Optimization of Process Parameters for Micropart Capillary Assembly with Precision Positioning

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1 Optimization of Process Parameters for Micropart Capillary Assembly with Precision Positioning Andrew X. Zhou, 1 Shaghayegh Abbasi, 2 Rajashree Baskaran, 2 Karl F. Böhringer 2 1 Department of Bioengineering, University of Washington, Seattle, Washington Department of Electrical Engineering, University of Washington, Seattle, Washington Abstract: The assembly of microdevices is currently done mainly with the pick and place method. However, this method is slow and expensive for assembly requiring high precision. Thus, the development of a new fast, yet highly precise method of assembly is the focus of current research. Self-assembly in liquid medium, where microdevices spontaneously arrange themselves into more complex systems using capillary forces, has been shown to be a potential candidate for parallel batch assembly with precision positioning. However, studies of how the design and process variables affect the precision of the method have yet to be investigated. The main barrier to achieving the desired precision in the x-y direction is the tilting of parts during the assembly process. In this project, we investigated the effect the volume of adhesive has on tilting and developed a theoretical model for the tilting. Our data show that the magnitude of tilting increases as the volume of adhesive used increases, in accordance with the model. In addition, we studied a method using vertical vibration with a speaker to correct the tilting. Our data show that this method is practical under certain conditions of adhesive coverage on the binding sites. With further investigation, tilting should be able to be corrected consistently. 1. INTRODUCTION Much research has been done in the past few decades on microelectromechanical systems (MEMS). These functional microdevices include electrical components such as sensors and actuators. Complex systems of these microdevices can be used in a wide variety of areas such as chemical analysis, biomedical instrumentation and telecommunications [9]. However, different microdevices cannot be manufactured on the same substrate due to incompatibility in fabrication steps and other issues; hence an assembly method is needed to put them together in a system after fabricating separately. Currently, most of these micro systems are created using the pick and place method, also known as a top-down approach. This method requires the use of a robot to pick individual devices up and place them in the desired location for assembly. Assembly with the pick and place method is effective and can be very precise on the micro scale. However, there are several problems with this technique. First, it can be very expensive if high precision is needed. The method is also very slow when large numbers of devices need to be assembled since the speed is limited by the number of robots or robot arms [5]. Finally, there is a problem known as sticking. On very small devices (less than a millimeter), electrostatic, van der Waals, and surface tension forces become stronger than the force due to gravity, causing devices to stick to the robots that are moving them [9]. Thus, a new technique needs to be developed that is cheaper and faster, but still has the precision of the pick and place method. Self-assembly, also known as a bottom-up approach, has been the focus of recent research. Self-assembly refers to a process where microdevices spontaneously arrange themselves into a more complex system. This technique borrows an idea from nature that has been used for millions of years the self-assembly of biological molecules to create a living organism. Since self-assembly is a parallel process where multiple devices can be assembled at once, it can, in principle, create huge systems of correctly placed microdevices quickly and efficiently [7]. Recent research has also shown that selfassembly can realistically compete with the pick and place method in terms of precision [5]. This makes self-assembly a very promising technique for mass fabrication of small devices. Various forces have been studied that could possibly drive the spontaneous assembly process, including gravitational [10], electrostatic [2,8], and capillary forces [5,6,7,9]. Capillary-based self-assembly shows promise as an effective method because capillary forces are dominant relative to other forces on small scales, allowing better self-alignment [5]. The technique involves the use of hydrophilic and

2 hydrophobic surfaces to selectively apply a lubricant (a hydrocarbon) to certain areas of the wafer (substrate) to be assembled on. The microdevices (parts) have the same hydrophilic and hydrophobic pattern, and will selectively bind to the substrate in the desired orientation. The driving force for this self-assembly and alignment is the minimization of surface energy, which is achieved by minimizing the area of hydrophobic surfaces exposed to the hydrophilic surroundings. The lubricant can then be solidified by a curing method, holding the assembled parts in place [5]. However, problems with the precision of this technique have yet to be solved. The main barrier to obtaining the desired precision is the tilting of microdevices during the assembly process. Tilting can also cause problems for sensitive optical applications [4]. To improve the effectiveness of this method, the tilting has to first be understood and then corrected. Introduced in this article is a model for part tilting, which can be used to minimize tilt angles by altering assembly process parameters. In addition, a method for correcting tilt is demonstrated for situations where tilt angles cannot be minimized below desired levels. 2.2 Substrate and Part Fabrication Figure 1 summarizes the fabrication process for the parts and substrates. The substrates were fabricated on a 4-inch silicon wafer. Due to the need for high binding precision, the rectangular binding sites were defined using lithography. In this process, photoresist AZ4620 was first spin coated and lithographically patterned on the substrate. Cr and Au were then evaporated on to the substrate with thicknesses of 100Ǻ and 1000Ǻ, respectively. Next, a lift-off procedure was done by soaking the wafer in acetone overnight to remove any Cr and Au that were deposited off the binding sites, thus fully defining the final shape of the binding sites. To make the gold binding sites more hydrophobic, the wafers were cleaned with O 2 plasma and then soaked in 1mM dodecanethiol in ethanol overnight. Thiol 2. MATERIALS AND METHODS 2.1 Substrate and Part Design The silicon parts had dimensions of 5 x 5 x 0.1mm and were nonfunctional (no electrical connections). The large surface area to thickness ratio was required in order for the capillary forces to be strong enough to align the parts, and also for the final purpose of the assembly, which is 3D stacking of high interconnect density electronic chips on the substrate. The binding sites on both the substrate and part were made out of gold and had dimensions of 3.65 x 4.9mm. Rectangular biding sites were chosen because there are fewer possible assembly orientations (2) in comparison to square binding sites (4). This allows for more flexibility in the circuitry design on the part due to the decrease in symmetry that is required. Past simulations have shown that the rectangular binding sites should have a length to width ratio of greater than 1.3:1 to consistently achieve correct assembly orientations [3]. Figure 1. Summary of part and substrate fabrication process. A silicon wafer is lithographically patterned with photoresist and evaporated with Cu and Au. After a lift-off procedure, the gold binding sites are coated with a self-assembled monolayer of dodecanethiol to make the binding sites more hydrophobic. molecules selectively bind to gold, creating a self-assembled monolayer (SAM) of dodecanethiol on the surface of the gold binding sites. Parts were fabricated by lithography in the same way as the substrates except that SAM coating was not done for the parts. An additional step was needed in part fabrication to create the desired part dimensions of 5 x 5 x 0.1mm. The wafer of parts was thinned to 0.1mm by a grinding process from the back side of the wafer and then diced into 5 x 5mm sections.

3 2.3 Self-Assembly Using Capillary Forces Figure 2 summarizes the general process for part self-assembly using capillary forces. The fabricated substrate with hydrophobic binding sites was first placed in water. Next, a heat curable adhesive was placed onto the hydrophobic binding sites using a micropipettor. The heat curable adhesive was made of 97% triethyleneglycol dimethacrylate and 3% benzoyl peroxide by weight, and was capable of solidifying after heating. Since the adhesive was also hydrophobic, it selectively covered the hydrophobic gold binding sites. Parts were then introduced into the water and allowed to selfassemble by energy minimization as discussed previously. Once the parts were self-assembled, the water was heated to 70 C for 2 hr to solidify the heat curable adhesive. 2.4 Tilt Correction Tilt correction was achieved using vertical vibration with a speaker. First, parts were allowed to self-assemble in a container of water as described previously. The container was then secured to a stage of a speaker connected to a waveform generator outputting a 15Hz, 9V peakto-peak sinusoidal wave. The vibration frequency was chosen based on the resonant frequency of the vibration system (speaker) since it gives maximum energy to the part-substrate system. The assembled parts were allowed to vibrate for 2 min. The tilt angles of the parts were measured before and after vibration using an optical camera. 3.1 Tilt Model 3. RESULTS The tilt angle of the part was modeled using force balance analysis. In the model, it was assumed that one edge of the tilted part was always in contact with the substrate, which was shown to be true over 90% of the time in experiments. As shown in Figure 3A, the two main forces acting on the part are gravity and the capillary force.

4 The capillary force can be calculated using the Young-Laplace equation: 1 1 Fc =Δ PA= γ AW + A R1 R2 (1) where F c is the capillary force, ΔP is the pressure difference between the adhesive and the water, γ AW is the adhesive-water interfacial tension, A is the binding site area, and R 1 and R 2 are the radii of curvature defined in Figure 3A. The force of gravity F g in the opposite direction of F c can be calculated using the equation Fg = mgcos( α) (2) where m is the mass of the part, g is the acceleration due to gravity, and α is the tilt angle. In this situation, the force due to gravity is minimal or near zero because the part is so small. For a tilted part to be in an equilibrium state, the capillary force must be equal and opposite the gravitational force. In order for the capillary force to be near zero, ΔP must also be near zero, corresponding to an R 1 of infinity, or a straight interfacial line between the water and adhesive, as seen in Figure 3B. The relationship between adhesive volume and tilt angle can then be calculated using geometry, resulting in the equation 2 α Vα = WL sin 2 (3) where W and L are the width and length of the binding site, and α is the tilt angle. 3.2 Model Validation To validate the tilting model, controlled amounts of the heat curable adhesive were placed on the binding sites of the substrate using a micropipettor, ranging from 3 μl to 17 μl. Part assembly and heat curing were performed as previously described. Tilt angles were then measured using an optical camera. At least five trials were done for each adhesive volume. A comparison between the model (Eq. 3) and experimental results is shown in Figure 4. As demonstrated by the model, tilt angle increases as the adhesive volume is increased. Experimental results follow a similar trend, but the model consistently overestimates the actual values at all volumes of adhesive. Figure 3. Model for tilting. (A) The two main forces acting on the part are gravity and the capillary force. (B)With the assumption that the gravitational force is near zero, it was concluded that the interfacial surface between the adhesive and water is close to a straight line. 3.3 Tilt Correction Simulations using Surface Evolver showed that the global energy minimum of an assembled system is at a tilt angle of 0. As discussed previously, the driving force for self-assembly is Figure 4. Model validation. The tilt model is plotted with the part tilt angle as a function of adhesive volume. Experimental results are also shown. Error bars represent standard deviation. energy minimization. Thus, assembled parts should tend to an orientation of zero tilt. However, due to friction and other attractive forces between the part and substrate, there are

5 other local energy minima where the part can be in equilibrium. As seen in Figure 5, parts approaching the binding site from the side push the adhesive so that it is no longer distributed evenly across the binding site. This results in the system reaching an equilibrium position in which the part is tilted (a local energy minimum). Figure 5. Part tilting. A part is self-assembled from the right side and becomes tilted after assembly is completed. To correct tilting, external energy must be supplied to push the system to its global energy minimum. Vertical vibration with a speaker was used to supply the external energy in this experiment. Different volumes of adhesive were placed on the binding sites using a micropipettor, ranging from 3 μl to 11 μl, to test the effectiveness of tilt correction at different adhesive volumes. At least five trials were done for each adhesive volume. Tilt correction can be clearly seen in an example in Figure 6. Figure 7 shows part tilt angles before and after vibration at multiple adhesive volumes. As seen in the plot, tilt was corrected to below 2 at all tested volumes. 4. DISCUSSION 4.1 Tilt Model As seen in the results, the experimental values were consistently lower than the values predicted by the model. The likely explanation for this trend is that the assumption of part-substrate contact may not always be true. In addition, the assumption of near zero gravitational force produced a simplified model. Future models can Figure 6. Example of tilt correction. (A) A part is tilted after assembly. (B) The same part is shown with tilt corrected after vertical vibration with a speaker. incorporate a more accurate force analysis with fewer simplifications. The current tilt model can be used in applications where there is a maximum acceptable tilt angle. The model allows for the calculation of the maximum volume of adhesive that can be used in order to guarantee that the tilt angle is below a required limit. As determined by the model and the experimental results, the tilt angle can be minimized by decreasing the adhesive volume. However, there are limitations to how much the adhesive volume can be reduced. The adhesive must fully cover the binding site and the minimum amount of adhesive that can be deposited on a binding site will be determined by the depositing method and adhesive contact angle. In certain situations, larger than desired tilt angles will be unavoidable and an effective tilt correction method must be used. 4.2 Tilt Correction The key to tilt correction is to supply external energy to the system so that the part is released from its local energy minimum equilibrium position, giving the part an opportunity to fall into its global energy minimum. Vertical vibration with a speaker was able to accomplish

6 Figure 7. Tilt correction with vertical vibration. The tilt angle of assembled parts before and after vibration is plotted for various adhesive volumes. Error bars represent standard deviation. this by supplying kinetic energy to the system. The results confirmed that the global energy minimum at all adhesive volumes is indeed the flat state, as predicted by the Surface Evolver simulation. 4.3 Future Work The tilt angle model described here gives the relation between tilt angle and adhesive volume. In the next step, by taking into account the gravity force, we would be able to find a more complete relation between tilt angle and all assembly parameters such as water-adhesive interfacial tension, part density, and adhesive volume. This relation can then be verified by doing experiments where all assembly parameters are fixed and only one parameter is changing. Another goal is to be able to deposit adhesive on the binding sites using dip coating instead of using a micropipettor. Dip coating allows adhesive to be deposited on multiple binding sites at once, speeding up the overall process. In addition, the volume of adhesive that is deposited will be very consistent on all binding sites and can be easily controlled by controlling the velocity and direction of dipping. Finally, more studies can be done on tilt correction to optimize the amplitude and frequency of vibration around the resonant frequency of the adhesive, which will give the best correction results. ACKNOWLEDGEMENTS This work was supported by research grants from Intel Corporation and grant number NSF EEC Special thanks also to the University of Washington Engineered Biomaterials (UWEB) Research Experience for Undergraduates program. In addition, the authors would like to thank the Microfabrication Laboratory at the Washington Technology Center for helping with the clean room microfabrication process. REFERENCES 1. Abbasi S, Zhou AX, Baskaran R, Böhringer KF. Part tilting in capillary-based selfassembly: modeling and correction methods. IEEE International Conference on Micro Electro Mechanical Systems, Tucson, USA, 2008; Böhringer KF, Goldberg KY, Cohn MB, Howe RT, Pisano AP. Parallel microassembly using electrostatic force fields. IEEE International Conference on Robotics and Automation, Leuven, Belgium, 1998; Fang J, Wang K, Böhringer KF. Selfassembly of PZT actuators for micropumps

7 with high process repeatability. Journal of Microelectromech Systems 2006;15: Scott KL, Howe RT, Radke CJ. Model for micropart planarization in capillary-base microassembly. The 12th International Conference on Solid State Sensors, Actuators and Microsystems, Boston, USA, 2003; Srinivasan U, Liepmann D, Howe RT. Microstructure to substrate self-assembly using capillary forces. Journal of Microelectromech Systems 2001;10: Terfort A, Bowden N, Whitesides GM. Three-dimensional self-assembly of millimeter-scale components. Nature 1997;386: Terfort A, Whitesides GM. Self-assembly of an operating electrical circuit based on shape complimentarily and the hydrophobic effect. Advanced Materials 1998;10: Tien J, Terfort A, Whitesides GM. Microfabrication through electrostatic selfassembly. Langmuir 1997;13: Xiong X, Hanein Y, Fang J, Wang Y, Wang W, Schwartz DT, Böhringer KF. Controlled multibatch self-assembly of microdevices. Journal of Microelectromechanical Systems 2003;12: Yeh HJ. Smith JS. Fluidic Assembly for the integration of GaAs light-emitting diodes on si substrates. IEEE Photonics Technology Letters 1994;6:

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