ALD-enabled nanopatterning: area-selective ALD by area-activation
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1 ALD-enabled nanopatterning: area-selective ALD by area-activation Adrie Mackus, Ageeth Bol, and Erwin Kessels
2 Outline Introduction & Area-selective deposition Area-selective ALD by area-deactivation Example: blocking with polyimide Area-selective ALD by area-activation Example: EBID & ALD of Pt (direct-write ALD) Intermezzo: μ-contact printing & ALD of Ru Example: μ-plasma printing & ALD of In 2 O 3 (direct-write ALD) Summary 2
3 Selective deposition for bottom-up processing Subtractive processes Additive processes 3
4 Area-selective deposition Surface with material A and material B Growth on material A only, not on material B Material A Material B 4
5 Area-selective deposition: core-shell nanoparticles Pt Pd Al 2 O 3 1. Deposit Pd nanoparticles by ALD 2. Deposit Pt shell by area-selective ALD on Pd core Fixed core diameter (100 cycles Pd) with varying shell thickness (0, 25, 50 and 75 cycles Pt) 5 Weber et al., Chem. Mater. 24, 2973 (2012). Weber et al., Nanotechnology 26, (2015).
6 Area-selective ALD: core-shell nanoparticles HAADF-STEM imaging Pt Pd Al 2 O 3 20 nm IMG1(frame1) 20 nm 2 nm EDS mapping 6 20 nm Pd L 20 nm Pt M Weber et al., Chem. Mater. 24, 2973 (2012). Weber et al., Nanotechnology 26, (2015).
7 Area-selective deposition: Al 2 O 3 on Cu/SiO 2 Patterned Cu/SiO 2 : SAMS grow on Cu(O x ) ALD of Al 2 O 3 on SiO 2 and (ultimately) on SAMS Selective etch of Al 2 O 3 and SAMS The SAMS grow selectively on the Cu(Ox) and not on the SiO 2 Al 2 O 3 grows on both the SiO 2 and on the SAMS (albeit with some delay and with a lower quality) 7 Minaye Hashemi et al., ACS Nano 9, 8710 (2015).
8 Nanopatterning using area-selective ALD? 8
9 ALD-enabled patterning Conventional: Etching 1. ALD Lift-off ALD-enabled: Area-selective ALD by area-deactivation 2. Resist patterning 1. Resist patterning 1. SAM patterning 3. Etching 2. ALD 2. ALD 4. Resist strip 3. Lift-off 3. SAM strip 9 Mackus et al., Nanoscale 6, (2014).
10 Area-selective ALD by area-deactivation Blank substrate Areas masked by photosensitive material or SAMs ALD on open areas only No deposition on the masking material (otherwise lift-off) The masking of the substrate by photosensitive material or by SAMs requires a patterning step (typically subtractive)! 10
11 AS-ALD by area-deactivation: using polyimide After polyimide photolithography patterning Polyimide SiO 2 50µm After 1000 cycles Pt ALD (300 ⁰C) Polyimide 50µm Pt Pt does not deposit on polyimide so no lift-off Polyimide does not flow at 300 ⁰ C so well-controlled pattern width 11 Vervuurt et al., Nanotechnology 27, (2016).
12 AS-ALD by area-deactivation: using polyimide I.) II.) Polyimide Graphene 20µm III.) IV.) Graphene Pt 20µm 12 Vervuurt et al., Nanotechnology 27, (2016).
13 Area-selective ALD by area-deactivation Blank substrate Areas masked by photosensitive material or SAMs ALD on open areas only No deposition on the masking material (otherwise lift-off) The masking of the substrate by photosensitive material or by SAMs requires a patterning step (typically subtractive)! 10
14 Summary: ALD-enabled patterning Conventional: ALD-enabled: Etching 1. ALD Lift-off Area-selective ALD by area-deactivation Area-selective ALD by area-activation 2. Resist patterning 1. Resist patterning 1. SAM patterning 3. Etching 2. ALD 2. ALD 1. Patterning of activation layer 4. Resist strip 3. Lift-off 3. SAM strip 2. ALD 9 Mackus et al., Nanoscale 6, (2014).
15 Area-selective ALD by area-activation Blank substrate Local activation of surface by seed layer or modification surface groups, etc. ALD on activated areas only The local activation is a patterning step but it is not subtractive! 115
16 AS-ALD by area-activation: EBID & ALD of Pt 1. Patterning step: e-beam induced deposition (EBID) e-beam Half-reaction A 2. Building step: Atomic layer deposition (ALD) Two-step process: Patterning: ultrathin (<1 ML) seed layer on oxide by EBID Building: area-selective ALD on seed layer Half-reaction B 14 Mackus et al., Nanoscale 4, 4477 (2012). US patent: 8,268,532 (2012).
17 AS-ALD by area-activation: EBID & ALD of Pt 1. Patterning step: EBID 2. Building step: ALD FEI Nova Nanolab 600 Pattering with: Nanoscale resolution of electron beam induced deposition (EBID) High Pt material quality as obtained by ALD 15 Mackus et al., Nanoscale 4, 4477 (2012). US patent: 8,268,532 (2012).
18 Direct-write ALD with e-beam patterning Direct-write: maskless and templateless patterning 16 Mackus et al., Nanoscale 4, 4477 (2012). US patent: 8,268,532 (2012).
19 Direct-write ALD of Pt contacts Back-gated (single-wall) CNTFET with direct-write ALD Pt contacts TLM structure on graphene with direct-write ALD Pt contacts 17 Mackus et al., Appl. Phys. Lett. 110, (2017). Thissen et al., 2D Mater. 4, (2017).
20 Underlying surface science: Pt dissociates O 2 Thickness (nm) ⁰C H 3 C Pt CH 3 CH 3 CH 3 Thermal ALD Pt (on Pt) Plasma ALD Pt 2 Thermal ALD Pt (on Al 0 2 O 3 ) Number of cycles Pt ALD Pt nucleates poorly on oxides Nucleation depends on O 2 pressure and sample temperature 18 Mackus et al., Chem. Mater. 25, 1905 (2013) Getman et al., J. Phys. Chem. C 112, 26 (2008)
21 AS-ALD by area-activation: EBID & ALD of Pt 1. Patterning step: EBID 2. Building step: ALD FEI Nova Nanolab 600 Pattering with: Nanoscale resolution of electron beam induced deposition (EBID) High Pt material quality as obtained by ALD 15 Mackus et al., Nanoscale 4, 4477 (2012). US patent: 8,268,532 (2012).
22 Underlying surface science: Pt dissociates O 2 Thickness (nm) ⁰C H 3 C Pt CH 3 CH 3 CH 3 Thermal ALD Pt (on Pt) Plasma ALD Pt 2 Thermal ALD Pt (on Al 0 2 O 3 ) Number of cycles Pt ALD Pt nucleates poorly on oxides Nucleation depends on O 2 pressure and sample temperature 18 Mackus et al., Chem. Mater. 25, 1905 (2013). Getman et al., J. Phys. Chem. C 112, 26 (2008).
23 Underlying surface science: Ru dissociates O 2 19 Leick et al., J. Phys. Chem. C 117, (2013) and references therein.
24 AS-ALD by area-activation: μ-cp & ALD of Ru 1. Patterning step: Micro-contact printing 2. Building step: Atomic layer deposition (ALD) Ru temperature window = ⁰C Ru does not nucleate just below temperature window: 250 ⁰C 20 Färm et al., Chem. Mater. 24, 275 (2012).
25 Outline Introduction & Area-selective deposition Area-selective ALD by area-deactivation Example: blocking with polyimide Area-selective ALD by area-activation Example: EBID & ALD of Pt (direct-write ALD) Intermezzo: μ-contact printing & ALD of Ru Example: μ-plasma printing & ALD of In 2 O 3 (direct-write ALD) Summary 2
26 AS-ALD by area-activation: μpp & ALD of In 2 O 3 1. Patterning step: μ-plasma printer (in air) 2. Building step: Atomic layer deposition (ALD) Half-reaction A Two-step process: Patterning: plasma treatment of H-terminated silicon surface Building: area-selective ALD on treated area Half-reaction B 21 Mameli et al., Chem. Mater. 29, 921 (2017).
27 AS-ALD by area-activation: μ-pp & ALD of In 2 O 3 1. Patterning step: μ-plasma printer (in air) 2. Building step: Atomic layer deposition (ALD) Pattering with: Sub-mm resolution of μ-plasma printer High In 2 O 3 material quality as obtained by ALD 22 Libera et al., Chem. Mater. 23, (2011). Mameli et al., Chem. Mater. 29, 921 (2017).
28 Direct-write ALD of In 2 O 3 1) Blank H-terminated surface 2) 3) µ-plasma activation ALD Si(%) In(%) XPS linear scan Si 2p In 3d distance (mm) 228 Mameli et al., Chem. Mater. 29, 921 (2017).
29 Underlying surface science: InCp adsorption Adsorption energies of InCp (in ev) Si(111)-H Si(111)-OH ALD In 2 O 3 using InCp as precursor exhibits a large nucleation delay on H-terminated surfaces Calculations in progress: Adsorption on Si(111)-OH seems thermodynamically more favorable 24 Mameli et al., Chem. Mater. 29, 921 (2017).
30 Summary Area-selective deposition will provide processing solutions for upcoming technology nodes There is especially interest in area-selective ALD as ALD is starting surface dependent Preferably also nanopatterning by area-selective ALD We can distinguish two approaches: Area-selective ALD by area-deactivation Area-selective ALD by area-activation Area-selective ALD by area-activation is the ultimate dream as the surface on which no film needs to be deposited remains untouched Presented two approaches that can be categorized as direct-write ALD To be continued! 25
31 Summary: ALD-enabled patterning Conventional: ALD-enabled: Etching 1. ALD Lift-off Area-selective ALD by area-deactivation Area-selective ALD by area-activation 2. Resist patterning 1. Resist patterning 1. SAM patterning 3. Etching 2. ALD 2. ALD 1. Patterning of activation layer 4. Resist strip 3. Lift-off 3. SAM strip 2. ALD 9 Mackus et al., Nanoscale 6, (2014).
32 Review paper 26 Mackus et al., Nanoscale 6, (2014).
33 Acknowledgments Patterning of graphene with polyimide René Vervuurt Direct-write ALD of Pt Nick Thissen Direct-write ALD of In 2 O 3 Alfredo Mameli Yinghuan Kuang Morteza Aghaee Adriana Creatore Fred Roozeboom 27
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