) October 4, 2005
6.12 Microelectronic Devices and Circuits Fall 25 Lecture 8 1 Lecture 8 PN Junction and MOS Electrostatics (V) Electrostatics of Metal Oide Semiconductor Structure (cont.) Contents: October 4, 25 1. Overview
CMOS Devices. PN junctions and diodes NMOS and PMOS transistors Resistors Capacitors Inductors Bipolar transistors
CMOS Devices PN junctions and diodes NMOS and PMOS transistors Resistors Capacitors Inductors Bipolar transistors PN Junctions Diffusion causes depletion region D.R. is insulator and establishes barrier
Section 12: Intro to Devices
Section 12: Intro to Devices Extensive reading materials on reserve, including Robert F. Pierret, Semiconductor Device Fundamentals EE143 Ali Javey Bond Model of Electrons and Holes Si Si Si Si Si Si Si
Lecture 0. EE206 Electronics I
Lecture 0 Course Overview EE206 Electronics I Course description: Theory, characteristics and operation of diodes, bipolar junction transistors and MOSFET transistors. When: Tue Thu 10:30-12:20 (Lectures)
PN Junction
P Junction 2017-05-04 Definition Power Electronics = semiconductor switches are used Analogue amplifier = high power loss 250 200 u x 150 100 u Udc i 50 0 0 50 100 150 200 250 300 350 400 i,u dc i,u u
ESE 570: Digital Integrated Circuits and VLSI Fundamentals
ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 4: January 24, 2017 MOS Transistor Theory, MOS Model Penn ESE 570 Spring 2017 Khanna Lecture Outline! Semiconductor Physics " Band gaps "
Integrated Circuits & Systems
Federal University of Santa Catarina Center for Technology Computer Science & Electronics Engineering Integrated Circuits & Systems INE 5442 Lecture 10 MOSFET part 1 guntzel@inf.ufsc.br ual-well Trench-Isolated
Lecture 15 OUTLINE. MOSFET structure & operation (qualitative) Review of electrostatics The (N)MOS capacitor
Lecture 15 OUTLINE MOSFET structure & operation (qualitative) Review of electrostatics The (N)MOS capacitor Electrostatics Charge vs. voltage characteristic Reading: Chapter 6.1 6.2.1 EE15 Spring 28 Lecture
Nanoelectronics. Topics
Nanoelectronics Topics Moore s Law Inorganic nanoelectronic devices Resonant tunneling Quantum dots Single electron transistors Motivation for molecular electronics The review article Overview of Nanoelectronic
MOSFET: Introduction
E&CE 437 Integrated VLSI Systems MOS Transistor 1 of 30 MOSFET: Introduction Metal oxide semiconductor field effect transistor (MOSFET) or MOS is widely used for implementing digital designs Its major
Course overview. Me: Dr Luke Wilson. The course: Physics and applications of semiconductors. Office: E17 open door policy
Course overview Me: Dr Luke Wilson Office: E17 open door policy email: luke.wilson@sheffield.ac.uk The course: Physics and applications of semiconductors 10 lectures aim is to allow time for at least one
Department of Electrical and Computer Engineering, Cornell University. ECE 3150: Microelectronics. Spring Due on March 01, 2018 at 7:00 PM
Department of Electrical and Computer Engineering, Cornell University ECE 3150: Microelectronics Spring 2018 Homework 4 Due on March 01, 2018 at 7:00 PM Suggested Readings: a) Lecture notes Important Note:
ESE 570: Digital Integrated Circuits and VLSI Fundamentals
ESE 570: Digital Integrated Circuits and VLSI Fundamentals Lec 4: January 29, 2019 MOS Transistor Theory, MOS Model Penn ESE 570 Spring 2019 Khanna Lecture Outline! CMOS Process Enhancements! Semiconductor
Index. buried oxide 35, 44 51, 89, 238 buried channel 56
Index A acceptor 275 accumulation layer 35, 45, 57 activation energy 157 Auger electron spectroscopy (AES) 90 anode 44, 46, 55 9, 64, 182 anode current 45, 49, 65, 77, 106, 128 anode voltage 45, 52, 65,
Device Models (PN Diode, MOSFET )
Device Models (PN Diode, MOSFET ) Instructor: Steven P. Levitan steve@ece.pitt.edu TA: Gayatri Mehta, José Martínez Book: Digital Integrated Circuits: A Design Perspective; Jan Rabaey Lab Notes: Handed
EE 527 MICROFABRICATION. Lecture 5 Tai-Chang Chen University of Washington
EE 527 MICROFABRICATION Lecture 5 Tai-Chang Chen University of Washington MICROSCOPY AND VISUALIZATION Electron microscope, transmission electron microscope Resolution: atomic imaging Use: lattice spacing.
Lecture 04 Review of MOSFET
ECE 541/ME 541 Microelectronic Fabrication Techniques Lecture 04 Review of MOSFET Zheng Yang (ERF 3017, email: yangzhen@uic.edu) What is a Transistor? A Switch! An MOS Transistor V GS V T V GS S Ron D
Spring Semester 2012 Final Exam
Spring Semester 2012 Final Exam Note: Show your work, underline results, and always show units. Official exam time: 2.0 hours; an extension of at least 1.0 hour will be granted to anyone. Materials parameters
Week 3, Lectures 6-8, Jan 29 Feb 2, 2001
Week 3, Lectures 6-8, Jan 29 Feb 2, 2001 EECS 105 Microelectronics Devices and Circuits, Spring 2001 Andrew R. Neureuther Topics: M: Charge density, electric field, and potential; W: Capacitance of pn
Device Models (PN Diode, MOSFET )
Device Models (PN Diode, MOSFET ) Instructor: Steven P. Levitan steve@ece.pitt.edu TA: Gayatri Mehta, José Martínez Book: Digital Integrated Circuits: A Design Perspective; Jan Rabaey Lab Notes: Handed
MOS Capacitor MOSFET Devices. MOSFET s. INEL Solid State Electronics. Manuel Toledo Quiñones. ECE Dept. UPRM.
INEL 6055 - Solid State Electronics ECE Dept. UPRM 20th March 2006 Definitions MOS Capacitor Isolated Metal, SiO 2, Si Threshold Voltage qφ m metal d vacuum level SiO qχ 2 E g /2 qφ F E C E i E F E v qφ
Quantum Device Simulation. Overview Of Atlas Quantum Features
Quantum Device Simulation Introduction Motivation for using Quantum models Overview of Atlas Quantum features Discussion of Quantum models - 2 - Motivation Reduction in device size -> coherence length
MS482 Materials Characterization ( 재료분석 ) Lecture Note 5: RBS
2016 Fall Semester MS482 Materials Characterization ( 재료분석 ) Lecture Note 5: RBS Byungha Shin Dept. of MSE, KAIST 1 Course Information Syllabus 1. Overview of various characterization techniques (1 lecture)
Characterization of the gate-voltage dependency of input capacitance in a SiC MOSFET
Characterization of the gate-voltage dependency of input capacitance in a SiC MOSFET Nathabhat Phankong 1a), Tsuyoshi Funaki 2, and Takashi Hikihara 1 1 Kyoto University, Dept. of Electrical Eng., Graduate
Development Software of Al-SiO 2 -Si MOS IV Characterization in Accumulation Case
Applied Physics Research; Vol. 7, No. ; 015 ISSN 1916-9639 E-ISSN 1916-9647 Published by Canadian Center of Science and Education Development Software of -SiO -Si MOS IV Characteriation in Accumulation
Section 12: Intro to Devices
Section 12: Intro to Devices Extensive reading materials on reserve, including Robert F. Pierret, Semiconductor Device Fundamentals Bond Model of Electrons and Holes Si Si Si Si Si Si Si Si Si Silicon
16EC401 BASIC ELECTRONIC DEVICES UNIT I PN JUNCTION DIODE. Energy Band Diagram of Conductor, Insulator and Semiconductor:
16EC401 BASIC ELECTRONIC DEVICES UNIT I PN JUNCTION DIODE Energy bands in Intrinsic and Extrinsic silicon: Energy Band Diagram of Conductor, Insulator and Semiconductor: 1 2 Carrier transport: Any motion
Schottky Rectifiers Zheng Yang (ERF 3017,
ECE442 Power Semiconductor Devices and Integrated Circuits Schottky Rectifiers Zheng Yang (ERF 3017, email: yangzhen@uic.edu) Power Schottky Rectifier Structure 2 Metal-Semiconductor Contact The work function
Lecture 6: 2D FET Electrostatics
Lecture 6: 2D FET Electrostatics 2016-02-01 Lecture 6, High Speed Devices 2014 1 Lecture 6: III-V FET DC I - MESFETs Reading Guide: Liu: 323-337 (he mainly focuses on the single heterostructure FET) Jena:
6.012 Electronic Devices and Circuits
Page 1 of 12 YOUR NAME Department of Electrical Engineering and Computer Science Massachusetts Institute of Technology 6.012 Electronic Devices and Circuits FINAL EXAMINATION Open book. Notes: 1. Unless
GaN based transistors
GaN based transistors S FP FP dielectric G SiO 2 Al x Ga 1-x N barrier i-gan Buffer i-sic D Transistors "The Transistor was probably the most important invention of the 20th Century The American Institute
Lecture 3: CMOS Transistor Theory
Lecture 3: CMOS Transistor Theory Outline Introduction MOS Capacitor nmos I-V Characteristics pmos I-V Characteristics Gate and Diffusion Capacitance 2 Introduction So far, we have treated transistors
Introduction and Background
Analog CMOS Integrated Circuit Design Introduction and Background Dr. Jawdat Abu-Taha Department of Electrical and Computer Engineering Islamic University of Gaza jtaha@iugaza.edu.ps 1 Marking Assignments
! Previously: simple models (0 and 1 st order) " Comfortable with basic functions and circuits. ! This week and next (4 lectures)
ESE370: CircuitLevel Modeling, Design, and Optimization for Digital Systems Lec 6: September 14, 2015 MOS Model You are Here: Transistor Edition! Previously: simple models (0 and 1 st order) " Comfortable
Chalcogenide semiconductor research and applications. Tutorial 2: Thin film characterization. Rafael Jaramillo Massachusetts Institute of Technology
Chalcogenide semiconductor research and applications Tutorial 2: Thin film characterization Rafael Jaramillo Massachusetts Institute of Technology Section 1: Measuring composition August 20, 2017 Jaramillo
Semiconductor device structures are traditionally divided into homojunction devices
0. Introduction: Semiconductor device structures are traditionally divided into homojunction devices (devices consisting of only one type of semiconductor material) and heterojunction devices (consisting