Electrical Conductive Adhesives with Nanotechnologies
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1 Yi Li Daniel Lu C.P. Wong Electrical Conductive Adhesives with Nanotechnologies Springer
2 1 Introduction Electronics Packaging and Interconnect Interconnection Materials Lead-Free Interconnect Materials Electrically Conductive Adhesives 15 References 19 2 Nanotechnology Introduction to Nanotechnologies and Nanopackaging Nanoparticles Introduction Nanoparticle Fabrication Nanoparticle Applications Nano Solder Particles Carbon Nanotubes (CNTs) Carbon Nanotubes for Electrical Interconnect Applications Nanocomposites Recent Advances in Nanocomposites Areas of Application of Nanocomposites Nano Interconnect Carbon Nanotube Transistors CNTVia CNT as Flip Chip Interconnect Nanoparticle Interlayer for Copper to Copper Bonding Interconnection Using Inkjet Printing of Nano-ink Nanowires and Nanobelts Introduction Applications of Nanowires 60 References 65 3 Characterizations of Electrically Conductive Adhesives Recent Advances in Polymeric Materials for Electronic Packaging Silicones (Polyorganosiloxanes) Epoxies Polyurethanes Polyimides 85
3 viii Silicone-Polyimide (SP1) Bismaleimide (BMI) Resins Cyanate Ester Resins Analytical Approaches for ECA Differential Scanning Calorimeter (DSC) Thermogravimetry Analyzer (TGA) Dynamic Mechanical Analyzer (DMA) Thermo-mechanical Analysis (TMA) Viscometer and Rheometer Fourier Transform Infrared (FT-IR) X-Ray Photoelectron Spectroscopy (XPS) X-Ray Diffraction (XRD) Transmission Electron Microscopy (ТЕМ) Scanning Electron Microscopy (SEM) Raman Spectroscopy Gas Chromatography/Mass Spectrometry Electrical Characterization of ECAs Mechanical Property Characterization 113 References Isotropically Conductive Adhesives (ICAs) Introduction Percolation Theory of Conduction Adhesive Matrix Conductive Fillers Processing of ICAs Screen and Stencil Printing Dispensing Inkjet Printing Flip Chip Applications Using ICAs ICA Process for Unbumped Chips Metal-Bumped Flip Chip Joints ICAs for Surface Mount Applications ICAs for CSP Applications ICAs for Advanced Packaging Applications Solar Cell Three-Dimensional Stacking Microspring ICAs for Printed Circuit Board Applications High-Frequency Performance of ICA Joints Reliability of ICA Joints 149
4 ix 4.10 Recent Advances on ICAs Fundamental Understanding of the Lubricant Layer on Ag Flakes Understanding of Conductivity Mechanism of ICAs Improvement of Electrical Conductivity of ICAs Mechanism Underlying Unstable Contact Resistance of ICA Joints Improvement of Contact Resistance Stability Impact Performance Adhesion Strength Recent Advances on Nano-ICAs 205 References Anisotropically Conductive Adhesives/Films (ACA/ACF) Introduction АСА Materials and Processing АСА Materials Processing Applications of ACA/ACF ACAs/ACFs for Flat Panel Displays ACAs/ACFs for Fine-Pitch Interconnections ACA/ACF in Flip Chip Applications Recent Advances of ACA/ACF and Nano-ACA/ACF Low-Temperature Sintering of Nano-Ag- Filled ACA/ACF АСА Joints with Low Melting Point (LMP) Filler Self-Assembled Molecular Wires for Nano-ACA/ACF Silver Migration Control in Nano-silver filled АСА ACA/ACF with Ferromagnetic Conductive Fillers Nanowire ACF for Ultra-fine-pitch Flip Chip Interconnection Thermal Performance of ACA/ACF ACA/ACF Reliability Effects of Bonding Conditions Effect of Mechanical Properties on the Reliability of ACF Joints Effects of Bump Height on the Reliability of АСА Joints Future Advances of ACA/ACF Materials Development 268
5 x High-Frequency Compatibility Reliability Wafer-Level Application 269 References Non-conductive Adhesives/Films (NCA/NCF) Introduction Electrical Properties of NCA/NCF Joints Contact Resistance of NCA/NCF Joints Reliability ofnca/ncf Joints Recent Advances of NCA/NCF Low-Temperature Assembly ofncf Improvement of Electrical Properties of NCA/NCF Joints with ^-Conjugated Molecular Wires NCA/NCF with Fillers Incorporation of Non-conductive Fillers in NCA/NCF Multi-layer ACF/NCF Wafer-Level NCF 296 References Conductive Nano-Inks Introduction An Overview of Conventional Patterning of Electronics Introduction of Printed Electronics Utility of High Volume Printing Processes in Printable Electronics Conventional Conductive Inks Metallic Ink Conductive Carbon Ink Conductive Nano-Inks Metallic Nano-Inks Conducting Polymer- Based Inks Organometallic Ink Processing of Nano Ink Ink-jet Printing Pyrolytic Printing Gravüre Printing Applications of Conductive Inks Die Attach for High Power Devices 343
6 xi Printed Low-resistance Metal Conductors for Printed Electronics Micro-bump Interconnect for System-in-Package (SiP) 349 References Intrinsically Conducting Polymers (ICPs) Basics of Intrinsically Conducting Polymers Introduction Doping Polyacetylene Applications of Conducting Polymers Lithography Metallization Corrosion Protection of Metals Electrostatic Discharge (ESD) Protection for Electronic Components Field-Effect Transistors (FET) Sensors Microfluid Pump Shielding of Electromagnetic Interference (EMI) Nanofiber-Based Nanocomposites And Devices Polymer Light-Emitting Diodes (PLEDs) Solar Cells Three-Dimensional Interconnect Conducting Polymer Artificial Muscles ICP as Interconnect Materials 406 References Future Trend of Conductive Adhesive Technology Recent Advances in Conductive Adhesive Technology Challenges and Opportunities of ICAs Electrical Performance Improvement Silver Migration Mechanical Property Improvement Manufacturability and Yields Cost Reduction ICAs Based on Intrinsically Conducting Polymers ICAs for Printed Organic Electronics Challenges and Opportunities for ACAs Thermo-mechanical Reliability 430
7 xii High-Frequency Compatibility Current-Carrying Capability Reliability Manufacturability Challenges and Opportunities for NCAs 431 References 432 Index 433
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